• Recession calls for balance (2009-03-10) [ EDA ]
• Fear not! The replacement is here (2009-03-10) [ RF/Wireless Design ]
• Submarine cable to link Tunisia, Italy (2009-03-10) [ Network Design ]
• iSuppli posts positive outlook for smart phones (2009-03-10) [ RF/Wireless Design ]
• Gemalto to obtain NXP's mobile services biz (2009-03-10) [ RF/Wireless Design ]

• Murata, CSR fete partnership milestone (2009-03-10) [ Process/Manufacturing ]
• Bad news for Japan tool, materials markets (2009-03-10) [ Process/Manufacturing ]
• Graphics chipset: end in sight? (2009-03-10) [ Optical Electronics and Display ]
• Elpida, Micron vie for Taiwan DRAM rule (2009-03-10) [ Buffer/Storage ]
• Analyst: Spansion has three options (2009-03-10) [ Process/Manufacturing ]

• Digital radio test covers FM land mobile (2009-03-10) [ Design Test ]
• DC/DC regulator is electromagnetic compliant (2009-03-10) [ Power Design ]
• Probe system meets new network protocols (2009-03-10) [ Design Test ]
• Measure subsystem handles up to 576 channels (2009-03-10) [ Design Test ]
• 8bit MCUs include RTCC, other peripherals (2009-03-10) [ Control Design ]

• Transceivers tout integrated power converter (2009-03-10) [ EMI/EMC Design ]
• Chips eye computationally intensive apps (2009-03-10) [ Interface Design ]
• Multicore drives customizable hearing aid (2009-03-10) [ Embedded Systems ]
• Is LTE crushing WiMAX? (2009-03-09) [ RF/Wireless Design ]
• 30MW PV plant to rise in Austin, Texas (2009-03-09) [ Power Design ]

• Intel invests in high-performance computing R&D (2009-03-09) [ Embedded Systems ]
• Murata, Lineage ink PoL power licensing deal (2009-03-09) [ Power Design ]
• ARM-based netbooks face software roadblock (2009-03-09) [ Embedded Systems ]
• VDC: Embedded processors defy downturn (2009-03-09) [ Embedded Systems ]
• Report: Taiwan plans DRAM venture (2009-03-09) [ Buffer/Storage ]

• Embedded, connectivity ICs shine in gloomy market (2009-03-09) [ RF/Wireless Design ]
• Switches come in manual, electrical versions (2009-03-09) [ Network Design ]
• Oscillator touts low BER at high-speed transfers (2009-03-09) [ Signal Conditioning ]
• Crypto security solution prevents firmware theft (2009-03-09) [ Security Design ]
• Touch sensing software for MCUs cuts BOM cost (2009-03-09) [ Sensor Technology ]

• Capacitors reduce acoustic noise in CE apps (2009-03-09) [ Embedded Systems ]
• Front-end modules address size demands (2009-03-09) [ RF/Wireless Design ]
• Single board computer designed for portables (2009-03-09) [ Embedded Systems ]
• Conversion algorithm to boot conventional TVs (2009-03-09) [ Embedded Systems ]
• Performing DAC operations with CPLDs (2009-03-06) [ Programmable Logic ]

• Multicamera system boosts safe driving (2009-03-06) [ Optical Electronics and Display ]
• Digital power solution saves energy, cuts CO<SUB>2</SUB> emission (2009-03-06) [ Power Design ]
• Content processor now supports RMI multicores (2009-03-06) [ Embedded Systems ]
• SBC tailored for low-end PC/104 market (2009-03-06) [ Embedded Systems ]
• 'First' quarter-inch image sensors integrate EDoF (2009-03-06) [ Sensor Technology ]

• RF mixers fit for high-dynamic range apps (2009-03-06) [ RF/Wireless Design ]
• Software platform to drive in-car infotainment (2009-03-06) [ Embedded Systems ]
• Platform aims to cut PHY design time (2009-03-06) [ RF/Wireless Design ]
• NEC LCD restructures, to close Kagoshima plant (2009-03-06) [ Process/Manufacturing ]
• Bosch taps Lam's deep silicon etch system (2009-03-06) [ Process/Manufacturing ]

• Nokia Siemens supports TD-LTE tech rollout (2009-03-06) [ RF/Wireless Design ]
• 120Hz panel shipments reached 3.3M in Q4 08 (2009-03-06) [ Optical Electronics and Display ]
• AMD foundry spinoff christened 'GlobalFoundries' (2009-03-06) [ Process/Manufacturing ]
• What will TSMC gain from Intel deal? (2009-03-06) [ Process/Manufacturing ]
• Litho woes: R&D gap, downturn (2009-03-06) [ Process/Manufacturing ]

• Analysis: Should NXP file for bankruptcy? (2009-03-06) [ Process/Manufacturing ]
• Germany is crowned solar power star (2009-03-05) [ Power Design ]
• Freescale, arivus develop OFDM PLC solutions (2009-03-05) [ Network Design ]
• Agreement promotes standard specs for RF remotes (2009-03-05) [ RF/Wireless Design ]
• AMD transaction sets stage for The Foundry Company (2009-03-05) [ Process/Manufacturing ]

• Energy efficiency center rises in Dresden (2009-03-05) [ Power Design ]
• Analysis: Intel-ARM rivalry heats up (2009-03-05) [ Embedded Systems ]
• Intel's Barrett: Invest in education, R&D (2009-03-05) [ Process/Manufacturing ]
• Firms team on car infotainment common platform (2009-03-05) [ Embedded Systems ]
• DC/DC regulators withstand extreme temp (2009-03-05) [ Power Design ]

