• Ranking shuffle seen in solar cell market (2008-02-20) [ Process/Manufacturing ]
• Xbox unfazed by rumored HD DVD surrender (2008-02-20) [ Buffer/Storage ]
• Hong Kong invests $25.6M on Wi-Fi facilities (2008-02-20) [ RF/Wireless Design ]
• BlackBerry maker sues Motorola for patent infringement (2008-02-20) [ RF/Wireless Design ]
• Report: Toshiba, SanDisk to jointly fund NAND plants (2008-02-20) [ Buffer/Storage ]

• Solar industry dynamics to change wafer vendors' game (2008-02-20) [ Process/Manufacturing ]
• Buzz: Taiwan's Compal to relocate plants to Vietnam (2008-02-20) [ Process/Manufacturing ]
• TEL, Sharp form thin-film PV joint venture (2008-02-20) [ Process/Manufacturing ]
• India's Fab City attracts investments as focus shifts to solar (2008-02-20) [ Process/Manufacturing ]
• Ericsson sells off enterprise comms biz (2008-02-20) [ Process/Manufacturing ]

• Investor coalition earmarks $10B for 'cleantech' (2008-02-20) [ Process/Manufacturing ]
• DRAM makers chalk up worst figures in 2007 (2008-02-20) [ Process/Manufacturing ]
• Compact fuel gauge blends LED drivers, push-button input (2008-02-20) [ Power Design ]
• 'Progressive Re-Processing' is HD video processor's claim (2008-02-20) [ Control Design ]
• Agilent debuts LTE UE protocol tester (2008-02-20) [ Design Test ]

• Functional verification platform is intelligent (2008-02-20) [ Design Test ]
• Variable gain amplifier supports multichannel data access (2008-02-20) [ Signal Conditioning ]
• CEVA multimedia platforms expand video standard support (2008-02-20) [ Digital Signal Processing ]
• Small board promises high-performance DSP (2008-02-20) [ Digital Signal Processing ]
• Ref kit simplifies BLDC motor control development (2008-02-20) [ Embedded Systems ]

• MicroTCA platform touts cost, space savings (2008-02-20) [ Embedded Systems ]
• 2.7-inch LCD display touts intelligent programmability (2008-02-20) [ Optical Electronics and Display ]
• Chip integrates power management, audio features (2008-02-20) [ Signal Conditioning ]
• 2Vrms audio line driver operates from 3.3V supply (2008-02-20) [ Signal Conditioning ]
• A/V, memory glitz and glam at IIC-China (2008-02-19) [ Buffer/Storage ]

• Report: HD DVD concedes to Blu-ray, ends hi-def battle (2008-02-19) [ Optical Electronics and Display ]
• Panasonic gets majority stake in LCD JV with Hitachi, Toshiba (2008-02-19) [ Process/Manufacturing ]
• Mtekvision media processor gets DivX-certified (2008-02-19) [ Embedded Systems ]
• iSuppli: Wii to rule this year's game console arena (2008-02-19) [ Embedded Systems ]
• Opinion: Profit is not a crime, neither is charity (2008-02-19) [ RF/Wireless Design ]

• SK Telecom enters China telematics market (2008-02-19) [ RF/Wireless Design ]
• eMemory-MagnaChip alliance eyes OTP macro for 0.18µm (2008-02-19) [ Buffer/Storage ]
• Chartered buys Hitachi wafer fab in Singapore (2008-02-19) [ Process/Manufacturing ]
• Firms step up parallel-programming efforts for multicore (2008-02-19) [ Embedded Systems ]
• Apple, Google, Nokia spark shift in carrier market (2008-02-19) [ RF/Wireless Design ]

• Is Freescale going after the analog plum? (2008-02-19) [ Signal Conditioning ]
• Optimism stirs in mobile TV market (2008-02-19) [ RF/Wireless Design ]
• Carbon nanotube transistors suit printed electronics (2008-02-19) [ Process/Manufacturing ]
• Handheld radio test set comes with spectrum analyzer option (2008-02-19) [ Design Test ]
• USB power switch has adjustable current limit (2008-02-19) [ Interface Design ]

