• Freescale positions LED backlight driver for notebooks, FPDs (2008-09-10) [ Optical Electronics and Display ]
• Chip manages power in 32bit MCU-based designs (2008-09-10) [ Interface Design ]
• Wi-Fi chip streams multiple HD videos simultaneously (2008-09-10) [ RF/Wireless ]
• FastSoft TCP accelerator targets carrier systems (2008-09-10) [ Embedded Systems ]
• Audio DSP brings Dolby Volume to home theaters (2008-09-10) [ Digital Signal Processing ]

• VHF/UHF transmitter delivers up to 100Kbit/s (2008-09-10) [ RF/Wireless ]
• Demo board eases capacitive touch-sensing interface (2008-09-10) [ Sensor Technology ]
• Oscillators provide widest RF to consumer apps (2008-09-10) [ RF/Wireless ]
• Intel launches 'green' Xeon processors (2008-09-10) [ Embedded Systems ]
• 12bit ADCs weather +125°C (2008-09-10) [ Amplifying/Conditioning/Converting ]

• Meritec and Cinch's NX+ touts enhanced performance (2008-09-10) [ Networking Design ]
• Low power, green designs define future LCD trends (2008-09-10) [ Optical Electronics and Display ]
• U.S. SEC okays ON Semi-Catalyst merger statement (2008-09-10) [ EDA/IC Design ]
• Sanyo Denki eyes Actel's FPGAs for new products (2008-09-10) [ Control Design ]
• Tiny switches respond to security cards' risks (2008-09-10) [ Security Design ]

• Skyworks, Ember partner on Zigbee front-end modules (2008-09-10) [ RF/Wireless ]
• Reviewing lessons from giants' flop modules (2008-09-10) [ RF/Wireless ]
• Elcoteq buys Philips' flat-panel TV plant in Mexico (2008-09-10) [ Process/Manufacturing ]
• Nokia feels pressure of economic slowdown (2008-09-10) [ RF/Wireless ]
• WSJ: Dell to sell off PC factories (2008-09-10) [ Process/Manufacturing ]

• Report: Broadband costs could spark digital divide in UK (2008-09-10) [ RF/Wireless ]
• Altera brings SOPC World 2008 to India, China (2008-09-10) [ Programmable Logic ]
• Changes await Korea's broadcasting, comms sector (2008-09-10) [ RF/Wireless ]
• Implement virtualization in mobile devices (2008-09-10) [ EDA/IC Design ]
• ABI: Bluetooth to hit 95% penetration rate in MIDs (2008-09-09) [ RF/Wireless ]

• Vmware, Fujitsu bring server virtualization to Southeast Asia (2008-09-09) [ Embedded Systems ]
• PV firm eyes Spanish market for solar cells (2008-09-09) [ Power Design ]
• SemIndia-Jurong JV preps for tech collaboration (2008-09-09) [ Process/Manufacturing ]
• Special chips ready to identify unique marks (2008-09-09) [ Security Design ]
• LG targets $20B display sales by 2010 (2008-09-09) [ Process/Manufacturing ]

• India petroleum firms tap IBM's RFID tracking solution (2008-09-09) [ RF/Wireless ]
• German gov't backs 32nm mask litho project (2008-09-09) [ Process/Manufacturing ]
• Buzz: Will Samsung buy SanDisk? (2008-09-09) [ Process/Manufacturing ]
• NXP roadmap drives application-specific solutions (2008-09-09) [ Process/Manufacturing ]
• Russia gets mobile WiMAX network (2008-09-09) [ RF/Wireless ]

• Pioneer's Blu-ray players spin with Wolfson audio DAC (2008-09-09) [ Amplifying/Conditioning/Converting ]
• Nordic rolls 'smallest' ultralow power 2.4GHz wireless solution (2008-09-09) [ RF/Wireless ]
• AD Semi enables three-point touchscreen sensing (2008-09-09) [ Sensor Technology ]
• ST takes wrap off AC-switch gate driver with supervisor IC (2008-09-09) [ Control Design ]
• Software simplifies metamaterial-based RF designs (2008-09-09) [ RF/Wireless ]

