• EMC rolls 200-/400GB enterprise flash drives (2009-03-20) [ Buffer/Storage ]
• Digital signal mixer packs 4-channel power amp (2009-03-20) [ Signal Conditioning ]
• Wireless test solutions support CPRI, OBSAI (2009-03-20) [ Design Test ]
• Spectrum analyzers handle up to 26.6GHz (2009-03-20) [ Design Test ]
• DACs support high-fidelity digital synthesis (2009-03-20) [ Signal Conditioning ]

• Integrated RF charging tech powers battery (2009-03-20) [ RF/Wireless Design ]
• Broadband tech boasts 5x faster data rate (2009-03-20) [ Signal Conditioning ]
• Yield tool minimizes design re-spin (2009-03-20) [ EDA ]
• SDK, Hoya end hard disk media consolidation (2009-03-20) [ Buffer/Storage ]
• GPS IC year-on-year growth rate slackens (2009-03-20) [ RF/Wireless Design ]

• Agilent, Aster collaborate on test platforms (2009-03-20) [ Test & Packaging ]
• Aeroflex to provide automated test for Icom radios (2009-03-20) [ Design Test ]
• TI exec weighs in on iPhone, future smart phones (2009-03-20) [ Embedded Systems ]
• BridgeCo to invest $2M in India R&D center (2009-03-20) [ Process/Manufacturing ]
• Quantum theory to explain high-temp superconducting (2009-03-20) [ Process/Manufacturing ]

• Analysis: Why IBM-Sun merger makes sense (2009-03-20) [ Embedded Systems ]
• Power management for optimal design (2009-03-19) [ EDA ]
• Nvidia technology to go into PS3 (2009-03-19) [ Embedded Systems ]
• Court dismisses lawsuit vs. Qualcomm (2009-03-19) [ EDA ]
• Car displays remain in the fast lane of growth (2009-03-19) [ Optical Electronics and Display ]

• Nokia reorganizes to adapt to market situation (2009-03-19) [ Process/Manufacturing ]
• Solar PV to enjoy long-term growth (2009-03-19) [ Power Design ]
• Sneak peek at techs that could change the world (2009-03-19) [ RF/Wireless Design ]
• Synopsys CEO confident of IC rebound (2009-03-19) [ EDA ]
• ASML climbs IC equipment supplier list (2009-03-19) [ Process/Manufacturing ]

• Mapping tool handles multicore comms topology (2009-03-19) [ Embedded Systems ]
• IAR Workbench packs enhanced debug for Atmel MCUs (2009-03-19) [ Embedded Systems ]
• Digital radio test supports Motorola portable apps (2009-03-19) [ Design Test ]
• Chipset replaces transformers in energy meters (2009-03-19) [ Signal Conditioning ]
• UHF receiver has -102dBm receive sensitivity (2009-03-19) [ RF/Wireless Design ]

• Sensor to address 'sweet spot' of digicams (2009-03-19) [ Sensor Technology ]
• Embedded code gets a dose of parallelism (2009-03-19) [ Control Design ]
• 'Highest' density transceiver FPGA now shipping (2009-03-19) [ Programmable Logic ]
• Freescale enters debt-swap to cope with downturn (2009-03-18) [ Process/Manufacturing ]
• Toward a greener IT landscape in Asia (2009-03-18) [ Process/Manufacturing ]

• Analyst: Telco landscape is transforming (2009-03-18) [ RF/Wireless Design ]
• Fujitsu performs LTE field testing in Japan (2009-03-18) [ RF/Wireless Design ]
• FCI, SMIC: new 300mm flip chip allies (2009-03-18) [ Process/Manufacturing ]
• WiMedia Alliance to cease operations (2009-03-18) [ RF/Wireless Design ]
• Elpida buys PSC shares in Rexchip (2009-03-18) [ Buffer/Storage ]

• Applied aims for bigger slice of solar market (2009-03-18) [ Process/Manufacturing ]
• Samsung claims print electronics progress (2009-03-18) [ Process/Manufacturing ]
• Intel to end AMD license pact over foundry JV (2009-03-18) [ Process/Manufacturing ]
• DC/DC controller promises high reliability (2009-03-18) [ Power Design ]
• Absolute encoder targets robotics apps (2009-03-18) [ Sensor Technology ]

