• Trouble in CFL land (2009-01-20) [ Optical Electronics and Display ]
• Will Wi-Fi reign supreme? (2009-01-20) [ RF/Wireless Design ]
• PC sales post record drop in Q4 08 (2009-01-20) [ Embedded Systems ]
• SemiBuzz: Samsung undergoes reorganization (2009-01-20) [ Process/Manufacturing ]
• AMD plans 900 additional job cuts (2009-01-20) [ Process/Manufacturing ]

• Chip plant utilization could drop 50% in Q1 (2009-01-20) [ Process/Manufacturing ]
• Fujitsu intros 65nm mobile WiMAX design (2009-01-20) [ EDA ]
• Masdar City shines with First Solar's help (2009-01-20) [ Power Design ]
• iSuppli: DTV chip business declined in '08 (2009-01-20) [ Optical Electronics and Display ]
• Nokia Siemens to supply 3G gear to Thailand provider (2009-01-20) [ RF/Wireless Design ]

• Hi-temp resistor handles -65°C to +275°C range (2009-01-20) [ Signal Conditioning ]
• LTE, 3G RF chips tout high data rates, cost savings (2009-01-20) [ RF/Wireless Design ]
• Charger IC offers up to 28V overvoltage protection (2009-01-20) [ Power Design ]
• Software improves capacitor design-in process (2009-01-20) [ EDA ]
• Rugged DC/DC converters feature 4:1 input range (2009-01-20) [ Power Design ]

• A/V codecs reduce development cycles, cut cost (2009-01-20) [ Signal Conditioning ]
• Sampling soon: transceivers designed in CMOS (2009-01-20) [ Process/Manufacturing ]
• Image sensor addresses notebooks' low-light sensitivity demand (2009-01-20) [ Sensor Technology ]
• Is Asia winning a race to patent ideas in the U.S.? (2009-01-19) [ Process/Manufacturing ]
• Efficient regulator delivers light load for green apps (2009-01-19) [ Power Design ]

• Audio switch eliminates unwanted clicks in cellphones (2009-01-19) [ Network Design ]
• Highly-integrated PMICs fit OLED displays (2009-01-19) [ Optical Electronics and Display ]
• Tiny SD/MMC voltage transistor targets portable apps (2009-01-19) [ Power Design ]
• LED flash driver aims at high Mpixel camera phones (2009-01-19) [ Control Design ]
• Audio DSP adds RealAudio decoders (2009-01-19) [ Digital Signal Processing ]

• Chip enables audio, video editing in mobile phones (2009-01-19) [ Embedded Systems ]
• Researchers claim 'world-record' PV efficiency (2009-01-19) [ Power Design ]
• 450mm fab spins new round of debate (2009-01-19) [ Process/Manufacturing ]
• Market slump to delay 32-/28nm era (2009-01-19) [ Process/Manufacturing ]
• EDAC: IP, EDA to help stir economic recovery (2009-01-19) [ EDA ]

• Wall Street forecasts 20% IC market dip in '09 (2009-01-19) [ Process/Manufacturing ]
• Ultrathin wafer bonding system installed in Taiwan lab (2009-01-19) [ EDA ]
• New opportunities abound in organic electronics (2009-01-19) [ Process/Manufacturing ]
• ITC: SiRF infringed 6 GPS-related patents (2009-01-19) [ Embedded Systems ]
• Spansion seeks strategic alternatives (2009-01-19) [ Buffer/Storage ]

• De-embedding surface-mount RF devices (2009-01-16) [ Design Test ]
• When will the industry bounce back? (2009-01-16) [ Process/Manufacturing ]
• Power efficiency takes on a new meaning (2009-01-16) [ Power Design ]
• Court of Arbitration issues $60.6M to Tessera (2009-01-16) [ Process/Manufacturing ]
• $55M fund to fuel Boston-Power Li-ion capital (2009-01-16) [ Embedded Systems ]

