• GPS Snitch gets scrutinized (2009-01-30) [ RF/Wireless Design ]
• Designing power for the masses (2009-01-30) [ Power Design ]
• A call for more solar funding (2009-01-30) [ Process/Manufacturing ]
• PCIe boards deliver fast interconnect links (2009-01-30) [ Interface Design ]
• 3D graphics zoom in on HDTVs (2009-01-30) [ Optical Electronics and Display ]

• Step-down regulator touts 95% efficiency (2009-01-30) [ Power Design ]
• Shark fin antenna fits automobiles (2009-01-30) [ RF/Wireless Design ]
• Commex unveils dual-channel 10GbE NIC (2009-01-30) [ Interface Design ]
• Embedded box computer aims at several apps (2009-01-30) [ Embedded Systems ]
• MicroTCA system developed for ruggedized apps (2009-01-30) [ Design Test ]

• Solution to address stability problems (2009-01-30) [ Power Design ]
• Fujitsu to halt HDD head biz (2009-01-30) [ Process/Manufacturing ]
• Mosaid, Buffalo ink wireless license agreement (2009-01-30) [ RF/Wireless Design ]
• Report: Panasonic to shut down three plants (2009-01-30) [ Process/Manufacturing ]
• Joint research to reduce chip footprint by 10x (2009-01-30) [ EDA ]

• EC okays $600M aid for Crolles3 R&D project (2009-01-30) [ Process/Manufacturing ]
• IR light touted to boost solar cell power (2009-01-30) [ Optical Electronics and Display ]
• TI to keep wireless baseband biz (2009-01-30) [ RF/Wireless Design ]
• IBM faces workers' fury over more job cuts (2009-01-30) [ Process/Manufacturing ]
• The bad stuff impacting DDR timing budgets and ways to avoid 'em (2009-01-29) [ EDA ]

• Bridging options enable configurable computing (2009-01-29) [ Interface Design ]
• TFT LCD industry goes through hardest time in a decade (2009-01-29) [ Optical Electronics and Display ]
• Joint lab to work on future digital media apps (2009-01-29) [ RF/Wireless Design ]
• NIL, IMS collaborate on nanoimprint litho (2009-01-29) [ EDA ]
• Green tech gets a boost with new tech center (2009-01-29) [ EDA ]

• ST cost-cutting scheme affects 4,500 jobs (2009-01-29) [ Process/Manufacturing ]
• Intel advances RF energy harvesting tech (2009-01-29) [ RF/Wireless Design ]
• Analyst: IC market to plummet 28% in 2009 (2009-01-29) [ Process/Manufacturing ]
• TI braces for prolonged recession (2009-01-29) [ Process/Manufacturing ]
• Low-impedance capacitors handle up to 125°C (2009-01-29) [ Signal Conditioning ]

• Buck regulators boast ultrafast transient response (2009-01-29) [ Power Design ]
• Dual-output controller delivers up to 25A (2009-01-29) [ Power Design ]
• AVR microcontroller packs Touch-library (2009-01-29) [ Sensor Technology ]
• Freescale presents 'one-stop-shop' connectivity solution (2009-01-29) [ Network Design ]
• RJ-45 plug-in connector works with Fast, Gigabit Ethernet (2009-01-29) [ Interface Design ]

• LED arrays enter solid-state lighting market (2009-01-29) [ Optical Electronics and Display ]
• Energy initiative covers PCs, building controls (2009-01-29) [ Embedded Systems ]
• The myth of width: When wide screens don't work (2009-01-28) [ Process/Manufacturing ]
• The bright side of the economic depression (2009-01-28) [ Embedded Systems ]
• MIFARE revs up Moscow's AFC system (2009-01-28) [ RF/Wireless Design ]

• Netbook's time to shine has come (2009-01-28) [ Embedded Systems ]
• Maxim gains Innova, advances secure MCU tech (2009-01-28) [ Security Design ]
• Acquisition spawns company focusing on software (2009-01-28) [ Embedded Systems ]
• Researchers develop semiconducting 'buckytubes' (2009-01-28) [ Process/Manufacturing ]
• Downturn stalls Dow's Rohm and Haas takeover (2009-01-28) [ Process/Manufacturing ]

• TI profit crashes 86%, sheds jobs (2009-01-28) [ Process/Manufacturing ]
• Qimonda still in production amidst turmoil (2009-01-28) [ Buffer/Storage ]
• 24bit DACs match high-end home audio apps (2009-01-28) [ Signal Conditioning ]
• Network, spectrum analyzer simplifies TV design (2009-01-28) [ Design Test ]
• DC/DC converters transport up to 16W power (2009-01-28) [ Power Design ]

