• China to surpass North America in flat-panel market ranking (2008-07-10) [ Optical Electronics and Display ]
• Agilent expands particle analysis line with acquisition (2008-07-10) [ EDA/IC Design ]
• Philips offloads PC monitor biz to TPV (2008-07-10) [ Optical Electronics and Display ]
• Dreamworks taps Intel tech for 3D movies (2008-07-10) [ Optical Electronics and Display ]
• Applied to build 'green' Asia hub in Singapore (2008-07-10) [ Process/Manufacturing ]

• Siemens job cuts to impact many engineering posts (2008-07-10) [ Process/Manufacturing ]
• 60GHz spec conflicts remain unsettled (2008-07-10) [ RF/Wireless ]
• Memristors ready for 2009 debut (2008-07-10) [ Process/Manufacturing ]
• Report: Top OEMs gobbled 76% of chips shipped (2008-07-10) [ Process/Manufacturing ]
• EC steps up funding in robotics research (2008-07-10) [ Control Design ]

• ZTE eyes R&D center in Nanjing (2008-07-10) [ RF/Wireless ]
• Conexant to gain Freescale's SigmaTel MFP portfolio (2008-07-10) [ Optical Electronics and Display ]
• White LED achieves 90 lumens at 250mA (2008-07-10) [ Optical Electronics and Display ]
• MCU boasts 200MHz operation, 2.5Mbyte on-chip flash (2008-07-10) [ Buffer/Storage ]
• austriamicrosystems tips 1A LDO regulator (2008-07-10) [ Amplifying/Conditioning/Converting ]

• Samsung designs 90nm smart card for SIM, mobile TV (2008-07-10) [ RF/Wireless ]
• 12Gbit/s content processing board secures network (2008-07-10) [ Embedded Systems ]
• Power management IC eyes mobile GPS (2008-07-10) [ RF/Wireless ]
• AOS debuts chip for boost regulator segment (2008-07-10) [ Power Design ]
• Bluetooth v.2.1 chip gears up for automotive (2008-07-10) [ RF/Wireless ]

• Energy kits offer easy evaluation for wireless sensor apps (2008-07-10) [ Sensor Technology ]
• Low-power DC/DC converter renders longer battery runtime (2008-07-10) [ Power Design ]
• Low-cost DC power supplies pack high-end features (2008-07-10) [ Power Design ]
• LNA GaAs MMIC fit for One-Segment broadcasting (2008-07-10) [ RF/Wireless ]
• NAND flash price to stabilize after August (2008-07-09) [ Buffer/Storage ]

• Canadian Solar inks five sales deals in Europe (2008-07-09) [ Power Design ]
• Carbon Design acquires ARM SoC Designer (2008-07-09) [ EDA/IC Design ]
• Siemens CEO confirms major restructuring, hints job cuts (2008-07-09) [ Process/Manufacturing ]
• Toyota to make Prius hybrids 'greener' with solar panels (2008-07-09) [ Power Design ]
• Industry giants see more businesses in VC (2008-07-09) [ Process/Manufacturing ]

• Buzz: Intel drops ASML, turns to Nikon for 32nm (2008-07-09) [ Process/Manufacturing ]
• Taiwan craves for bigger slice of notebook market (2008-07-09) [ Embedded Systems ]
• India seeks to boost efforts in IP firms (2008-07-09) [ EDA/IC Design ]
• NXP customizes green ICs toward sustainability (2008-07-09) [ Amplifying/Conditioning/Converting ]
• NEC buys Hungarian wireless firm (2008-07-09) [ RF/Wireless ]

• TI, Xinwei step up broadband coverage in China households (2008-07-09) [ Networking Design ]
• Snap-in rocker switches come in various actuator styles (2008-07-09) [ Networking Design ]
• 8:1 mux rolls for USB 2.0 apps (2008-07-09) [ Networking Design ]
• Class-D amp does dynamic range compression (2008-07-09) [ Amplifying/Conditioning/Converting ]
• Touch controller adds LED, GPIO functions (2008-07-09) [ Sensor Technology ]

