• TI claims 'first' eight-channel, digital-input serializer (2008-06-20) [ Amplifying/Conditioning/Converting ]
• Aeroflex tips 3GHz RF generator (2008-06-20) [ Design Test ]
• DC/DC converter achieves high power density, accuracy (2008-06-20) [ Amplifying/Conditioning/Converting ]
• Memory IP for code storage debuts (2008-06-20) [ Buffer/Storage ]
• Portable analyzer handles 1Hz to 40MHz range (2008-06-20) [ Design Test ]

• PLX rolls low-lane-count PCIe switches (2008-06-20) [ Networking Design ]
• Digital radio receiver supports all Eureka-147 standards (2008-06-20) [ RF/Wireless ]
• Power amplifier upgrades GSM/EDGE cellphone capacity (2008-06-20) [ Amplifying/Conditioning/Converting ]
• Sensors offer improved functionality for multiple apps (2008-06-20) [ Sensor Technology ]
• Chip resistors guarantee robustness (2008-06-20) [ Power Design ]

• Leadis beefs up linear regulator offering (2008-06-20) [ Power Design ]
• Future of Blu-ray in China still unclear, notes CCID (2008-06-20) [ Buffer/Storage ]
• GaN transistors roll from TriQuint Semiconductor (2008-06-20) [ Power Design ]
• NXP-Bibliotheca RFID solution powers German library (2008-06-20) [ RF/Wireless ]
• mimoOn taps Nokia wireless experts (2008-06-20) [ RF/Wireless ]

• REC sets up solar plant in Singapore (2008-06-20) [ Process/Manufacturing ]
• TI to boost use of proprietary process, fabs (2008-06-20) [ Process/Manufacturing ]
• IBM, Intel climb up Top 500 'most powerful' list (2008-06-20) [ Embedded Systems ]
• Universal Display achieves 102lm/W in white OLEDs (2008-06-20) [ Optical Electronics and Display ]
• Wireless sensor nets hunt for full 'killer' apps (2008-06-20) [ Sensor Technology ]

• Cadence-Mentor merger a 'bad idea', analyst says (2008-06-20) [ EDA/IC Design ]
• Navteq announces LBS challenge winners (2008-06-20) [ RF/Wireless ]
• Unisem, FlipChip deal zeroes in on wafer technologies (2008-06-20) [ Test/Packaging ]
• Fujitsu simplifies development of 32nm LSIs (2008-06-19) [ Process/Manufacturing ]
• Report: Hynix to acquire ProMOS stake (2008-06-19) [ Buffer/Storage ]

• Radiocomp, Altera deliver OBSAI solution for WiMAX/LTE (2008-06-19) [ EDA/IC Design ]
• Motorola scores WiMAX deployment deal in France (2008-06-19) [ RF/Wireless ]
• Windows Embedded Partner Program gets Freescale onboard (2008-06-19) [ Embedded Systems ]
• Will patent suit remove DTV off the air? (2008-06-19) [ RF/Wireless ]
• Apple tips OpenCL for parallel programming (2008-06-19) [ Optical Electronics and Display ]

• $1.6B Cadence buyout offer not enough, Mentor says (2008-06-19) [ EDA/IC Design ]
• SanDisk, Toshiba team up to produce 3D memory chips (2008-06-19) [ EDA/IC Design ]
• On-chip sensors regulate environment temp levels (2008-06-19) [ Sensor Technology ]
• NEC taps Genband as femtocell partner (2008-06-19) [ RF/Wireless ]
• WorldSpace-ST tandem eyes digital radio chips for Europe (2008-06-19) [ Process/Manufacturing ]

• Step-up DC/DC converters feature FET (2008-06-19) [ Amplifying/Conditioning/Converting ]
• Ease analog interface to processors via TI ADCs (2008-06-19) [ Amplifying/Conditioning/Converting ]
• RF detector manages handset power (2008-06-19) [ RF/Wireless ]
• Boundary-scan controllers allow functional testing (2008-06-19) [ Design Test ]
• 32bit MCUs enable improved performance in automotive apps (2008-06-19) [ Control Design ]

