• Taiwan taps SunFab for solar panel production (2009-04-20) [ Power Design ]
• SemiBuzz: NEC, Renesas in merger talks (2009-04-20) [ Process/Manufacturing ]
• Fujitsu, Cisco drive unified comms in Japan (2009-04-20) [ RF/Wireless Design ]
• Samsung scores big in new iPod Shuffle (2009-04-20) [ Buffer/Storage ]
• Dell, HP boost low-end CPUs in emerging markets (2009-04-20) [ Embedded Systems ]

• Google's Android gets an upgrade (2009-04-20) [ Embedded Systems ]
• Analyst: Stay away from 450mm (2009-04-20) [ Process/Manufacturing ]
• IBM 'fab club' tips 28nm high-k process (2009-04-20) [ Process/Manufacturing ]
• 0.18µm RFCMOS design kit helps trim die size (2009-04-20) [ EDA ]
• Secure MCU packs NV SRAM, tamper-detection tech (2009-04-20) [ Security Design ]

• Cypress rolls low-power, fast asynchronous SRAMs (2009-04-20) [ Buffer/Storage ]
• Light manager tailored for smart phones (2009-04-20) [ Optical Electronics and Display ]
• Li-ion charger with 50mA LDO flaunts slim form (2009-04-20) [ Power Design ]
• Chipset delivers high-quality voice over broadband (2009-04-20) [ Signal Conditioning ]
• Medical connectors promise fast, secure lock (2009-04-20) [ Network Design ]

• SD card MUX operates three I/O levels (2009-04-20) [ Interface Design ]
• IMEC tools optimize multiprocessor SoC design (2009-04-17) [ EDA ]
• Battery monitor packs current-sense resistor (2009-04-17) [ Power Design ]
• Rectifiers boast ultralow forward voltage drops (2009-04-17) [ Signal Conditioning ]
• Processor performs Layer 7 content-aware processing (2009-04-17) [ Control Design ]

• Linear sensor eyes position-sensing apps (2009-04-17) [ Sensor Technology ]
• POL converters available in SMD, SIP (2009-04-17) [ Power Design ]
• Netbook market creates OS opportunities (2009-04-17) [ Embedded Systems ]
• Report: Another China GPS satellite takes off (2009-04-17) [ RF/Wireless Design ]
• New JEDEC standard doubles memory interface performance (2009-04-17) [ Buffer/Storage ]

• Tektronix buys CEM solutions provider (2009-04-17) [ RF/Wireless Design ]
• Asia Pacific market drives digital radio growth (2009-04-17) [ RF/Wireless Design ]
• Philips shuts down 3DTV operations (2009-04-17) [ Optical Electronics and Display ]
• Analysis: Has IC market really hit bottom? (2009-04-17) [ Process/Manufacturing ]
• Microchip seeks to 'elbow out' MCU rivals (2009-04-17) [ Control Design ]

• Marvell bets big on connected devices (2009-04-16) [ Embedded Systems ]
• SDIO software supports Mentor Nucleus RTOS (2009-04-16) [ Embedded Systems ]
• Power controller delivers 250 picoseconds PWM (2009-04-16) [ Power Design ]
• Amp doubles playback time in portable apps (2009-04-16) [ Signal Conditioning ]
• Evaluation platform tailored for media gateway apps (2009-04-16) [ Design Test ]

• Automotive MCU handles low-amplitude signals (2009-04-16) [ Control Design ]
• Receivers integrate features for Doppler processing (2009-04-16) [ Signal Conditioning ]
• SDI chipset provides complete serial link solution (2009-04-16) [ Interface Design ]
• Processor boosts wired, wireless nets performance (2009-04-16) [ RF/Wireless Design ]
• MEMS fire up component revolution (2009-04-16) [ Sensor Technology ]

• Despite downturn, panel prices rise (2009-04-16) [ Optical Electronics and Display ]
• ICT reaches out to rural areas (2009-04-16) [ Control Design ]
• Japan gov't ends tariff on Hynix (2009-04-16) [ Buffer/Storage ]
• Samsung, Spansion settle patent litigation suit (2009-04-16) [ Buffer/Storage ]
• Freescale wireless biz sale still underway (2009-04-16) [ RF/Wireless Design ]

