• Pick the right output capacitors for LED drivers (2008-04-01) [ EDA/IC Design ]
• Raise UWB throughput for wireless HD video (2008-04-01) [ Optical Electronics and Display ]
• Intel, ST seal Numonyx deal (2008-04-01) [ Process/Manufacturing ]
• China to tip odds on Microsoft's Yahoo bid? (2008-04-01) [ Embedded Systems ]
• Another bleak year ahead for RFIC market (2008-04-01) [ Process/Manufacturing ]

• Solar startup out to beat coal on price (2008-04-01) [ Process/Manufacturing ]
• Sub-$1,000 Dell notebooks get Blu-ray drive (2008-04-01) [ Buffer/Storage ]
• The mobile handset market 10 years after (2008-04-01) [ RF/Wireless ]
• Achieving analog success through predictability (2008-04-01) [ Process/Manufacturing ]
• 'Openness' fulfills SystemVerilog promise (2008-04-01) [ EDA/IC Design ]

• Think of whole-system design (2008-04-01) [ Embedded Systems ]
• Simulate system effects for better design (2008-04-01) [ EDA/IC Design ]
• Establish architecture to address VoIP QoS (2008-04-01) [ RF/Wireless ]
• IPTV calls for content-aware network edge devices (2008-04-01) [ RF/Wireless ]
• Battery charger chips get crafty (2008-04-01) [ Power Design ]

• Optical communications migrate to SFP+ (2008-04-01) [ Optical Electronics and Display ]
• Organic RFID tags to zap bar codes (2008-04-01) [ RF/Wireless ]
• Cellphones integrate RF to cut costs (2008-04-01) [ RF/Wireless ]
• 8bit MCUs take tiny steps to rule the market (2008-04-01) [ Embedded Systems ]
• ICs ready for medical practice (2008-04-01) [ Sensor Technology ]

• Innovative flying probe test, soldering solution debut (2008-04-01) [ Test/Packaging ]
• 16bit AFE speeds up SOHO operations (2008-04-01) [ Control Design ]
• Epoxy withstands up to 500°F (2008-04-01) [ Process/Manufacturing ]
• TI, Aptina offer HD IP network camera ref design (2008-04-01) [ Optical Electronics and Display ]
• Fiber-optic connector suits harsh environs (2008-04-01) [ Networking Design ]

• Mini-card unites wireless USB, Bluetooth (2008-04-01) [ RF/Wireless ]
• WVGA LCD module features WLED backlighting (2008-04-01) [ Optical Electronics and Display ]
• Smartcards get dose of 16bit secure MCUs (2008-04-01) [ Security Design ]
• PCIe frame grabber transmits at 800Mbit/s (2008-04-01) [ Test/Packaging ]
• CCFL inverters up LCD backlighting efficiency (2008-04-01) [ Optical Electronics and Display ]

• Shorter lead time for these D-sub connectors (2008-04-01) [ Networking Design ]
• Micro Digital intros USB MVSP for embedded systems (2008-04-01) [ Interface Design ]
• 256Gbyte SSD flaunts 12.5mm form (2008-03-31) [ Buffer/Storage ]
• Numonyx set to get green light (2008-03-31) [ Process/Manufacturing ]
• Bringing multizone digital audio to life (2008-03-31) [ RF/Wireless ]

• Touchy-feely for Moto's mobile TV device (2008-03-31) [ RF/Wireless ]
• Micron, Hynix, Nanya react to Rambus acquittal (2008-03-31) [ Buffer/Storage ]
• South Korea police wants GPS on all phones (2008-03-31) [ RF/Wireless ]
• Samsung opens $670M facility in Vietnam (2008-03-31) [ Process/Manufacturing ]
• Zensys receives funding from Panasonic's venture group (2008-03-31) [ RF/Wireless ]

• Fairchild sets up fulfilment center in Suzhou, China (2008-03-31) [ Process/Manufacturing ]
• China flat-panel TV market up for robust growth (2008-03-31) [ Process/Manufacturing ]
• Nokia Siemens nabs net expansion deal in Indonesia (2008-03-31) [ RF/Wireless ]
• Analysis: Sirius-XM merger is good for IC industry (2008-03-31) [ RF/Wireless ]
• Wolfson audio chips not in Apple's next iPods? (2008-03-31) [ Embedded Systems ]

