• Paving the way to strong sensor, control nets (2009-11-20) [ Networks ]
• 16bit MCUs pack dual interface, Mifare Plus S (2009-11-20) [ Controls/MCUs ]
• SiGe mixer enables cost-effective filter designs (2009-11-20) [ RF/Microwave ]
• Test solution meets HDMI 1.4 compliance (2009-11-20) [ T&M ]
• IP core supports Serial RapidIO 2.1 (2009-11-20) [ EDA/IP ]

• Thick-film resistors achieve 50ppm/°C TCR (2009-11-20) [ Power/Alternative Energy ]
• Infotainment SoCs fit car navigation, telematics (2009-11-20) [ Processors/DSPs ]
• Solar panels set out on road to recovery (2009-11-20) [ Power/Alternative Energy ]
• Intel, NEC push supercomputer boundaries (2009-11-20) [ Embedded ]
• Sanyo batteries hitch onto European HEVs (2009-11-20) [ Power/Alternative Energy ]

• Partners work on WHDI reference design (2009-11-20) [ RF/Microwave ]
• Rattner: Boost supercomputing through 3D Web (2009-11-20) [ Embedded ]
• Amimon brings WHDI to notebook PCs (2009-11-20) [ RF/Microwave ]
• Secure MCU fights counterfeit copies (2009-11-19) [ Controls/MCUs ]
• DC/DC converter offers fast response for CE (2009-11-19) [ Power/Alternative Energy ]

• FPGAs boast six-week turnaround time (2009-11-19) [ FPGAs/PLDs ]
• Tesla GPUs enable low-cost parallel computing (2009-11-19) [ Processors/DSPs ]
• Serial flash delivers 320Mbit/s burst data rate (2009-11-19) [ Memory/Storage ]
• Ethernet switch handles harsh industrial setups (2009-11-19) [ Interface ]
• Digital media devices sprout for connected homes (2009-11-19) [ Embedded ]

• Malaysia aims to become multimedia hub (2009-11-19) [ Networks ]
• ST, NXP ink Mifare license agreement (2009-11-19) [ RF/Microwave ]
• NEC Electronics consolidates manufacturing lines (2009-11-19) [ Manufacturing/Packaging ]
• Toshiba touts EUV photoresist for 20nm process (2009-11-19) [ Manufacturing/Packaging ]
• SICAS: IC industry close to sold out (2009-11-19) [ Manufacturing/Packaging ]

• AC/DC power modules claim 40-year lifespan (2009-11-18) [ Power/Alternative Energy ]
• MOSFETs simplify circuit design in VoIP equipment (2009-11-18) [ Power/Alternative Energy ]
• Low-cost 32bit MCUs cut code size for 8-/16bit apps (2009-11-18) [ Controls/MCUs ]
• Rail-to-rail op amps boast 180MHz at 1mA (2009-11-18) [ Amplifiers/Converters ]
• USB oscilloscopes deliver 5GSps sampling rate (2009-11-18) [ T&M ]

• 16bit MCUs pack RF transceiver for Zigbee RF4CE (2009-11-18) [ Controls/MCUs ]
• Solar industry players start to fall (2009-11-18) [ Power/Alternative Energy ]
• Cavium acquires Linux expert for $50M (2009-11-18) [ Embedded ]
• HP ventures into data centers via 3Com (2009-11-18) [ Embedded ]
• VMS MobiFone brings 3G to Vietnam (2009-11-18) [ RF/Microwave ]

• VLSI: IC inventory levels stay down (2009-11-18) [ Manufacturing/Packaging ]
• ITRI material boosts Li-ion battery safety (2009-11-18) [ Manufacturing/Packaging ]
• MicroSD card brings extreme gaming into handsets (2009-11-17) [ Memory/Storage ]
• Modems support DC-HSPA+, multi-mode 3G/LTE (2009-11-17) [ RF/Microwave ]
• MEMS gyro packs 360° detection (2009-11-17) [ Sensors/MEMS ]

• IGBT handles high-voltage inverter modules (2009-11-17) [ Power/Alternative Energy ]
• Low-frequency interface ensures stable communication (2009-11-17) [ Interface ]
• Optical transceivers deliver 10Gbit/s per channel (2009-11-17) [ Optoelectronics/Displays ]
• Femtocell adoption lags in 2009 (2009-11-17) [ Networks ]
• Casio, Toppan form OLED joint venture (2009-11-17) [ Optoelectronics/Displays ]

• MediaFLO gets Japan MIC nod (2009-11-17) [ RF/Microwave ]
• Dow, Caltech tie up on photovoltaic R&D (2009-11-17) [ Power/Alternative Energy ]
• DoCoMo cuts handset BOM with RF MEMS (2009-11-17) [ Sensors/MEMS ]
• Analysts take on handset OEMs' latest offerings (2009-11-17) [ RF/Microwave ]
• Antennas handle Wi-Fi, Bluetooth ops simultaneously (2009-11-16) [ RF/Microwave ]