• Chip cancels ambient noise during calls (2008-07-09) [ EMI/EMC Design ]
• Adapter complies with green energy standards (2008-07-09) [ Power Design ]
• AC/DC switching supplies handle EMC noise (2008-07-09) [ Amplifying/Conditioning/Converting ]
• MEMS microphone is ultrasmall at 2mm² (2008-07-09) [ Sensor Technology ]
• CSSP platforms expand smart phones' connectivity (2008-07-09) [ Programmable Logic ]

• Enhanced tool suite improves system analysis, profiling (2008-07-09) [ EDA/IC Design ]
• External wireless antenna covers 7 frequencies (2008-07-09) [ RF/Wireless ]
• AC/DC power supply gains ITE, medical safety approvals (2008-07-09) [ Power Design ]
• Debugging a shared memory problem in multicore with virtual hardware (2008-07-08) [ Embedded Systems ]
• DesignWare IP tool supports SATA 3.0 (2008-07-08) [ EDA/IC Design ]

• Bus converter outputs 300W at 42A (2008-07-08) [ Amplifying/Conditioning/Converting ]
• 24bit DAQ card debuts for load cell measurements (2008-07-08) [ Embedded Systems ]
• TVS device guards high-speed data interfaces (2008-07-08) [ EMI/EMC Design ]
• Port processors expand connectivity for DTVs (2008-07-08) [ Control Design ]
• High-current inductor touts compact housing (2008-07-08) [ Power Design ]

• Driver rolls for upper, lower power n-channel MOSFETs (2008-07-08) [ Power Design ]
• 1Mbit serial EEPROM completes data transfer in 1sec (2008-07-08) [ Buffer/Storage ]
• High-CV wet capacitors withstand harsh environments (2008-07-08) [ Sensor Technology ]
• Tiny VCO offers ultralow phase noise (2008-07-08) [ RF/Wireless ]
• Freescale fortifies QorIQ communications platforms (2008-07-08) [ Networking Design ]

• IR designs MOSFETs for power supplies, electric motors (2008-07-08) [ Power Design ]
• 802.11n sales continue to grow, notes Wi-Fi Alliance (2008-07-08) [ RF/Wireless ]
• Alcatel-Lucent, INRIA open R&D lab for future networks (2008-07-08) [ EDA/IC Design ]
• Infineon extends security pact with German Ministry (2008-07-08) [ Security Design ]
• Toshiba integrates Ericsson broadband modules in notebooks (2008-07-08) [ RF/Wireless ]

• Cisco expands investment in Russia tech industry (2008-07-08) [ RF/Wireless ]
• China's Yingli bags PV contract in Belgium (2008-07-08) [ Power Design ]
• Report: KLA-Tencor, Lam trim workforce (2008-07-08) [ Process/Manufacturing ]
• Embedded designers face tighter schedule challenges (2008-07-08) [ EDA/IC Design ]
• Politician opines on $240M Seagate investment (2008-07-08) [ Process/Manufacturing ]

• Applied funding arm to build more Indian IC firms (2008-07-08) [ EDA/IC Design ]
• New fall schedule, venues for IIC-China '09 (2008-07-08) [ EDA/IC Design ]
• Bosch makes public tender offer to ersol shareholders (2008-07-08) [ Power Design ]
• Zarlink refuses to back down from proxy battle (2008-07-08) [ Process/Manufacturing ]
• Tech firms' scores plunge in new green electronics test (2008-07-07) [ Process/Manufacturing ]

• InterDigital, Nokia settle patent cases in English Court (2008-07-07) [ RF/Wireless ]
• Qimonda, Siltronic team on next-gen transistors (2008-07-07) [ Process/Manufacturing ]
• New CEO reorganizes Infineon, denies merger rumors (2008-07-07) [ RF/Wireless ]
• New alliance to fuel patent pooling (2008-07-07) [ EDA/IC Design ]
• SemIndia scouts new partner after AMD deal expires (2008-07-07) [ Process/Manufacturing ]

