• Motorola takes control of WLAN security provider (2008-07-31) [ Security Design ]
• Tools ease design of MM2 TTL radios (2008-07-31) [ RF/Wireless Design ]
• Thin-film solar cells to generate 26GW of power by 2015 (2008-07-31) [ Power Design ]
• Intel invests $12.5M in solar materials provider (2008-07-31) [ Process/Manufacturing ]
• Siemens finds JV partner for enterprise comms biz (2008-07-31) [ RF/Wireless Design ]

• ST offloads HDD controller division to Western Digital (2008-07-31) [ Buffer/Storage ]
• Coming soon: Lens-free lasers (2008-07-31) [ Optical Electronics and Display ]
• India to develop $10 laptops (2008-07-31) [ Embedded Systems ]
• Three giants collaborate on cloud computing (2008-07-31) [ Test & Packaging ]
• Ultrafast 3D circuit enables higher switching capacity (2008-07-31) [ EDA ]

• Numonyx absorbs 50 employees amid cutbacks (2008-07-31) [ Process/Manufacturing ]
• Kodak image sensors gear up for space mission (2008-07-31) [ Optical Electronics and Display ]
• Affordable wireless access heads to Indonesia (2008-07-31) [ RF/Wireless Design ]
• Power managers meet automotive quality standard (2008-07-31) [ Power Design ]
• Software grants simulation for automotive designs (2008-07-31) [ EDA ]

• Laird Tech takes wrap off thermal interface material (2008-07-31) [ Interface Design ]
• 1GHz PXI digitizer samples up to 20GSps rate (2008-07-31) [ Design Test ]
• Turnkey solution installs industrial wireless apps (2008-07-31) [ RF/Wireless Design ]
• Controller extends Internet, security to M2M devices (2008-07-31) [ Network Design ]
• Coaxial RF connector delivers reliable functionality (2008-07-31) [ RF/Wireless Design ]

• USB device adds digital, analog I/O features (2008-07-31) [ Interface Design ]
• Connector integrates high-speed backplane system (2008-07-31) [ Network Design ]
• Software radio PMC modules highlight performance, density (2008-07-31) [ Programmable Logic ]
• DC/DC converters are fit for military, avionics use (2008-07-31) [ Power Design ]
• RapidIO evaluation platform cuts time-to-market, BOM (2008-07-30) [ Interface Design ]

• Test modules roll for Ethernet, Fibre Channel (2008-07-30) [ Design Test ]
• Tiny comparators draw ultralow power (2008-07-30) [ Power Design ]
• OMAP banishes complexity in HD multimedia designs (2008-07-30) [ Embedded Systems ]
• POL converters offer up to 30A output current (2008-07-30) [ Signal Conditioning ]
• 30W DC/DC converter claims small footprint (2008-07-30) [ Signal Conditioning ]

• AC/DC power conversion ICs have low-profile (2008-07-30) [ Power Design ]
• Boost converters combine switches in mini package (2008-07-30) [ Power Design ]
• Frame grabber offers flexible connection to multiple inputs (2008-07-30) [ Interface Design ]
• Tiny DC/DC converters render easy scalability (2008-07-30) [ Power Design ]
• Rotary potentiometer garners multiple design wins (2008-07-30) [ Sensor Technology ]

• Development kit revs up electronic design (2008-07-30) [ EDA ]
• Hifn-AMCC duo targets networking, storage design (2008-07-30) [ Embedded Systems ]
• Intersil acquires digital audio amp specialist (2008-07-30) [ Signal Conditioning ]
• UMC signs up with Sematech consortium (2008-07-30) [ Process/Manufacturing ]
• Fujitsu beefs up capacity of U.S. facility (2008-07-30) [ Process/Manufacturing ]

• Processor battle moves to consumer computing (2008-07-30) [ Embedded Systems ]
• Media drives 12% increase in home nets (2008-07-30) [ RF/Wireless Design ]
• AMD pushes 'asset-smart' program (2008-07-30) [ Process/Manufacturing ]
• National hails Synopsys as its key EDA partner (2008-07-30) [ EDA ]
• Commentary: Tough calls during tough times (2008-07-30) [ Process/Manufacturing ]