• Buck-boost converter boasts up to 90% efficiency (2009-03-18) [ Power Design ]
• Mux/demux for 100G networks to sample soon (2009-03-18) [ Network Design ]
• Synopsys aims to accelerate chip development (2009-03-18) [ EDA ]
• Cisco debuts Unified Computing System (2009-03-18) [ EDA ]
• Solution supports on-chip power management (2009-03-18) [ EDA ]

• Low-power HD Radio IC is fully integrated (2009-03-17) [ RF/Wireless Design ]
• MCUs with embedded flash fit industrial apps (2009-03-17) [ Control Design ]
• Troposcatter devices operate over AN/TRC-170 (2009-03-17) [ RF/Wireless Design ]
• Analyzer handles T-DMB, DAB signals (2009-03-17) [ Design Test ]
• Amp designed to take on space apps (2009-03-17) [ Signal Conditioning ]

• Zigbee module touts -98dBm receive sensitivity (2009-03-17) [ Security Design ]
• Chip combines MLC, memory controller (2009-03-17) [ Buffer/Storage ]
• All-electrical vehicle produces zero emissions (2009-03-17) [ Embedded Systems ]
• Clearing up cloud (computing) issues (2009-03-17) [ Embedded Systems ]
• Nichia, Semi-Photonics settle patent case (2009-03-17) [ Optical Electronics and Display ]

• National reports Q3 income, consolidation plans (2009-03-17) [ Process/Manufacturing ]
• Non-NFC commerce outpaces NFC dealings (2009-03-17) [ RF/Wireless Design ]
• Will Qimonda stay in operation? (2009-03-17) [ Buffer/Storage ]
• Toshiba, Samsung mull SanDisk takeover? (2009-03-17) [ Buffer/Storage ]
• Power IC sales to nose-dive this year (2009-03-17) [ Power Design ]

• Nanowires to bring fuel cells to mass market (2009-03-17) [ Power Design ]
• Optimism brews amid talks of recovery (2009-03-17) [ Process/Manufacturing ]
• VCSEL driver, amp combo fits 10G Ethernet (2009-03-16) [ Network Design ]
• Radio test software supports P25 (2009-03-16) [ Design Test ]
• RF ICs handle up to 2GHz wireless apps (2009-03-16) [ RF/Wireless Design ]

• Conference system packs automatic mic mixing (2009-03-16) [ Signal Conditioning ]
• FPGA solution enables low-cost PCIe bridge (2009-03-16) [ Programmable Logic ]
• Silicon oscillator reduces peak radiated EMI (2009-03-16) [ EMI/EMC Design ]
• Power switch requires less board space (2009-03-16) [ Power Design ]
• Liquid level switches suit medical, industrial (2009-03-16) [ Sensor Technology ]

• austriamicrosystems files infringement suit vs. Melexis (2009-03-16) [ Embedded Systems ]
• Omron, Renesas team up for touch sensors (2009-03-16) [ Sensor Technology ]
• Seiko Epson, Sony: soon-to-be LCD allies (2009-03-16) [ Optical Electronics and Display ]
• Broadcom hailed as top GPS IC vendor (2009-03-16) [ RF/Wireless Design ]
• Signs point to semiconductor rehab (2009-03-16) [ Process/Manufacturing ]

• MID shipments to hit 416M units by 2012 (2009-03-16) [ RF/Wireless Design ]
• Top IC firms less bright in 2008 (2009-03-16) [ Process/Manufacturing ]
• Intel China fab plan is on track (2009-03-16) [ Process/Manufacturing ]
• Ease real-time solder joint fault detection in FPGAs (2009-03-13) [ Design Test ]
• Automotive head unit gains traction (2009-03-13) [ EDA ]

• DC/DC converter packs automatic fault detection (2009-03-13) [ Power Design ]
• Power supplies fit space-constraint designs (2009-03-13) [ Power Design ]
• Improved memory, cache boost DSP performance (2009-03-13) [ Digital Signal Processing ]
• Broadband test allows concurrent internal, field access (2009-03-13) [ Design Test ]
• ESD device protects handset antennas (2009-03-13) [ EMI/EMC Design ]

