• LTE rollout to boost picocell, femtocell markets (2008-09-30) [ RF/Microwave ]
• Ascent Solar, Texsa co-develop PV roofing materials (2008-09-30) [ Manufacturing/Packaging ]
• Atmel restructuring continues in Nantes (2008-09-30) [ Manufacturing/Packaging ]
• Tech groups explore co-polymer lithography (2008-09-30) [ Manufacturing/Packaging ]
• Analyst: Micron plays waiting game in Qimonda takeover (2008-09-30) [ Memory/Storage ]

• Analysts stay cool amid Wall Street crisis (2008-09-30) [ Manufacturing/Packaging ]
• PMC-Sierra expands WiMAX RFIC solutions (2008-09-30) [ RF/Microwave ]
• Intel, Chartered criticize chip IP industry (2008-09-30) [ EDA/IP ]
• Visa-Nokia solidifies further mobile payment project (2008-09-30) [ RF/Microwave ]
• Digi-Key, DLP ink global distribution deal (2008-09-30) [ Manufacturing/Packaging ]

• Toshiba taps Agilent for RFIC design, evaluation (2008-09-30) [ EDA/IP ]
• Super 3G enlists Fujitsu's network aid (2008-09-30) [ RF/Microwave ]
• Asian start-ups to get hold of silicon shuttle services (2008-09-30) [ EDA/IP ]
• Mirics bags design win in multiband TV receiver chip (2008-09-30) [ RF/Microwave ]
• Compact UWB antenna extends bandwidth to radars (2008-09-30) [ RF/Microwave ]

• New solar inks achieve target yields, cell capacity (2008-09-30) [ Power/Alternative Energy ]
• Simulator ensures better mixed-signal circuits (2008-09-30) [ EDA/IP ]
• Two firms tie up to upgrade camera image systems (2008-09-30) [ Optoelectronics/Displays ]
• ON Semiconductor's stepper motor designs receive updates (2008-09-30) [ Embedded ]
• EMI suppression film capacitors have increased voltage rating (2008-09-30) [ Amplifiers/Converters ]

• Turnkey solution detects free fall in laptops (2008-09-30) [ Sensors/MEMS ]
• Motion controller ready for various apps (2008-09-30) [ Embedded ]
• ADC facilitates automotive radar applications (2008-09-30) [ Amplifiers/Converters ]
• Development kit propels Software Defined Silicon designs (2008-09-30) [ EDA/IP ]
• Controller built for high-current LEDs (2008-09-30) [ Optoelectronics/Displays ]

• White LEDs enable optimum optical power (2008-09-29) [ Optoelectronics/Displays ]
• 3-axis compass IC delivers better map readings (2008-09-29) [ Sensors/MEMS ]
• Isolated DC/DC converters ease module use in OEM apps (2008-09-29) [ Power/Alternative Energy ]
• Sensor design tool speeds up data conversion design (2008-09-29) [ EDA/IP ]
• System monitor responds to multiple computing needs (2008-09-29) [ Power/Alternative Energy ]

• Rohm offers isolated AC/DC converter (2008-09-29) [ Power/Alternative Energy ]
• Fairchild's voltage translator is ultrafast (2008-09-29) [ Interface ]
• CD/MP3 stereo 2:1 multiplexer promises ultralow distortion (2008-09-29) [ Embedded ]
• Power supply ready for high-speed testing of mobiles (2008-09-29) [ T&M ]
• Mentor extends synthesis support for new Xilinx FPGAs (2008-09-29) [ EDA/IP ]

• Freescale unveils virtual prototypes of automotive MCUs (2008-09-29) [ Controls/MCUs ]
• ESD protection arrays toughen up for portable apps (2008-09-29) [ Amplifiers/Converters ]
• Duo achieves new 100Gbit/s optical transmission record (2008-09-29) [ Networks ]
• Samsung taps RFMD chips for 3G handsets (2008-09-29) [ RF/Microwave ]
• Report: Hynix to sell China fab stake to Numonyx (2008-09-29) [ Manufacturing/Packaging ]