• Will Toshiba buy Fujitsu's HDD business? (2009-01-16) [ Buffer/Storage ]
• Intel Capital invests in three India companies (2009-01-16) [ EDA ]
• Chips find new market in adaptive braking systems (2009-01-16) [ Buffer/Storage ]
• Fab tool execs brace for longer downturn (2009-01-16) [ Process/Manufacturing ]
• Analysis: ST keeps Europe IC market afloat (2009-01-16) [ Process/Manufacturing ]

• New LED materials to boost solid-state lighting (2009-01-16) [ Optical Electronics and Display ]
• Enhanced thermistor fits with 150mm wire leads (2009-01-16) [ Sensor Technology ]
• Avago announces isolation amps (2009-01-16) [ EMI/EMC Design ]
• Ubiquisys readies ZoneGate upgrade (2009-01-16) [ Network Design ]
• Researchers rethink concepts of magnetic data storage (2009-01-16) [ Buffer/Storage ]

• Wide-input range DC/DC converters tout 91% efficiency (2009-01-16) [ Signal Conditioning ]
• USB wireless transmitter rolls for audio professionals (2009-01-16) [ RF/Wireless Design ]
• Lighting solution simplifies white XLamp LED designs (2009-01-16) [ EDA ]
• Digital audio engine boasts improved quality, low cost (2009-01-16) [ Signal Conditioning ]
• Boosting power supply efficiency (2009-01-16) [ Power Design ]

• Switches pack low quiescent current, ESD protection (2009-01-15) [ Network Design ]
• HDMI receiver with CEC improves HDTV quality (2009-01-15) [ Interface Design ]
• ZIF probe tips handle DDR, GDDR validation (2009-01-15) [ Design Test ]
• High-efficiency AC/DC power supply carries 2800W (2009-01-15) [ Power Design ]
• Audio, video codecs for ARM chip aim at mobiles (2009-01-15) [ Control Design ]

• SBCs ensure easy deployment of wireless nodes (2009-01-15) [ RF/Wireless Design ]
• Integrated driver-MOSFET touts 96.5% efficiency (2009-01-15) [ Buffer/Storage ]
• FlexRay flaunts benefits in Audi car (2009-01-15) [ Embedded Systems ]
• Coming soon: HD projector cellphones (2009-01-15) [ Optical Electronics and Display ]
• Report: EDA revenues slid 11% in Q3 (2009-01-15) [ EDA ]

• iPhone Nano means more business for semis (2009-01-15) [ Process/Manufacturing ]
• Analog circuits boost energy harvesting (2009-01-15) [ Power Design ]
• Spirit DSP, RMI to deliver voice, video over IP (2009-01-15) [ Embedded Systems ]
• Wi-Fi weathered the '08 economic storm (2009-01-15) [ RF/Wireless Design ]
• DDR3 interface solution enables 1.6bit/s data rates (2009-01-15) [ Buffer/Storage ]

• ST, Paratek cooperate on RF tunable products (2009-01-15) [ RF/Wireless Design ]
• Simple design powers snazzy digital frame (2009-01-14) [ Sensor Technology ]
• People need to collaborate before our appliances will (2009-01-14) [ Power Design ]
• Philips shapes intelligent consumer electronics (2009-01-14) [ Embedded Systems ]
• Converter enables low-cost DisplayPort-to-VGA connection (2009-01-14) [ Interface Design ]

• High-brightness LED touts low thermal resistance (2009-01-14) [ Optical Electronics and Display ]
• Vector network analyzer handles up to 70GHz (2009-01-14) [ Design Test ]
• MCU solution boasts energy, cost savings (2009-01-14) [ Control Design ]
• RF filters require less mounting space (2009-01-14) [ RF/Wireless Design ]
• Toyota reveals third-generation Prius (2009-01-14) [ Embedded Systems ]

• HD H.264 encoder IP core targets surveillance (2009-01-14) [ EDA ]
• Gear up for 32nm NAND chips (2009-01-14) [ EDA ]
• Reports: GPS, Wi-Fi to defy '09 slump (2009-01-14) [ RF/Wireless Design ]
• Firm sees another dip in electronic systems market (2009-01-14) [ Process/Manufacturing ]
• Researchers use fiber optics for tunnel detection (2009-01-14) [ Network Design ]