• Sematech forum to tackle transition to 22nm (2008-03-31) [ Process/Manufacturing ]
• Toshiba adds VHF-to-UHF dual-mode LNA (2008-03-31) [ RF/Wireless ]
• Programmable chips bring audio clarity to HDTVs (2008-03-31) [ Amplifying/Conditioning/Converting ]
• AMD unveils 'first' 65W quad-core desktop processor (2008-03-31) [ Embedded Systems ]
• Synchronous rectifier ups efficiency in power designs (2008-03-31) [ Power Design ]

• USB 2.0 OTG controller saves space, power (2008-03-31) [ Interface Design ]
• DisplayPort receiver debuts for flat-panel displays (2008-03-31) [ Interface Design ]
• HB LED solution eases intelligent lighting design (2008-03-31) [ Optical Electronics and Display ]
• Simplified system design via these clocking chips (2008-03-31) [ Amplifying/Conditioning/Converting ]
• Step-down converter suits systems with USB (2008-03-31) [ Interface Design ]

• Hall-effect sensors claim low noise, high bandwidth (2008-03-31) [ Sensor Technology ]
• HTPS TFT panels offer SXGA+ resolution (2008-03-31) [ Optical Electronics and Display ]
• Qualcomm helps Vietnam villages connect to 3G (2008-03-28) [ RF/Wireless ]
• Silicon Labs, ADI settle patent suit (2008-03-28) [ Digital Signal Processing ]
• Low-power 32Mbit, 64Mbit SRAMs roll (2008-03-28) [ Buffer/Storage ]

• Green Grid gets Fujitsu onboard (2008-03-28) [ Process/Manufacturing ]
• Battery shortage threatens top laptop makers (2008-03-28) [ Buffer/Storage ]
• Chip execs start incubator fund for Asia, E. Europe (2008-03-28) [ Process/Manufacturing ]
• 2007 chipmaking tool sales soar on Asia wings (2008-03-28) [ Process/Manufacturing ]
• Nvidia leads list of early Vista driver crashes (2008-03-28) [ Optical Electronics and Display ]

• Motorola split-up may save its leaking ship (2008-03-28) [ Process/Manufacturing ]
• New facility to boost Renesas' Beijing production (2008-03-28) [ Process/Manufacturing ]
• Samsung renews DivX license deal for CE devices (2008-03-28) [ Optical Electronics and Display ]
• Gartner: Near-term prospects dim for India WiMAX market (2008-03-28) [ RF/Wireless ]
• eASIC program makes 'many designs per engineer' (2008-03-28) [ Programmable Logic ]

• Device delivers Ethernet mapping over PDH (2008-03-28) [ Networking Design ]
• Rambus is victorious in trial vs. memory makers (2008-03-28) [ Buffer/Storage ]
• TI offers 'lowest-power' voltage feedback amp (2008-03-28) [ Amplifying/Conditioning/Converting ]
• NXP beefs up ARM MCU portfolio (2008-03-28) [ Embedded Systems ]
• OOK receiver balances performance, power draw, BOM (2008-03-28) [ RF/Wireless ]

• VCO touts 'exceptionally' low phase noise, high output power (2008-03-28) [ Amplifying/Conditioning/Converting ]
• Samtec intros twisted pair IDC cable (2008-03-28) [ Networking Design ]
• DSCs feature 100KSps, 16bit audio DAC module (2008-03-28) [ Digital Signal Processing ]
• SP3T antenna switch handles 2.4-2.5GHz band (2008-03-28) [ RF/Wireless ]
• Chip plays Bluetooth-audio combo in mobiles (2008-03-28) [ RF/Wireless ]

• Pickering adds new matrices to LXI switching solutions (2008-03-28) [ Networking Design ]
• Designing RF with op amps (Part 1) (2008-03-27) [ EDA/IC Design ]
• SMIC shares soar on news of strategic investor (2008-03-27) [ Process/Manufacturing ]
• Satellite radio mega-merger clears antitrust regulators (2008-03-27) [ RF/Wireless ]
• Microsoft, HP to build tech center in Taiwan (2008-03-27) [ Embedded Systems ]

