• Solar thermal tech soars as alternative energy (2008-07-18) [ Power Design ]
• Update: 60GHz group opposes Gbit Wi-Fi plan (2008-07-18) [ RF/Wireless Design ]
• Bountiful future seen for OLED, mini-note PC panels (2008-07-18) [ Optical Electronics and Display ]
• Group implements multicore management standard (2008-07-18) [ Embedded Systems ]
• MTNet taps Aeroflex platform for CDMA, A-GPS test (2008-07-18) [ EDA ]

• Digital Audio Tape becomes an HP-Sony project (2008-07-18) [ Process/Manufacturing ]
• FDA okays Intel's home-based health care device (2008-07-18) [ Interface Design ]
• Microsemi takes control of Semicoa (2008-07-18) [ Optical Electronics and Display ]
• Nokia Siemens to conduct HSPA trial in Taiwan (2008-07-18) [ RF/Wireless Design ]
• Rambus, Qimonda revise patent license deal (2008-07-18) [ Buffer/Storage ]

• Solar cars course throughout North America (2008-07-18) [ Power Design ]
• Intel enjoys solid growth amid economic woes (2008-07-18) [ Process/Manufacturing ]
• Terabyte drive sports power-efficient design (2008-07-18) [ Buffer/Storage ]
• High-stability TCXOs aim at mobile GPS market (2008-07-18) [ Optical Electronics and Display ]
• Voltage regulator modules have ultralow profile (2008-07-18) [ Power Design ]

• Virage new DDR3 interface handles up to 1.6Gbit/s (2008-07-18) [ Buffer/Storage ]
• 1U fan trays offer three-, six-fan options (2008-07-18) [ EMI/EMC Design ]
• Interface devices tout ultralow voltage, I/O protection (2008-07-18) [ Interface Design ]
• Step-down controller rolls for notebook memories (2008-07-18) [ Power Design ]
• Voltage translator provides ease in SD card apps (2008-07-18) [ Signal Conditioning ]

• Fan/heat sink mix chills low-profile ICs (2008-07-18) [ EMI/EMC Design ]
• High-quality LCD display driver targets handsets (2008-07-18) [ Optical Electronics and Display ]
• Ultracompact power supply fits small real estate (2008-07-18) [ Power Design ]
• ACS Motion Control expands module control system portfolio (2008-07-18) [ Network Design ]
• China Mobile gains membership in TD-SCDMA Alliance (2008-07-17) [ RF/Wireless Design ]

• Tánaiste, ON Semi intensify R&D on digital power (2008-07-17) [ Power Design ]
• Numonyx NOR reaches out to 65nm (2008-07-17) [ Process/Manufacturing ]
• Samsung 'downturn' rumors surface (2008-07-17) [ Process/Manufacturing ]
• Freescale, Arada co-develop 802.11n ref design (2008-07-17) [ EDA ]
• Continental opens R&D, manufacturing site in India (2008-07-17) [ Process/Manufacturing ]

• India overhauls technical education system (2008-07-17) [ Process/Manufacturing ]
• Is chip R&D facing a dead end? (2008-07-17) [ Process/Manufacturing ]
• SEMI anticipates 20% dip in market performance (2008-07-17) [ Process/Manufacturing ]
• Apple eludes key players in new iPhone (2008-07-17) [ RF/Wireless Design ]
• Sinosoft tech gets top security with Fujitsu biometrics (2008-07-17) [ Security Design ]

• Ramtron works to curb effects of defective devices (2008-07-17) [ Process/Manufacturing ]
• Tiny load switches control high current rails in UMPC (2008-07-17) [ Power Design ]
• Processor packs power-performance punch (2008-07-17) [ Control Design ]
• HP modules deliver 10GbE over multimode (2008-07-17) [ Network Design ]
• Midspeed apps get performance boost from circuit jumpers (2008-07-17) [ Interface Design ]

• RS232 board handles 9,600-baud wireless link (2008-07-17) [ RF/Wireless Design ]
• Sun rolls 'first' 1Tbyte tape storage drive (2008-07-17) [ Buffer/Storage ]
• Instrumentation amp touts lowest power, improved accuracy (2008-07-17) [ Signal Conditioning ]
• SBC renders small form factor multicore computing (2008-07-17) [ Embedded Systems ]
• Crimp terminal provides high current capacity (2008-07-17) [ Interface Design ]

• Wideband filter quashes noise on DisplayPort links (2008-07-17) [ Interface Design ]
• AVX connectors deal with 15A, 650V (2008-07-17) [ Process/Manufacturing ]
• Agilent offers first HiSIM2.4 model extraction package (2008-07-17) [ Test & Packaging ]
• Door zone devices improve car comfort, convenience (2008-07-16) [ Interface Design ]
• Conquer ULC handset design challenges (2008-07-16) [ RF/Wireless Design ]

