• Solar power: The next major energy source (2008-09-19) [ Power/Alternative Energy ]
• Group readies guide kit for SOI circuit design (2008-09-19) [ Embedded ]
• Cisco employs virtualization OS for storage tools (2008-09-19) [ Networks ]
• DTV SoCs allow versatile connectivity design system (2008-09-19) [ Embedded ]
• Airwire antenna extends power transmission range (2008-09-19) [ RF/Microwave ]

• Video amps enhance images, capacity of HDTVs (2008-09-19) [ Optoelectronics/Displays ]
• VCA taps DaVinci tech for video analytics solution (2008-09-19) [ Embedded ]
• Speedy read channel fit for enterprise HDDs (2008-09-19) [ Embedded ]
• Dual buck converter fuses high, low current power functions (2008-09-19) [ Power/Alternative Energy ]
• Connectors gear up for in-flight entertainment (2008-09-19) [ Networks ]

• Evaluation kit delivers drop-in 2:1 HDMI solution (2008-09-19) [ Networks ]
• Low absolute TR characterizes Z-Foil resistor (2008-09-19) [ Power/Alternative Energy ]
• DC/DC boost converter designed for LCDs, OLEDs (2008-09-19) [ Power/Alternative Energy ]
• Nokia grabs top spot in green electronics list (2008-09-19) [ Manufacturing/Packaging ]
• Tegal acquires Alcatel Lucent 3D packing IP (2008-09-19) [ Manufacturing/Packaging ]

• Analysis: Communications processors to hit dead end? (2008-09-19) [ RF/Microwave ]
• IBM pushes 'computational scaling' for 22nm (2008-09-19) [ Manufacturing/Packaging ]
• Tech firms face impact of financial crisis (2008-09-19) [ Manufacturing/Packaging ]
• Has IC biz lost its 'money-making touch'? (2008-09-19) [ Manufacturing/Packaging ]
• Which memory rival should buy SanDisk? (2008-09-19) [ Memory/Storage ]

• 'Smart Objects' IP networking receive support from alliance (2008-09-19) [ Embedded ]
• Cree, Digi-Key beef up distribution arrangement (2008-09-19) [ Manufacturing/Packaging ]
• Wired home area networks standard in the works (2008-09-19) [ RF/Microwave ]
• LDK, Q-Cells cooperate on solar-grade silicon processing (2008-09-19) [ Manufacturing/Packaging ]
• Ericsson secures $450M network deal in Vietnam (2008-09-19) [ RF/Microwave ]

• Transceiver speeds up transmission in multiple networks (2008-09-18) [ RF/Microwave ]
• Serial FRAM delivers increased storage capacity (2008-09-18) [ Memory/Storage ]
• ASIC blocks hasten serial data transfers (2008-09-18) [ FPGAs/PLDs ]
• ADI unleashes HDTV audio platform, HDMI transmitter (2008-09-18) [ Interface ]
• 1.5GHz FPGAs target ASIC sockets in complex systems (2008-09-18) [ EDA/IP ]

• Power supplies are ready for military tasks (2008-09-18) [ Power/Alternative Energy ]
• picoChip heralds 262GIPS, 35GMACS multicore wireless chips (2008-09-18) [ RF/Microwave ]
• PMIC features USB On-The-Go, overvoltage protection (2008-09-18) [ Power/Alternative Energy ]
• ESL EDA platform slashes design time in half (2008-09-18) [ EDA/IP ]
• IP network camera reference design is fit for advanced surveillance (2008-09-18) [ Embedded ]

• ROM-based Bluetooth embraces DSP (2008-09-18) [ RF/Microwave ]
• LIN/SAE J2602 transceivers meet rigid car requirements (2008-09-18) [ Interface ]
• Freescale to acquire communications software provider (2008-09-18) [ Embedded ]
• ABI: Touchscreens in mobile apps to hit $5B next year (2008-09-18) [ Sensors/MEMS ]
• Intel aids India's first microprocessor design (2008-09-18) [ Processors/DSPs ]

• Wireless firm targets to bridge WiMAX, LTE (2008-09-18) [ RF/Microwave ]
• Silicon Valley beefs up solar initiatives (2008-09-18) [ Manufacturing/Packaging ]
• DTV standard challenges mobile TV spec in China (2008-09-18) [ RF/Microwave ]
• SanDisk turns down Samsung's takeover bid (2008-09-18) [ Manufacturing/Packaging ]
• RMI fortifies partnerships with CSR, SiGe Semi (2008-09-18) [ RF/Microwave ]