• Indian IT firms expect decline in annual growth (2008-07-30) [ Control Design ]
• ST-NXP Wireless is all set to do business (2008-07-30) [ RF/Wireless Design ]
• Ford's virtual engineering receives Quantum3D aid (2008-07-30) [ Embedded Systems ]
• Chartered to push 45nm despite unstable market (2008-07-29) [ Process/Manufacturing ]
• Nanotech research encourages Russia-U.S. partnership (2008-07-29) [ Process/Manufacturing ]

• FCC gives green light to Sirius-XM merger (2008-07-29) [ RF/Wireless Design ]
• HDMI reigns as king of high-definition interface (2008-07-29) [ Interface Design ]
• Siemens Mobility trims operations (2008-07-29) [ Process/Manufacturing ]
• Appellate Court affirms Motorola case over patent breach (2008-07-29) [ RF/Wireless Design ]
• China Mobile rents out TD-SCDMA phones during Olympics (2008-07-29) [ RF/Wireless Design ]

• Analysis: Ripple effect of Qualcomm-Nokia truce (2008-07-29) [ RF/Wireless Design ]
• ST in talks on Phoenix fab sale (2008-07-29) [ Process/Manufacturing ]
• Infineon streamlines operations, plans 3,000 layoffs (2008-07-29) [ Process/Manufacturing ]
• Vishay, Yosun ink distribution deal (2008-07-29) [ Process/Manufacturing ]
• Mini-tender offer receives TI snub (2008-07-29) [ Process/Manufacturing ]

• Debuggers support ARM multicore processors (2008-07-29) [ Embedded Systems ]
• Automotive MCU driver is AUTOSAR 2.1-compatible (2008-07-29) [ Control Design ]
• Voltage monitors, sequencers underscore accuracy (2008-07-29) [ Power Design ]
• LSI enables content processing on Intel platforms (2008-07-29) [ Embedded Systems ]
• M8 connector fits industrial apps (2008-07-29) [ Network Design ]

• ATCA backplane adds MicroTCA interconnect (2008-07-29) [ Embedded Systems ]
• Signal relay imparts high switching current (2008-07-29) [ Power Design ]
• Modules expand spectrum of DDR3 memory (2008-07-29) [ Buffer/Storage ]
• Metered power units stabilize circuit load in real time (2008-07-29) [ Power Design ]
• Compact SPDT switch renders improved functions (2008-07-29) [ RF/Wireless Design ]

• Ethernet controller boasts higher throughput (2008-07-29) [ Interface Design ]
• Power meters receive software (2008-07-29) [ Test & Packaging ]
• Fujitsu external drive line stores up to 500GB data (2008-07-28) [ Security Design ]
• Multichannel clock buffers optimize embedded designs (2008-07-28) [ EDA ]
• GPS apps get immunity to interference via LNA (2008-07-28) [ RF/Wireless Design ]

• Power supplies with adjustable voltage are medical-grade (2008-07-28) [ Power Design ]
• microSDHC card adds 8GB memory to handsets (2008-07-28) [ Buffer/Storage ]
• Dual-core single board computer targets imaging apps (2008-07-28) [ Embedded Systems ]
• Temp sensor with EEPROM touts ±.5°C accuracy (2008-07-28) [ Sensor Technology ]
• Compact hot swap controller eases optical networks (2008-07-28) [ Network Design ]

• Advanced UARTs integrate multiple features (2008-07-28) [ Interface Design ]
• GNAT Pro for RTX enhances Windows apps (2008-07-28) [ Embedded Systems ]
• White LEDs come in CLCC-2 flat ceramic package (2008-07-28) [ Optical Electronics and Display ]
• Laser driver features integrated bias, high drive current (2008-07-28) [ Optical Electronics and Display ]
• First Solar puts up 10MW PV plant for Sempra (2008-07-28) [ Process/Manufacturing ]

• Kontron releases updated UGM spec (2008-07-28) [ EDA ]
• Returned electronic apps cost Europe $11.5B in 2007 (2008-07-28) [ Process/Manufacturing ]
• Intel takes a slice of SoC market (2008-07-28) [ Process/Manufacturing ]
• India firms beef up internal IT training (2008-07-28) [ Process/Manufacturing ]
• Fujitsu endeavors to adopt 'Green Policy 2020' (2008-07-28) [ Process/Manufacturing ]

