• WiMAX gets boost from Sprint-Clearwire venture (2008-05-09) [ RF/Wireless ]
• Gates pledges $147M for South Korea IT industry (2008-05-09) [ Process/Manufacturing ]
• ST, Mobileye design SoC for vision-based driver assistance (2008-05-09) [ Sensor Technology ]
• HP, Entrust team to deploy Taiwan ePassports in 2H (2008-05-09) [ Security Design ]
• Chunghwa, Vietnamese telecom form Internet services JV (2008-05-09) [ RF/Wireless ]

• Intel, SGI power up NASA supercomputers (2008-05-09) [ Embedded Systems ]
• Indian IC ecosystem ready for takeoff (2008-05-09) [ EDA/IC Design ]
• Intel paid PC makers to shun rival chips, AMD says (2008-05-09) [ Embedded Systems ]
• DuPont, Dainippon Screen to collaborate on printed OLEDs (2008-05-09) [ Process/Manufacturing ]
• eSilicon eyes acquisitions to drive growth (2008-05-09) [ EDA/IC Design ]

• ARM to trump Intel in MID design-ins (2008-05-09) [ Optical Electronics and Display ]
• HTC Touch Diamond snaps at iPhone's heels (2008-05-09) [ RF/Wireless ]
• Flash capacitor chargers tout output circuit protection (2008-05-09) [ Sensor Technology ]
• ST reduces on-resistance for fast-recovery MOSFETs (2008-05-09) [ Power Design ]
• NI adds speed to bus-powered DAQ devices for USB (2008-05-09) [ Design Test ]

• TI tips wireless remote control LED design kit (2008-05-09) [ Optical Electronics and Display ]
• AMD drafts road map for 45nm server processors (2008-05-09) [ Embedded Systems ]
• Dual-channel sampling oscilloscope delivers 12GHz (2008-05-09) [ Design Test ]
• Pushbutton LED switches present multiple options (2008-05-09) [ Optical Electronics and Display ]
• Thermal management kit offers 100 heat sink options (2008-05-09) [ EDA/IC Design ]

• Stainless steel D-sub connectors resist corrosion (2008-05-09) [ Networking Design ]
• Transient voltage suppressor guards DSL line drivers (2008-05-09) [ EMI/EMC Design ]
• Custom, mini versions available for molded inductors (2008-05-09) [ Power Design ]
• Metal element resistors maximize heat dissipation (2008-05-09) [ EMI/EMC Design ]
• PC cards reveal cost impact of spec revision in handsets (2008-05-09) [ Embedded Systems ]

• Run practical power network synthesis (2008-05-09) [ EDA/IC Design ]
• Software radio PMC delivers 256 DDC channels (2008-05-08) [ RF/Wireless ]
• Chip meets USB 2.0 ESD protection needs (2008-05-08) [ EMI/EMC Design ]
• Library tools speed development of 60GHz video nets (2008-05-08) [ RF/Wireless ]
• Hall-effect sensors transfer data in harsh automotive setups (2008-05-08) [ Sensor Technology ]

• Audio amp integrates boost converter for portable apps (2008-05-08) [ Amplifying/Conditioning/Converting ]
• Tool eases fault detection in source code (2008-05-08) [ EDA/IC Design ]
• ThreadX RTOS supports latest Luminary MCUs (2008-05-08) [ Embedded Systems ]
• Conduction-cooled XMC module delivers 10GbE (2008-05-08) [ RF/Wireless ]
• DSP board targets embedded control, remote DAQ (2008-05-08) [ Digital Signal Processing ]

• Triac drive optocouplers claim best-in-class noise immunity (2008-05-08) [ Optical Electronics and Display ]
• Mercury offers ultracompact rugged 100 GFLOP computer (2008-05-08) [ Embedded Systems ]
• Multithreaded processor speeds packet-oriented apps for SMEs (2008-05-08) [ Embedded Systems ]
• Report: NAND flash glut turns for the worse in Q1 (2008-05-08) [ Buffer/Storage ]
• RFMD restructures, veers away from wireless systems (2008-05-08) [ Process/Manufacturing ]

• LSI, Dell, Seagate demo 'first' 6Gbit/s SAS interoperability (2008-05-08) [ Buffer/Storage ]
• Korea's new IT strategy targets auto electronics (2008-05-08) [ Embedded Systems ]
• Atmel restructuring strategy baffles analysts (2008-05-08) [ Process/Manufacturing ]
• Hyundai gets Microsoft help in in-car infotainment (2008-05-08) [ Embedded Systems ]
• Verizon joins Europe-India undersea optical cable project (2008-05-08) [ Optical Electronics and Display ]