• Lattice to undergo restructuring (2008-09-18) [ Manufacturing/Packaging ]
• IR board slams Vishay's bid (2008-09-18) [ Manufacturing/Packaging ]
• Yangzhou to house Suntech's new PV cell facility (2008-09-18) [ Manufacturing/Packaging ]
• NEC, Elmos commence joint partnership (2008-09-18) [ Manufacturing/Packaging ]
• Equalizer IC enables error-free transmission in copper cables (2008-09-17) [ Networks ]

• Controller supports multiphase power conversion (2008-09-17) [ Power/Alternative Energy ]
• Converters upgrade wide range of high-speed apps (2008-09-17) [ Power/Alternative Energy ]
• CCD technology renders high-res, standard HD image (2008-09-17) [ Sensors/MEMS ]
• DC/DC converters cut board-level power needs (2008-09-17) [ Power/Alternative Energy ]
• Controller increases capacity of multiple modules (2008-09-17) [ Power/Alternative Energy ]

• Network storage system reduces space, power use (2008-09-17) [ Memory/Storage ]
• Space-bound FPGAs injected with DSP capabilities (2008-09-17) [ FPGAs/PLDs ]
• Adlink packs ATCA blade with powerful features (2008-09-17) [ Processors/DSPs ]
• Video security encoders get a boost via McVFE (2008-09-17) [ Processors/DSPs ]
• 18bit DAC transforms system performance, designs (2008-09-17) [ Embedded ]

• Matrox eyes overhaul of security solutions portfolio (2008-09-17) [ Embedded ]
• Analyst: Fabless model is 'stressed out' (2008-09-17) [ Manufacturing/Packaging ]
• LTX-Credence streamlines operations (2008-09-17) [ Manufacturing/Packaging ]
• Mobile TV leaves handset operators behind (2008-09-17) [ RF/Microwave ]
• Commentary: Who's to blame for NX'Ps fate? (2008-09-17) [ Manufacturing/Packaging ]

• Intel sets stage for 'virtualization 2.0' (2008-09-17) [ Processors/DSPs ]
• Europe hopes to boost innovation with EIT (2008-09-17) [ Embedded ]
• AuthenTec sensors grace Fujitsu Siemens laptops (2008-09-17) [ Sensors/MEMS ]
• EDS integration means restructuring for HP (2008-09-17) [ Embedded ]
• Olympics dampens China DRAM market (2008-09-17) [ Memory/Storage ]

• NEC, Telecom Italia reach wireless deal (2008-09-17) [ RF/Microwave ]
• Trina Solar inks sales deal with Invictus (2008-09-17) [ Manufacturing/Packaging ]
• Kemet sells wet tantalum assets to Vishay (2008-09-17) [ Manufacturing/Packaging ]
• Bluetooth: Embracing the medical challenge (2008-09-16) [ RF/Microwave ]
• Manage growing complexity in automotive design (2008-09-16) [ EDA/IP ]

• Two firms ready Bluetooth software for audio optimization (2008-09-16) [ RF/Microwave ]
• Enhanced power supply promises reliable output power (2008-09-16) [ Power/Alternative Energy ]
• MEMS gyroscope upgrades system production, efficiency (2008-09-16) [ Sensors/MEMS ]
• Low-pass filters/amplifiers offer high signal capacity (2008-09-16) [ RF/Microwave ]
• Compact encoder ICs advance motion sensing apps (2008-09-16) [ Embedded ]

• Reference design allows multipurpose mobile connectivity (2008-09-16) [ RF/Microwave ]
• Mentor, Cadence hoist verification to a new stature (2008-09-16) [ EDA/IP ]
• Video clock reference design augments jitter performance (2008-09-16) [ Embedded ]
• Freescale boosts energy efficiency in embedded processing (2008-09-16) [ Embedded ]
• TDK churns out low-profile, low ESL multilayer capacitor (2008-09-16) [ Embedded ]

• DVB-T/H, DTMB measurements get help from Agilent (2008-09-16) [ T&M ]
• TI DOCSIS 3.0 eyes data, video gateway apps (2008-09-16) [ Networks ]
• TI honors Jack Kilby with IC research center (2008-09-16) [ EDA/IP ]
• TV chip market up for growth, consolidation (2008-09-16) [ Optoelectronics/Displays ]
• South Korea, Germany shine brighter than U.S. in solar energy (2008-09-16) [ Power/Alternative Energy ]