• Cisco certifies Ralink's 802.11n chipset (2008-03-27) [ RF/Wireless ]
• Qimonda, Nanya review DRAM JV Inotera (2008-03-27) [ Process/Manufacturing ]
• ON Semi, TTTech to work on TTP controllers (2008-03-27) [ Control Design ]
• Samsung buys Clairvoyante's PenTile tech (2008-03-27) [ Optical Electronics and Display ]
• AT&T, NTT joins Trans-Pacific Consortium (2008-03-27) [ Networking Design ]

• WiMAX takes off at airports (2008-03-27) [ RF/Wireless ]
• Speedy chip secret ingredient: Carbon (2008-03-27) [ Process/Manufacturing ]
• $10 solution enables wireless health monitoring (2008-03-27) [ RF/Wireless ]
• Vista SP1 trips on popular Intel chipset drivers (2008-03-27) [ Embedded Systems ]
• Mini SMD LEDs target automotive, industrial lighting (2008-03-27) [ Optical Electronics and Display ]

• Intel debuts low-voltage 45nm Xeon chips (2008-03-27) [ Embedded Systems ]
• Tiny 400mA DC/DC ups battery life in handhelds (2008-03-27) [ Amplifying/Conditioning/Converting ]
• NI expands C Series line for data loggers (2008-03-27) [ Design Test ]
• Single/dual MOSFET drivers feature adjustable LDO (2008-03-27) [ Power Design ]
• High-speed networking via RJ45 magnetic jacks (2008-03-27) [ Networking Design ]

• ST adds MLP options to serial EEPROM portfolio (2008-03-27) [ Buffer/Storage ]
• High-voltage relay provides low resistance (2008-03-27) [ Power Design ]
• IAR starter kit rolls for Freescale ColdFire (2008-03-27) [ Embedded Systems ]
• Power amps fit next-gen cellular, WiMAX apps (2008-03-27) [ Amplifying/Conditioning/Converting ]
• 65nm Cyclone III FPGAs come in tiny package (2008-03-27) [ Programmable Logic ]

• 802.11n solutions roll from Extricom (2008-03-27) [ RF/Wireless ]
• Hyundai ushers in hybrid car era (2008-03-26) [ Power Design ]
• Samsung to spend $214M on new LCD plant (2008-03-26) [ Process/Manufacturing ]
• Google pitches 'white space' for wireless Internet (2008-03-26) [ RF/Wireless ]
• Hybrid STB eyes DTV market in China (2008-03-26) [ Embedded Systems ]

• U.S. ITC to probe patent claim relating to Blu-ray (2008-03-26) [ Process/Manufacturing ]
• TMSC unveils 40nm 'half-node' step to 32nm (2008-03-26) [ Process/Manufacturing ]
• Bain's offer to buy 3Com fizzles out (2008-03-26) [ Networking Design ]
• Gibson sues more guitar video game makers (2008-03-26) [ Embedded Systems ]
• India wireless subscriber base nips at China's heels (2008-03-26) [ RF/Wireless ]

• Icahn is creating 'distractions,' Motorola says (2008-03-26) [ RF/Wireless ]
• IC Insights stands by 9% market outlook for 2008 (2008-03-26) [ Process/Manufacturing ]
• Yahoo taps Indian supercomputer for cloud computing (2008-03-26) [ Embedded Systems ]
• HB LED drivers handle long LED strings (2008-03-26) [ Optical Electronics and Display ]
• Analog front ends debut for medical imaging (2008-03-26) [ Optical Electronics and Display ]

• Structured ASIC aims at military, aerospace sectors (2008-03-26) [ Programmable Logic ]
• Xilinx design tools suit logic, embedded, DSP (2008-03-26) [ EDA/IC Design ]
• Kit touts Agilent's complex monolithic optics (2008-03-26) [ EDA/IC Design ]
• ARC tips new lines of licensable CPU/DSP cores (2008-03-26) [ Embedded Systems ]
• Power converter targets small-, medium-sized TFT LCDs (2008-03-26) [ Optical Electronics and Display ]