• Nu Horizons, Osram expand distribution deal to India (2008-07-16) [ Optical Electronics and Display ]
• Qualcomm, IMEC team on 3D tech for wireless apps (2008-07-16) [ EDA ]
• Survey: Mobile TV, Wi-Fi, games turn off handset users (2008-07-16) [ RF/Wireless Design ]
• Apple pledges support for PA Semi processor (2008-07-16) [ Embedded Systems ]
• Nanoelectrodes could cut hydrogen fuel cost (2008-07-16) [ Process/Manufacturing ]

• Dynamic software tool compatible with real-time Linux systems (2008-07-16) [ Embedded Systems ]
• Compact power inductor line fits multiple apps (2008-07-16) [ RF/Wireless Design ]
• Stepdown DC/DC converters render high efficiency (2008-07-16) [ Power Design ]
• Oscilloscope Tools provide faster decode, debug (2008-07-16) [ Design Test ]
• Advanced capacitor handles high DC filtering (2008-07-16) [ Power Design ]

• Freescale, Arada tie up to hasten 802.11n production (2008-07-16) [ RF/Wireless Design ]
• Allegro presents low voltage dual DC/stepper motor driver (2008-07-16) [ Embedded Systems ]
• Atmel bestows upgrades to PMU (2008-07-16) [ Power Design ]
• Supercapacitor charger comes in compact housing (2008-07-16) [ Power Design ]
• Out-of-band tuner stars in cable STB, digital cable-ready TV (2008-07-16) [ RF/Wireless Design ]

• Dual-type power MOSFET boasts high efficiency (2008-07-16) [ Power Design ]
• Cadence Virtuoso aids analog, mixed-signal SoC designs (2008-07-16) [ EDA ]
• Transformed LSI shifts to implementation mode (2008-07-16) [ Buffer/Storage ]
• Mesh nets survive catastrophes (2008-07-16) [ Network Design ]
• The evolution of processor cores (2008-07-16) [ RF/Wireless Design ]

• Predicting real-world wireless performance (2008-07-16) [ EDA ]
• Comply with real-time network needs (2008-07-16) [ Sensor Technology ]
• Hysteretic converters for multiple LED lighting (2008-07-16) [ Optical Electronics and Display ]
• Beyond supercool: room-temperature THz lasers (2008-07-16) [ Sensor Technology ]
• SpringSoft works on global ambition (2008-07-16) [ EDA ]

• Litho options falling behind process needs (2008-07-16) [ Process/Manufacturing ]
• AuthenTec adds technical team in Tokyo (2008-07-15) [ Sensor Technology ]
• iSuppli: Southeast Asia is next LCD-TV hot spot (2008-07-15) [ Optical Electronics and Display ]
• Wafer tech cuts costs in PV manufacturing (2008-07-15) [ Process/Manufacturing ]
• MEMC inks solar wafer deal with Taiwan's Tainergy (2008-07-15) [ Process/Manufacturing ]

• Nokia Siemens wins China Mobile network deal (2008-07-15) [ Network Design ]
• Will Siemens pull out from Fujitsu JV? (2008-07-15) [ Embedded Systems ]
• AMD's takes $948M charge amid job cuts (2008-07-15) [ Process/Manufacturing ]
• iPhone 3G still packs some surprises (2008-07-15) [ Buffer/Storage ]
• Powerline standard needs more support (2008-07-15) [ Network Design ]

• Are chipmakers in the mood to buy equipment? (2008-07-15) [ EDA ]
• It's final: Nokia concludes Navteq purchase (2008-07-15) [ RF/Wireless Design ]
• China Telecom readies 2nd stage of TD-SCDMA plan (2008-07-15) [ Network Design ]
• Chip creates 3D stereo sound from 2-channel audio (2008-07-15) [ Signal Conditioning ]
• Voice response system ensures high QoE for VoIP (2008-07-15) [ Design Test ]

• High-voltage I/O library integrates ESD protection (2008-07-15) [ EMI/EMC Design ]
• Signal transmitter employs inductive principle (2008-07-15) [ Sensor Technology ]
• 50Mpixel image sensor produces vivid colors (2008-07-15) [ Optical Electronics and Display ]
• Component arrays ease design, manufacturing (2008-07-15) [ Sensor Technology ]
• Ethernet media converter stretches EMC performance (2008-07-15) [ Network Design ]

• MEMS microhotplates remain stable under extreme conditions (2008-07-15) [ Sensor Technology ]
• 25V MOSFET promises low on-resistance, gate charge (2008-07-15) [ Signal Conditioning ]
• POLARIS solution powers multimedia handsets (2008-07-15) [ RF/Wireless Design ]
• HP touts two-in-one server blade for data centers (2008-07-15) [ Buffer/Storage ]
• Panel potentiometer is heavy duty (2008-07-15) [ Optical Electronics and Display ]

