• Tiny WiMAX transceiver maximizes data throughput (2009-10-09) [ RF/Wireless Design ]
• Temp sensor boasts accuracy, low power (2009-10-09) [ Sensor Technology ]
• Ultrasound T/R switch speeds design (2009-10-09) [ Interface Design ]
• Chassis improves USB data acquisition (2009-10-09) [ Interface Design ]
• Boost switch delivers low switching losses (2009-10-09) [ Power Design ]

• WirelessHD chipsets pack HDMI, LVDS (2009-10-09) [ RF/Wireless Design ]
• Mobile PCs embrace embedded DisplayPort (2009-10-09) [ Interface Design ]
• TSMC, IMEC team on More-than-Moore tech (2009-10-09) [ Process/Manufacturing ]
• ISE Labs expands test capabilities (2009-10-09) [ Design Test ]
• ARM, GlobalFoundries partner on 28nm HKMG (2009-10-09) [ Process/Manufacturing ]

• Is Russia ready to build a nanotech industry? (2009-10-09) [ Process/Manufacturing ]
• MIPS wants a slice of handset market (2009-10-09) [ EDA ]
• Solar panels blend in with asphalt (2009-10-08) [ Power Design ]
• FPGAs eases PCIe-compliant system design (2009-10-08) [ Programmable Logic ]
• Static-free switchlocks pack up to 2,000 key codes (2009-10-08) [ Network Design ]

• Audio amps are 20x more efficient than Class D (2009-10-08) [ Signal Conditioning ]
• Ethernet mezzanine board supports XMC, PMC slots (2009-10-08) [ Interface Design ]
• PMIC maximizes ARM processor performance (2009-10-08) [ Power Design ]
• LCD TV outlook brightens as CRT demand slips (2009-10-08) [ Optical Electronics and Display ]
• Anadigics, WIN Semi ink foundry deal (2009-10-08) [ Process/Manufacturing ]

• Renesas aids intelligent transport test in China (2009-10-08) [ Design Test ]
• Samsung licenses Apical imaging IP core (2009-10-08) [ EDA ]
• Specialty foundries seek new growth opportunities (2009-10-08) [ Process/Manufacturing ]
• NXP changes raise questions on long-term plans (2009-10-08) [ Embedded Systems ]
• Voltage reference IC provides 15db PSRR (2009-10-07) [ Power Design ]

• Automotive half-bridge driver self-oscillates (2009-10-07) [ Control Design ]
• Remote motion control gets Zigbee-enabled (2009-10-07) [ Sensor Technology ]
• Optocouplers pack high gain photo detector (2009-10-07) [ Optical Electronics and Display ]
• Intel processor-based SBC packs 4Gbyte SDRAM (2009-10-07) [ Embedded Systems ]
• Digital step attenuator touts 26ns switching times (2009-10-07) [ Power Design ]

• IMEC to house Kaneka's photovoltaic lab (2009-10-07) [ Power Design ]
• iSuppli sees foundries thinning ranks in 2010 (2009-10-07) [ Process/Manufacturing ]
• Trident takes over NXP's DTV, STB units (2009-10-07) [ Embedded Systems ]
• Nortel puts GSM/GSM-R unit on sale (2009-10-07) [ RF/Wireless Design ]
• TSMC pumps capital, R&D investments (2009-10-07) [ Process/Manufacturing ]

• Numonyx CEO: PCM will enable innovation (2009-10-07) [ Buffer/Storage ]
• Audio codec packs programmable digital filters (2009-10-06) [ Signal Conditioning ]
• High-energy Li-ion battery module touts 58Ah at 25.2V (2009-10-06) [ Power Design ]
• DC/DC controller drives up to 25A load current (2009-10-06) [ Power Design ]
• 200mA LDOs deliver 8&#181A quiescent current (2009-10-06) [ Power Design ]

• Connectors offer increased contact density in PCBs (2009-10-06) [ Network Design ]
• 512-core graphics chip supports real-time ray tracing (2009-10-06) [ Embedded Systems ]
• ABI sees GPS IC shipment rebound in 2010 (2009-10-06) [ RF/Wireless Design ]
• D2S, Advantest partner on maskless SoCs (2009-10-06) [ Process/Manufacturing ]
• IMEC pushes 3D integration of DRAM on logic (2009-10-06) [ Process/Manufacturing ]