• Buzz: Sanyo sets up Li-ion battery plant in Hyogo (2008-07-07) [ Process/Manufacturing ]
• FEI buys wireless audio IP license for UWB (2008-07-07) [ RF/Wireless ]
• Nvidia struggles amid product delays, lost share (2008-07-07) [ Process/Manufacturing ]
• EDA market shows signs of weakness (2008-07-07) [ EDA/IC Design ]
• LG Electronics, Honeywell join forces in building solution system (2008-07-07) [ Networking Design ]

• Fuji Xerox lowers CO<SUB>2</SUB>emission in 2007 (2008-07-07) [ Process/Manufacturing ]
• ARM dev't tool supports Freescale i.MX31 (2008-07-07) [ Embedded Systems ]
• PLCs cut costs in developing production equipment (2008-07-07) [ Networking Design ]
• Radiation-hardened MOSFETs simplify design (2008-07-07) [ Power Design ]
• HDMI switches include auto-adaptive equalizers (2008-07-07) [ Interface Design ]

• TI positions analog front-end for portable ultrasound (2008-07-07) [ Interface Design ]
• 8bit MCU features dual-bus design (2008-07-07) [ Embedded Systems ]
• Tool generates microHz to 32MHz waveforms (2008-07-07) [ Design Test ]
• Sine wave inverters promise 3-phase output (2008-07-07) [ Amplifying/Conditioning/Converting ]
• USB power manager stretches battery life (2008-07-07) [ Power Design ]

• High-density coprocessor module delivers 'fastest' connection (2008-07-07) [ Programmable Logic ]
• Audio apps receive a shot of Fairchild BJTs (2008-07-07) [ Amplifying/Conditioning/Converting ]
• Panasonic comes up with GaN ICs for millimeter-wave comms (2008-07-07) [ EDA/IC Design ]
• Pioneer sheds plasma panel factory (2008-07-04) [ Optical Electronics and Display ]
• NEC, Sumitomo absorb submarine optic cable specialist (2008-07-04) [ Optical Electronics and Display ]

• Tessera licenses image-enhancement tech to Samsung (2008-07-04) [ Optical Electronics and Display ]
• Kontron shifts production focus on Asia (2008-07-04) [ Process/Manufacturing ]
• USDC, Applied team on TFTs for next-gen displays (2008-07-04) [ Optical Electronics and Display ]
• EC, ESA open bidding to build Galileo system (2008-07-04) [ RF/Wireless ]
• Nvidia covers costs for faulty chips (2008-07-04) [ Process/Manufacturing ]

• WiMAX, 3G drive India wireless market growth (2008-07-04) [ RF/Wireless ]
• Cisco readies 10G FCoE market (2008-07-04) [ Networking Design ]
• Hot air system can cut energy expenses (2008-07-04) [ Power Design ]
• MTS Systems' Nano Instruments moves to Agilent (2008-07-04) [ Test/Packaging ]
• Nokia receives green light on Navteq purchase (2008-07-04) [ RF/Wireless ]

• Silicon TV tuners speed past the CAN (2008-07-04) [ RF/Wireless ]
• Series promises complete digital motion control solution (2008-07-04) [ Control Design ]
• DC/DC converters are space-efficient (2008-07-04) [ Amplifying/Conditioning/Converting ]
• Secure supervisor adds memory, tamper-detection (2008-07-04) [ Security Design ]
• Audio chip does EMI filtering, ESD protection (2008-07-04) [ EMI/EMC Design ]

• Power Architecture MCUs gear up for automotive (2008-07-04) [ Embedded Systems ]
• Interconnect links processing, memory channels (2008-07-04) [ Buffer/Storage ]
• Microwave signal generator delivers power analysis (2008-07-04) [ EDA/IC Design ]
• Driver streamlines Class-D audio amplifier performance (2008-07-04) [ Amplifying/Conditioning/Converting ]
• Microwave Office 2008 offers increased flexibility (2008-07-04) [ EDA/IC Design ]

