Article review (Sorted By Date)
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1GSps ADC enables higher-density receivers
(2009-10-30)
[ Signal Conditioning ]
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Capacitors equipped for high-temp operations
(2009-10-30)
[ Power Design ]
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Bluetooth headset ICs reduce wind noise
(2009-10-30)
[ RF/Wireless Design ]
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Servo controller delivers flexible motion functions
(2009-10-30)
[ Control Design ]
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AMC delivers flexibility for wireless radios
(2009-10-30)
[ Embedded Systems ]
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WiMAX 802.16e-compliant radio packs SISO, MIMO
(2009-10-30)
[ RF/Wireless Design ]
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China IC market gears for 2010 rebound
(2009-10-30)
[ Process/Manufacturing ]
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Solar panel achieves 20.4% total area efficiency
(2009-10-30)
[ Power Design ]
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Freescale, Synopsys extend verification tie-up
(2009-10-30)
[ EDA ]
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NXP HD radio ICs bring quality sound to Audi
(2009-10-30)
[ RF/Wireless Design ]
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Study: Test shortcuts cause memory failures
(2009-10-30)
[ Test & Packaging ]
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High-rate Bluetooth opts for 60GHz
(2009-10-30)
[ RF/Wireless Design ]
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Laser driver fits pico projectors in tiny CE apps
(2009-10-29)
[ Power Design ]
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Trench MOSFETs tailored for computing apps
(2009-10-29)
[ Power Design ]
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ADCs maximize flexibility, minimize costs
(2009-10-29)
[ Signal Conditioning ]
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Ultracapacitor promises 10-year SSD data protection
(2009-10-29)
[ Power Design ]
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Graphics SoC packs dual APIX interfaces
(2009-10-29)
[ Optical Electronics and Display ]
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Op amps deliver 4kV ESD resistance
(2009-10-29)
[ Signal Conditioning ]
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Global UMD shipments to top 385M in 2014
(2009-10-29)
[ Embedded Systems ]
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Dow Corning sets up Middle East HQ in Bahrain
(2009-10-29)
[ Process/Manufacturing ]
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Nepal, Vietnam rural schools get broadband-connected
(2009-10-29)
[ RF/Wireless Design ]
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Applied solar research center rises in Xi'an
(2009-10-29)
[ Power Design ]
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Telematics boom drives need to boost car security
(2009-10-29)
[ RF/Wireless Design ]
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Beyer remains optimistic but wary about IC market
(2009-10-29)
[ Process/Manufacturing ]
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Codecs cut power consumption on all op states
(2009-10-28)
[ Signal Conditioning ]
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0.11µm 30V process trims costs
(2009-10-28)
[ EDA ]
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4G power amplifier boosts mobile WiMAX
(2009-10-28)
[ Signal Conditioning ]
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MCU packs hardware vector engine
(2009-10-28)
[ Control Design ]
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USB host controller supports 10Mbit/s transfer speed
(2009-10-28)
[ Interface Design ]
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RTC boasts low current drain, wide operating range
(2009-10-28)
[ Interface Design ]
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iSuppli: DRAM rebound will continue to 2010
(2009-10-28)
[ Buffer/Storage ]
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Sigma Designs, CopperGate fuse home net platforms
(2009-10-28)
[ Network Design ]
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MEMC beefs up solar biz with new acquisition
(2009-10-28)
[ Power Design ]
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Nakaya, Amkor, Toshiba form assembly, test JV
(2009-10-28)
[ Test & Packaging ]
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Powerchip, Taiwan Memory seek gov't funds
(2009-10-28)
[ Buffer/Storage ]
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Klein: Wind River is better than usual
(2009-10-28)
[ Embedded Systems ]
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FPGAs with 11.3Gbit/s transceivers suit OTN apps
(2009-10-27)
[ Programmable Logic ]
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Traveling wave amp fits high-speed comm apps
(2009-10-27)
[ Signal Conditioning ]
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LDO boasts wide input, output voltage ranges
(2009-10-27)
[ Power Design ]
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I²C keyboard controller supports QWERTY
(2009-10-27)
[ Control Design ]
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ARM-based MCUs consume less than 18 µA/MHz
(2009-10-27)
[ Embedded Systems ]
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USB-to-LAN controllers suit embedded nets
(2009-10-27)
[ Interface Design ]