• Tip of the Week: Simple power supply for FPGAs (Part 1) (2008-07-14) [ Programmable Logic ]
• More firms endorse Symbian Foundation (2008-07-14) [ RF/Wireless Design ]
• Dow beefs up advanced materials offering with new acquisition (2008-07-14) [ Process/Manufacturing ]
• Rambus files patent suit vs. Nvidia (2008-07-14) [ Buffer/Storage ]
• Sematech: 450mm program is on track (2008-07-14) [ Process/Manufacturing ]

• France pledges support for Crolles3 project (2008-07-14) [ Process/Manufacturing ]
• Paint-on solar panels boost efficiency at less cost (2008-07-14) [ Power Design ]
• SunPower to build 35MW solar power plants in U.S. (2008-07-14) [ Process/Manufacturing ]
• Nokia urges consumers to recycle old phones (2008-07-14) [ RF/Wireless Design ]
• Standards for 3D memory chips set (2008-07-14) [ EDA ]

• Silicon fabs target $49.2B for R&D (2008-07-14) [ Process/Manufacturing ]
• Japanese design services firms sign up for PFI (2008-07-14) [ EDA ]
• Impinj buys Intel's RFID reader chip biz (2008-07-14) [ RF/Wireless Design ]
• Optical switch does non-contact object sensing (2008-07-14) [ Sensor Technology ]
• TI rolls 16bit single-channel ADC, low-jitter clock (2008-07-14) [ Signal Conditioning ]

• DAQ cards add motion control interface (2008-07-14) [ Embedded Systems ]
• Serdes with UART/I²C control suits automotive cameras (2008-07-14) [ Interface Design ]
• New XAP processor is built for Zigbee, Bluetooth (2008-07-14) [ Control Design ]
• High-power Li-ion batteries use spinel tech (2008-07-14) [ Power Design ]
• Seagate squeezes 1.5Tbyte data in 3.5-inch drive (2008-07-14) [ Buffer/Storage ]

• Compact IR detector provides low-power use (2008-07-14) [ Optical Electronics and Display ]
• Wireless test systems integrate wider signal capabilities (2008-07-14) [ Design Test ]
• IO library tenders 4KV ESD protection (2008-07-14) [ EMI/EMC Design ]
• Updated CGH microrray software can process 100+ samples (2008-07-14) [ Test & Packaging ]
• NAND flash pushes beyond 10MBps (2008-07-11) [ Buffer/Storage ]

• China consumer IC market to continue growing, says CCID (2008-07-11) [ Process/Manufacturing ]
• Emcore gets $29M purchase order for solar cell receivers (2008-07-11) [ Process/Manufacturing ]
• Intel invests in German solar firm (2008-07-11) [ Power Design ]
• Trio renews Cell/B.E. deal with Georgia Tech (2008-07-11) [ Embedded Systems ]
• NFC Forum releases two new specs (2008-07-11) [ RF/Wireless Design ]

• Report: NXP to bring Mifare 'hackers' to court (2008-07-11) [ RF/Wireless Design ]
• Numonyx, Elpida forge memory foundry deal (2008-07-11) [ Buffer/Storage ]
• Scientists assess greenhouse gas used in chips, LCD (2008-07-11) [ Process/Manufacturing ]
• Samsung drives to produce more reliable SSDs (2008-07-11) [ Process/Manufacturing ]
• Wireless sector battles the doldrums (2008-07-11) [ Process/Manufacturing ]

• Bousted wins contract to build chip-equipment production site (2008-07-11) [ Process/Manufacturing ]
• USDC switches name to FlexTech Alliance, expands mission (2008-07-11) [ Optical Electronics and Display ]
• Compact RGB LED driver manages 24 outputs (2008-07-11) [ Optical Electronics and Display ]
• Processor includes software driver, RTOS support for FPGAS (2008-07-11) [ Programmable Logic ]
• 65nm application processors power PNDs (2008-07-11) [ Control Design ]

• 1A boost converter claims 97% efficiency (2008-07-11) [ Signal Conditioning ]
• NI expands test data management, visualization (2008-07-11) [ Design Test ]
• Qimonda heats up competition with GDDR5 ICs (2008-07-11) [ Buffer/Storage ]
• Solid-state power amplifier line rolls (2008-07-11) [ Signal Conditioning ]
• Temperature simulators are fully programmable (2008-07-11) [ Design Test ]

• Memory tester offers improved efficiency (2008-07-11) [ Test & Packaging ]
• Optical circuitry integrates customized routing system (2008-07-11) [ Network Design ]
• Fairchilld touts optcoupler with highest noise immunity (2008-07-11) [ Optical Electronics and Display ]
• Spectrum analyzers now handle TD-SCDMA signals (2008-07-11) [ Test & Packaging ]