• Diamond, sapphire wafers, anyone? (2009-04-16) [ Process/Manufacturing ]
• Android extends beyond cellphones (2009-04-16) [ Embedded Systems ]
• Driver IC features negative voltage spike immunity (2009-04-15) [ Control Design ]
• 32bit flash MCUs pack peripheral, comm functions (2009-04-15) [ Control Design ]
• RapidIO solution delivers faster link rates (2009-04-15) [ RF/Wireless Design ]

• Coaxial connector tailored for car navigation apps (2009-04-15) [ Network Design ]
• Bourns boosts circuit protection lineup (2009-04-15) [ EMI/EMC Design ]
• 45nS comparators suit battery-powered apps (2009-04-15) [ Power Design ]
• ASIC platform promises reduced NRE costs (2009-04-15) [ Process/Manufacturing ]
• Server flash drives welcome MLC (2009-04-15) [ Buffer/Storage ]

• China eyes growth in comms segment (2009-04-15) [ Process/Manufacturing ]
• Virident servers to use Numonyx flash memories (2009-04-15) [ Buffer/Storage ]
• IBM, CEA/Leti to cooperate on nanoelectronics research (2009-04-15) [ EDA ]
• Sharp, Pioneer to establish optical disk JV (2009-04-15) [ Optical Electronics and Display ]
• ST climbs Gartner's chip vendor list (2009-04-15) [ Process/Manufacturing ]

• Diatoms boost dye-sensitized solar cell efficiency (2009-04-15) [ Power Design ]
• ARM netbooks hit video, software snags (2009-04-15) [ Embedded Systems ]
• Report: Samsung bags iPhone NAND order (2009-04-15) [ Buffer/Storage ]
• Transimpedance amp meets GPON Class B+ requirements (2009-04-14) [ Signal Conditioning ]
• Smart card interface claims 'lowest power stop mode' (2009-04-14) [ Interface Design ]

• MCUs enable new-gen 8bit performance (2009-04-14) [ Control Design ]
• 2GHz Atom aims at handheld notebooks (2009-04-14) [ Embedded Systems ]
• PLM, PPS.TV deliver Internet streaming in HDTVs (2009-04-14) [ Optical Electronics and Display ]
• Intel helps modernize Vietnam's education system (2009-04-14) [ Embedded Systems ]
• Micron, Nanya seek Taiwan gov't support (2009-04-14) [ Buffer/Storage ]

• Good news: IC recovery to start in 2H 09 (2009-04-14) [ Process/Manufacturing ]
• Dual DC/DC converter guaranteed at 150°C (2009-04-13) [ Power Design ]
• SBC RDK loads multiple connectivity options (2009-04-13) [ EDA ]
• Server board packs two Intel Xeon processors (2009-04-13) [ Embedded Systems ]
• AC input switching power supplies are customizable (2009-04-13) [ Power Design ]

• Embedded GPS receiver targets timing apps (2009-04-13) [ RF/Wireless Design ]
• PHY IC addresses ultralow-cost cellular comms (2009-04-13) [ RF/Wireless Design ]
• New IGBTs promise lower saturation voltages (2009-04-13) [ Signal Conditioning ]
• Panel demand growth fuels price increase (2009-04-13) [ Optical Electronics and Display ]
• Report: Vietnam gov't okays 3G firms (2009-04-13) [ RF/Wireless Design ]

• HP invests in Malaysia tech center (2009-04-13) [ Process/Manufacturing ]
• Wireless groups issue femtocell standards (2009-04-13) [ RF/Wireless Design ]
• Gartner: No electronics, IC recovery yet (2009-04-13) [ Process/Manufacturing ]
• IBM Fellow sees end of Moore's Law (2009-04-13) [ EDA ]
• Will foundry rebound last? (2009-04-13) [ Process/Manufacturing ]