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IDC sees quick rebound for PC market
(2009-10-27)
[ Embedded Systems ]
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Mentor, Aeroconseil partner for China aviation
(2009-10-27)
[ EDA ]
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Solar cell attains 35.8% conversion efficiency
(2009-10-27)
[ Power Design ]
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NXP, Infineon help EU's BioP@ss eID project
(2009-10-27)
[ Security Design ]
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Sematech installs tools in 450mm prototype fab
(2009-10-27)
[ Process/Manufacturing ]
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Bright future awaits LED market
(2009-10-27)
[ Optical Electronics and Display ]
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DOST system keeps people, orgs, gov't connected
(2009-10-23)
[ Embedded Systems ]
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34nm MLC NAND touts improved data transfer rates
(2009-10-23)
[ Buffer/Storage ]
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Processors bring PC performance to mobiles
(2009-10-23)
[ Embedded Systems ]
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PWM controllers power DDR3 DIMMs
(2009-10-23)
[ Power Design ]
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LED driver delivers over 20A continuous current
(2009-10-23)
[ Optical Electronics and Display ]
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EPON Transceiver improves optical net performance
(2009-10-23)
[ Network Design ]
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Chip antennas cover 470MHz to 860MHz UHF band
(2009-10-23)
[ RF/Wireless Design ]
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2.5B low-energy Bluetooth ICs to ship in 2014
(2009-10-23)
[ RF/Wireless Design ]
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SK Telecom, Bell Labs embark on post 4G R&D
(2009-10-23)
[ RF/Wireless Design ]
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E Ink, Freescale team to improve digital reading
(2009-10-23)
[ Optical Electronics and Display ]
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Cadence, ARM co-develop next-gen SoC design flow
(2009-10-23)
[ EDA ]
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IC packaging becomes more challenging
(2009-10-23)
[ Test & Packaging ]
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Samsung urges Korea to expand beyond memory
(2009-10-23)
[ Process/Manufacturing ]
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China team helps improve education for the blind
(2009-10-22)
[ Embedded Systems ]
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IF reference kit eases base station design
(2009-10-22)
[ EDA ]
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ADCs achieves up to 91.5dB SNR
(2009-10-22)
[ Power Design ]
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Camera module switches simplify design
(2009-10-22)
[ Network Design ]
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Flexible e-paper reaches 100mm curved radius
(2009-10-22)
[ Optical Electronics and Display ]
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Compact LEDs make ultraslim LCD TVs, monitors
(2009-10-22)
[ Optical Electronics and Display ]
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Panel pots extend to two million cycles
(2009-10-22)
[ Power Design ]
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Flat-panel market set for 2010 rebound
(2009-10-22)
[ Optical Electronics and Display ]
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Entropic, Intellon fuse coax, powerline
(2009-10-22)
[ Network Design ]
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Xilinx adopts ARM processors, interconnect tech
(2009-10-22)
[ Programmable Logic ]
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China preps ePassport system
(2009-10-22)
[ Security Design ]
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NXP CEO defends restructuring moves
(2009-10-22)
[ Process/Manufacturing ]
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Long road to SuperSpeed USB
(2009-10-22)
[ Interface Design ]
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Voice switch saves space in two-way talk apps
(2009-10-21)
[ Interface Design ]
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CMOS image sensors increase design flexibility
(2009-10-21)
[ Optical Electronics and Display ]
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Diode array guards high-speed data interfaces
(2009-10-21)
[ EMI/EMC Design ]
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DC/DC converters boast ultrawide input range
(2009-10-21)
[ Power Design ]
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Mixed-signal oscilloscopes pack 20 channels
(2009-10-21)
[ Design Test ]
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Mobile apps demand pushes graphics, multimedia ICs
(2009-10-21)
[ Embedded Systems ]
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Cisco buys Starent Networks for $2.9B
(2009-10-21)
[ RF/Wireless Design ]
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SMIC pushes 40-/55nm devices
(2009-10-21)
[ Process/Manufacturing ]
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GlobalFoundries taps Mentor EDA tools
(2009-10-21)
[ EDA ]
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Analysis: Is IBM turning over key IC tech to China?
(2009-10-21)
[ Process/Manufacturing ]
--- Total 84 records ---
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