• Unlock Micron's 50nm DRAM technology (2009-04-09) [ Buffer/Storage ]
• Power Tip #3: Avoiding oscillation issues in input filters (2009-04-09) [ Signal Conditioning ]
• 7W diode laser tailored for medical market (2009-04-09) [ Optical Electronics and Display ]
• Ultrathin ceramic capacitors deliver 10nF capacitance (2009-04-09) [ Power Design ]
• Industrial controller packs Intel Core Duo processor (2009-04-09) [ Control Design ]

• High power amp uses dual-sided bias architecture (2009-04-09) [ Signal Conditioning ]
• New standard to reduce handhelds' power consumption (2009-04-09) [ Embedded Systems ]
• Survey: Mobile phone users want Wi-Fi (2009-04-09) [ RF/Wireless Design ]
• Micron veers away from Taiwan DRAM venture (2009-04-09) [ Buffer/Storage ]
• Smart grid: ready for take off? (2009-04-09) [ Network Design ]

• Single-sided slide switch flaunts thinner design (2009-04-08) [ Network Design ]
• SoCs support Full HD, WXGA resolutions for LCD TVs (2009-04-08) [ Signal Conditioning ]
• ATCA SBC with Intel Xeon designed for 4G apps (2009-04-08) [ Embedded Systems ]
• DSP suits audio conferencing, power protection apps (2009-04-08) [ Digital Signal Processing ]
• Network platform touts more performance per watt (2009-04-08) [ Security Design ]

• Integrated RF LDMOS bias controllers debut (2009-04-08) [ RF/Wireless Design ]
• New flexible DSAs expand Peregrine's lineup (2009-04-08) [ RF/Wireless Design ]
• TV chip manufacturing competition sizzles (2009-04-08) [ Optical Electronics and Display ]
• Canadian Solar to supply solar panels to Sichuan (2009-04-08) [ Power Design ]
• Research to reform embedded systems (2009-04-08) [ Embedded Systems ]

• Where did memory vendors go wrong? (2009-04-08) [ Buffer/Storage ]
• Students build solar-powered race car (2009-04-08) [ Power Design ]
• Japan team develops solar cell out of optical fiber (2009-04-08) [ Power Design ]
• What's next after IBM-Sun merger talks fizzle? (2009-04-08) [ Embedded Systems ]
• Bluetooth headset is microphone-free (2009-04-07) [ RF/Wireless Design ]

• AC ammeters equipped with over current alarm (2009-04-07) [ Design Test ]
• Development kit supports ARM-based MCUs (2009-04-07) [ EDA ]
• Debug tech support caters to MIPS32 24KE (2009-04-07) [ EDA ]
• Serial module designed for legacy devices (2009-04-07) [ Interface Design ]
• Antenna switch replaces traditional solution (2009-04-07) [ RF/Wireless Design ]

• Tool deals with stack overflow problems (2009-04-07) [ Embedded Systems ]
• Singapore R&D institute adopts Synopsys tools (2009-04-07) [ EDA ]
• 'Green' solutions go 'smart' (2009-04-07) [ Embedded Systems ]
• TI's Philippine building bags LEED certification (2009-04-07) [ Process/Manufacturing ]
• HD consumer electronics set for triple growth (2009-04-07) [ Optical Electronics and Display ]

• ST, Infineon, AMSL ratings go sour (2009-04-07) [ Process/Manufacturing ]
• Continental opens new China R&D center (2009-04-07) [ Control Design ]
• Researchers tap viruses for 'green' batteries (2009-04-07) [ Power Design ]
• GE, Intel join forces for telehealth (2009-04-06) [ Embedded Systems ]
• Varistors boast ultralow leakage current (2009-04-06) [ Signal Conditioning ]

• User-customizable verification module to debut (2009-04-06) [ Design Test ]
• Ruggedized board befits mission-critical environments (2009-04-06) [ Embedded Systems ]
• Devices expand Dynastron image sensor lineup (2009-04-06) [ Sensor Technology ]
• Analysis: PV market to tighten in '09 (2009-04-06) [ Power Design ]
• Renesas gets 'pro-active' with new patent program (2009-04-06) [ EDA ]

• Wireless, MEMS advancements boost energy harvesting (2009-04-06) [ Sensor Technology ]
• 6-slot ATCA backplane comes in Mesh topology (2009-04-03) [ Embedded Systems ]
• Buck-boost controller promises up to 98% efficiency (2009-04-03) [ Power Design ]
• LDO regulator equipped with power save mode (2009-04-03) [ Power Design ]
• Step-up converter delivers low-noise output (2009-04-03) [ Power Design ]