• U.S. FTTH broadband subscribers reach 3.76M (2008-09-29) [ RF/Microwave ]
• Freescale mulls options for mobile chip biz (2008-09-29) [ RF/Microwave ]
• IBM launches 'green' consulting services (2008-09-29) [ Manufacturing/Packaging ]
• Future shines bright for OLED lighting (2008-09-29) [ Optoelectronics/Displays ]
• Power Integrations patents applicable vs. Fairchild (2008-09-29) [ Manufacturing/Packaging ]

• Nvidia finds new partner in MotionDSP (2008-09-29) [ Processors/DSPs ]
• Yingli PV modules head to U.S. campus solar energy facility (2008-09-29) [ Manufacturing/Packaging ]
• Intel Capital set to purchase Telligent $20M shares (2008-09-29) [ Embedded ]
• Sarnoff Europe is newest member of TSMC DCA (2008-09-29) [ EDA/IP ]
• Imagine Cup fuels students' inquisitive minds (2008-09-29) [ Embedded ]

• Continental preps Li-ion battery production for hybrids (2008-09-26) [ Manufacturing/Packaging ]
• Dell turns laptops green with LED displays (2008-09-26) [ Optoelectronics/Displays ]
• Rumor: Is AMD sacking 'Bobcat' project? (2008-09-26) [ Processors/DSPs ]
• Chartered moves to 40nm process and below (2008-09-26) [ Manufacturing/Packaging ]
• Bringing Internet content to TV remains a challenge (2008-09-26) [ Optoelectronics/Displays ]

• Analysts skeptical of NXP survival plan (2008-09-26) [ Manufacturing/Packaging ]
• Qualcomm mobile chip powers first Android handset (2008-09-26) [ RF/Microwave ]
• Appellate court sustains jury verdict on Qualcomm breach (2008-09-26) [ Manufacturing/Packaging ]
• Atmel handed out Common Criteria certification EAL4+ (2008-09-26) [ Controls/MCUs ]
• Transmeta looks into possibility of sale (2008-09-26) [ Manufacturing/Packaging ]

• Renesas mulls selling of German fab (2008-09-26) [ Manufacturing/Packaging ]
• IBM sets up global cloud computing centers (2008-09-26) [ Embedded ]
• Two firms tie up to create multicore media env't (2008-09-26) [ Processors/DSPs ]
• P2P system hastens file distribution in intranets (2008-09-26) [ Networks ]
• Agilent signal analyzers carry Matlab (2008-09-26) [ T&M ]

• PWM controller ensures better standby mode capacity (2008-09-26) [ Power/Alternative Energy ]
• Image processor to simplify data compression for SLRs (2008-09-26) [ Sensors/MEMS ]
• TI boosts power requirement of OMAP35x-flavored designs (2008-09-26) [ Processors/DSPs ]
• Multiport LVDS crossbar switches ease links (2008-09-26) [ Interface ]
• Double-sided cooling sets apart power MOSFET (2008-09-26) [ Power/Alternative Energy ]

• DC/DC converter tipped for CCD, LCD (2008-09-26) [ Power/Alternative Energy ]
• FPGA solution zeroes in on next-gen telecomm equipment (2008-09-26) [ FPGAs/PLDs ]
• Epson Toyocom applies QMEMS on pressure sensors (2008-09-26) [ Sensors/MEMS ]
• Power meters come with wide bandwidth, high sampling rate (2008-09-26) [ T&M ]
• Will pedestrian navigation take off? (2008-09-25) [ RF/Microwave ]

• BridgeCo, Heartland co-develop networked audio solutions (2008-09-25) [ Embedded ]
• Aixtron: LED market boom not before 2013 (2008-09-25) [ Optoelectronics/Displays ]
• European bank to invest in India clean tech industry (2008-09-25) [ Power/Alternative Energy ]
• IBM opens gates of 300mm fab (2008-09-25) [ Manufacturing/Packaging ]
• DRAM, NAND prices suffer another slide (2008-09-25) [ Memory/Storage ]

• Intel's Barrett criticizes U.S gov't policies (2008-09-25) [ Manufacturing/Packaging ]
• SoCIP to make its debut in October (2008-09-25) [ EDA/IP ]
• NEC sets aside funds for Kineto Wireless (2008-09-25) [ RF/Microwave ]
• GE-Tatung births HDTV company (2008-09-25) [ Manufacturing/Packaging ]
• Cloud computing gets Oracle, Intel backing (2008-09-25) [ Embedded ]