• Servo module integrates 12 ADCs, 12 DACs (2008-06-19) [ Embedded Systems ]
• Processor delivers 1Tflop performance (2008-06-19) [ Embedded Systems ]
• Tiny hall effect switches tout low standby current (2008-06-19) [ Sensor Technology ]
• Quintplexer offers antenna apps low power use (2008-06-19) [ RF/Wireless ]
• QLogic boasts 20Gbit/s Infiniband card (2008-06-19) [ Buffer/Storage ]

• Multicore processing receives an eight-core dose (2008-06-19) [ Embedded Systems ]
• Infineon claims world's first 1.8V broadband LNA (2008-06-19) [ RF/Wireless ]
• HP secures reign in notebook market, others slip (2008-06-18) [ Optical Electronics and Display ]
• Credence sells Amerang operations to Advantest (2008-06-18) [ Process/Manufacturing ]
• IBM, TOK to bring low-cost solar cells to market (2008-06-18) [ Process/Manufacturing ]

• Analogix files antitrust suit vs. Silicon Image (2008-06-18) [ EDA/IC Design ]
• Thai telecom gets green network upgrade (2008-06-18) [ RF/Wireless ]
• Bosch, Samsung SDI ink Li-ion battery JV (2008-06-18) [ Process/Manufacturing ]
• Intel spins off solar unit, forms SpectraWatt (2008-06-18) [ Power Design ]
• Will WiMAX, LTE coexist in multimode? (2008-06-18) [ RF/Wireless ]

• Toshiba shuts down 200mm NAND JV (2008-06-18) [ EMI/EMC Design ]
• Group probes PHY issues on data center apps (2008-06-18) [ Networking Design ]
• Galileo sets to achieve cosmic expectations (2008-06-18) [ RF/Wireless ]
• IPL Alliance's 'interoperable' ref flow puts pressure on Cadence (2008-06-18) [ EDA/IC Design ]
• IAR Embedded Workbench supports Freescale MCUs (2008-06-18) [ Embedded Systems ]

• 30W universal adapter suits medical apps (2008-06-18) [ Power Design ]
• Mentor's Nucleus supports i.MX31 platform (2008-06-18) [ Embedded Systems ]
• STM8S MCUs bring 8bit scalability to industrial apps (2008-06-18) [ Embedded Systems ]
• NXP claims world's 'fastest' cellular modem (2008-06-18) [ RF/Wireless ]
• Tool combines multiplay tests over same port (2008-06-18) [ Design Test ]

• LabVIEW toolkit does low-cost GPS testing (2008-06-18) [ Design Test ]
• AMD, Nvidia take graphics duel to TFlops (2008-06-18) [ Digital Signal Processing ]
• UART device targets consumer, industrial apps (2008-06-18) [ RF/Wireless ]
• ISM band transceiver meets FCC standard (2008-06-18) [ RF/Wireless ]
• Packet switches tailored for high-bandwidth apps (2008-06-18) [ Networking Design ]

• HDMI verification tool is OVM-ready (2008-06-18) [ Design Test ]
• Enhance VoIP telephony with HD Voice (2008-06-17) [ RF/Wireless ]
• Allocating memory in Matlab-to-C code (2008-06-17) [ EDA/IC Design ]
• LTE subscribers to boom to 32M in 2013 (2008-06-17) [ RF/Wireless ]
• Comag sued for MPEG-2 patent infringement (2008-06-17) [ Embedded Systems ]

• Toshiba doubles 2025 CO<SUB>2</SUB> emission reduction target (2008-06-17) [ Process/Manufacturing ]
• ITC favors Broadcom on patent suit against SiRF (2008-06-17) [ RF/Wireless ]
• Blu-ray takeoff tied to ICs from Taiwan (2008-06-17) [ Buffer/Storage ]
• Top CE, IC firms forge RF remote control consortium (2008-06-17) [ RF/Wireless ]
• BrightSource solar center breaks ground in Israel (2008-06-17) [ Process/Manufacturing ]