• NXP, Siemens co-develop GPS/GSM-based toll system (2008-05-08) [ RF/Wireless ]
• IC Insights: Samsung debuts in top 10 foundry list (2008-05-08) [ Process/Manufacturing ]
• AMD shares up on fab spinoff reports (2008-05-08) [ Process/Manufacturing ]
• VC investments in cleantech on the rise (2008-05-08) [ Process/Manufacturing ]
• A prequel to the Apple-PA Semi saga? (2008-05-08) [ Embedded Systems ]

• Study: RFID reader market is integrating, innovating (2008-05-07) [ RF/Wireless ]
• TSMC, Intel, Samsung join hands on 450mm shift (2008-05-07) [ Process/Manufacturing ]
• Incentive program levels Bluetooth field for small biz (2008-05-07) [ RF/Wireless ]
• IM Flash delays production at Singapore plant (2008-05-07) [ Process/Manufacturing ]
• T-Mobile, Nokia unite to bring social nets to mobiles (2008-05-07) [ RF/Wireless ]

• NFC readies to crack market (2008-05-07) [ Security Design ]
• South Korean firm places $28M order for solar cell receivers (2008-05-07) [ Power Design ]
• Qualcomm, Foxlink to build mirasol fab in Taiwan (2008-05-07) [ Process/Manufacturing ]
• EC pressed to allot 25% of UHF spectrum for mobile broadband (2008-05-07) [ RF/Wireless ]
• ABI: Not much luck for femtocells this year (2008-05-07) [ RF/Wireless ]

• GSA sees fabless model taking over semi industry (2008-05-07) [ EDA/IC Design ]
• Qimonda debuts in solar cell market (2008-05-07) [ Process/Manufacturing ]
• Transistor photocouplers suit general-purpose apps (2008-05-07) [ Optical Electronics and Display ]
• MEMS sensor offers reliable system failure warning (2008-05-07) [ Sensor Technology ]
• Single, dual frequency crystal oscillators roll (2008-05-07) [ Interface Design ]

• 32V 500mA buck regulator integrates dual power monitor (2008-05-07) [ Power Design ]
• 90nm repeater supports PCIe 2.0, Infiniband (2008-05-07) [ Interface Design ]
• Oscilloscopes handle PCIe 2.0 compliance testing (2008-05-07) [ Design Test ]
• 65nm switches target merchant silicon solutions (2008-05-07) [ Networking Design ]
• Simtek boosts nvSRAM portfolio with 8Mbit family (2008-05-07) [ Buffer/Storage ]

• DDR3 registered clock driver exceeds JESD47 spec (2008-05-07) [ Control Design ]
• Laird tips 700MHz spectrum antenna products (2008-05-07) [ RF/Wireless ]
• Proximity, ambient light sensor comes in single chip (2008-05-07) [ Sensor Technology ]
• Crystal oscillators provide frequency margining (2008-05-07) [ Amplifying/Conditioning/Converting ]
• Qualcomm demos MediaFLO for in-car mobile TV (2008-05-06) [ RF/Wireless ]

• Forum pushes spec to unify home nets efforts (2008-05-06) [ Networking Design ]
• HP Labs proves 4th element in electronic circuits (2008-05-06) [ Process/Manufacturing ]
• Microsoft gives up Yahoo takeover bid (2008-05-06) [ Embedded Systems ]
• Survey: South Korean kids want cellphones (2008-05-06) [ RF/Wireless ]
• Cisco-Nokia mobile offering gaining momentum (2008-05-06) [ RF/Wireless ]

• Epson achieves 100% recycling goal in 12 sites (2008-05-06) [ Process/Manufacturing ]
• Real-life 'Iron Man' in the works from Raytheon (2008-05-06) [ Sensor Technology ]
• Tech firms face new fear: currency fluctuations (2008-05-06) [ Process/Manufacturing ]
• IBM, Google join hands on 'cloud computing' (2008-05-06) [ Buffer/Storage ]
• NXP plans IP licensing program for Mifare (2008-05-06) [ Security Design ]

• Leading IMI to a billion by 2011 (2008-05-06) [ Process/Manufacturing ]
• Programmable multi-output regulator targets UMPCs (2008-05-06) [ Embedded Systems ]
• IR emitter in leaded package offers wide viewing angle (2008-05-06) [ Optical Electronics and Display ]
• 16bit DAC achieves ±1LSB INL, DNL (2008-05-06) [ Amplifying/Conditioning/Converting ]
• Monitor with keyboard quickens portable PXI testing (2008-05-06) [ Design Test ]