• GaAs FET amplifier gears up for military, wireless apps (2008-09-09) [ Amplifying/Conditioning/Converting ]
• Delay generator has eight timing channels (2008-09-09) [ EDA/IC Design ]
• Flexible transceivers pack high ESD protection (2008-09-09) [ RF/Wireless ]
• Tiny HDMI transmitter maximizes control for HD devices (2008-09-09) [ Interface Design ]
• PV inverter ensures large-scale utility connections (2008-09-09) [ Power Design ]

• Analyzer revs up serial comms implementation (2008-09-09) [ Design Test ]
• Atmel peppers customizable MCU with UWB MAC (2008-09-09) [ Control Design ]
• Low-cost tool generates waveform for bench apps (2008-09-08) [ Design Test ]
• NI smart cameras show embedded machine vision (2008-09-08) [ Optical Electronics and Display ]
• SP3T switch fits WLAN, Bluetooth apps (2008-09-08) [ RF/Wireless ]

• Compact connectors allow multiple mounting (2008-09-08) [ Networking Design ]
• DisplayPort repeater device unrolls from Parade (2008-09-08) [ RF/Wireless ]
• PCIe DVR cards render real-time H.264 encoding (2008-09-08) [ Interface Design ]
• Timing module tracks GPS signals (2008-09-08) [ Design Test ]
• Board touts rapid evaluation, prototyping (2008-09-08) [ EDA/IC Design ]

• Encoder IC requires minimal space (2008-09-08) [ Control Design ]
• Current-sense amplifier asserts accuracy, low power use (2008-09-08) [ Amplifying/Conditioning/Converting ]
• 600V ICs zoom in on automotive applications (2008-09-08) [ Power Design ]
• Integrated controller delivers compact Hot Swap solution (2008-09-08) [ Power Design ]
• Printed electronics materials market to reach $11B by 2015 (2008-09-08) [ Process/Manufacturing ]

• Intel Capital invests in WiMAX service provider (2008-09-08) [ RF/Wireless ]
• Bosch puts up research center in Singapore (2008-09-08) [ Process/Manufacturing ]
• Tyco to reorganize automotive ops in Europe (2008-09-08) [ Process/Manufacturing ]
• Polycrystalline supply to push thin film solar growth (2008-09-08) [ Process/Manufacturing ]
• UWB finds place in wireless HD videos (2008-09-08) [ RF/Wireless ]

• Will AMD finally detail fab-lite progress? (2008-09-08) [ Process/Manufacturing ]
• LDK inks 7-year solar deal with Hyundai (2008-09-08) [ Process/Manufacturing ]
• Debate on flash memory's future heats up (2008-09-08) [ Process/Manufacturing ]
• Analyst expects more 3G baseband tie-ups (2008-09-08) [ RF/Wireless ]
• Alcatel-Lucent collects Mobile WiMAX certification (2008-09-08) [ RF/Wireless ]

• Sony deals again with burn hazard laptops (2008-09-08) [ Process/Manufacturing ]
• Sharp catches up on 'cool' handset craze (2008-09-05) [ RF/Wireless ]
• Avago introduces GPS LNA with integrated FBAR filter (2008-09-05) [ RF/Wireless ]
• Agilent eases testing of five major display formats (2008-09-05) [ Design Test ]
• V8 powers Google's Chrome (2008-09-05) [ Embedded Systems ]

• ASA rolls M1 scope tools ver6.01 (2008-09-05) [ Design Test ]
• Oscillator handles 75-85MHz frequency range (2008-09-05) [ RF/Wireless ]
• Fan trays ensure thermal protection in cooling apps (2008-09-05) [ Embedded Systems ]
• Superjunction MOSFETs trim on-state resistance, gate charge (2008-09-05) [ Power Design ]
• Crystal oscillators upgrade functionality of bus interfaces (2008-09-05) [ RF/Wireless ]