• TI, Qualcomm set to dominate MID sector (2008-06-17) [ RF/Wireless ]
• India to finalize 3G guidelines this month (2008-06-17) [ RF/Wireless ]
• ADI brings HDMI in digital homes (2008-06-17) [ EDA/IC Design ]
• Analysis: Business gets tough for EDA vendors (2008-06-17) [ EDA/IC Design ]
• Toppan boasts 'first' 32nm photomask (2008-06-17) [ Process/Manufacturing ]

• 3D sensor embeds click/double-click detection (2008-06-17) [ Sensor Technology ]
• Quad-core Opteron chips 'scale up' data centers (2008-06-17) [ Embedded Systems ]
• Embedded design kit rolls for CryptoController (2008-06-17) [ EDA/IC Design ]
• Linearity amplifier promises better signal fidelity (2008-06-17) [ Amplifying/Conditioning/Converting ]
• Chip drives n-channel high-speed MOSFETs (2008-06-17) [ Power Design ]

• Tool tests multiple mobile RF specs (2008-06-17) [ Design Test ]
• Equalizer secures lossless transmission of video (2008-06-17) [ Amplifying/Conditioning/Converting ]
• Board adds isolated analog inputs for DAP systems (2008-06-17) [ EMI/EMC Design ]
• Optical module targets high-def video market (2008-06-17) [ Optical Electronics and Display ]
• Enea enhances LINX IPC for compatibility (2008-06-17) [ Digital Signal Processing ]

• Kit accelerates 802.11n designs (2008-06-17) [ EDA/IC Design ]
• SOIC adapter stretches PCB lifespan (2008-06-17) [ Networking Design ]
• Top considerations in selecting mobile antennas (2008-06-16) [ EDA/IC Design ]
• Samsung launches green strategy (2008-06-16) [ Process/Manufacturing ]
• TI acquires analog design specialist (2008-06-16) [ EDA/IC Design ]

• Memory problems prompt SIA to cut forecast (2008-06-16) [ Process/Manufacturing ]
• UMC tips roadmap, veers away from 450mm (2008-06-16) [ Process/Manufacturing ]
• India preps Karnataka as next IC hub (2008-06-16) [ EDA/IC Design ]
• Intel to drive next graphics era (2008-06-16) [ Optical Electronics and Display ]
• Broadband burgeons the world over (2008-06-16) [ Networking Design ]

• Microchip polishes skills to battle the doldrums (2008-06-16) [ Control Design ]
• Issues cloud Carrier Ethernet (2008-06-16) [ Networking Design ]
• Break the barriers to greater innovation (2008-06-16) [ EDA/IC Design ]
• Advice for the FPGA novice (2008-06-16) [ Programmable Logic ]
• Automotive MCUs get flexible (2008-06-16) [ Programmable Logic ]

• Implement an FPGA ASIC prototype (2008-06-16) [ EDA/IC Design ]
• Parallel makes a comeback (2008-06-16) [ Amplifying/Conditioning/Converting ]
• Unlock precision comparator design (2008-06-16) [ Embedded Systems ]
• Commentary: Integration in wireless SoCs may be cost-defective (2008-06-16) [ RF/Wireless ]
• Module integrates Core 2 Duo, high-end graphics (2008-06-16) [ Embedded Systems ]

• NI unveils three Compact FieldPoint controllers (2008-06-16) [ Networking Design ]
• Tuning-fork crystal unit is ultraslim at 0.48mm (2008-06-16) [ EDA/IC Design ]
• ADC driver touts distortion performance, low power (2008-06-16) [ Amplifying/Conditioning/Converting ]
• Real-time clock extends standby time of handhelds (2008-06-16) [ Embedded Systems ]
• Power-saving flash SSDs integrate open source tech (2008-06-16) [ Buffer/Storage ]

