• ABI: DTV receiver market up for 32% growth by 2013 (2008-02-08) [ RF/Wireless Design ]
• Silicon Hive, Apical co-develop embedded imaging sol'n for mobiles (2008-02-08) [ Optical Electronics and Display ]
• Atmel enters touch sensing market with Quantum acquisition (2008-02-08) [ Interface Design ]
• Apple beefs up iPhone, iPod Touch storage capacity (2008-02-08) [ Buffer/Storage ]
• Freescale to pay $110M for SigmaTel (2008-02-08) [ Embedded Systems ]

• TI, MIT develop design technique for ultralow-voltage ICs (2008-02-08) [ Power Design ]
• ARM, Samsung extend licensing deal (2008-02-08) [ EDA ]
• Wi-Fi, WiMAX soon to invade handsets (2008-02-08) [ RF/Wireless Design ]
• Next-gen memory race heats up as bets roll (2008-02-08) [ Buffer/Storage ]
• Report: Toshiba to allocate $6.6B for new NAND plant (2008-02-08) [ Process/Manufacturing ]

• GPS turns cellphone into handy navigation device (2008-02-08) [ RF/Wireless Design ]
• Processor designers debate future of multicore (2008-02-08) [ EDA ]
• 65nm DTV receivers cut power draw, design footprint (2008-02-08) [ RF/Wireless Design ]
• RF transmit processor combines DUC, CFR, DPD (2008-02-08) [ RF/Wireless Design ]
• Scope breaks 1Gpt memory barrier (2008-02-08) [ Design Test ]

• Reconfigurable analog baseband LSI tailored for SDR (2008-02-08) [ RF/Wireless Design ]
• Variable gain amp sets new performance standard (2008-02-08) [ Signal Conditioning ]
• Programmable LCD modules fast track development cycles (2008-02-08) [ Optical Electronics and Display ]
• Mezzanine connectors tout high density, high speed (2008-02-08) [ Network Design ]
• SFP+ interconnects deliver up to 10Gbit/s (2008-02-08) [ Network Design ]

• Active copper cables operate at 10Gbit/s over 10m (2008-02-08) [ Network Design ]
• PoE midspan promises up to 576W with 8/16 ports (2008-02-08) [ Network Design ]
• Tiny step-down DC/DC regulates power from various sources (2008-02-08) [ Power Design ]
• Tiny 40A automotive relay switches heavy loads (2008-02-08) [ Network Design ]
• Cordless phone enters next phase (2008-02-07) [ RF/Wireless Design ]

• TI bares details of 45nm process (2008-02-07) [ Process/Manufacturing ]
• IBM expands India foothold with new delivery center (2008-02-07) [ Process/Manufacturing ]
• Ericsson equips Lenovo notebooks with built-in HSPA (2008-02-07) [ RF/Wireless Design ]
• Taiwan flat-panel market to hit $62.11B by 2011 (2008-02-07) [ Process/Manufacturing ]
• ZTE boosts Hutchison's 3G mobile broadband offerings (2008-02-07) [ RF/Wireless Design ]

• NXP, ARM expand MCU tech licensing deal (2008-02-07) [ Embedded Systems ]
• QLogic picks AMCC's storage processor (2008-02-07) [ Buffer/Storage ]
• Huawei, Symantec finalize storage, security JV (2008-02-07) [ Security Design ]
• Surface PC for consumers in the works from Microsoft (2008-02-07) [ Embedded Systems ]
• Dwindling VC funding 'troubling' for semis (2008-02-07) [ Process/Manufacturing ]

• Chips of the future will mimic human learning (2008-02-07) [ Signal Conditioning ]
• Samsung: UD tech, 3D content make future TV (2008-02-07) [ Optical Electronics and Display ]
• Tektronix adds live RF to mid-range analyzers (2008-02-07) [ Test & Packaging ]
• AC/DC telco rectifier delivers 96% efficiency (2008-02-07) [ RF/Wireless Design ]
• GaAs MMIC packaging uses surface-mount tech (2008-02-07) [ RF/Wireless Design ]

• Aruba intros 'blast-resistant' Wi-Fi gear (2008-02-07) [ RF/Wireless Design ]
• Startup adds wireless monitor to band-aids (2008-02-07) [ RF/Wireless Design ]
• SATA-compatible NAND flash controller supports 150MBps (2008-02-07) [ Buffer/Storage ]
• Media player chip brings HD sound to music phones (2008-02-07) [ RF/Wireless Design ]
• Module measures high-speed serial bus signals (2008-02-07) [ Design Test ]

• DSP with MAC, PHY functions goes 'Beyond 3G' (2008-02-07) [ Programmable Logic ]
• Fujitsu debuts 77GHz CMOS-based power amp (2008-02-07) [ Signal Conditioning ]
• Differential connector system eyes high-speed designs (2008-02-07) [ Network Design ]
• Panel pot with cermet offers 6W power rating at 50°C (2008-02-07) [ Signal Conditioning ]
• Google exec: Microsoft's Yahoo bid 'troubling' (2008-02-06) [ Embedded Systems ]

• AMD to set up sales, R&D center in Chengdu (2008-02-06) [ Process/Manufacturing ]
• Fairchild opens R&D center in India (2008-02-06) [ EDA ]
• Intel, Micron co-develop 'fastest' NAND flash tech (2008-02-06) [ Process/Manufacturing ]
• Nvidia acquires gaming physics tech provider (2008-02-06) [ Optical Electronics and Display ]
• Will EUV litho ever cross over from R&D to production? (2008-02-06) [ Process/Manufacturing ]