• NI-WisyTech pairing eyes WiMAX toolkit for LabView (2008-09-25) [ T&M ]
• 'Fastest' 16bit ADC fits multiple process devices (2008-09-25) [ Amplifiers/Converters ]
• Integrated PSoC, nvSRAM secure updated data logging (2008-09-25) [ EDA/IP ]
• Linear debuts monitor ICs to drive hybrids, cars (2008-09-25) [ Power/Alternative Energy ]
• Slim MEMS oscillator targets memory modules (2008-09-25) [ Sensors/MEMS ]

• Synopsys ventures on analog/mixed-signal tools (2008-09-25) [ EDA/IP ]
• MEMS microphones are CE-bound (2008-09-25) [ Sensors/MEMS ]
• Tensilica users receive IP core supports from Aftek (2008-09-25) [ EDA/IP ]
• Mitel-Teleoptix picks AMCC's 10Gbit PHY technology (2008-09-25) [ Networks ]
• Pickering updates LXI switching solution offering (2008-09-25) [ Interface ]

• Catalyst starts temperature sensor line with 12bit device (2008-09-25) [ Sensors/MEMS ]
• Murata boosts AC/DC switching power supply lineup (2008-09-25) [ Power/Alternative Energy ]
• NXP tunes into car radio market with low IF tuner systems (2008-09-25) [ Amplifiers/Converters ]
• Trina Solar, Gestamp open PV plant in Spain (2008-09-24) [ Manufacturing/Packaging ]
• NEC bags femtocell system order from Softbank (2008-09-24) [ RF/Microwave ]

• Atmel workers hold one-day strike in France (2008-09-24) [ Manufacturing/Packaging ]
• Improved tech to bring e-ink display mainstream (2008-09-24) [ Optoelectronics/Displays ]
• Albany NanoTech beefs up cleantech efforts (2008-09-24) [ Manufacturing/Packaging ]
• Analysts: Micron-Qimonda deal in the works (2008-09-24) [ Memory/Storage ]
• Tessera extends biz to VGA camera lenses (2008-09-24) [ Optoelectronics/Displays ]

• Viaccess gets help to secure access to mobile TV (2008-09-24) [ RF/Microwave ]
• IBM to work on Dublin's smart ticketing system (2008-09-24) [ Embedded ]
• ST talks about domino logic (2008-09-24) [ EDA/IP ]
• ARC is up for reorganization (2008-09-24) [ Manufacturing/Packaging ]
• SNIA steps up solid-state storage drive (2008-09-24) [ Memory/Storage ]

• Standalone receiver delivers flexibility in LCD TVs (2008-09-24) [ Amplifiers/Converters ]
• Cable driver backs 3G/HD/SD video serial apps (2008-09-24) [ Embedded ]
• CF card series achieves faster data transfer capacity (2008-09-24) [ Memory/Storage ]
• Toggle switches reduce accidental switching risks (2008-09-24) [ Interface ]
• WiMAX femtocell SoC slashes design cost barriers (2008-09-24) [ RF/Microwave ]

• McCreary debuts, flaunts remote features (2008-09-24) [ Networks ]
• AMCC, Avago jointly showcase SFP+ 10GBASE-LRM solution (2008-09-24) [ Optoelectronics/Displays ]
• Motion controllers carry advanced tuning tools for robotics (2008-09-24) [ Controls/MCUs ]
• 32bit MCU is fit for financial terminal apps (2008-09-24) [ Controls/MCUs ]
• Unicon uses Wolfson audio for Linux-based mobile solution (2008-09-24) [ RF/Microwave ]

• Bosch positions latest MEMS sensors for CE (2008-09-24) [ Sensors/MEMS ]
• Equalizer eases transition to 8.5G (2008-09-24) [ Networks ]
• TI arms Archos IMT with OMAP chips (2008-09-24) [ Processors/DSPs ]
• Actions Semi teams up with GPS map provider (2008-09-23) [ RF/Microwave ]
• GSMA drives renewable energy initiative (2008-09-23) [ RF/Microwave ]