• Processor enables smart infrastructure deployments (2009-03-13) [ Network Design ]
• Adapter eases time-triggered networking (2009-03-13) [ RF/Wireless Design ]
• ARM Cortex models now available (2009-03-13) [ Interface Design ]
• MPEG-2 patent holders slam suit vs. Lenovo (2009-03-13) [ Control Design ]
• Firm reveals LCD monitor trends (2009-03-13) [ Optical Electronics and Display ]

• India's spacecraft to use ITT microconnectors (2009-03-13) [ Interface Design ]
• ON Semi, Samsung resolve patent dispute (2009-03-13) [ Buffer/Storage ]
• Will Taiwan DRAM venture push through? (2009-03-13) [ Buffer/Storage ]
• Xilinx CEO: no VC comeback for semis (2009-03-13) [ Process/Manufacturing ]
• Recession, underinvestment drag China IC industry (2009-03-13) [ Process/Manufacturing ]

• Tech recharges batteries in a snap (2009-03-13) [ Power Design ]
• Digging up a mechanical, electronic beauty (2009-03-12) [ Embedded Systems ]
• Tackling FM antenna design roadblocks (2009-03-12) [ RF/Wireless Design ]
• Detect switches come in right, left actuations (2009-03-12) [ Network Design ]
• Digital audio amps improve bass response (2009-03-12) [ Signal Conditioning ]

• PCB design software packs enhanced functions (2009-03-12) [ EDA ]
• Smart card allows flexible access to data centers (2009-03-12) [ Security Design ]
• RF filters suit up to 6GHz frequencies (2009-03-12) [ RF/Wireless Design ]
• Virtualization products simplify storage (2009-03-12) [ EDA ]
• IP cores are tunable for reuse (2009-03-12) [ EDA ]

• Ultra-thin chips flex to fit into garments (2009-03-12) [ Embedded Systems ]
• LG begins 8th-gen LCD production (2009-03-12) [ Process/Manufacturing ]
• SOHO, consumer to propel Wi-Fi equipment orders (2009-03-12) [ RF/Wireless Design ]
• Initiative to support GPU computing startups (2009-03-12) [ Control Design ]
• Rambus, Hynix concur on royalty rates (2009-03-12) [ Buffer/Storage ]

• ARM CPUs to trump Atom in netbooks by '12? (2009-03-12) [ Embedded Systems ]
• USB 3.0 wins Gennum support (2009-03-12) [ Interface Design ]
• Lean inventories could revive industry (2009-03-12) [ Process/Manufacturing ]
• Digital frames audition for home's 'third screen' (2009-03-12) [ Optical Electronics and Display ]
• How do you set Wi-Fi's flavors? (2009-03-11) [ RF/Wireless Design ]

• Power Tip #2: Overcoming power supply's noise issues (2009-03-11) [ Signal Conditioning ]
• On-chip IP set to replace ATEs (2009-03-11) [ Design Test ]
• Video filter amp cuts consumption to 1µA (2009-03-11) [ Signal Conditioning ]
• Multimedia processor packs DDR memory (2009-03-11) [ Embedded Systems ]
• DC blowers cool down space-constrained apps (2009-03-11) [ EMI/EMC Design ]

• Cooperation creates 45nm HDMI-based IP (2009-03-11) [ Optical Electronics and Display ]
• FM chip antenna fits mobile apps (2009-03-11) [ RF/Wireless Design ]
• Highly integrated digicam processor unveiled (2009-03-11) [ Digital Signal Processing ]
• MCU family gasconades robust touch sensing (2009-03-11) [ Security Design ]
• Acquisition gives Microchip compiler expertise (2009-03-11) [ EDA ]

• Warm welcome for wireless power? (2009-03-11) [ Power Design ]
• Collaboration to deliver enterprise 10GbE adapters (2009-03-11) [ Programmable Logic ]
• R<SUP>3</SUP>Logic to advance 3D design flow R&D (2009-03-11) [ Embedded Systems ]
• Ruiz sees shifting consumer concern to value (2009-03-11) [ Process/Manufacturing ]
• Light-emitting nanotube gets efficiency boost (2009-03-11) [ Optical Electronics and Display ]

• Comms services hype wanes (2009-03-11) [ RF/Wireless Design ]
• Xi'an HTDZ rises as China's R&D hotbed (2009-03-11) [ EDA ]