• ITC probes basis for Freescale's case vs. LSI (2008-09-16) [ EDA/IP ]
• NXP to close fabs with installed redesign plan (2008-09-16) [ Manufacturing/Packaging ]
• Medical ICs outpace CE, computer chips (2008-09-16) [ Manufacturing/Packaging ]
• Hitachi GST highlights green commitment (2008-09-16) [ Memory/Storage ]
• MOST networks invade Asia cars (2008-09-16) [ Networks ]

• Improve code review with shorter checklists (2008-09-16) [ Embedded ]
• Combine C and assembly code for maximum DSP performance (2008-09-16) [ Embedded ]
• Single-chip multiprocessing steps up (2008-09-16) [ Processors/DSPs ]
• Be awed by amazing engineering feats (2008-09-16) [ EDA/IP ]
• Jedec spec standardizes 8B/10B gains (2008-09-16) [ Amplifiers/Converters ]

• Driving the data for navigation devices (2008-09-16) [ RF/Microwave ]
• Cleantech investment boom begins (2008-09-16) [ Power/Alternative Energy ]
• MEMS wear sophistication well (2008-09-16) [ Sensors/MEMS ]
• IIC-Taiwan encompasses entire design value chain (2008-09-15) [ EDA/IP ]
• Tensilica, Cadence tip CPF-enabled multimedia designer (2008-09-15) [ EDA/IP ]

• Sify taps Cisco to deploy IP-NGN in India (2008-09-15) [ Networks ]
• Samsung, Intrinsity join forces on low-power processors (2008-09-15) [ Processors/DSPs ]
• Harman, Wipro open engineering center in India (2008-09-15) [ Manufacturing/Packaging ]
• Bright future awaits green photonics market (2008-09-15) [ Optoelectronics/Displays ]
• Web content on TV is just a click away (2008-09-15) [ Networks ]

• Analysts: Fab-tool market gloom persists (2008-09-15) [ Manufacturing/Packaging ]
• IBM, NEC to develop 32nm IC processing (2008-09-15) [ Manufacturing/Packaging ]
• U.S. lab outwits Europe's supercollider in particle testing (2008-09-15) [ Optoelectronics/Displays ]
• Analysis: Magma struggles to difficult times (2008-09-15) [ EDA/IP ]
• Newtec broadband terminal uses Altera FPGAs (2008-09-15) [ FPGAs/PLDs ]

• Irish maritime wireless systems provider gets DoCoMo funding (2008-09-15) [ RF/Microwave ]
• Surface mount chip capacitors target telecom apps (2008-09-15) [ Amplifiers/Converters ]
• CMOS image sensor combines wide range, high resolution (2008-09-15) [ Sensors/MEMS ]
• Step-down converters are 95 percent power efficient (2008-09-15) [ Power/Alternative Energy ]
• Nordic Semi claims smallest 2.4GHz wireless SoC (2008-09-15) [ RF/Microwave ]

• New demodulator highlights DVB-T2 tech for HDTV (2008-09-15) [ RF/Microwave ]
• DC/DC controller regulates pre-biased loads (2008-09-15) [ Power/Alternative Energy ]
• Driver IC upgrades LCD backlight for media player apps (2008-09-15) [ Optoelectronics/Displays ]
• Stereo audio codec fits portable systems (2008-09-15) [ Amplifiers/Converters ]
• AMD revs up 3D graphics rendering (2008-09-15) [ Embedded ]

• Dual-axis accelerometers improve ESC systems (2008-09-15) [ Sensors/MEMS ]
• DVB-S2 demodulator paves way for cost-effective HDTV equipment (2008-09-15) [ Embedded ]
• PCIe passive switches ready for next-gen data rates (2008-09-15) [ Interface ]
• TI OMAP: ARMed and ready (2008-09-12) [ Processors/DSPs ]
• AC/DC power supplies meet safety standards (2008-09-12) [ Power/Alternative Energy ]

• CF card boasts increased capacity, improved transfer rate (2008-09-12) [ Memory/Storage ]
• Atmel adds GUI to 125kHz RFID evaluation kit (2008-09-12) [ Embedded ]
• Turnkey algorithms extend benefits of STM32 MCU (2008-09-12) [ Embedded ]
• National Semi rolls 3G-SDI design kits (2008-09-12) [ Embedded ]
• Platform enables multicodec media processing (2008-09-12) [ Processors/DSPs ]