• PSoC Designer upgrades usability with customized tools (2008-07-04) [ EDA/IC Design ]
• Solomon Systech boosts single-chip TFT-LCD driver offerings (2008-07-04) [ Optical Electronics and Display ]
• TI says amplifiers slash audio expense for HDTVs (2008-07-04) [ Amplifying/Conditioning/Converting ]
• Thomson, NXP seal can tuner JV (2008-07-03) [ RF/Wireless ]
• TI sets up power unit under analog business (2008-07-03) [ Power Design ]

• Cypress sells MEMS subsidiary to Dainippon Screen (2008-07-03) [ Sensor Technology ]
• Will China mobile TV take off in time for Olympics? (2008-07-03) [ RF/Wireless ]
• Sony patent filings point to touchscreen innovations (2008-07-03) [ Optical Electronics and Display ]
• Processor bout: Q1 goes to Intel (2008-07-03) [ Embedded Systems ]
• 802.11n Wi-Fi market to flourish, says ABI (2008-07-03) [ RF/Wireless ]

• Nextreme gets grant to fuel efficiency of thermoelectrics (2008-07-03) [ Process/Manufacturing ]
• India intensifies support for solar initiatives (2008-07-03) [ Embedded Systems ]
• Confab stresses potential thermal crisis in IC design (2008-07-03) [ EDA/IC Design ]
• Now showing in Shanghai homes: digital TV (2008-07-03) [ Amplifying/Conditioning/Converting ]
• MPS victorious in case vs. Linear (2008-07-03) [ Process/Manufacturing ]

• Light photo sensor prolongs battery life in portable apps (2008-07-03) [ Sensor Technology ]
• Measurement app, signal analyzers roll for LTE devices (2008-07-03) [ Design Test ]
• HP liquid rack cools data centers (2008-07-03) [ EDA/IC Design ]
• Timing devices extend UMPC battery life, signal range (2008-07-03) [ Interface Design ]
• Hermetically sealed resistors built for high-reliability apps (2008-07-03) [ Power Design ]

• inFact tool adds distributed computing function (2008-07-03) [ EDA/IC Design ]
• LNA fits cable STB, DTV tuner systems (2008-07-03) [ RF/Wireless ]
• Device does conversion while supporting continuous load (2008-07-03) [ Power Design ]
• SP2T switch offers wideband performance (2008-07-03) [ RF/Wireless ]
• High-power analog output cards support various channels (2008-07-03) [ Interface Design ]

• Atmel MCU to receive ARM Cortex-M3 dose (2008-07-03) [ Control Design ]
• 16-channel I&#178;C LED blinker joins Catalyst bus lineup (2008-07-03) [ Optical Electronics and Display ]
• Find the right balance for multiple LED strings (2008-07-02) [ Optical Electronics and Display ]
• Serial ATA and the evolution in data storage technology (2008-07-02) [ Buffer/Storage ]
• Installed base of PCs to hit 2B units by 2014 (2008-07-02) [ Control Design ]

• Virage Logic absorbs logic memory IP biz of Impinj (2008-07-02) [ Buffer/Storage ]
• Qualcomm brings 3G to Thai health stations (2008-07-02) [ RF/Wireless ]
• Wi-Fi Alliance certifies voice over Wi-Fi devices (2008-07-02) [ RF/Wireless ]
• Samsung invests in contactless IC firm (2008-07-02) [ RF/Wireless ]
• Mentor seeks advice on Cadence takeover bid (2008-07-02) [ EDA/IC Design ]

• Opinion: Why ST-NXP JV needs a new name (2008-07-02) [ RF/Wireless ]
• Can cable TV spec revive living room PC? (2008-07-02) [ Optical Electronics and Display ]
• Spansion all set for Numonyx challenge (2008-07-02) [ Process/Manufacturing ]
• Report: 'Apple effect' no impact in NAND market (2008-07-02) [ Buffer/Storage ]
• Google, Tele Atlas shake hands on map deal (2008-07-02) [ RF/Wireless ]