• Femtocell baseband to integrate DSP core (2008-09-05) [ Digital Signal Processing ]
• IP core enhances capacity of next IEEE standard (2008-09-05) [ EDA/IC Design ]
• JTAG beefs up lineup with new tools, updates (2008-09-05) [ Design Test ]
• Single test system for LTE debuts (2008-09-05) [ Design Test ]
• Firms agree to supply solar cells in Europe by 2013 (2008-09-05) [ Power Design ]

• Slump in DRAM, NAND flash prices lingers (2008-09-05) [ Buffer/Storage ]
• Researchers create 'nanonets' for electronics (2008-09-05) [ EDA/IC Design ]
• Slowdown becomes boon for consumer electronics (2008-09-05) [ Process/Manufacturing ]
• Spansion inaugurates security tech office in Milan (2008-09-05) [ Process/Manufacturing ]
• Alchip taps Sony Semi's packaging tech for ASICs (2008-09-05) [ Process/Manufacturing ]

• Canadian Solar, GCL ink long-term supply deal (2008-09-05) [ Process/Manufacturing ]
• Intel acquires mobile Linux developer (2008-09-05) [ Embedded Systems ]
• Infineon shares up on Qimonda sale rumors (2008-09-05) [ Process/Manufacturing ]
• Opinion: Google's Chrome not yet for mainstream computing (2008-09-05) [ Embedded Systems ]
• Hong Kong is last stop for Agilent's wireless test tour (2008-09-05) [ Design Test ]

• X-Fab Sarawak all set to start 0.35µm process tech (2008-09-05) [ Process/Manufacturing ]
• Plexus sees Hangzhou as manufacturing site (2008-09-05) [ Process/Manufacturing ]
• Leadis to exhibit driver, audio, touch solutions at IIC-Taiwan (2008-09-04) [ Optical Electronics and Display ]
• Tool suite upgrade touts faster fault detection (2008-09-04) [ Design Test ]
• Gbit network equipment LSI draws low power (2008-09-04) [ Embedded Systems ]

• Thermocouple power sensors claim 'widest' dynamic range (2008-09-04) [ Sensor Technology ]
• Low-cost STB platform boosts Brazil's TV viewing (2008-09-04) [ Control Design ]
• Carrier board assists in multiple module capacities (2008-09-04) [ Interface Design ]
• Receiver IC gears up multibands with software (2008-09-04) [ RF/Wireless ]
• 'First' test platform for USB 3.0 rolls (2008-09-04) [ Interface Design ]

• Monitoring ICs convey real-time power info (2008-09-04) [ Power Design ]
• Power supply does away with additional system airflow (2008-09-04) [ Power Design ]
• Tiny PMIC makes the most of battery runtime (2008-09-04) [ Power Design ]
• Active current limiting defines OVPs (2008-09-04) [ Power Design ]
• New JV of Li-ion cells for cars hits the road (2008-09-04) [ Power Design ]

• New wave of ATE consolidation emerges (2008-09-04) [ Design Test ]
• Spansion to incorporate NAND flash to handsets (2008-09-04) [ Buffer/Storage ]
• LTX-Credence rises from merger of two ATE vendors (2008-09-04) [ EDA/IC Design ]
• Asia-Pacific IC industry on track to grow 6.4% (2008-09-04) [ Process/Manufacturing ]
• Fujitsu, Nanya sign license deal to settle patent suit (2008-09-04) [ Buffer/Storage ]

• NFC handset trial draws favorable response in UK (2008-09-04) [ RF/Wireless ]
• NSF, research consortium team on multicore design (2008-09-04) [ EDA/IC Design ]
• SIA: 300mm wafers rule IC manufacturing in July (2008-09-04) [ Process/Manufacturing ]
• Google mobile browser runs on ARM, x86 (2008-09-04) [ Embedded Systems ]
• Suntech inks another deal with DC Chemical (2008-09-04) [ Process/Manufacturing ]