• ST sees 'weak' growth in automotive, wireless (2008-07-28) [ RF/Wireless Design ]
• SanDisk to set standards for SSDs (2008-07-28) [ Buffer/Storage ]
• Beijing Olympics to impact China PC market (2008-07-28) [ Control Design ]
• SunPower enters Australian solar market via acquisition (2008-07-28) [ Power Design ]
• Huawei equips Bangladeshi U open wireless lab (2008-07-28) [ RF/Wireless Design ]

• LabView examines structural health of Olympic venues (2008-07-28) [ EDA ]
• Ultrabright WLEDs shine at 136 lumens/W efficacy (2008-07-25) [ Optical Electronics and Display ]
• Industry confab sheds light on future of organic electronics (2008-07-25) [ Process/Manufacturing ]
• Applied breaks ground for Taiwan plant expansion (2008-07-25) [ Process/Manufacturing ]
• DFI initiative gets LSI, ST on board (2008-07-25) [ Buffer/Storage ]

• Handsets poised for steady growth despite declining ASPs (2008-07-25) [ RF/Wireless Design ]
• Update: CEA to look into 3DTV spec proposal (2008-07-25) [ Optical Electronics and Display ]
• CE giants extend support for Wi-Fi variant (2008-07-25) [ RF/Wireless Design ]
• Market growth for HDDs stays high despite setbacks (2008-07-25) [ Buffer/Storage ]
• What has driven Cadence to buyout Mentor? (2008-07-25) [ EDA ]

• Hynix's 200mm U.S. facility to close shop soon (2008-07-25) [ Process/Manufacturing ]
• Cisco beefs up home networking portfolio with acquisition (2008-07-25) [ Network Design ]
• Nokia, Qualcomm call truce, sign new deal (2008-07-25) [ RF/Wireless Design ]
• Improved design ups reliability of DIN connectors (2008-07-25) [ Network Design ]
• DesignWare IP packs fully synthesizable PowerPC cores (2008-07-25) [ EDA ]

• RF tool adds 5.7Mbit/s HSUPA data analysis (2008-07-25) [ Design Test ]
• NXP 'green' PC solution gets 80 PLUS Gold rating (2008-07-25) [ Power Design ]
• Potentiometer switch trims panel real estate (2008-07-25) [ Sensor Technology ]
• Rocker switch, panel indicators maintain IP67 sealing (2008-07-25) [ Optical Electronics and Display ]
• Omniscient C compiler boosts PIC32 RISC performance (2008-07-25) [ Embedded Systems ]

• High-speed USB flash drive carries FIPS validation (2008-07-25) [ Buffer/Storage ]
• Fingerprint sensor provides customized features (2008-07-25) [ Sensor Technology ]
• High-density processor hits benchmark for low power use (2008-07-25) [ Security Design ]
• Multiphase controller eyes server, storage markets (2008-07-25) [ Power Design ]
• Multiplexer zeroes in on flexibility (2008-07-25) [ Interface Design ]

• China IPRDC, Thomson Reuters biz promote best IP practices (2008-07-24) [ Embedded Systems ]
• NXP chips sharpen images of Loewe LCD TVs (2008-07-24) [ RF/Wireless Design ]
• PMC-Sierra licenses MIPS cores for comms, storage solutions (2008-07-24) [ EDA ]
• Toshiba-Matsushita JV to develop OLED displays (2008-07-24) [ Optical Electronics and Display ]
• Project Galaxy allots $6.4M for GALS research (2008-07-24) [ EDA ]

• Demand for low-cost cars fuels new automotive designs (2008-07-24) [ Control Design ]
• India board design services to hit $458M this year (2008-07-24) [ EDA ]
• Three firms showcase 3GPP LTE femtocell functionality (2008-07-24) [ RF/Wireless Design ]
• Analyst sees glory days ahead for IC market (2008-07-24) [ Process/Manufacturing ]
• Optical lithography can cover 12nm, says MIT (2008-07-24) [ Process/Manufacturing ]