• XPhase chipset delivers AMD CPU power solution (2008-02-19) [ Embedded Systems ]
• Sumitomo readies 8Gbit/s SFP+ transceivers (2008-02-19) [ Network Design ]
• Dual-core SBC extends VMEbus lifecycle (2008-02-19) [ Embedded Systems ]
• Programmable CMOS RF transceiver debuts (2008-02-19) [ RF/Wireless Design ]
• GbE transceiver ups data transfer reliability (2008-02-19) [ RF/Wireless Design ]

• PICO Extreme platform touts TCAB technology (2008-02-19) [ EDA ]
• TV encoder LSI has built-in image correction (2008-02-19) [ Optical Electronics and Display ]
• Polar Edge power amp rolls for 3G wireless handsets (2008-02-19) [ RF/Wireless Design ]
• Cadence, Mentor enhance OVM source-code library (2008-02-19) [ EDA ]
• Take a holistic approach to power management for mobile devices (2008-02-18) [ Power Design ]

• How to downgrade from Windows Vista to XP (2008-02-18) [ Embedded Systems ]
• Advanced software boosts PC efficiency measurements (2008-02-18) [ Embedded Systems ]
• Why select a <I>digital</I> power converter? (2008-02-18) [ Signal Conditioning ]
• Sun grooms Infiniband for Ethernet face-off (2008-02-18) [ Network Design ]
• Developing countries reap benefits of wireless comms (2008-02-18) [ RF/Wireless Design ]

• Intel, Microsoft pool funds for parallel programming effort (2008-02-18) [ Embedded Systems ]
• Printed electronics market to hit $30.1B by 2015 (2008-02-18) [ Process/Manufacturing ]
• NXP, Thomson merge can tuner module biz (2008-02-18) [ Signal Conditioning ]
• Freescale's 3G MXC reference design gets upgrade (2008-02-18) [ RF/Wireless Design ]
• Voltage-feedback amp draws lowest power at 5mA (2008-02-18) [ Signal Conditioning ]

• Precision op amp suits high-voltage apps (2008-02-18) [ Signal Conditioning ]
• Single-chip WiMAX RF transceiver halves BOM (2008-02-18) [ RF/Wireless Design ]
• Improved ratings typify 4-channel protection array (2008-02-18) [ EMI/EMC Design ]
• Double capacity for this embedded flash drive (2008-02-18) [ Buffer/Storage ]
• NXP chip brings H.264/MPEG-4 to iDTV (2008-02-18) [ Embedded Systems ]

• New SMU, switches enhance PXI platform for DC apps (2008-02-18) [ Design Test ]
• ST debuts fully integrated NFC SoC (2008-02-18) [ RF/Wireless Design ]
• Handset front-end modules support all global standards (2008-02-18) [ RF/Wireless Design ]
• Class AB/D speaker driver fits space-constrained apps (2008-02-18) [ Signal Conditioning ]
• 'Smallest' VGA camera sensor doubles light sensitivity (2008-02-18) [ Sensor Technology ]

• Use UWB in ultralow-power Zigbee sensor nodes (2008-02-18) [ RF/Wireless Design ]
• Fundamentals and design principles of RF antennas (Part 1) (2008-02-18) [ RF/Wireless Design ]
• Brain-picking: What do EEs have to say? (2008-02-18) [ Process/Manufacturing ]
• Cadence identifies Asia's EDA growth factors (2008-02-18) [ EDA ]
• Not just for DSPs anymore (2008-02-18) [ Digital Signal Processing ]

• Engineers do more of D in R&D (2008-02-18) [ EDA ]
• Overcome critical SoC architectural challenges (2008-02-18) [ Interface Design ]
• Enhance the audio experience in flat-panel TVs (2008-02-18) [ Control Design ]
• Attain audio, video performance goals (2008-02-18) [ Digital Signal Processing ]
• Re-examine assumptions for better designs (2008-02-18) [ Embedded Systems ]

• Capacitive sensing makes a splash (2008-02-18) [ Sensor Technology ]
• Why we need a new analog design flow (2008-02-18) [ EDA ]
• MEMS shrink digital projector to pico unit (2008-02-18) [ Sensor Technology ]
• Chengdu seals claim as major electronics hub (2008-02-15) [ EDA ]
• Latest IC solutions take center stage at IIC-China 2008 (2008-02-15) [ Process/Manufacturing ]