• Brushless DC motor driver is fully integrated (2008-05-06) [ Control Design ]
• Jelly Bean terminal blocks upgrade current rating to 60A (2008-05-06) [ Power Design ]
• DAC features six programmable outputs (2008-05-06) [ Amplifying/Conditioning/Converting ]
• Printer subassembly designed for kiosk apps (2008-05-06) [ Embedded Systems ]
• Industrial Ethernet connectors handle 10Gbit rates (2008-05-06) [ Networking Design ]

• Icera develops HSPA modem in 65nm CMOS (2008-05-06) [ RF/Wireless ]
• 'Smallest' solar array simulator delivers up to 1,200W (2008-05-06) [ Power Design ]
• Single-chip synchronous clock boosts SDH, SONET, Ethernet (2008-05-06) [ Sensor Technology ]
• Introduction to video compression (2008-05-05) [ EDA/IC Design ]
• Take a peek inside Sony's OLED TV (2008-05-05) [ Optical Electronics and Display ]

• Designing DSP-based digital DC/DC power supply (Part 2) (2008-05-05) [ Digital Signal Processing ]
• SIA: Q1 08 semiconductor sales rose 3.8% y-on-y (2008-05-05) [ Process/Manufacturing ]
• Analysts debate prospects of MEMS accelerometers in cellphones (2008-05-05) [ Sensor Technology ]
• Winbond shareholders approve logic IC biz spinoff (2008-05-05) [ Process/Manufacturing ]
• Power Forward Initiative gets MindTree onboard (2008-05-05) [ EDA/IC Design ]

• Survey: China suppliers to raise export prices (2008-05-05) [ Process/Manufacturing ]
• Freescale closes acquisition of SigmaTel (2008-05-05) [ Process/Manufacturing ]
• Dark days loom as solar industry faces polysilicon shortage (2008-05-05) [ Process/Manufacturing ]
• Cadence opens first IC design center in Brazil (2008-05-05) [ EDA/IC Design ]
• Ubinetics acquisition charges hurt CSR shares (2008-05-05) [ RF/Wireless ]

• Samsung stays on top of DRAM rankings (2008-05-05) [ Process/Manufacturing ]
• Fujitsu reports advance in 'soft error' estimation (2008-05-05) [ Process/Manufacturing ]
• ARM joins UEFI effort (2008-05-05) [ Embedded Systems ]
• Innovative FET design works with radar, avionics apps (2008-05-05) [ RF/Wireless ]
• NI adds Virtex-5 FPGA to PXI I/O devices (2008-05-05) [ Design Test ]

• SMB networks go green with 65nm GbE switches (2008-05-05) [ RF/Wireless ]
• TI code composer tool offers embedded emulation (2008-05-05) [ EDA/IC Design ]
• Conduction-cooled SBC rolls for signal intelligence apps (2008-05-05) [ Embedded Systems ]
• Power management IC meets CDMA handset needs (2008-05-05) [ RF/Wireless ]
• 4-port PoE midspan suits high-power apps (2008-05-05) [ Networking Design ]

• Power amps tout high linearity, low power (2008-05-05) [ Amplifying/Conditioning/Converting ]
• Wire-to-board connectors enable secure mating (2008-05-05) [ Embedded Systems ]
• Intel takes wraps off 10GbE network interface card (2008-05-05) [ Interface Design ]
• Passive switches support both DisplayPort, PCIe 2.0 (2008-05-05) [ Interface Design ]
• Tiny SAR ADC dissipates less power (2008-05-05) [ Amplifying/Conditioning/Converting ]

• Ophir-Spiricon claims 'first' CO<SUB>2</SUB> laser beam profiler (2008-05-02) [ Optical Electronics and Display ]
• C-shaped encoder module integrates into industrial motors (2008-05-02) [ Optical Electronics and Display ]
• Teridian unrolls third-generation power meter ICs (2008-05-02) [ Power Design ]
• Low-power 10GBASE-T PHY consumes less than 6W (2008-05-02) [ Networking Design ]
• Backplane connectors deliver 20Gbit/s (2008-05-02) [ Networking Design ]

