• Finding defects in safety-critical code (2009-03-31) [ Embedded Systems ]
• TI's Lowe banks on analog to propel company growth (2009-03-31) [ Process/Manufacturing ]
• Dual 10GbE AMC packs Virtex-5 FPGA (2009-03-31) [ Embedded Systems ]
• DisplayPort IC handles up to 2.7Gbit/s data rate (2009-03-31) [ Optical Electronics and Display ]
• 10MHz op amp features rail-to-rail I/O (2009-03-31) [ Signal Conditioning ]

• Power transistors achieve 2mΩ on-resistance (2009-03-31) [ Power Design ]
• Audio connectors suit comms, security apps (2009-03-31) [ EMI/EMC Design ]
• Solar gear promises higher conversion efficiency (2009-03-31) [ Process/Manufacturing ]
• PHY solution supports 10GbE apps (2009-03-31) [ Network Design ]
• 'Fastest' 24bit delta-sigma ADC unveiled (2009-03-31) [ Signal Conditioning ]

• Key Stream transfers WLAN biz to Renesas (2009-03-31) [ RF/Wireless Design ]
• Study: consumers want video in digital photo frames (2009-03-31) [ Embedded Systems ]
• First HSPA+ network shines in Singapore (2009-03-31) [ RF/Wireless Design ]
• Spreadtrum to supply chipsets to Samsung (2009-03-31) [ RF/Wireless Design ]
• Magma CEO optimistic on analog push (2009-03-31) [ EDA ]

• Analyst warns of further DDR3 delay (2009-03-31) [ Buffer/Storage ]
• Circuit stacking handles complex 3D designs (2009-03-31) [ Process/Manufacturing ]
• Report: PC market to go 'slightly up' (2009-03-31) [ Embedded Systems ]
• GPU core controllers handle wide I/O voltage ratios (2009-03-30) [ Power Design ]
• Mobile test packs UE CAT4 LTE support (2009-03-30) [ Design Test ]

• Fiber optic transceivers achieve up to 40Gbit/s (2009-03-30) [ Network Design ]
• PCIe 2.0 switches offer 90, 80 lane options (2009-03-30) [ Network Design ]
• Wireless sensor ICs promise longer battery life (2009-03-30) [ Sensor Technology ]
• LED driver IC touts voltage, current protection (2009-03-30) [ Optical Electronics and Display ]
• Hybrid line amps crafted for CATV distribution (2009-03-30) [ RF/Wireless Design ]

• Handset chips Edge toward low power (2009-03-30) [ RF/Wireless Design ]
• Biometric module recognizes veins, fingerprints (2009-03-30) [ Security Design ]
• What should semi equipment suppliers do to survive? (2009-03-30) [ Process/Manufacturing ]
• Going green: analog's amulet during tough times (2009-03-30) [ RF/Wireless Design ]
• Nvidia hurls countersuit vs. Intel (2009-03-30) [ Control Design ]

• PSC chair warns of DRAM shortage (2009-03-30) [ Process/Manufacturing ]
• Downturn forces Fairchild to shut down fabs (2009-03-30) [ Process/Manufacturing ]
• Samsung ups power-efficiency efforts (2009-03-30) [ Optical Electronics and Display ]
• Will TI bid for rival analog IC firm? (2009-03-30) [ Signal Conditioning ]
• Wi-Fi, Ethernet DAQ modules handle harsh setups (2009-03-27) [ Design Test ]

• 32bit MCUs achieve 1.65 MIPS/MHz processing (2009-03-27) [ Control Design ]
• Li-ion battery switch packs four enable inputs (2009-03-27) [ Network Design ]
• Payload test offers standard, customizable programs (2009-03-27) [ Design Test ]
• Say hello to 'first' 40Gbit/s nets SMT device (2009-03-27) [ Signal Conditioning ]
• Line sensor claims enhanced noise performance (2009-03-27) [ Design Test ]

• Devices to enable fiber infrastructure upgrade (2009-03-27) [ Digital Signal Processing ]
• 110nm CMOS squeezes extra die per wafer (2009-03-27) [ Process/Manufacturing ]
• China Sunergy inks 35MW PV agreement (2009-03-27) [ Power Design ]
• Plasma panel market loses pace (2009-03-27) [ Optical Electronics and Display ]
• Malaysia entices foreign ICT companies (2009-03-27) [ Process/Manufacturing ]

• 2.5GHz WiMAX network deployed in the Philippines (2009-03-27) [ RF/Wireless Design ]
• High hopes dim for Russia contract manufacturing (2009-03-27) [ Process/Manufacturing ]
• Researchers turn reclaimed silicon to solar cell (2009-03-27) [ Power Design ]
• Capacity cuts propel NAND price hike (2009-03-27) [ Buffer/Storage ]
• New standard sparks home net debate (2009-03-27) [ Network Design ]

• Low profile BeO package fits power IC switches (2009-03-26) [ Process/Manufacturing ]
• Solution supports CTIA A-GPS over the air test (2009-03-26) [ Design Test ]
• GEPON ref design packs transmit power monitor (2009-03-26) [ EDA ]
• DC/DC controllers deliver fast transient response (2009-03-26) [ Power Design ]
• Power supply ref design promises 94% efficiency (2009-03-26) [ Power Design ]