• LG to supply 3G phones for GSMA's Horizon project (2008-02-15) [ RF/Wireless Design ]
• Renesas, Sharp, Powerchip enter LCD driver JV (2008-02-15) [ Optical Electronics and Display ]
• Dialog Semi to bring PMOLED displays to mobiles (2008-02-15) [ Optical Electronics and Display ]
• Beyer leaves Intersil, assumes Freescale CEO post (2008-02-15) [ Process/Manufacturing ]
• ABI: Mobile handsets to enter navigation markets (2008-02-15) [ RF/Wireless Design ]

• Gemalto delivers NFC solution to Taiwan Mobile (2008-02-15) [ RF/Wireless Design ]
• Alcatel-Lucent, NEC forge LTE joint venture (2008-02-15) [ RF/Wireless Design ]
• NXP steps up wireless business initiatives (2008-02-15) [ RF/Wireless Design ]
• Analyst spots glitch on AMD Puma platform (2008-02-15) [ Embedded Systems ]
• Chipmakers ready 10G Ethernet for PCIe, virtualization (2008-02-15) [ Process/Manufacturing ]

• Mobile execs agree on cooperation, disagree over WiMAX, LTE (2008-02-15) [ RF/Wireless Design ]
• Tweaks behind delay of ST-Intel phase-change memory (2008-02-15) [ Process/Manufacturing ]
• 65nm mobile TV SoC supports all standards (2008-02-15) [ RF/Wireless Design ]
• Wireless processor offers control, networking, security (2008-02-15) [ RF/Wireless Design ]
• Multiband Mobile WiMAX receiver rolls from Agilent (2008-02-15) [ Design Test ]

• RMS power detector measures signals with varying crest factors (2008-02-15) [ Power Design ]
• TI adds HD camcorder function to handsets (2008-02-15) [ Digital Signal Processing ]
• ST's Nomadik multimedia processor integrates Linux (2008-02-15) [ Embedded Systems ]
• Quad-band Edge PA modules strut slimmed-down frame (2008-02-15) [ RF/Wireless Design ]
• Front-end module aims at 3.9G wireless apps (2008-02-15) [ RF/Wireless Design ]

• Mobile TV ICs tout high integration, energy efficiency (2008-02-15) [ RF/Wireless Design ]
• AMD unrolls chips for media-rich mobile devices (2008-02-15) [ Digital Signal Processing ]
• PXI RTD simulator promises high accuracy (2008-02-15) [ EDA ]
• AC/DC power supplies meet energy efficiency standards (2008-02-15) [ Power Design ]
• DesignArt Networks receives Motorola funding (2008-02-14) [ RF/Wireless Design ]

• IDC: China semiconductor market to hit $28 billion in 2011 (2008-02-14) [ Process/Manufacturing ]
• IBM, South Korea gov't in talks for new R&D center (2008-02-14) [ Process/Manufacturing ]
• Fujitsu spins off LSI business (2008-02-14) [ Process/Manufacturing ]
• EC antitrust body raids Intel offices in Germany (2008-02-14) [ Embedded Systems ]
• ARM, Renesas ink processor IP license deal (2008-02-14) [ Embedded Systems ]

• Internet ready to invade mobiles (2008-02-14) [ RF/Wireless Design ]
• Tech firms demo slew of Android prototypes (2008-02-14) [ RF/Wireless Design ]
• LG.Philips LCD updates name to suit new biz model (2008-02-14) [ Process/Manufacturing ]
• AMD pushes software shift for multicore CPUs (2008-02-14) [ EDA ]
• LiMo Foundation debuts Linux handsets (2008-02-14) [ RF/Wireless Design ]

• Bluetooth piggybacks on Wi-Fi as UWB uptake crawls (2008-02-14) [ RF/Wireless Design ]
• MCUs combine 200 MIPS processor, 512KB on-chip flash (2008-02-14) [ Embedded Systems ]
• AMCC merges 10GbE, Sonet in new offering (2008-02-14) [ Network Design ]
• Intel chip switches between Wi-Fi, WiMAX (2008-02-14) [ RF/Wireless Design ]
• IMEC debuts mobile SDR baseband processor platform (2008-02-14) [ RF/Wireless Design ]