• Panasonic releases long-life electric double layer capacitor (2008-05-02) [ Sensor Technology ]
• PHY IP handles 5Gbit/s PCIe 2.0 PHY IP (2008-05-02) [ Interface Design ]
• First 65nm dual KR-to-XAUI PHY rolls (2008-05-02) [ RF/Wireless ]
• Agilent tips 10x faster planar 3D EM simulator (2008-05-02) [ Design Test ]
• Driver powers up to 10 LEDs, offers 32:1 ratio (2008-05-02) [ Optical Electronics and Display ]

• WiMAX MIMO transceiver improves SNR by 10dB (2008-05-02) [ RF/Wireless ]
• ESD protector clears HDMI 1.3a, 20kV tests (2008-05-02) [ EMI/EMC Design ]
• Gateway Alliance rises for access processors (2008-05-02) [ Amplifying/Conditioning/Converting ]
• Epcos gains NXP's RF-MEMS unit (2008-05-02) [ RF/Wireless ]
• HomeGrid Forum seeks standard for networking digital content (2008-05-02) [ Networking Design ]

• iPhone is now Canada-bound (2008-05-02) [ RF/Wireless ]
• Conexant to turn over STB business to NXP (2008-05-02) [ Amplifying/Conditioning/Converting ]
• SUSS, Philips cooperate on new imprint litho tech (2008-05-02) [ Process/Manufacturing ]
• ST invites Russia's Sitronics into Crolles2 (2008-05-02) [ Process/Manufacturing ]
• Work underway on mobile DRAM interface spec (2008-05-02) [ Buffer/Storage ]

• PRBA calls for update to UN test scheme for Li-ion batteries (2008-05-02) [ Design Test ]
• China CE giants back DIVA networking spec (2008-05-02) [ Amplifying/Conditioning/Converting ]
• Samsung sees huge surge in Blu-ray demand (2008-05-02) [ Optical Electronics and Display ]
• SMIC drops DRAM biz amidst losses (2008-05-02) [ Process/Manufacturing ]
• Use MSGQ module to optimize sRIO gains (2008-05-01) [ Digital Signal Processing ]

• Defining the memory's role in a secured environment (2008-05-01) [ Security Design ]
• 5GHz PCIe 2.0 core aims to speed up Express road map (2008-05-01) [ EDA/IC Design ]
• Touch sensors target transparent user interfaces (2008-05-01) [ Sensor Technology ]
• TI unveils hot swap controllers for AdvancedMCs (2008-05-01) [ RF/Wireless ]
• Memory compilers, logic libraries support TSMC 40nm process (2008-05-01) [ Embedded Systems ]

• Vocoder IC rolls with full duplex capability (2008-05-01) [ Amplifying/Conditioning/Converting ]
• Broadcom debuts 65nm 10GbE PHY transceiver (2008-05-01) [ RF/Wireless ]
• The MathWorks pitches automated model-checking support (2008-05-01) [ EDA/IC Design ]
• Freescale extends 8bit MCU offering for industrial, automotive (2008-05-01) [ Control Design ]
• Processing engine works with FPGA mezzanine card standard (2008-05-01) [ Interface Design ]

• Industrial LCD module achieves superior viewing angles (2008-05-01) [ Optical Electronics and Display ]
• Automotive memory products withstand extreme heat (2008-05-01) [ EMI/EMC Design ]
• Circular connector comes in rugged metal shell (2008-05-01) [ Networking Design ]
• Second Galileo satellite now in orbit (2008-05-01) [ RF/Wireless ]
• Survey: Free-to-air mobile TV is next killer app (2008-05-01) [ RF/Wireless ]

• Vietnam venture group invests in IC services firm (2008-05-01) [ Process/Manufacturing ]
• Samsung details $27.9B investment plans (2008-05-01) [ Process/Manufacturing ]
• Apprenticeship hones practical engineering skills (2008-05-01) [ EDA/IC Design ]
• Consider real-world conditions in WiMAX MIMO test (2008-05-01) [ Test/Packaging ]
• Use analog switches for multimedia cellphone design (2008-05-01) [ RF/Wireless ]

• Partition and package to miniaturize handsets (2008-05-01) [ RF/Wireless ]
• HDMI goes mobile (2008-05-01) [ Digital Signal Processing ]
• MLC adds muscle to NAND (2008-05-01) [ Buffer/Storage ]
• Understanding embedded antennas (2008-05-01) [ RF/Wireless ]
• Eliminate bugs with static analysis (2008-05-01) [ Design Test ]

• Fabless ASIC camp gets funds (2008-05-01) [ EDA/IC Design ]
• Chip rush promise from IP-enabled CE? (2008-05-01) [ RF/Wireless ]
• SoCs wrestle with schedule delays (2008-05-01) [ EDA/IC Design ]