• Is mindshare shifting from CPU to GPU? Intel to Nvidia? (2009-02-20) [ Process/Manufacturing ]
• FPGA outsourcing: 10 questions to ask (2009-02-20) [ Programmable Logic ]
• MIMO antenna improves WLAN operations (2009-02-20) [ RF/Wireless Design ]
• USB module supports RS232-based apps (2009-02-20) [ Interface Design ]
• Supervisor circuits pack battery backup, CE gating (2009-02-20) [ Power Design ]

• UV LEDs target medical, industrial apps (2009-02-20) [ Optical Electronics and Display ]
• PFC controller IC is extremely efficient (2009-02-20) [ Power Design ]
• Murata intros Okami DC/DC converter models (2009-02-20) [ Power Design ]
• Actel's Igloo nano starter kits now available (2009-02-20) [ Programmable Logic ]
• 65nm SoC caters to CMMB (2009-02-20) [ RF/Wireless Design ]

• 2008: downturn, changes for telco broadband (2009-02-20) [ RF/Wireless Design ]
• Nvidia: agreement with Intel still applies (2009-02-20) [ Embedded Systems ]
• Italy awaits 2.2MW solar power plant (2009-02-20) [ Power Design ]
• Qualcomm, LG to bring energy-efficient displays (2009-02-20) [ Optical Electronics and Display ]
• Downturn bleeds DRAM makers dry (2009-02-20) [ Buffer/Storage ]

• AMD foundry spin-off gets green light (2009-02-20) [ Process/Manufacturing ]
• India modernization to boost chip market (2009-02-20) [ Process/Manufacturing ]
• Applied stays positive, banks on solar (2009-02-20) [ Process/Manufacturing ]
• iPod look-alike packs extra surprises (2009-02-19) [ Buffer/Storage ]
• Rapid prototyping & core vs. context (2009-02-19) [ EDA ]

• GPS IC promises up to 165dBM sensitivity (2009-02-19) [ RF/Wireless Design ]
• Baseband ref design suits eight-user femtocells (2009-02-19) [ EDA ]
• Audio power amp comes with electric volume (2009-02-19) [ Signal Conditioning ]
• Compact battery charger delivers up to 2A (2009-02-19) [ Power Design ]
• Highly integrated transmitter IC reduces BOM (2009-02-19) [ RF/Wireless Design ]

• Voltage regulators reckon energy efficiency (2009-02-19) [ Buffer/Storage ]
• Chip supports Infiniband, Ethernet, Fibre Channel (2009-02-19) [ Network Design ]
• Power converter harnesses green energy (2009-02-19) [ Signal Conditioning ]
• Netlogic, Wintegra to co-develop reference solution (2009-02-19) [ Security Design ]
• PV manufacturer gains stake in Asia Silicon (2009-02-19) [ Power Design ]

• Fujitsu to transfer HDD biz to Toshiba (2009-02-19) [ Buffer/Storage ]
• Duo to provide smart phone platform (2009-02-19) [ RF/Wireless Design ]
• Nokia and Qualcomm: foes to partners (2009-02-19) [ RF/Wireless Design ]
• Analyst skeptical on Broadcom's 3G design wins (2009-02-19) [ RF/Wireless Design ]
• NAND flash recovery underway? (2009-02-19) [ Buffer/Storage ]

• Survey: Consumers want power-efficient apps (2009-02-19) [ Power Design ]
• Gartner predicts the future (2009-02-18) [ Process/Manufacturing ]
• Is energy harvesting ready to boot batteries? (2009-02-18) [ Power Design ]
• Testing an OFDM-based MIMO system (2009-02-18) [ Design Test ]
• Rev up efficiency of motor-control based designs (2009-02-18) [ Control Design ]

• Inventing the future (2009-02-18) [ EDA ]
• True-rms ammeters promise accurate reading (2009-02-18) [ Design Test ]
• Inductors handle high transient current spikes (2009-02-18) [ Signal Conditioning ]
• Connector plugs offer molded locking system (2009-02-18) [ Network Design ]
• Low noise op amps eye optical sensors (2009-02-18) [ Signal Conditioning ]

• MLC NOR flash in 45nm now sampling (2009-02-18) [ Buffer/Storage ]
• 2MHz LED driver suits compact apps (2009-02-18) [ Power Design ]
• Video encoder for mobiles supports 1,080p (2009-02-18) [ Embedded Systems ]
• Startup targets 'an Internet of things' (2009-02-18) [ RF/Wireless Design ]
• Juniper, Nokia to deliver fully interoperable Carrier Ethernet (2009-02-18) [ RF/Wireless Design ]