• Tegal secures products, IP for 3D packaging, MEMS (2008-09-04) [ EDA/IC Design ]
• Staccato drives UWB market with Ripcord2 (2008-09-03) [ RF/Wireless ]
• FPC connectors boast .25mm pitch (2008-09-03) [ Networking Design ]
• Flexible video mux packs programmable filters, sync separators (2008-09-03) [ Networking Design ]
• SSR paves way for enhanced installation system (2008-09-03) [ Power Design ]

• Flexible MCU kit provides high capacity, low-cost solutions (2008-09-03) [ Design Test ]
• Four-way terminal blocks simplify connections (2008-09-03) [ Networking Design ]
• Buck regulators achieve ultrafast switching frequency (2008-09-03) [ Power Design ]
• Voltage translators target I²C apps (2008-09-03) [ Interface Design ]
• High flex cables fit C-Track, robotic systems (2008-09-03) [ Networking Design ]

• Motherboard delivers two independent displays (2008-09-03) [ Embedded Systems ]
• Amplifiers handle 500MHz to 1.5GHz bandwidth (2008-09-03) [ Amplifying/Conditioning/Converting ]
• Agilent touts free PLL analysis software (2008-09-03) [ Test/Packaging ]
• Spectra2 enhancements highlight core network test capabilities (2008-09-03) [ Test/Packaging ]
• Two firms sign deal to develop solar cells (2008-09-03) [ Power Design ]

• Infineon leads power semi market (2008-09-03) [ Process/Manufacturing ]
• How far can EDA sustain losses? (2008-09-03) [ EDA/IC Design ]
• CE, wireless devices drive market growth for MEMS (2008-09-03) [ Sensor Technology ]
• LG Display, Taiwan firm put up LCD fab JV (2008-09-03) [ Process/Manufacturing ]
• Mitsubishi beefs up PV cell production with new facility (2008-09-03) [ Process/Manufacturing ]

• Motorola delivers HD IPTV services in Germany (2008-09-03) [ Optical Electronics and Display ]
• Analysis: What's next with the Vishay-IR deal? (2008-09-03) [ Process/Manufacturing ]
• Intel helps boost India WiMAX services (2008-09-03) [ RF/Wireless ]
• SSDs not yet ripe for 'storage-class' apps (2008-09-03) [ Buffer/Storage ]
• Hynix calls for Japan to eliminate chip duty (2008-09-03) [ Process/Manufacturing ]

• Defective HD TVs spell legal woes for Hitachi (2008-09-03) [ Process/Manufacturing ]
• Achieve efficiencies with algorithmic synthesis (2008-09-02) [ EDA/IC Design ]
• Waveguide terminations flaunt rugged, compact design (2008-09-02) [ Networking Design ]
• LVDS switches deliver up to 3.125Gbit/s transmit rate (2008-09-02) [ Networking Design ]
• 30Gbit/s Serdes with clock jitter cleaner debuts from TI (2008-09-02) [ Interface Design ]

• Samsung aims low-density SSDs at low-price PCs (2008-09-02) [ Buffer/Storage ]
• Clock generator eliminates input frequency selection pins (2008-09-02) [ Interface Design ]
• Mini-ITX SBC integrates Intel EP80579 processor (2008-09-02) [ Embedded Systems ]
• Avago updates gate drive optocoupler portfolio (2008-09-02) [ Optical Electronics and Display ]
• On/off controller enables easy, low-cost switching (2008-09-02) [ Control Design ]

• High-speed amplifiers offer flexible video bandwidth (2008-09-02) [ Amplifying/Conditioning/Converting ]
• Low-power stereo DAC improves sound of digital devices (2008-09-02) [ Digital Signal Processing ]
• Portables all set for lightning fast, miniscule solutions (2008-09-02) [ Power Design ]
• Loewe hybrid LCD TVs get a boost via NXP SoC (2008-09-02) [ Embedded Systems ]
• HP-EDS merger creates IT super-giant (2008-09-02) [ Embedded Systems ]