• 60GHz, MoCA take center stage at CES (2009-01-14) [ RF/Wireless Design ]
• Trio works on e-beam solutions (2009-01-14) [ Process/Manufacturing ]
• Wireless power consortium pursues standard (2009-01-14) [ Power Design ]
• Report: LG to provide flat panels to Apple (2009-01-14) [ Optical Electronics and Display ]
• Micrel, Cyan partner on industrial RF modules (2009-01-14) [ RF/Wireless Design ]

• Intel to bring out chip for lower-cost thin laptops (2009-01-13) [ Process/Manufacturing ]
• Infrastructure needs to keep up with HD demands (2009-01-13) [ Optical Electronics and Display ]
• Analysis: Is Spansion running out of options? (2009-01-13) [ Buffer/Storage ]
• CES: Hard times evident in empty seats (2009-01-13) [ Process/Manufacturing ]
• Will Blu-ray finally fly in 2009? (2009-01-13) [ Buffer/Storage ]

• Analyst: Not all gloom for mobile handsets (2009-01-13) [ RF/Wireless Design ]
• Yingli acquires Cyber Power Group (2009-01-13) [ Power Design ]
• Bluetooth enters the digital living room space (2009-01-13) [ RF/Wireless Design ]
• Court: Rambus intentionally destroyed evidence (2009-01-13) [ EDA ]
• Audio chip packs DSP, class-D amplifier (2009-01-13) [ Digital Signal Processing ]

• Dual-output step-down controller delivers up to 50A (2009-01-13) [ Control Design ]
• CE receives cost-effective Bluetooth solution (2009-01-13) [ RF/Wireless Design ]
• 2200µF capacitors fit USB express cards (2009-01-13) [ Signal Conditioning ]
• PCIe 2.0 IP supports 65nm node (2009-01-13) [ Interface Design ]
• Longer distance HDMI cables emerge (2009-01-13) [ Interface Design ]

• Audio platform aims at Internet radios (2009-01-13) [ Digital Signal Processing ]
• Graphics processors for notebooks launched (2009-01-13) [ Buffer/Storage ]
• How will Tan lead Cadence's resurgence? (2009-01-13) [ EDA ]
• A whole new world for debugging (2009-01-12) [ Embedded Systems ]
• Pulling bits out of the "soup"— more on high speed receivers (2009-01-12) [ EDA ]

• Report: DSP shipments drop, wireless stays up (2009-01-12) [ Digital Signal Processing ]
• Execs see bright future for India IC industry (2009-01-12) [ Process/Manufacturing ]
• Sony CEO stays positive despite economic crisis (2009-01-12) [ Embedded Systems ]
• Analyst: Intel may suffer from netbook success (2009-01-12) [ Embedded Systems ]
• Silicon TV tuner IC makes its way to LG TVs (2009-01-12) [ RF/Wireless Design ]

• 3G licenses issued to China carriers (2009-01-12) [ RF/Wireless Design ]
• Analyst: No winners in DRAM 'chicken game' (2009-01-12) [ Buffer/Storage ]
• 1.2MW Hawaii solar farm to supply 30% of demand (2009-01-12) [ Power Design ]
• Single-chip STB IC packs HD, interactive combo (2009-01-12) [ Embedded Systems ]
• SMT connector family offers up to 54 pins (2009-01-12) [ Network Design ]

• Ethernet module speeds up design time (2009-01-12) [ Network Design ]
• Rack, panel connectors fit amusement equipment (2009-01-12) [ Network Design ]
• Display processor supporting LiquidHD revealed (2009-01-12) [ Embedded Systems ]
• 'First' 190V n-channel power MOSFET rolls (2009-01-12) [ Optical Electronics and Display ]
• 45nm desktop processors run up to 3GHz (2009-01-12) [ Control Design ]

• ARM-based integrated processor aims at photo frames (2009-01-12) [ Embedded Systems ]