• Group pushes RFID standardization to secure supply chain (2008-09-23) [ RF/Microwave ]
• Albany NanoTech to open 22nm R&D fab (2008-09-23) [ Manufacturing/Packaging ]
• Android-powered smart phones ready for launch (2008-09-23) [ Embedded ]
• Taiwan solar revenues reach $1.1B in 1H 08 (2008-09-23) [ Manufacturing/Packaging ]
• Analysis: Trouble in China foundry biz? (2008-09-23) [ Manufacturing/Packaging ]

• ST chooses Agilent's MIPI D-PHY test platform (2008-09-23) [ T&M ]
• GreenBrilliance taps Spire's turnkey solar module assembly (2008-09-23) [ Manufacturing/Packaging ]
• Applied clinches largest solar deployment title (2008-09-23) [ Power/Alternative Energy ]
• U.S. OEMS reign in industrial, medical electronics ranking (2008-09-23) [ Embedded ]
• Solar module biz to witness rise of LG-Conergy JV (2008-09-23) [ Manufacturing/Packaging ]

• MicroTCA chassis guards panels from shock, vibration (2008-09-23) [ Embedded ]
• Brushless motor delivers faster sensing programmability (2008-09-23) [ Sensors/MEMS ]
• IP video phone goes beyond video conferencing (2008-09-23) [ RF/Microwave ]
• Reliable PCIe boards hasten algorithm processing (2008-09-23) [ Interface ]
• Integrated CAD tool system eases project execution (2008-09-23) [ EDA/IP ]

• Bookham offers XFP-E tunable pluggable transceiver (2008-09-23) [ Networks ]
• RPM extends programming support for Cypress's PSoC (2008-09-23) [ Embedded ]
• Legend readies demodulators for China market (2008-09-23) [ RF/Microwave ]
• Renesas secures M2M wireless comms (2008-09-23) [ Controls/MCUs ]
• MLCCs weather extreme mechanical stress (2008-09-23) [ Embedded ]

• 1200W, 2000W bulk front-end power supplies debut (2008-09-23) [ Power/Alternative Energy ]
• IR rolls Class D audio power amplifier reference design (2008-09-23) [ Power/Alternative Energy ]
• Hynix shuts down 200mm fabs (2008-09-22) [ Manufacturing/Packaging ]
• Report: India LCD TV market doubles every year (2008-09-22) [ Manufacturing/Packaging ]
• Dell mum over plans on Limerick facility (2008-09-22) [ Manufacturing/Packaging ]

• Patent startup secures high-profile VC investments (2008-09-22) [ EDA/IP ]
• IC Insights slashes 2008 forecast by $6B (2008-09-22) [ Manufacturing/Packaging ]
• New York may get solar boost from IBM (2008-09-22) [ Manufacturing/Packaging ]
• TV big shots lack stereo 3D patents (2008-09-22) [ Optoelectronics/Displays ]
• Mobile broadband aims to bridge elderly, caregivers (2008-09-22) [ RF/Microwave ]

• Hoku beefs up polysilicon supply pact with Tianwei (2008-09-22) [ Manufacturing/Packaging ]
• NXP solution embedded in accident alert system in cars (2008-09-22) [ Embedded ]
• Nvidia trims employee count (2008-09-22) [ Manufacturing/Packaging ]
• Hitachi lays out plan to power up TV biz (2008-09-22) [ Manufacturing/Packaging ]
• Integrated tuner IC touts superior performance (2008-09-22) [ Amplifiers/Converters ]

• Compact op amp delivers stable protection circuitry (2008-09-22) [ Power/Alternative Energy ]
• Security chips monitor unauthorized batteries (2008-09-22) [ Sensors/MEMS ]
• LabVIEW driver eases interface with monitoring tools (2008-09-22) [ EDA/IP ]
• Study: USB adapters better than discrete graphics cards (2008-09-22) [ Networks ]
• Firms tie up for dynamic video streaming demo (2008-09-22) [ RF/Microwave ]

• Bi-directional ECAD-MCAD offers collaboration capability (2008-09-22) [ EDA/IP ]
• Touch controller highlights reliability, trims component count (2008-09-22) [ Controls/MCUs ]
• DC/DC converters encourage cost savings (2008-09-22) [ Amplifiers/Converters ]
• Connectors zoom in on automotives (2008-09-22) [ Interface ]
• Next-generation embedded packaging solution rolls (2008-09-22) [ T&M ]

• ST toughens further new power MOSFETs (2008-09-22) [ Power/Alternative Energy ]