• WitsView warns of low-profit cycle for panel makers (2008-09-02) [ Optical Electronics and Display ]
• Trio cooks up RTOS-based reference design platform (2008-09-02) [ EDA/IC Design ]
• Can Hynix's new facility overcome NAND trials? (2008-09-02) [ Buffer/Storage ]
• Solar cells top thin-film markets for energy apps (2008-09-02) [ Power Design ]
• Oki spins off telecomm biz (2008-09-02) [ Process/Manufacturing ]

• Qualcomm found in contempt of Broadcom patents (2008-09-02) [ RF/Wireless ]
• IR turns down Vishay's takeover offer (2008-09-02) [ Process/Manufacturing ]
• Bell Labs drops IC research biz (2008-09-02) [ Process/Manufacturing ]
• Analysis: AMD's three-year reorganization (2008-09-02) [ Process/Manufacturing ]
• Microchip pours $65M investment in India (2008-09-02) [ Process/Manufacturing ]

• Appellate court sustains favorable ruling to AnalogicTech (2008-09-02) [ Power Design ]
• 50mA regulators suit automotive, industrial control apps (2008-09-01) [ Power Design ]
• AC/DC power supplies boast medical safety badge (2008-09-01) [ Power Design ]
• ATCA chassis packs dual redundant fan trays (2008-09-01) [ Embedded Systems ]
• Optical spectrum analyzer delivers improved throughput at lower cost (2008-09-01) [ Design Test ]

• iDTV SoC backs next-gen HD video standard (2008-09-01) [ Optical Electronics and Display ]
• Sn-Pb plating for capacitors meets lead form needs (2008-09-01) [ Process/Manufacturing ]
• Design tool shortens programming of mixed-signal devices (2008-09-01) [ EDA/IC Design ]
• Compact optocouplers have ultralow package (2008-09-01) [ Optical Electronics and Display ]
• Broadcom DTV solution touts global connectivity (2008-09-01) [ Amplifying/Conditioning/Converting ]

• Vishay offers amber and yellow power LEDs in CLCC-2 package (2008-09-01) [ Optical Electronics and Display ]
• On/off pushbutton controller simplifies switching (2008-09-01) [ EMI/EMC Design ]
• Rohm and Haas readies photovoltaic products (2008-09-01) [ Process/Manufacturing ]
• 16bit MCU: ready for 32bit action (2008-09-01) [ Control Design ]
• MCU, Asia spell the difference for Atmel (2008-09-01) [ Embedded Systems ]

• 3D-TSVs spark packaging revolution (2008-09-01) [ Process/Manufacturing ]
• NAND flash benefits multimedia phones (2008-09-01) [ Buffer/Storage ]
• Tool industry must face parallel programming issues (2008-09-01) [ Embedded Systems ]
• Calling video IP vendors to consolidate (2008-09-01) [ Digital Signal Processing ]
• Mobile video tackles HD challenge (2008-09-01) [ Optical Electronics and Display ]

• UWB connections extend to handsets (2008-09-01) [ RF/Wireless ]
• EcoRAM cuts data center power use (2008-09-01) [ Process/Manufacturing ]
• FPGAs qualify for cars, low-power apps (2008-09-01) [ EDA/IC Design ]
• Components continue shrinking (2008-09-01) [ Process/Manufacturing ]
• Fortified show features new components (2008-09-01) [ EDA/IC Design ]

• Taiwan takes more of notebook market (2008-09-01) [ Embedded Systems ]
• Internet transforms CE into computing devices (2008-09-01) [ Embedded Systems ]
• Chip R&D treads shaky ground (2008-09-01) [ Process/Manufacturing ]
• IIC-Taiwan kicks off innovation (2008-09-01) [ EDA/IC Design ]
• Winning the power challenge (2008-09-01) [ Digital Signal Processing ]