• Crossing paths: netbooks and smart phones (2009-02-27) [ RF/Wireless Design ]
• AC vs. DC—The Westinghouse/Edison War Continues… (2009-02-27) [ Power Design ]
• How the portable gaming industry matured (Part 1) (2009-02-27) [ Embedded Systems ]
• Base station chipset packs UMTS interface (2009-02-27) [ RF/Wireless Design ]
• Buck regulator promises high efficiency (2009-02-27) [ Power Design ]

• Connectors free up space for components (2009-02-27) [ Network Design ]
• Modules improve handset efficiency (2009-02-27) [ RF/Wireless Design ]
• IC family claims improved RF performance (2009-02-27) [ RF/Wireless Design ]
• Series digitizer touts high speed, resolution (2009-02-27) [ Programmable Logic ]
• Integrated battery charger supplies 2A charge current (2009-02-27) [ EMI/EMC Design ]

• ARM processor suits low-power apps (2009-02-27) [ Control Design ]
• ADI acquires power-line carrier tech (2009-02-27) [ Power Design ]
• Nokia Siemens gains China design wins (2009-02-27) [ RF/Wireless Design ]
• WiMAX's massive network: 430M people (2009-02-27) [ RF/Wireless Design ]
• Partners enhance process co-optimization (2009-02-27) [ Process/Manufacturing ]

• Gartner sounds alarm over revenue dip (2009-02-27) [ Process/Manufacturing ]
• Opinion: UWB outlook gets bleaker (2009-02-27) [ RF/Wireless Design ]
• G.hn brings rivals under one roof (2009-02-27) [ Network Design ]
• Analysis: What slows down tech innovation? (2009-02-27) [ EDA ]
• Will DisplayPort get a second chance? (2009-02-26) [ Design Test ]

• Back to the future (2009-02-26) [ EDA ]
• DC/DC converters handle wide-input voltage apps (2009-02-26) [ Power Design ]
• Pulsers boast faster ramp time, less delay (2009-02-26) [ Signal Conditioning ]
• Solution eases on-site testing (2009-02-26) [ Design Test ]
• Digital intercoms keep cars connected (2009-02-26) [ RF/Wireless Design ]

• Clock generator simplifies nets, comms (2009-02-26) [ Network Design ]
• 65nm FPGAs, clock ICs defy downturn (2009-02-26) [ Programmable Logic ]
• ARM-based processor drives plugtop PC (2009-02-26) [ Embedded Systems ]
• 'First' flexible touchscreen makes touchdown (2009-02-26) [ Optical Electronics and Display ]
• With acquisition, Hitachi joins external storage fray (2009-02-26) [ Buffer/Storage ]

• Collaboration to bring 42nm flash optimization (2009-02-26) [ Buffer/Storage ]
• U.S. Court denies injunction barring Hynix (2009-02-26) [ Buffer/Storage ]
• AMOLEDs sparkled in '08 (2009-02-26) [ Optical Electronics and Display ]
• Siano sets sight on China electronics (2009-02-26) [ RF/Wireless Design ]
• Chip vendors unite for e-beam initiative (2009-02-26) [ Process/Manufacturing ]

• Firms gear for EUV litho despite tool delay (2009-02-26) [ Process/Manufacturing ]
• Japan electronics giants struggle to stay on top (2009-02-26) [ Process/Manufacturing ]
• Power Tip #1: Dealing with power supply's trade-offs (2009-02-25) [ Embedded Systems ]
• Plug and Play IP goal remains "elusive" or is becoming tangible? (2009-02-25) [ EDA ]
• Standard, custom fan trays cool telecom apps (2009-02-25) [ EMI/EMC Design ]

• Online simulation tool trims design time (2009-02-25) [ EDA ]
• USB converter cables back RS-422, RS-485 (2009-02-25) [ Interface Design ]
• Touch controller runs on all-digital process (2009-02-25) [ Sensor Technology ]
• MEMS sensor tracks air pressure (2009-02-25) [ Sensor Technology ]
• Design environment aims to cut dev't time (2009-02-25) [ Buffer/Storage ]