• TVS offers 200A forward surge current (2009-11-16) [ Power/Alternative Energy ]
• RFID chip integrates 2Kbit memory (2009-11-16) [ RF/Microwave ]
• Quad-voltage supervisors pack programmable delay (2009-11-16) [ Power/Alternative Energy ]
• Processors pack video, graphics multimedia features (2009-11-16) [ Processors/DSPs ]
• USB-to-SDIO host bridge IC operates at 480Mbit/s (2009-11-16) [ Interface ]

• Contactless payments pick up post-recession (2009-11-16) [ RF/Microwave ]
• China taps Infineon MCUs for e-Passport (2009-11-16) [ Controls/MCUs ]
• TI, Fullpower bring motion sensing to portable apps (2009-11-16) [ Sensors/MEMS ]
• Elpida, Winbond enter outsourcing agreement (2009-11-16) [ Manufacturing/Packaging ]
• Price pressure puts German PV market in red (2009-11-16) [ Power/Alternative Energy ]

• Analysis: What's next after Intel-AMD settlement? (2009-11-16) [ Processors/DSPs ]
• Royalty-free codecs enable low-cost HD VoIP (2009-11-13) [ Amplifiers/Converters ]
• System basis chips boost in-vehicle networks (2009-11-13) [ Interface ]
• Dual-output DC/DC controller offers up to 12 phases (2009-11-13) [ Power/Alternative Energy ]
• ADCs offer resolution, channel count flexibility (2009-11-13) [ Amplifiers/Converters ]

• Slot interposers validate DDR3 memory bus (2009-11-13) [ T&M ]
• Coming soon: x86 core with integrated graphics (2009-11-13) [ Processors/DSPs ]
• Carmakers face electric vehicles with caution (2009-11-13) [ Power/Alternative Energy ]
• Tech groups join hands to boost Malaysia 4G network (2009-11-13) [ RF/Microwave ]
• Wolfson builds R&D center in Yokohama (2009-11-13) [ Manufacturing/Packaging ]

• Vimicro, CSMBC drive CMMB mobile TV (2009-11-13) [ RF/Microwave ]
• TSMC ventures into solid-state lighting (2009-11-13) [ Manufacturing/Packaging ]
• Consumer electronics boom to drive IC recovery (2009-11-13) [ Manufacturing/Packaging ]
• SEIPI clocks 25 years promoting Philippine electronics industry (2009-11-12) [ Manufacturing/Packaging ]
• AC/DC power supply with speed fan minimizes noise (2009-11-12) [ Power/Alternative Energy ]

• LDO offers 20µVRMS output voltage noise (2009-11-12) [ Power/Alternative Energy ]
• MCUs ensure high-level security at low power (2009-11-12) [ Controls/MCUs ]
• GPS front-end module packs FBAR filter, LNA (2009-11-12) [ RF/Microwave ]
• USB IC supports all-passive audio accessories (2009-11-12) [ Interface ]
• IO-Link solutions promise reduced dev't time (2009-11-12) [ Interface ]

• Broadcom embedded ICs rule digital homes (2009-11-12) [ Processors/DSPs ]
• Cisco buys DVN STB biz for $44.5M (2009-11-12) [ Embedded ]
• JV aims for China mobile apps supremacy (2009-11-12) [ RF/Microwave ]
• Cree opens first production plant in China (2009-11-12) [ Manufacturing/Packaging ]
• Analysis: Change is in the wind at SMIC (2009-11-12) [ EDA/IP ]

• Op amps enable accurate medical devices (2009-11-11) [ Amplifiers/Converters ]
• Smart card connectors offer high-temp thermoplastics (2009-11-11) [ Networks ]
• Processor manages SIM data for M2M apps (2009-11-11) [ Processors/DSPs ]
• DSPs improve non-destructive test equipment (2009-11-11) [ Processors/DSPs ]
• FPGA-based AMC handles high-speed optical links (2009-11-11) [ Interface ]

• Media processor delivers 1800p Blu-ray quality (2009-11-11) [ Processors/DSPs ]
• More brushless DC motors enter cars (2009-11-11) [ Controls/MCUs ]
• Suntech, Huadian build solar plant in Jiangsu (2009-11-11) [ Power/Alternative Energy ]
• Elpida, ProMOS ink DRAM foundry deal (2009-11-11) [ Manufacturing/Packaging ]
• Bosch sets up power electronics center in Germany (2009-11-11) [ Power/Alternative Energy ]

• PLDs find bright spots in downturn (2009-11-11) [ FPGAs/PLDs ]
• First Abu Dhabi fab to rise in four years (2009-11-11) [ Manufacturing/Packaging ]