• DirectPath tech powers Class-G headphone amps (2009-04-03) [ Signal Conditioning ]
• Serial FRAM flaunts higher-speed read/write (2009-04-03) [ Buffer/Storage ]
• Audio subsystems aim to simplify design (2009-04-03) [ Embedded Systems ]
• Satellite-terrestrial mobile platform is SDR-based (2009-04-03) [ RF/Wireless Design ]
• 0.18µm embedded flash suits power-sensitive apps (2009-04-03) [ Buffer/Storage ]

• Asia to bid farewell to NECCAP PCs (2009-04-03) [ Embedded Systems ]
• IDC: Southeast Asia beams with bright telecom market (2009-04-03) [ RF/Wireless Design ]
• Toshiba to acquire Panasonic's share in LCD JV (2009-04-03) [ Optical Electronics and Display ]
• Korea, Taiwan panel makers to boost output in '09 (2009-04-03) [ Process/Manufacturing ]
• Nokia slashes $5B in contract manufacturing (2009-04-03) [ Process/Manufacturing ]

• Taiwan Memory taps Elpida as tech partner (2009-04-03) [ Buffer/Storage ]
• Intel stays on top of MPU market in '08 (2009-04-03) [ Embedded Systems ]
• LCD controller driver packs key scan function (2009-04-02) [ Optical Electronics and Display ]
• GPRS Edge modem suits M2M apps (2009-04-02) [ RF/Wireless Design ]
• MEMS motion sensor delivers analog output (2009-04-02) [ Sensor Technology ]

• UHF RFID reader includes USB interface (2009-04-02) [ RF/Wireless Design ]
• Next-gen DSCs boast flexibility (2009-04-02) [ Power Design ]
• 45nm-based comms processor aims at 3G, 4G (2009-04-02) [ Control Design ]
• MEMS oscillator offered in smaller packages (2009-04-02) [ RF/Wireless Design ]
• Chips jumpstart commercial FCoE (2009-04-02) [ Programmable Logic ]

• Dolby's HD audio technologies penetrate China (2009-04-02) [ Embedded Systems ]
• Wafer-level optics tech licensed to Qtech (2009-04-02) [ Optical Electronics and Display ]
• China outperforms U.S. in 2008 auto production (2009-04-02) [ Embedded Systems ]
• Cambodia's telecoms sector gets a shot in the arm (2009-04-02) [ RF/Wireless Design ]
• DRAM makers to keep low utilization rates in 2009 (2009-04-02) [ Buffer/Storage ]

• Intel drives broadband initiative in India (2009-04-02) [ RF/Wireless Design ]
• IC rebound: Is it for real? (2009-04-02) [ Process/Manufacturing ]
• Globalfoundries assures commitment to Dresden (2009-04-02) [ Process/Manufacturing ]
• Design 101: Class D amplifiers (2009-04-01) [ Signal Conditioning ]
• Automotive industry bids 5V NOR flash goodbye (2009-04-01) [ Buffer/Storage ]

• Touch panel packs multi-touch input functions (2009-04-01) [ Sensor Technology ]
• LTE test system promises complete RF testing (2009-04-01) [ Design Test ]
• Driver, receiver ICs handle video signal transmission (2009-04-01) [ Signal Conditioning ]
• 5V NOR flash tailored for automotive, embedded apps (2009-04-01) [ Buffer/Storage ]
• Graphics IP cores come in multiprocessing versions (2009-04-01) [ EDA ]

• MEMS user interface enables control functions (2009-04-01) [ Sensor Technology ]
• QuickLogic platform supports Qualcomm mobile processors (2009-04-01) [ Interface Design ]
• Mobile music market meets DAC with 102dB SNR (2009-04-01) [ Embedded Systems ]
• Collaboration to drive interconnect solutions in autos (2009-04-01) [ Programmable Logic ]
• Joint effort aims to enable 3D semiconductors (2009-04-01) [ Process/Manufacturing ]

• Winners and losers of the solar cell market (2009-04-01) [ Power Design ]
• Contract to create Asian submarine cable net system (2009-04-01) [ Network Design ]
• Avnet, HKPC drive LED lighting in Hong Kong (2009-04-01) [ Optical Electronics and Display ]
• Tech firms, universities seek cloud computing standards (2009-04-01) [ Embedded Systems ]
• Gartner: Asia-Pacific IC market to drop 23% (2009-04-01) [ Process/Manufacturing ]

• Analysis: Numonyx braces for stormy 2009 (2009-04-01) [ Buffer/Storage ]