• EMI filters integrate diodes for ESD protection (2008-09-12) [ Amplifiers/Converters ]
• Design kit eases signal interface between DACs, amps (2008-09-12) [ EDA/IP ]
• Compact AC/DC supply drives medical components (2008-09-12) [ Power/Alternative Energy ]
• ispLEVER service pack to enhance designer's creativity (2008-09-12) [ EDA/IP ]
• NXP security chips smash speed record for eGovernment deals (2008-09-12) [ Embedded ]

• Freescale revs up airbag tech with DSI chips (2008-09-12) [ Sensors/MEMS ]
• Mattson to streamline spending strategy (2008-09-12) [ Manufacturing/Packaging ]
• Health care community notes medical converging issues (2008-09-12) [ Sensors/MEMS ]
• National Semi CEO joins 'green revolution' (2008-09-12) [ EDA/IP ]
• Chip materials market outshines IC equipment sector (2008-09-12) [ Manufacturing/Packaging ]

• Huawei fortifies focus on Germany with new center (2008-09-12) [ Manufacturing/Packaging ]
• Synopsys, Ovonyx develop simulation model for PCM (2008-09-12) [ EDA/IP ]
• eMemory, MagnaChip team on non-volatile memory IP (2008-09-12) [ Memory/Storage ]
• South Korea enters PV solar market (2008-09-12) [ Manufacturing/Packaging ]
• Venture capital veers away from fabless IC firms (2008-09-12) [ Manufacturing/Packaging ]

• Vishay sweetens IR takeover bid to $1.7B (2008-09-12) [ Manufacturing/Packaging ]
• Digi-Key, Altium agree on global distribution (2008-09-12) [ Manufacturing/Packaging ]
• Qualcomm's Gobi gets Panasonic Tough(book) (2008-09-12) [ Embedded ]
• RF synthetic instrument supports up to 26.5GHz (2008-09-11) [ T&M ]
• HTPS panels enable HD viewing in 3LCD projection systems (2008-09-11) [ Optoelectronics/Displays ]

• ADI optimizes image quality, power efficiency of ultrasound devices (2008-09-11) [ EDA/IP ]
• TI brings 32bit real-time control to cost-sensitive apps (2008-09-11) [ Embedded ]
• Compact HDMI interface hastens board assembly capacity (2008-09-11) [ Interface ]
• Connectors deliver versatility in multiple apps (2008-09-11) [ Networks ]
• Module enables better features for 45nm processors (2008-09-11) [ Embedded ]

• Low-jitter oscillators withstand high frequencies (2008-09-11) [ RF/Microwave ]
• Power converter yields up to 6MW of wind energy (2008-09-11) [ Power/Alternative Energy ]
• Tool eases design, signal testing of digital radio (2008-09-11) [ EDA/IP ]
• Spartan-3A FPGA evaluation kit gets an upgrade (2008-09-11) [ EDA/IP ]
• OpenSPARC evaluation platform is rich in features (2008-09-11) [ EDA/IP ]

• Symbian Foundation wins nine new members (2008-09-11) [ Embedded ]
• O3b makes fast Internet accessible to emerging markets (2008-09-11) [ Networks ]
• Nvidia-Opera tie-up brings optimized Web browsing (2008-09-11) [ Processors/DSPs ]
• No major surprises in Apple's product launch (2008-09-11) [ RF/Microwave ]
• Taiwan's PC market continues to slide (2008-09-11) [ Manufacturing/Packaging ]

• Study finds growing recognition of Wi-Fi Certified products (2008-09-11) [ RF/Microwave ]
• Nokia Siemens powers Beijing-Tianjin railway comms system (2008-09-11) [ RF/Microwave ]
• EEs enable collider discover new physics (2008-09-11) [ Optoelectronics/Displays ]
• Can SEMI revive Dresden manufacturing flare? (2008-09-11) [ Manufacturing/Packaging ]
• Analysis: The long road to mobile TV (2008-09-11) [ RF/Microwave ]

• Air-conditioner maker picks ON Semi's high-voltage switcher (2008-09-11) [ Manufacturing/Packaging ]
• Analog Devices taps Virage Logic's Aeon NVM tech (2008-09-11) [ Manufacturing/Packaging ]