• Dwindling earnings force Sony Ericsson to trim workforce (2008-07-24) [ RF/Wireless Design ]
• Mindspeed finalizes IP sale (2008-07-24) [ Network Design ]
• 16bit MCUs drive automotive, chassis control apps (2008-07-24) [ Embedded Systems ]
• TI DSP, processor lines address power budget needs (2008-07-24) [ Digital Signal Processing ]
• New PC on the block elevates green computing (2008-07-24) [ Control Design ]

• Conexant allows watching TV on PCs (2008-07-24) [ RF/Wireless Design ]
• Entropic-Echostar duo team on satellite TV chips (2008-07-24) [ RF/Wireless Design ]
• Beefed up interface line carries rugged, power, I/O interconnects (2008-07-24) [ Interface Design ]
• 'Smallest' SAW duplexers, filters work with W-CDMA bands (2008-07-24) [ RF/Wireless Design ]
• Low-power DDR3 SO-DIMMs render high performance (2008-07-24) [ Buffer/Storage ]

• CPU module highlights AMD processors (2008-07-24) [ Embedded Systems ]
• Oxford controllers reduce cost for storage devices (2008-07-24) [ Control Design ]
• USB security dongle handles complicated access systems (2008-07-24) [ Security Design ]
• DC/DC converter series rides on ultrahigh performance (2008-07-24) [ Power Design ]
• Achieving precision performance from digital pots (2008-07-23) [ EDA ]

• CCID: Steady growth seen for China mobile market (2008-07-23) [ RF/Wireless Design ]
• K-micro boosts ASIC line with new MIPS cores (2008-07-23) [ Embedded Systems ]
• China telco firms obtain 3G licenses after restructuring (2008-07-23) [ RF/Wireless Design ]
• Brocade to pay $3B for Foundry Networks (2008-07-23) [ Network Design ]
• Infineon powers Chinese hybrid cars (2008-07-23) [ Power Design ]

• Efforts heat up in bid to draw investors on energy apps (2008-07-23) [ Process/Manufacturing ]
• Hollywood to bring 3D viewing to TVs (2008-07-23) [ Optical Electronics and Display ]
• Solar wafer firm to streamline market strategies (2008-07-23) [ Process/Manufacturing ]
• Planet NI: Encouraging innovation in India (2008-07-23) [ Design Test ]
• Is it all gloom for ATE? (2008-07-23) [ Design Test ]

• HKSTP-IBM partnership sees extension (2008-07-23) [ EDA ]
• Asia Pacific Microsystems, UMC seal MEMS deal (2008-07-23) [ Process/Manufacturing ]
• Software upgrade supports higher power testing (2008-07-23) [ Design Test ]
• NEC-Skyley platform meets Zigbee PRO specs (2008-07-23) [ RF/Wireless Design ]
• PoE controller eases sub-13W designs (2008-07-23) [ Network Design ]

• RS-232 transceiver isolates data, power lines on chip (2008-07-23) [ EMI/EMC Design ]
• Tool measures high-speed radio layers on WLAN chips (2008-07-23) [ Design Test ]
• TraceX solution embeds system analysis (2008-07-23) [ Embedded Systems ]
• Mobile WiMAX gets high stability from power amp (2008-07-23) [ RF/Wireless Design ]
• Class D speaker amplifier minimizes design cost, space (2008-07-23) [ Signal Conditioning ]

• Dual-port devices satisfy memory buffering standards (2008-07-23) [ Programmable Logic ]
• SBC carries Freescale processors (2008-07-23) [ Embedded Systems ]
• Universal adapter embraces energy efficiency (2008-07-23) [ Power Design ]
• Hong Kong welcomes Fujitsu's new quad-core processor (2008-07-23) [ Control Design ]
• Soudai pours $100M in China district for solar PV (2008-07-22) [ Buffer/Storage ]

• Ericsson, Softbank deliver faster mobile broadband in Japan (2008-07-22) [ RF/Wireless Design ]
• Canadian Solar bags 9MW deal with Conergy (2008-07-22) [ Power Design ]
• Nokia Siemens to focus on DSL, optical access (2008-07-22) [ Network Design ]
• EUV delays drive shift to double-patterning (2008-07-22) [ Process/Manufacturing ]
• Court favors release of Mifare security report (2008-07-22) [ Security Design ]