• Charger ICs for portable CEs optimize Li-ion batteries (2008-02-14) [ Power Design ]
• Ref design enables low-cost HEDGE smartphones (2008-02-14) [ RF/Wireless Design ]
• Drop-in modules dedicated to low-power ISM-band apps (2008-02-14) [ RF/Wireless Design ]
• Edge power amp eyes 3G handsets, equipment (2008-02-14) [ RF/Wireless Design ]
• Sensorless motor-control kit rolls for ARM Cortex devices (2008-02-14) [ Embedded Systems ]

• Micron ships samples of 'fastest' mobile DRAM (2008-02-14) [ Buffer/Storage ]
• Flexible Class AB/D speaker driver suits portable apps (2008-02-14) [ Signal Conditioning ]
• Step-down DC/DC leaves compact footprint (2008-02-14) [ Power Design ]
• Guitar Hero jams go wireless (2008-02-14) [ RF/Wireless Design ]
• Random number generator operates at 2Mbit/s (2008-02-13) [ Embedded Systems ]

• Acquisition ASIC rolls for EEG systems (2008-02-13) [ Digital Signal Processing ]
• Camera phones get smarter with ST's image sensor (2008-02-13) [ Sensor Technology ]
• Ref design highlights extended mobility between Edge, WiMAX (2008-02-13) [ RF/Wireless Design ]
• Active mixer supports wide frequency range, saves cost (2008-02-13) [ RF/Wireless Design ]
• Voice processor mimics human hearing to nix noise (2008-02-13) [ RF/Wireless Design ]

• Xilinx, Freescale offer DPD design for power amplifiers (2008-02-13) [ Programmable Logic ]
• CMOS RF switches deliver GaAs performance (2008-02-13) [ RF/Wireless Design ]
• Samsung unveils 65nm mobile application processor (2008-02-13) [ RF/Wireless Design ]
• Nvidia's cellular CPU handles 720p video (2008-02-13) [ Control Design ]
• Ref design eases development of femtocell base stations (2008-02-13) [ RF/Wireless Design ]

• Micronas unveils 8bit MCU line for LIN bus apps (2008-02-13) [ Network Design ]
• Hitachi eyes healthy future for hard drives (2008-02-13) [ Buffer/Storage ]
• Qualcomm enables global connectivity in HP notebooks (2008-02-13) [ RF/Wireless Design ]
• Rumor: Motorola, Nortel discuss merger of wireless units (2008-02-13) [ Process/Manufacturing ]
• SanDisk, SK Telecom team on card-based mobile TV solution (2008-02-13) [ Buffer/Storage ]

• Laird beefs up wireless lineup with Ezurio purchase (2008-02-13) [ RF/Wireless Design ]
• A-GPS gets boost with Rx, ST cooperation (2008-02-13) [ RF/Wireless Design ]
• Analyst: Future bleak for mobile equipment vendors (2008-02-13) [ RF/Wireless Design ]
• Yahoo spurns Microsoft bid, software giant presses on (2008-02-13) [ Embedded Systems ]
• Media funds may soon shift to mobiles (2008-02-13) [ RF/Wireless Design ]

• Nokia out to beat Google in reshaping Internet (2008-02-13) [ RF/Wireless Design ]
• Sumitomo makes hostile takeover bid for Axcelis (2008-02-13) [ Process/Manufacturing ]
• Open-IP consortium debates patent-brokering service (2008-02-13) [ EDA ]
• GPS-enabled Nokia handsets bring real-time traffic info (2008-02-12) [ RF/Wireless Design ]
• NEC, Kineto push 3GPP GAN for femtocell standardization (2008-02-12) [ Interface Design ]

• China Mobile picks Gemalto for multimedia SIM deployment (2008-02-12) [ Buffer/Storage ]
• Report: China handset shipments slowing down (2008-02-12) [ Process/Manufacturing ]
• Korean plasma TV industry set to bounce back in '08 (2008-02-12) [ Optical Electronics and Display ]
• NI buys virtual instrumentation solutions provider (2008-02-12) [ Design Test ]
• SiRF enters multimedia market, eyes gPhone (2008-02-12) [ RF/Wireless Design ]