• Lab-on-chip detects avian flu on the fly (2008-03-26) [ Sensor Technology ]
• Optical sensors get boost from signal-conditioning IC (2008-03-26) [ Sensor Technology ]
• Storage system rolls for cable operators, government security (2008-03-26) [ Buffer/Storage ]
• IDT intros PCIe Gen2 timing products (2008-03-26) [ Interface Design ]
• Toshiba readies 128GByte notebook SSD (2008-03-26) [ Buffer/Storage ]

• Demistifying software-defined radio platforms (2008-03-25) [ EDA/IC Design ]
• Dell sets eyes on China, India (2008-03-25) [ Embedded Systems ]
• Flextronics closes phase one of Arima acquisition (2008-03-25) [ Process/Manufacturing ]
• Nokia Siemens commits to renewable energy use (2008-03-25) [ RF/Wireless ]
• Weak memory segment drags chip market (2008-03-25) [ Process/Manufacturing ]

• Broadcom, Coship to debut HD STBs in China (2008-03-25) [ Embedded Systems ]
• Super-compressed silane superconducts (2008-03-25) [ Process/Manufacturing ]
• Pixer sets up CDC mask processing center in Taiwan (2008-03-25) [ Process/Manufacturing ]
• The real deal on Synopsys' Synplicity buyout (2008-03-25) [ EDA/IC Design ]
• Analyst advises Infineon to drop Qimonda (2008-03-25) [ Process/Manufacturing ]

• Fortuitous time for China's SOI endeavors (2008-03-25) [ Process/Manufacturing ]
• Mitsubishi touts polysilicon PV conversion record (2008-03-25) [ Process/Manufacturing ]
• 700MHz plum goes to Verizon, AT&T (2008-03-25) [ RF/Wireless ]
• ASA releases DisplayPort compliance test script (2008-03-25) [ Design Test ]
• Multifunction USB DAQ devices claims high accuracy (2008-03-25) [ Design Test ]

• Chip brings AVS-enabled IP STB to Asia (2008-03-25) [ RF/Wireless ]
• New Platform Express supports IP-XACT 1.4 (2008-03-25) [ EDA/IC Design ]
• High-speed MOSFET driver bucks or boosts efficiently (2008-03-25) [ Power Design ]
• ADI debuts 'first' gate drivers with isolated power (2008-03-25) [ Power Design ]
• Sealed tact switches tout 1 million operations (2008-03-25) [ Embedded Systems ]

• Cable tester has API for control via external programs (2008-03-25) [ Design Test ]
• DAQ tools offer high-speed performance over Ethernet (2008-03-25) [ Design Test ]
• Hybrid tech removes physical test points for ICT (2008-03-25) [ Design Test ]
• Analog companion IC joins power management, audio interface (2008-03-25) [ Interface Design ]
• Authentication ICs secure cellphone batteries (2008-03-25) [ Security Design ]

• Applied Materials still top IC gear supplier (2008-03-24) [ Process/Manufacturing ]
• Sneak peek at Intel's upcoming chip lines (2008-03-24) [ Embedded Systems ]
• FlatWire offers simpler, less costly alternative to WPANs (2008-03-24) [ Interface Design ]
• Solar market generates growth spurts (2008-03-24) [ Power Design ]
• Embedded software evaluation tries hybrid approach (2008-03-24) [ Embedded Systems ]

• iSuppli: Fascinating times ahead for touchscreens (2008-03-24) [ Sensor Technology ]
• Mini USB power meter touts wide frequency range (2008-03-24) [ Design Test ]
• Infineon answers VoIP feature in low-cost handsets (2008-03-24) [ RF/Wireless ]
• RDS data receivers zoom in on portable, in-car apps (2008-03-24) [ Amplifying/Conditioning/Converting ]
• Step-down regulator ready for military apps (2008-03-24) [ Power Design ]

• COTS- compliant EMI filters tip for military, avionic apps (2008-03-24) [ EMI/EMC Design ]
• FPGAs showcase highest I/O density for programmable devices (2008-03-24) [ Programmable Logic ]
• Apple unveils 802.11n mobile base station for iTunes (2008-03-21) [ RF/Wireless ]
• Long way to go for Brazil's chip biz? (2008-03-21) [ Process/Manufacturing ]