• Boost mode converter drives up to 40 white LEDs (2009-01-28) [ Optical Electronics and Display ]
• Passive equalizers augment transmission performance (2009-01-28) [ Interface Design ]
• Multicore processor zooms in on automotives (2009-01-28) [ Buffer/Storage ]
• MEMS oscillators extend handhelds' battery life (2009-01-28) [ Signal Conditioning ]
• Panel potentiometers come in compact form (2009-01-28) [ Power Design ]

• Driving reliable automotive designs (2009-01-27) [ Programmable Logic ]
• Is Sony a bellwether for Japan Inc.? (2009-01-27) [ Process/Manufacturing ]
• Deconstructing Samsung's reshuffle (2009-01-27) [ Process/Manufacturing ]
• Restructuring: Will it resurrect Qimonda? (2009-01-27) [ Buffer/Storage ]
• RS-232 transceivers deliver up to 3Mbit/s data rate (2009-01-27) [ RF/Wireless Design ]

• Connectors highlight easy-locking for automotives (2009-01-27) [ Network Design ]
• ST 65nm RF platform includes GoldenGate simulation (2009-01-27) [ Design Test ]
• Tiny power MOSFETs offer backside insulation (2009-01-27) [ Power Design ]
• CEVA unveils 'most compact, power-efficient' platform for HD audio (2009-01-27) [ Digital Signal Processing ]
• Touch panel computer targets factory automation (2009-01-27) [ Process/Manufacturing ]

• Configurable processor suits power-, space-constrained apps (2009-01-27) [ Control Design ]
• Solido addresses process variation challenges (2009-01-27) [ EDA ]
• ZTE picks Apexone's amplifiers for advanced handsets (2009-01-27) [ Signal Conditioning ]
• LG steps up clean energy drive (2009-01-27) [ Power Design ]
• China's handset market bound for growth (2009-01-27) [ RF/Wireless Design ]

• Qualcomm grants LT Mobile CDMA2000 license (2009-01-27) [ RF/Wireless Design ]
• Japan fab-tool, materials markets plunge (2009-01-27) [ Process/Manufacturing ]
• Intel-AMD spat brewing over foundry venture? (2009-01-27) [ EDA ]
• $1B capex club finds fewer members (2009-01-27) [ Process/Manufacturing ]
• Analysis: Qimonda folds, who's next? (2009-01-27) [ Buffer/Storage ]

• Netbooks: good for consumers, bad for the tech economy? (2009-01-26) [ Embedded Systems ]
• iSuppli: China IC market to tumble (2009-01-26) [ Process/Manufacturing ]
• Comment: Unlocking Apple's secret formula (2009-01-26) [ Process/Manufacturing ]
• Reports: Qimonda bailout hits roadblock (2009-01-26) [ Buffer/Storage ]
• What's the best way to cope with recession? (2009-01-26) [ Process/Manufacturing ]

• Fairchild earns design wins from China centers (2009-01-26) [ Optical Electronics and Display ]
• Sanyo adopts Xilinx FPGAs for surveillance cams (2009-01-26) [ Security Design ]
• Dongfeng, Freescale to put up auto electronics lab in China (2009-01-26) [ Embedded Systems ]
• Greenpeace challenges CE companies to go greener (2009-01-26) [ Process/Manufacturing ]
• Tiny IR receivers come in 3 versions (2009-01-26) [ Optical Electronics and Display ]

• Sunon unveils low-noise LED cooling module (2009-01-26) [ EMI/EMC Design ]
• Amp provides precision monitoring for portables (2009-01-26) [ Signal Conditioning ]
• PXI digitizers offer high-impedance mezzanine (2009-01-26) [ Design Test ]
• Bourns expands SMT power resistor product line (2009-01-26) [ Process/Manufacturing ]
• Tektronix debuts 'fastest' serial data analysis oscilloscopes (2009-01-26) [ Design Test ]

• zFAST synthesis capabilities handle large designs (2009-01-26) [ EDA ]
• Market welcomes 'smallest' GPS combo handset device (2009-01-26) [ RF/Wireless Design ]
• Batteries not included (2009-01-23) [ Power Design ]
• Japan rules as most innovative nation (2009-01-23) [ EDA ]
• Taking the wrap off a 50-year old radio (2009-01-23) [ RF/Wireless Design ]

• How to weather the economic storm (2009-01-23) [ EDA ]
• TSMC denies layoff plans (2009-01-23) [ Process/Manufacturing ]
• Apple defies economic crunch (2009-01-23) [ Process/Manufacturing ]
• ChipMOS drops packaging deal with Spansion (2009-01-23) [ Test & Packaging ]
• Intel succumbs to job cuts, fab shutdown (2009-01-23) [ Process/Manufacturing ]