• National ventures into photovoltaic market (2008-07-02) [ Power Design ]
• Phase change interference materials suit Intel's Penryn (2008-07-02) [ Process/Manufacturing ]
• Adapters comply with U.S. Energy Independence, Security Act (2008-07-02) [ Power Design ]
• Altera tool builds DSP design in minutes (2008-07-02) [ EDA/IC Design ]
• NI aims dual GbE interface at PXI Express (2008-07-02) [ Design Test ]

• DACs simplify power supply adjustments (2008-07-02) [ Amplifying/Conditioning/Converting ]
• ADI revs up high-speed data conversion (2008-07-02) [ Digital Signal Processing ]
• Power resistors come in TO-263 housing (2008-07-02) [ Power Design ]
• Mobile SDRAM rolls from ISSI (2008-07-02) [ Buffer/Storage ]
• Fingerprint sensor renders improved performance (2008-07-02) [ Sensor Technology ]

• Compact power supplies meet medical demands (2008-07-02) [ Power Design ]
• White LED shines bright, promises long life (2008-07-02) [ Test/Packaging ]
• Avago's family of digital optocouplers gets new members (2008-07-02) [ Optical Electronics and Display ]
• Enable DSP co-processing in FPGAs (2008-07-02) [ Networking Design ]
• Who calls the shot over at Infineon? (2008-07-01) [ Process/Manufacturing ]

• Energy-efficient dual core processor blades promise high reliability (2008-07-01) [ Embedded Systems ]
• High-voltage ICs drive trapezoidal motor controls (2008-07-01) [ Power Design ]
• Energy saving op amp targets home electronics (2008-07-01) [ Amplifying/Conditioning/Converting ]
• Flex data links suit mid-speed apps (2008-07-01) [ Networking Design ]
• Power amplifier for WLAN brings high gain (2008-07-01) [ RF/Wireless ]

• NEC upgrades its CPU peripherals' capacity (2008-07-01) [ Programmable Logic ]
• 802.11 radio module delivers cost efficiency in M2M comm (2008-07-01) [ RF/Wireless ]
• Carrier cards offer ease in I/O connection (2008-07-01) [ Interface Design ]
• Resistor guarantees improved load-life stability (2008-07-01) [ Power Design ]
• TI presents free Zigbee 2007 software stacks (2008-07-01) [ Networking Design ]

• Battery charger plays down power dissipation (2008-07-01) [ Power Design ]
• Handheld tester deals with MoCA-based home networks (2008-07-01) [ Test/Packaging ]
• Identifying the tech vendor elite (2008-07-01) [ Process/Manufacturing ]
• Synopsys gears up for 'techonomic' challenges (2008-07-01) [ EDA/IC Design ]
• Hardware secures standards (2008-07-01) [ Security Design ]

• A perspective on professional organizations (2008-07-01) [ EDA/IC Design ]
• Reduce non-stationary noise in handsets (2008-07-01) [ EMI/EMC Design ]
• Guide to low-power wireless network specs (2008-07-01) [ RF/Wireless ]
• Test highlights Bluetooth issues (2008-07-01) [ Design Test ]
• PDPs pursue HDTV victory (2008-07-01) [ Optical Electronics and Display ]

• WiMAX Wave 2 tests commence (2008-07-01) [ Design Test ]
• Chips embed CEC to support HDMI 1.3 (2008-07-01) [ Interface Design ]
• Microcontrollers embrace USBs (2008-07-01) [ Embedded Systems ]
• Roadrunner strives to lead supercomputer race (2008-07-01) [ Embedded Systems ]
• LCD, plasma successors make headway (2008-07-01) [ Optical Electronics and Display ]

• IP standards to Roll for sensor nets (2008-07-01) [ Sensor Technology ]