• Mayer to step down as Freescale CEO (2008-02-12) [ Process/Manufacturing ]
• U.S. Patent Reform Act faces opposition (2008-02-12) [ EDA ]
• Agilent, Comsys step up testing of Mobile WiMAX modules (2008-02-12) [ Test & Packaging ]
• EDA tools aid in drug development (2008-02-12) [ EDA ]
• Sun defers Rock rollout to next year (2008-02-12) [ Embedded Systems ]

• Fujitsu tips 'smallest' RF module for Mobile WiMAX (2008-02-12) [ RF/Wireless Design ]
• NXP chip brings triband, Bluetooth to ULC handsets (2008-02-12) [ RF/Wireless Design ]
• Agilent scopes add serial bus triggering, decoding (2008-02-12) [ Design Test ]
• Tantalum multianode capacitor targets high-power apps (2008-02-12) [ Signal Conditioning ]
• Digital repeater EVM reduces design complexity (2008-02-12) [ Design Test ]

• USB IP saves power, simplifies connection (2008-02-12) [ EDA ]
• Waterproof connector has one-touch bayonet lock (2008-02-12) [ Network Design ]
• 8/16-channel DAQ cards aim at PCIe (2008-02-12) [ Design Test ]
• HSPA phone platform supports all open OS (2008-02-12) [ RF/Wireless Design ]
• Washable mini switches guarantee long mechanical life (2008-02-12) [ Network Design ]

• Chipset enables HD video, hi-fi music, 3D gaming in mobiles (2008-02-12) [ RF/Wireless Design ]
• Infineon intros security MCUs for M2M apps (2008-02-12) [ Security Design ]
• Putting the system in electronic system design (2008-02-11) [ Embedded Systems ]
• GDDR5 gears for bandwidth-hungry graphics (2008-02-11) [ Buffer/Storage ]
• Telecom players urge for convergent, rich communications (2008-02-11) [ Digital Signal Processing ]

• Ericsson bags microwave, optical transmission deal in Singapore (2008-02-11) [ RF/Wireless Design ]
• Power Integrations buys Potentia Semi for $5.5M (2008-02-11) [ Power Design ]
• Toshiba touts 'fastest' embedded DRAM tech (2008-02-11) [ Buffer/Storage ]
• NXP, Samsung extend partnership to 3G solutions (2008-02-11) [ RF/Wireless Design ]
• National Semi initiates energy 'ecosystem' in India (2008-02-11) [ Power Design ]

• Analysis: Tech CEOs brave out economic woes (2008-02-11) [ Process/Manufacturing ]
• TEL obtains MMP portfolio license (2008-02-11) [ Embedded Systems ]
• DSP rises to PON challenge (2008-02-11) [ Optical Electronics and Display ]
• Comtech-Freescale partnership zooms in on automotive (2008-02-11) [ Control Design ]
• Qualcomm steps up HSPA, LTE push (2008-02-11) [ RF/Wireless Design ]

• Is Numonyx' delay behind Intel's late PCM rollout? (2008-02-11) [ Process/Manufacturing ]
• 60GHz-band transceiver claims 'highest' output power (2008-02-11) [ RF/Wireless Design ]
• RF driver amp blends power, performance (2008-02-11) [ RF/Wireless Design ]
• TI leaps ahead to HSPA+ for wireless systems (2008-02-11) [ RF/Wireless Design ]
• New application revs up Agilent's signal analyzers (2008-02-11) [ Test & Packaging ]

• LED drivers for backlights extend mobile battery life (2008-02-11) [ Optical Electronics and Display ]
• Compliance test software supports new serial data standards (2008-02-11) [ Design Test ]
• USB digitizers, DMMs feature plug-and-play operation (2008-02-11) [ Design Test ]
• Software tools ease 3GPP LTE signal evaluation (2008-02-11) [ Design Test ]
• Protection device tailored for DisplayPort (2008-02-11) [ EMI/EMC Design ]

• Less than $1 investment for high-speed USB (2008-02-11) [ Interface Design ]
• APD voltage control resistor has temperature compensation (2008-02-11) [ Signal Conditioning ]
• Toshiba develops 16Gbit NAND at 43nm CMOS tech (2008-02-11) [ Process/Manufacturing ]