• Slowdown marks China mobile handset chip market (2009-02-18) [ RF/Wireless Design ]
• ARM acquires video IP company (2009-02-18) [ Embedded Systems ]
• LG, Intel cruise to 'Moorestown' (2009-02-18) [ Embedded Systems ]
• Solar-powered handsets, anyone? (2009-02-18) [ RF/Wireless Design ]
• Databeans: Chip recovery on the way (2009-02-18) [ Process/Manufacturing ]

• Computer science needs overhaul (2009-02-18) [ Embedded Systems ]
• Nokia finds opportunities in downturn (2009-02-18) [ RF/Wireless Design ]
• Who's immune to the global downturn? (2009-02-17) [ Process/Manufacturing ]
• Show engineering some love (2009-02-17) [ EDA ]
• Building strength amid the storm (2009-02-17) [ Programmable Logic ]

• LEDs spreading light all around (2009-02-17) [ Optical Electronics and Display ]
• STB module delivers pocket TV experience (2009-02-17) [ Embedded Systems ]
• Gobi2000 module supports 5.76Mbit/s uplink (2009-02-17) [ RF/Wireless Design ]
• GaAs LNA fits one-segment broadcasting (2009-02-17) [ RF/Wireless Design ]
• PV cell connector gets UL-certified (2009-02-17) [ Network Design ]

• GSM/GPRS/Edge dev't system unveiled (2009-02-17) [ RF/Wireless Design ]
• Signal amps facilitate faster Internet (2009-02-17) [ Signal Conditioning ]
• Primetime now enables 2x faster runtime (2009-02-17) [ EDA ]
• Implantable ICs to advance medical R&D (2009-02-17) [ RF/Wireless Design ]
• Wi-Fi-enabled phones to double in numbers (2009-02-17) [ RF/Wireless Design ]

• Tower, Triune to collaborate on power management platform (2009-02-17) [ Process/Manufacturing ]
• Phones with embedded projection emerge (2009-02-17) [ Optical Electronics and Display ]
• Volkswagen, Toshiba to cooperate on next-gen vehicles (2009-02-17) [ Embedded Systems ]
• Chip packaging houses in red, too (2009-02-17) [ Test & Packaging ]
• What is Spansion's next move? (2009-02-17) [ Buffer/Storage ]

• Foundry watch: TSMC stays on top (2009-02-17) [ Process/Manufacturing ]
• Analysis: Intel's $7B fab plan (2009-02-17) [ Process/Manufacturing ]
• Uncovering static analysis pitfalls (2009-02-16) [ Design Test ]
• USB 3.0 Speeds—now and later (2009-02-16) [ Network Design ]
• 16bit PXI digitizers deliver up to 40MSps (2009-02-16) [ Design Test ]

• DC/DC converters offer high power in small package (2009-02-16) [ Power Design ]
• Low-power DACs come in SC70 packages (2009-02-16) [ Signal Conditioning ]
• GPS/GPRS chip cuts costs in handsets (2009-02-16) [ RF/Wireless Design ]
• Flash MCMs flaunt low power feature (2009-02-16) [ Buffer/Storage ]
• At ISSCC, transceivers reach giga-heights (2009-02-16) [ RF/Wireless Design ]

• Self-aligning nanotech targets display, solar markets (2009-02-16) [ Process/Manufacturing ]
• Silicon resonator consumes 1,000x less power (2009-02-16) [ Power Design ]
• iSuppli: no great expectations for EMS/ODM (2009-02-16) [ Process/Manufacturing ]
• Ramtron to install F-RAM process tech in IBM facility (2009-02-16) [ Process/Manufacturing ]
• Microchip won't pursue Atmel (2009-02-16) [ Control Design ]

• Industry welcomes ST-Ericsson JV (2009-02-16) [ RF/Wireless Design ]
• Buzz: UWB shakeout claims Tzero (2009-02-16) [ RF/Wireless Design ]
• Wireless eyes digital photo frames (2009-02-16) [ Optical Electronics and Display ]
• Panel questions future of MID market (2009-02-16) [ RF/Wireless Design ]
• Intel ventures into optical interconnects (2009-02-16) [ Network Design ]

• Dealing with statically detected defects (2009-02-13) [ Design Test ]
• Battle commences in 50nm DRAM arena (2009-02-13) [ Buffer/Storage ]
• Still dreaming of a plug-and-play IP (2009-02-13) [ EDA ]
• What's in store for P1801 (Unified Power Format)? (2009-02-13) [ EDA ]
• IR sensor features long detection range (2009-02-13) [ Sensor Technology ]