• Flying probe system touts high-accuracy testing (2008-06-16) [ Design Test ]
• Lattice rolls LTE wireless offering (2008-06-16) [ RF/Wireless ]
• Processors advance fiber access nets (2008-06-16) [ Networking Design ]
• Synfora extends synthesis technology to FPGAs (2008-06-16) [ Programmable Logic ]
• PCIe packet switches enable low-cost solutions (2008-06-16) [ Interface Design ]

• Filters handle multiple networks simultaneously (2008-06-16) [ RF/Wireless ]
• Unlock universal remote's Wi-Fi secret code (2008-06-13) [ RF/Wireless ]
• Alchimer picks Lenix as Korea representative for TSV (2008-06-13) [ Process/Manufacturing ]
• NEC puts up WiMAX R&D center in Taiwan (2008-06-13) [ RF/Wireless ]
• Qimonda, Elpida finalize DRAM partnership (2008-06-13) [ Buffer/Storage ]

• Kingsoft to form JV company in Vietnam (2008-06-13) [ Process/Manufacturing ]
• O2Micro wins low-power audio CD player patent (2008-06-13) [ Power Design ]
• Memorylink sues Motorola for patent stealing (2008-06-13) [ RF/Wireless ]
• SanDisk buys digital content distribution firm (2008-06-13) [ Buffer/Storage ]
• RoHS watchdog reports less violations in 2007 (2008-06-13) [ Process/Manufacturing ]

• Group to deliver 100Gbit equipment, transport (2008-06-13) [ Networking Design ]
• Virtualization spec brings PCIe to wider systems (2008-06-13) [ Networking Design ]
• The truth behind the 'Xbox 360 issue' (2008-06-13) [ Embedded Systems ]
• Analyst anticipates steady growth for MEMS players (2008-06-13) [ Sensor Technology ]
• 800/900MHz RF transceiver eyes low-power wireless apps (2008-06-13) [ RF/Wireless ]

• Driver IC offers power saving modes for TFT-LCDs (2008-06-13) [ Control Design ]
• Drivers trim footprint of mid-range camera phones (2008-06-13) [ Optical Electronics and Display ]
• Gyroscope sensors tout extended supply voltage range (2008-06-13) [ Sensor Technology ]
• OTP memory cells meet 0.35&#181;m process (2008-06-13) [ Buffer/Storage ]
• NXP tips NorDig-compliant STB solution (2008-06-13) [ Embedded Systems ]

• 2.5-inch enterprise drive heralds 300GB capacity (2008-06-13) [ Buffer/Storage ]
• Digital demodulator targets DVB-T market (2008-06-13) [ Amplifying/Conditioning/Converting ]
• DesignArt launches WiMAX base station chip (2008-06-13) [ RF/Wireless ]
• SSR exhibits longer 'survivability' in harsh environment (2008-06-13) [ Power Design ]
• Oki boasts tiny stereo audio codec LSI (2008-06-13) [ Embedded Systems ]

• Oscillator in compact package promises improved function (2008-06-13) [ RF/Wireless ]
• PC panel prices to wobble in June, says report (2008-06-12) [ Process/Manufacturing ]
• AUO touts green technologies (2008-06-12) [ Optical Electronics and Display ]
• Takumi teams up with quality design group (2008-06-12) [ EDA/IC Design ]
• Toyota's upgrades fuel cell vehicle efficiency (2008-06-12) [ Process/Manufacturing ]

• Future of display driver chip market looms (2008-06-12) [ Control Design ]
• Samsung gains edge in 450mm technology (2008-06-12) [ Process/Manufacturing ]
• RFMD inks supply deal with European defense electronics firm (2008-06-12) [ RF/Wireless ]
• Chartered acquires stake in Taiwan design firm (2008-06-12) [ EDA/IC Design ]
• Firms launch WiMAX open patent alliance (2008-06-12) [ RF/Wireless ]