• Sharp green plant starts LCD production (2009-10-06) [ Process/Manufacturing ]
• Grose: Cost is the biggest problem in IC industry (2009-10-06) [ Process/Manufacturing ]
• Analysis: TI fab deal is good for IC tool vendors (2009-10-06) [ Process/Manufacturing ]
• Automotive MCU tailored for ultrasonic sensors (2009-10-05) [ Control Design ]
• Highly-efficient LEDs offer up to 367lm (2009-10-05) [ Optical Electronics and Display ]

• Class D audio amp boasts 1W constant power (2009-10-05) [ Signal Conditioning ]
• Dual-phase IC packs independent power savings (2009-10-05) [ Power Design ]
• A/V capture card encodes four channels at 120fps (2009-10-05) [ Embedded Systems ]
• Clock IC eases synchronization in video apps (2009-10-05) [ Interface Design ]
• Japan firms team on LTE terminal platform (2009-10-05) [ RF/Wireless Design ]

• Spire bags Uni-CHEM solar line contracts (2009-10-05) [ Power Design ]
• Trina Solar, GCL-Poly extend solar supply deal (2009-10-05) [ Power Design ]
• Handset power needs to outpace battery capacity (2009-10-05) [ Power Design ]
• TI 300mm fab puts pressure on analog rivals (2009-10-05) [ Process/Manufacturing ]
• IC vendor watch: Who's got cash? (2009-10-05) [ Process/Manufacturing ]

• Braving software-to-silicon verification challenges at 45nm (2009-10-05) [ EDA ]
• Identifying the most favored embedded tool (2009-10-05) [ EDA ]
• Smart switches integrate HDMI 1.4 support (2009-10-02) [ Interface Design ]
• Processor supports faster boot times (2009-10-02) [ Embedded Systems ]
• Non-volatile RAM delivers up to 800MHz (2009-10-02) [ Buffer/Storage ]

• Serdes handles high-resolution, 24bit FPDs (2009-10-02) [ Interface Design ]
• Digital power regulators pack gate drivers (2009-10-02) [ Power Design ]
• SD card enables low-cost Wi-Fi connectivity in digicams (2009-10-02) [ Buffer/Storage ]
• OLED displays find success in mobile phones (2009-10-02) [ Optical Electronics and Display ]
• Panasonic, Renesas run 28nm development line (2009-10-02) [ Process/Manufacturing ]

• VARTA, Volkswagen form Li-ion battery JV (2009-10-02) [ Power Design ]
• TI opens 300mm analog fab in Texas (2009-10-02) [ Process/Manufacturing ]
• EDA posts sixth consecutive dip in Q2 (2009-10-02) [ EDA ]
• Analysts weigh in on Intel's French strategy (2009-10-02) [ Process/Manufacturing ]
• Bluetooth sensor targets wireless mouse (2009-10-01) [ Sensor Technology ]

• HD 3D PDP packs crosstalk reduction (2009-10-01) [ Optical Electronics and Display ]
• Board support package rolls for TI OMAP 3 (2009-10-01) [ EDA ]
• LDO regulators trim mounting area (2009-10-01) [ Power Design ]
• Virage expands interface IP solutions for CE (2009-10-01) [ EDA ]
• HDMI 1.4 IC supports audio return channel, 3D (2009-10-01) [ Interface Design ]

• ARM threatens Intel's reign on sub-notebooks (2009-10-01) [ Embedded Systems ]
• Firms join hands to form mobile HD interface group (2009-10-01) [ RF/Wireless Design ]
• DA NanoMaterials opens Asia HQ in Taiwan (2009-10-01) [ Process/Manufacturing ]
• SUSS MicroTec joins ITRI 3D consortium (2009-10-01) [ Process/Manufacturing ]
• French solar market gets partnership, VC boost (2009-10-01) [ Power Design ]

• What's behind Taiwan's relaxed investment rules (2009-10-01) [ Process/Manufacturing ]