• DC/DC regulator delivers up to 120W (2009-02-13) [ Power Design ]
• Power supplies come in fan-cooled models (2009-02-13) [ Power Design ]
• PMIC cuts design cycle time (2009-02-13) [ Power Design ]
• Wireless USB SoC delivers 120Mbit/s data rate (2009-02-13) [ Interface Design ]
• 40G building blocks showcased at ISSCC (2009-02-13) [ RF/Wireless Design ]

• Implantable SoC improves drug therapy (2009-02-13) [ Embedded Systems ]
• DSP architecture aims at 4G (2009-02-13) [ RF/Wireless Design ]
• Report: Q4 08 large TFT LCD shipments slipped (2009-02-13) [ Optical Electronics and Display ]
• Huawei, Intel open WiMAX test lab in China (2009-02-13) [ RF/Wireless Design ]
• Clear Skies to construct 2.1MW solar farm (2009-02-13) [ Power Design ]

• TI acquires Ciclon (2009-02-13) [ Process/Manufacturing ]
• MEMS accelerometers find place in CE (2009-02-13) [ Sensor Technology ]
• Dell drags Linux-ARM combo into Wintel PC (2009-02-13) [ Embedded Systems ]
• Test finds 3G handset reliability glitches (2009-02-13) [ RF/Wireless Design ]
• Buzz: Will UMC join IBM 'fab club'? (2009-02-13) [ Process/Manufacturing ]

• In-car info display boosts safe driving (2009-02-12) [ Optical Electronics and Display ]
• How to pluck delay from multicore interconnections (2009-02-12) [ Interface Design ]
• LED driver extends battery life in mobiles (2009-02-12) [ Optical Electronics and Display ]
• HD video IP core supports mobile apps, DTV (2009-02-12) [ EDA ]
• DC/DC converter offers 60V transient protection (2009-02-12) [ Power Design ]

• Overvoltage protectors handle up to 28V faults (2009-02-12) [ Power Design ]
• Cellphone-like prototyping tool stimulates creativity (2009-02-12) [ Embedded Systems ]
• Three-core DSP for LTE now sampling (2009-02-12) [ RF/Wireless Design ]
• Expanded Confirma prototyping platform introduced (2009-02-12) [ EDA ]
• Light sensor automates car's LCD control (2009-02-12) [ Sensor Technology ]

• Mobile TV: a fledgling to establish a foothold (2009-02-12) [ RF/Wireless Design ]
• Amid revamp, Spansion Japan operation continues (2009-02-12) [ Buffer/Storage ]
• Mobile WiMAX tech deploys in Russia (2009-02-12) [ RF/Wireless Design ]
• SiRF, CSR to join forces (2009-02-12) [ RF/Wireless Design ]
• Japan iPhone accessory enables TV viewing (2009-02-12) [ RF/Wireless Design ]

• AMD puts off foundry spin-off vote (2009-02-12) [ Process/Manufacturing ]
• Firms demo organic RFID breakthroughs (2009-02-12) [ RF/Wireless Design ]
• Five ways to beat IC scaling roadblocks (2009-02-12) [ Process/Manufacturing ]
• Back to basics: loving Layer 1 (2009-02-11) [ Network Design ]
• An uncertain way to make better chips (2009-02-11) [ EDA ]

• Effectively implement a static analysis tool (2009-02-11) [ Design Test ]
• PoCL frame grabber boasts 4Gbit/s transfer rate (2009-02-11) [ Interface Design ]
• Monolithic DrMOS delivers up to 20A load (2009-02-11) [ Power Design ]
• TVS diodes tout 67 W/mm² surge capability (2009-02-11) [ Power Design ]
• 3D camera solution simplifies handset design (2009-02-11) [ Optical Electronics and Display ]

• DDR cable assemblies provide 40Gbit/s speed (2009-02-11) [ EMI/EMC Design ]
• Chip integrates flurry of RF features (2009-02-11) [ RF/Wireless Design ]
• RISC/DSP MCU aims at industrial, control apps (2009-02-11) [ Digital Signal Processing ]
• Test platform for LTE is 'world's smallest' (2009-02-11) [ Design Test ]
• Taiwan awaits optical nets from CHT, Ericsson (2009-02-11) [ Network Design ]

• Samsung shaken by DRAM doldrums (2009-02-11) [ Buffer/Storage ]
• Qualcomm grants Linktop CDMA2000 patent license (2009-02-11) [ RF/Wireless Design ]
• 'Project Independence' to bring Xen-based client virtualization (2009-02-11) [ Embedded Systems ]
• China firm to lend Qimonda a hand? (2009-02-11) [ Buffer/Storage ]
• RF chips find big market in medical apps (2009-02-11) [ RF/Wireless Design ]

• Startup readies RRAMs for mass production (2009-02-11) [ Buffer/Storage ]
• Green tech to fuel IC innovation (2009-02-11) [ Process/Manufacturing ]