• Cheaper iPhone 3G, bigger returns? (2008-06-12) [ RF/Wireless ]
• Is Intel facing another product delay? (2008-06-12) [ Process/Manufacturing ]
• TSMC targets to unify 32nm design flow (2008-06-12) [ EDA/IC Design ]
• 65nm Bluetooth 2.1 chip touts up to 40% power savings (2008-06-12) [ RF/Wireless ]
• MCUs feature faster ADC, higher-precision DAC (2008-06-12) [ Control Design ]

• Dual-speed Serdes available for EPON terminals (2008-06-12) [ Networking Design ]
• ASK receiver withstands high temperature (2008-06-12) [ RF/Wireless ]
• Multiformat mobile WiMAX/WLAN test rolls (2008-06-12) [ Design Test ]
• Mini Socket iWiFi fits mobile M2M devices (2008-06-12) [ RF/Wireless ]
• Design tools eye ARM core for various apps (2008-06-12) [ EDA/IC Design ]

• Codec stretches audio playback times, reduces power use (2008-06-12) [ Amplifying/Conditioning/Converting ]
• 'Smallest' DC/DC converter remits high performance (2008-06-12) [ Power Design ]
• Three-phase MOSFET pre-driver targets automotive systems (2008-06-12) [ Power Design ]
• Freescale, Altera debut soft ColdFire cores on FPGAs (2008-06-12) [ Programmable Logic ]
• IDT updates HD audio codec portfolio (2008-06-12) [ Amplifying/Conditioning/Converting ]

• ESL methods for optimizing a multimedia phone chip (2008-06-11) [ RF/Wireless ]
• HP, Acer conclude patent dispute (2008-06-11) [ EDA/IC Design ]
• Aptina's SoCs to integrate Scalado encoder technology (2008-06-11) [ Sensor Technology ]
• Intel, Rosnanotech collaborate on sub-45nm research (2008-06-11) [ EDA/IC Design ]
• Freescale hands over MRAM biz to EverSpin (2008-06-11) [ Buffer/Storage ]

• NXP has Vietnam on its mind (2008-06-11) [ Process/Manufacturing ]
• China Display gains backlight supply contract from TCL (2008-06-11) [ Optical Electronics and Display ]
• CDT, Sumitomo, Novaled join forces on OLED project (2008-06-11) [ Optical Electronics and Display ]
• Gartner notes healthy appetite for smart phones (2008-06-11) [ RF/Wireless ]
• NEC software development center rises in Taiwan (2008-06-11) [ EDA/IC Design ]

• Processor core provider confesses chip design is a struggle (2008-06-11) [ EDA/IC Design ]
• Intel is again under FTC scrutiny (2008-06-11) [ EDA/IC Design ]
• Commentary: Applied's ASMI bid reads Intel (2008-06-11) [ Process/Manufacturing ]
• Mobile content now showing at your home TV (2008-06-11) [ RF/Wireless ]
• Inertial sensor simplifies industrial motion control designs (2008-06-11) [ Sensor Technology ]

• AnaPico offers alternative to high-end signal generator (2008-06-11) [ RF/Wireless ]
• TI steps up portfolio of new MCUs (2008-06-11) [ Control Design ]
• DC/DC converters fully charge for unregulated input voltage apps (2008-06-11) [ Power Design ]
• Advanced image signal processor ready for high-end life (2008-06-11) [ Control Design ]
• Microchip gives 16-, 32bit development platform hardware boost (2008-06-11) [ Interface Design ]

• SoC with eDRAM fit for mobile VGA graphics apps (2008-06-11) [ Buffer/Storage ]
• Instant replay of live TV receives Qpixel dose (2008-06-11) [ Buffer/Storage ]
• Ultralow-power FPGA aims to break industry records (2008-06-11) [ Programmable Logic ]
• Bluetooth automotive kit tackles interoperability challenges (2008-06-11) [ Networking Design ]
• Bondwire design gets Helic touch (2008-06-11) [ EDA/IC Design ]