• China's TD-SCDMA readies for Olympic debut (2008-07-22) [ RF/Wireless Design ]
• TFT LCD equipment sales pegged at $13B in '08 (2008-07-22) [ Optical Electronics and Display ]
• Samsung, Sun tie up to enable flash drive stability (2008-07-22) [ Buffer/Storage ]
• Commentary: Ruiz carries on processor fight (2008-07-22) [ Process/Manufacturing ]
• Nordic to tap Philippines as supply chain HQ (2008-07-22) [ Test & Packaging ]

• SSD standardization endeavors continue (2008-07-22) [ Buffer/Storage ]
• DesignWare SATA IP solution rolls for disk drives (2008-07-22) [ EDA ]
• Programmer facilitates data writing in flash ROM (2008-07-22) [ Embedded Systems ]
• Power efficient DDR3 SDRAM claims 2Gbit/s speed (2008-07-22) [ Buffer/Storage ]
• Programmable automation controller has four serial COM ports (2008-07-22) [ Interface Design ]

• DesignTag digital core adds thermal signaling (2008-07-22) [ EDA ]
• AMC boards cool slots in MicroTCA chassis (2008-07-22) [ Embedded Systems ]
• DC/DC converters attain ultrawide input range (2008-07-22) [ Signal Conditioning ]
• Compact DACs power up versatile functionality (2008-07-22) [ Power Design ]
• VMETRO hastens VPX system flow (2008-07-22) [ Interface Design ]

• Two design IP cores simplify interface connection (2008-07-22) [ EDA ]
• Schottky diodes achieve maximum junction temp (2008-07-22) [ Power Design ]
• TI shatters design costs in portable displays with new offering (2008-07-22) [ Control Design ]
• Innovation propels growth for consumer telematics (2008-07-21) [ RF/Wireless Design ]
• U-Blox, CEVA to resolve $2.5M IP dispute (2008-07-21) [ Embedded Systems ]

• Forum adopts protocol for large-scale femtocell deployments (2008-07-21) [ Network Design ]
• Sony seeks alliance toward standardized UWB tech (2008-07-21) [ RF/Wireless Design ]
• 450mm debate remains in the hot seat (2008-07-21) [ Process/Manufacturing ]
• IPG bags fiber laser system order from BMW (2008-07-21) [ Optical Electronics and Display ]
• ON Semi acquires Catalyst for $115M (2008-07-21) [ Process/Manufacturing ]

• Chip industry preps for 'More than Moore' era (2008-07-21) [ EDA ]
• Brighter white OLEDs could replace light bulbs (2008-07-21) [ Optical Electronics and Display ]
• What's in store for AMD under Meyer's lead? (2008-07-21) [ Process/Manufacturing ]
• EC still chases Intel on unfair competition (2008-07-21) [ Process/Manufacturing ]
• SOI Industry Consortium welcomes Nvidia (2008-07-21) [ Embedded Systems ]

• Half-bridge MOSFET drivers available from Maxim (2008-07-21) [ Power Design ]
• Atmel MCUs drive automotive LIN networking (2008-07-21) [ Control Design ]
• Battery charger promises faster charging for portable apps (2008-07-21) [ Power Design ]
• Power MOSFET trims costs, touts higher efficiency (2008-07-21) [ Power Design ]
• Tool cuts testing time of device development code (2008-07-21) [ Embedded Systems ]

• Wirewound power inductors claim low DC resistance (2008-07-21) [ Power Design ]
• VCO rolls for L-band microwave radio apps (2008-07-21) [ RF/Wireless Design ]
• Ultrahigh-precision resistor renders accuracy, reliability (2008-07-21) [ Power Design ]
• Low-cost audio, video codecs offer versatile features (2008-07-21) [ Programmable Logic ]
• Compact MOSFET drivers improve system performance (2008-07-21) [ Power Design ]

• Micrel zeroes in on security, size in Ethernet ICs (2008-07-21) [ Network Design ]
• Qimonda's mission: power savings in server apps (2008-07-21) [ Buffer/Storage ]