• Gartner's take on telepresence, predictions for '09 (2009-01-23) [ RF/Wireless Design ]
• Partners to push phase change memory development (2009-01-23) [ EDA ]
• Indonesia comms provider taps Fujitsu, NSW for optic-fiber nets (2009-01-23) [ Network Design ]
• China phone makers pick Siano chip for CMMB Mobile TV (2009-01-23) [ RF/Wireless Design ]
• Power amplifiers on the hot seat (2009-01-23) [ RF/Wireless Design ]

• 5.8GHz transmitter meets China e-toll standard (2009-01-23) [ RF/Wireless Design ]
• Low-power ADCs cut external component count (2009-01-23) [ Signal Conditioning ]
• LVDTs handle deep water monitoring (2009-01-23) [ Test & Packaging ]
• Crystal-free optical nav ICs fit tilt wheels (2009-01-23) [ Interface Design ]
• IP core enables next-gen 40Gbit/s systems (2009-01-23) [ Interface Design ]

• Solar energy harvesting kit powers wireless sensor nets (2009-01-23) [ Power Design ]
• IMS unwraps power splitters for broadcast apps (2009-01-23) [ RF/Wireless Design ]
• 'First' 1Gbit XDR DRAM boasts 7.2GHz speed (2009-01-23) [ Buffer/Storage ]
• CES 2009 take-aways (2009-01-22) [ EDA ]
• Suntech also eyes Masdar City (2009-01-22) [ Power Design ]

• LEDs shine bright in bleak IC market (2009-01-22) [ Optical Electronics and Display ]
• When will U.K.'s digital radio take off? (2009-01-22) [ RF/Wireless Design ]
• Report: ProMOS offloads fab gear to TSMC (2009-01-22) [ Process/Manufacturing ]
• Memory makers should consolidate, drop bailouts (2009-01-22) [ Buffer/Storage ]
• Qualcomm buys AMD's graphics, multimedia assets (2009-01-22) [ Control Design ]

• NEC, ArrayComm to jointly develop WiMAX products (2009-01-22) [ RF/Wireless Design ]
• 2009: year of green FPD implementation (2009-01-22) [ Optical Electronics and Display ]
• Thermoelectric coolers match optoelectronics, telecom apps (2009-01-22) [ EMI/EMC Design ]
• BER reference design rolls for 100G Ethernet testing (2009-01-22) [ Design Test ]
• Key switches boast improved tactile feedback (2009-01-22) [ Sensor Technology ]

• Connector packs Ethernet, MVB cable lines (2009-01-22) [ Network Design ]
• FET op amp fit for medical, portable devices (2009-01-22) [ Embedded Systems ]
• Tools support layered modeling based on TLM-2.0 (2009-01-22) [ EDA ]
• New-gen ULC handset platform unveiled (2009-01-22) [ RF/Wireless Design ]
• Synthesis tools' new versions promise better performance (2009-01-22) [ EDA ]

• Organic solar for energy harvesting (2009-01-21) [ Power Design ]
• Rapid prototyping bolsters efficiency (2009-01-21) [ Embedded Systems ]
• Frequency domain tutorial: Understanding spectral components (Part I) (2009-01-21) [ RF/Wireless Design ]
• Firms cut jobs, working time to weather crisis (2009-01-21) [ Process/Manufacturing ]
• Uncertainty forces Intel to skip Q1 forecast (2009-01-21) [ Process/Manufacturing ]

• Comment: CES 2009 hits and misses (2009-01-21) [ Optical Electronics and Display ]
• Programmable broadband heightens PC TV hype (2009-01-21) [ RF/Wireless Design ]
• 3G dongles, datacards see promising uptake in Asia (2009-01-21) [ RF/Wireless Design ]
• ST's MEMS sales soared in '08 (2009-01-21) [ Embedded Systems ]
• Contactless MCU chip to power Germany's ticketing system (2009-01-21) [ Embedded Systems ]

• Firms promote conductive ink for TFT-LCDs (2009-01-21) [ Optical Electronics and Display ]
• 6A buck regulator suits multicell batteries (2009-01-21) [ Power Design ]
• Inductors handle low, medium current apps (2009-01-21) [ Signal Conditioning ]
• Atmel MPUs come with free Windows support package (2009-01-21) [ Embedded Systems ]
• FPI gaskets deliver improved features (2009-01-21) [ Process/Manufacturing ]

• FPGA-based motor control development platform rolls (2009-01-21) [ Programmable Logic ]
• Digital multimeters aim at electronics, general industrial apps (2009-01-21) [ Test & Packaging ]
• Verification tool provides step-by-step approach (2009-01-21) [ EDA ]
• Startup samples display-battery modules (2009-01-21) [ Optical Electronics and Display ]