• Low-power embedded controller is environment-friendly (2009-03-26) [ Embedded Systems ]
• 100Gbit/s regenerator fabricated for optical nets (2009-03-26) [ Signal Conditioning ]
• Biometric sensor boasts durability, accuracy (2009-03-26) [ Sensor Technology ]
• Collaboration aims to dig into organic TFT (2009-03-26) [ Process/Manufacturing ]
• 30MW PV project to power New Mexico (2009-03-26) [ Power Design ]

• TSMC, Ciranova team up on advanced PDK tech (2009-03-26) [ Process/Manufacturing ]
• iSuppli: auto sensor shipments to decline (2009-03-26) [ Sensor Technology ]
• China stimulus fuels analog market rebound (2009-03-26) [ Process/Manufacturing ]
• Cold fusion now a reality? (2009-03-26) [ Process/Manufacturing ]
• Spain reigns in solar market (2009-03-26) [ Power Design ]

• Fab tools, anyone? (2009-03-26) [ Process/Manufacturing ]
• Touch button controller fits mobile apps (2009-03-25) [ Sensor Technology ]
• ASIX to demo single-chip Wi-Fi solutions (2009-03-25) [ RF/Wireless Design ]
• PXI chassis offer high cooling capacity (2009-03-25) [ Embedded Systems ]
• Mapper IC trims cost in Ethernet services (2009-03-25) [ Network Design ]

• Powersolve boosts power module offerings (2009-03-25) [ Power Design ]
• LED design goes interactive (2009-03-25) [ Optical Electronics and Display ]
• Hot swap controller gets an upgrade (2009-03-25) [ Power Design ]
• 'First' functional Cortex-M0 to be revealed (2009-03-25) [ Control Design ]
• PV materials sector to reach $600M sales by 2016 (2009-03-25) [ Power Design ]

• ST supports STBs with reduced power consumption (2009-03-25) [ Embedded Systems ]
• Ericsson to supply W-CDMA nets in China (2009-03-25) [ RF/Wireless Design ]
• Infineon, Bosch to collaborate on power ICs (2009-03-25) [ Process/Manufacturing ]
• Numonyx revisits 5V automotive flash (2009-03-25) [ Buffer/Storage ]
• Hitachi banks on new CEO for recovery (2009-03-25) [ Process/Manufacturing ]

• MEMS winners and losers of 2008 (2009-03-25) [ Sensor Technology ]
• Mounting layoffs fire up offshoring debate (2009-03-25) [ Process/Manufacturing ]
• Dev't kit speeds up Cyclone III FPGA design (2009-03-24) [ EDA ]
• RF receiver highlights low power, long range (2009-03-24) [ RF/Wireless Design ]
• Electrical design tool targets truck OEMs (2009-03-24) [ EDA ]

• ON Semi beefs up interface, MCU IP blocks (2009-03-24) [ EDA ]
• Gateway kit fits home, car audio systems (2009-03-24) [ Embedded Systems ]
• ST intros single-chip STB ICs (2009-03-24) [ RF/Wireless Design ]
• IP STB chips support China's AVS (2009-03-24) [ RF/Wireless Design ]
• Head-up display employs laser (2009-03-24) [ Optical Electronics and Display ]

• China Sunergy to supply asola 480MW solar cells (2009-03-24) [ Power Design ]
• Femtocell deployment to slow down temporarily (2009-03-24) [ RF/Wireless Design ]
• Gennum, Tundra ink acquisition agreement (2009-03-24) [ Process/Manufacturing ]
• Cisco intends to acquire Flip-Video creator (2009-03-24) [ Process/Manufacturing ]
• IEEE okays low-power design spec (2009-03-24) [ EDA ]

• Analyst sees slow multicore uptake in comms (2009-03-24) [ Embedded Systems ]
• Process variability gets a second chance (2009-03-24) [ EDA ]
• Intel to hold 55% of graphics market by 2010 (2009-03-24) [ Embedded Systems ]
• Employ CEC in HDTVs to meet Energy Star 3.0 (2009-03-23) [ Interface Design ]
• Module dev't kit eases custom solution design (2009-03-23) [ EDA ]

• Power monitor packs digital I²C interface (2009-03-23) [ Power Design ]
• Power generators boast improved efficiency, output (2009-03-23) [ Power Design ]
• Fluid sensor offers self-calibration circuitry (2009-03-23) [ Sensor Technology ]
• Miniature crystal oscillator offers massive performance (2009-03-23) [ Control Design ]
• Re-drivers target storage, computing apps (2009-03-23) [ Buffer/Storage ]

• Samsung ships DDR3-based modules for servers (2009-03-23) [ Buffer/Storage ]
• Here comes a thin-film tech breakthrough (2009-03-23) [ Process/Manufacturing ]
• TFT LCD components face critical market changes (2009-03-23) [ Optical Electronics and Display ]
• Japan companies dismiss workers in the Philippines (2009-03-23) [ Process/Manufacturing ]
• Infineon, Huawei ink framework purchase agreement (2009-03-23) [ RF/Wireless Design ]

• Acquisition powers National's solar solutions (2009-03-23) [ Power Design ]
• Nanorods simplify 3D chip stacking (2009-03-23) [ Process/Manufacturing ]
• Solar panel market to face slowdown in '09 (2009-03-23) [ Power Design ]
• IEEE, conference boost smart grid initiative (2009-03-23) [ Power Design ]
• Nokia braves out economic crunch (2009-03-23) [ Process/Manufacturing ]