• Free IAR Workbench supports LEGO Mindstorms (2009-03-05) [ Embedded Systems ]
• IP access control ensures high security at low cost (2009-03-05) [ Security Design ]
• High-voltage photocouplers meet UL safety standards (2009-03-05) [ Optical Electronics and Display ]
• Echelon's LonWorks suite gets a makeover (2009-03-05) [ Network Design ]
• Low-cost DaVinci packs increased encoding power (2009-03-05) [ Control Design ]

• Industrial interface converter is ruggedized (2009-03-05) [ EMI/EMC Design ]
• Fourth-gen MCUs achieve up to 100MHz (2009-03-05) [ Embedded Systems ]
• Make engineering fun for kids (2009-03-04) [ EDA ]
• Achieve differentiation through IP reuse (2009-03-04) [ EDA ]
• Micro detect switch packs extended life cycles (2009-03-04) [ Network Design ]

• Atom-powered modules fit for 'light' computing apps (2009-03-04) [ Embedded Systems ]
• Audio selector saves PCB space, costs (2009-03-04) [ Signal Conditioning ]
• Oscillators cut current use to 5&#181A (2009-03-04) [ Signal Conditioning ]
• Chip LEDs tout brightness, energy efficiency (2009-03-04) [ Optical Electronics and Display ]
• Flyback DC/DC controller suitable for several apps (2009-03-04) [ Power Design ]

• Atom supports variety of packages, temp (2009-03-04) [ Embedded Systems ]
• Chips link analog phones to ADSL (2009-03-04) [ Signal Conditioning ]
• Handset-based navigation gains momentum (2009-03-04) [ RF/Wireless Design ]
• NEC picks Virage to provide IP for 40nm (2009-03-04) [ EDA ]
• Intel, TSMC to collaborate on Atom (2009-03-04) [ Embedded Systems ]

• Scientists shed light on nano-thermal management (2009-03-04) [ EDA ]
• Deconstructing source-mask optimization tech (2009-03-04) [ Process/Manufacturing ]
• Consortium eyes Qimonda PV operations (2009-03-04) [ Power Design ]
• Fabless firms inch up top IC vendor list (2009-03-04) [ Process/Manufacturing ]
• Analyst confident on RF rebound in '09 (2009-03-04) [ RF/Wireless Design ]

• Intel vs. Qualcomm (2009-03-03) [ Process/Manufacturing ]
• Striving for wireless glory (2009-03-03) [ RF/Wireless Design ]
• Electronic babble? (2009-03-03) [ EDA ]
• Power modules come in eco-friendly packages (2009-03-03) [ Power Design ]
• MIMO antennas hype improved data throughput (2009-03-03) [ RF/Wireless Design ]

• Reflective memory PMC ensures data security (2009-03-03) [ Buffer/Storage ]
• Self-test device packs CPU interface support (2009-03-03) [ Design Test ]
• EEPROM devices tout 1.5V operating voltage (2009-03-03) [ Buffer/Storage ]
• Tyco unleashes cabling system's new version (2009-03-03) [ EMI/EMC Design ]
• Toshiba expands MOSFET lines (2009-03-03) [ Signal Conditioning ]

• A/V interface suits advanced security systems (2009-03-03) [ Security Design ]
• Sematech, Asahi Glass to improve EUV mask blank yield (2009-03-03) [ Process/Manufacturing ]
• China's car electronics swerves to the slow lane (2009-03-03) [ Embedded Systems ]
• Tokyo Electron, Oerlikon Solar team up for PV (2009-03-03) [ Process/Manufacturing ]
• 22nm chips to be developed by trio (2009-03-03) [ EDA ]

• TSMC details litho roadmap, taps maskless (2009-03-03) [ Process/Manufacturing ]
• Intel dips $62.9M R&D investment in Ireland (2009-03-03) [ Process/Manufacturing ]
• Spansion files for bankruptcy (2009-03-03) [ Process/Manufacturing ]
• Will Nokia deal boost Qualcomm market share? (2009-03-03) [ RF/Wireless Design ]
• Bleak week for memory chipmakers (2009-03-02) [ Process/Manufacturing ]

• Ref design fuses LCD power supply, inverter (2009-03-02) [ Optical Electronics and Display ]
• High-efficiency power supplies flaunt slim form (2009-03-02) [ Power Design ]
• Customizable MCU dev't kit packs 2M logic gates (2009-03-02) [ Control Design ]
• ADC claims highest SNR at over 500MHz (2009-03-02) [ Signal Conditioning ]
• Software tool accelerates ECU efficiency (2009-03-02) [ Embedded Systems ]

• Camera platform features enhanced processing (2009-03-02) [ Embedded Systems ]
• DC motor driver boasts 500mA output currents (2009-03-02) [ Power Design ]
• Verification tools receive upgrades (2009-03-02) [ EDA ]
• Carl Zeiss embarks on microscopy project (2009-03-02) [ Test & Packaging ]
• IP shipments to see double by 2012 (2009-03-02) [ EDA ]

• Lab makes room for Agilent oscilloscopes (2009-03-02) [ Design Test ]
• Auto semi faces growth brakes (2009-03-02) [ Sensor Technology ]
• Opinion: Android won't be stuck in handsets (2009-03-02) [ Embedded Systems ]
• ICs could reap $2B in alternative energy (2009-03-02) [ Power Design ]
• Panelists skeptical on next-gen litho (2009-03-02) [ Process/Manufacturing ]

• Intel contests 'netbook' copyright claims (2009-03-02) [ Embedded Systems ]