• Researchers demo reversible diode (2009-02-25) [ Power Design ]
• Aggregation switches ease I/O bottlenecks (2009-02-25) [ Interface Design ]
• Micron to phase out 200mm production (2009-02-25) [ Buffer/Storage ]
• Atmel module to secure 'first' NFC wallet (2009-02-25) [ Security Design ]
• Difficulties to haunt China's IC industry (2009-02-25) [ Process/Manufacturing ]

• ASE, AMPI: new power, MOSFET allies (2009-02-25) [ Power Design ]
• Quest continues for Spansion white knight (2009-02-25) [ Process/Manufacturing ]
• Downturn won't slow 40/100GbE takeoff (2009-02-25) [ Network Design ]
• Intel: EUV litho roadblocks ahead (2009-02-25) [ Process/Manufacturing ]
• Will Synopsys rule the EDA world? (2009-02-25) [ EDA ]

• LTE: Up for a test (2009-02-24) [ Design Test ]
• 'Goodwill' dole outs hurt tech asset value (2009-02-24) [ Process/Manufacturing ]
• Comment: Wasted calls (2009-02-24) [ Digital Signal Processing ]
• The greatest mobile device design challenge: power management (2009-02-24) [ RF/Wireless Design ]
• ST champions Green Power at IIC-China (2009-02-24) [ Embedded Systems ]

• 2.2MW solar power system completed in California (2009-02-24) [ Power Design ]
• Notebooks to feature 3G Internet connectivity (2009-02-24) [ RF/Wireless Design ]
• Markets open doors to carbon nanotubes (2009-02-24) [ Process/Manufacturing ]
• LG handset taps TrueTouch solution (2009-02-24) [ Interface Design ]
• Universal charger set for 2012 debut (2009-02-24) [ Power Design ]

• Qimonda U.S. files for bankruptcy, too (2009-02-24) [ Buffer/Storage ]
• $19B stimulus to boost health IT advancement (2009-02-24) [ Embedded Systems ]
• ADI consolidates fabs amid sales drop (2009-02-24) [ Process/Manufacturing ]
• DC/DC converter delivers up to 5.25V (2009-02-24) [ Power Design ]
• Control boards fuse high performance, flexibility (2009-02-24) [ Embedded Systems ]

• Low-cost handsets pack NFC capability (2009-02-24) [ RF/Wireless Design ]
• Power inductor fits automotive, industrial apps (2009-02-24) [ Signal Conditioning ]
• Allegro intros Hall-effect switches, latches (2009-02-24) [ Network Design ]
• Agilent offers 'first' LTE real-time base station test (2009-02-24) [ Design Test ]
• Silicon tuner provides artifact-free reception (2009-02-24) [ RF/Wireless Design ]

• Enterprise wireless sensor module now sampling (2009-02-24) [ RF/Wireless Design ]
• BiCMOS options lock in on optoelectronics (2009-02-23) [ Process/Manufacturing ]
• LED drivers come with all the circuitry (2009-02-23) [ Optical Electronics and Display ]
• 3G solution banks on low-cost promise (2009-02-23) [ RF/Wireless Design ]
• Evaluation modules facilitate USB 2.0 development (2009-02-23) [ Design Test ]

• 45nm smart phone ICs join OMAP family (2009-02-23) [ Embedded Systems ]
• GSM-GPRS add-on meets time-to-market demands (2009-02-23) [ RF/Wireless Design ]
• Low-cost connectors back high-speed transmission (2009-02-23) [ Interface Design ]
• Graphics IP cores aim at entry-level handsets (2009-02-23) [ Control Design ]
• Imagis to integrate haptic tech in CE chips (2009-02-23) [ Optical Electronics and Display ]

• Researchers craft nanoscale one-stop shop platform (2009-02-23) [ EDA ]
• Maxim, UEI purchase certain Zilog assets (2009-02-23) [ Security Design ]
• Apache, ST to address 45nm, 32nm issues (2009-02-23) [ EDA ]
• Pondering the Nokia/Qualcomm lovefest (2009-02-23) [ RF/Wireless Design ]
• The lowdown on the fab tool market (2009-02-23) [ Process/Manufacturing ]

• Embedded modem growth trips over downturn (2009-02-23) [ RF/Wireless Design ]
• Reality bites LTE rollout (2009-02-23) [ RF/Wireless Design ]