• NEC to work on PMICs for mobile Internet devices (2008-02-06) [ Power Design ]
• Qualcomm, Huawei ink Node B tech transfer deal (2008-02-06) [ RF/Wireless Design ]
• Flextronics fights to remain in EMS race (2008-02-06) [ Process/Manufacturing ]
• Cisco helps India beef up network engineering workforce (2008-02-06) [ Network Design ]
• Elpida, Hynix beat 2007 DRAM market downtrend (2008-02-06) [ Process/Manufacturing ]

• Samsung leads 2008 $1B capex club (2008-02-06) [ Process/Manufacturing ]
• RF modules target handsets in emerging markets (2008-02-06) [ RF/Wireless Design ]
• Complete LTE base station ref design debuts (2008-02-06) [ RF/Wireless Design ]
• Bloombase boosts data security in Hifn data cards (2008-02-06) [ Security Design ]
• Power-supply supervisor does reverse sequencing (2008-02-06) [ Power Design ]

• SAS RAID controllers fit midrange servers (2008-02-06) [ Embedded Systems ]
• 'First' 1.4&#181m; 5Mpixel image sensor rolls for handsets (2008-02-06) [ Sensor Technology ]
• ComboMemory devices eye entry-level handsets (2008-02-06) [ Buffer/Storage ]
• Analog IC integrates adjustable resistor tech (2008-02-06) [ Power Design ]
• Backplane connector operates at 12.5Gbit/s (2008-02-06) [ Network Design ]

• Car LCD controller LSI rolls with video decoder (2008-02-06) [ Control Design ]
• Memory compiler optimized for UMC 65nm LL process (2008-02-06) [ EDA ]
• NXP's GloNav acquisition yields 'smallest' GPS solution (2008-02-06) [ RF/Wireless Design ]
• Huawei, Mobily to deploy HSDPA in Saudi Arabia (2008-02-05) [ Network Design ]
• IBM sets up first cloud computing center in China (2008-02-05) [ Process/Manufacturing ]

• Survey confirms LED lighting market growth (2008-02-05) [ Process/Manufacturing ]
• SIA: Chip sales hit new record with $255.6B in 2007 (2008-02-05) [ Optical Electronics and Display ]
• Applied beefs up solar cell biz with Baccini buyout (2008-02-05) [ Process/Manufacturing ]
• Analysis: Mobile biz spinoff could spell the end for Motorola (2008-02-05) [ Process/Manufacturing ]
• HP dethrones TI as MEMS king in 2007 (2008-02-05) [ Sensor Technology ]

• Intel readies $1B investment in India (2008-02-05) [ Control Design ]
• Nokia Siemens, Ubiquisys enable 3G at home with femtocells (2008-02-05) [ RF/Wireless Design ]
• Maxim to fold Dallas fab, exit RF biz (2008-02-05) [ Process/Manufacturing ]
• Microsoft CEO on $44.6B Yahoo acquisition bid (2008-02-05) [ Embedded Systems ]
• Linear Tech debuts SiP signal chain receiver modules (2008-02-05) [ RF/Wireless Design ]

• Sub-$100 Linux phone offers 3G functionalities (2008-02-05) [ RF/Wireless Design ]
• Dual-core chips achieve 1,920 MIPS processing (2008-02-05) [ Control Design ]
• All-metal rotary encoders fit rugged apps (2008-02-05) [ Sensor Technology ]
• Multisensor interface IC uses 30µW of power (2008-02-05) [ Interface Design ]
• Memory controller SSD modules integrate NAND flash (2008-02-05) [ Buffer/Storage ]

• Software solution ensures REACH compliance (2008-02-05) [ Process/Manufacturing ]
• Battery fuel gauge with LDO rolls for mobile apps (2008-02-05) [ Power Design ]
• Samsung intros 128Gbyte MLC flash-based SSDs (2008-02-05) [ Buffer/Storage ]
• Power filters handle up to 20A (2008-02-05) [ Power Design ]
• Parametric probe cards cut testing costs at 45nm, beyond (2008-02-05) [ Test & Packaging ]

• Kits speed up DSP-based motor control design (2008-02-05) [ EDA ]
• Power-supply optocoupler basics (2008-02-05) [ Power Design ]
• Study: Governments fail to tap full potential of ICT (2008-02-04) [ RF/Wireless Design ]
• Matsushita, Samsung settle all patent suits (2008-02-04) [ Optical Electronics and Display ]
• Mitsubishi to acquire Renesas' Kumamoto facility (2008-02-04) [ Process/Manufacturing ]

• Airwaves auction marks new record with $15.6B (2008-02-04) [ RF/Wireless Design ]
• Motorola mulls separating mobile unit (2008-02-04) [ Process/Manufacturing ]
• China confers TD-SCDMA access licenses (2008-02-04) [ RF/Wireless Design ]
• Qualcomm, Mio to co-develop connected PNDs (2008-02-04) [ RF/Wireless Design ]
• Femto Forum gets NXP onboard (2008-02-04) [ RF/Wireless Design ]

• Sun stirs industry support for Rock CPU (2008-02-04) [ Embedded Systems ]
• Flextronics shakes off doubts over Solectron acquisition (2008-02-04) [ Process/Manufacturing ]
• IBM seeks standard to link chip models with tools (2008-02-04) [ EDA ]
• Intel schedules phase out of 65nm processors (2008-02-04) [ Embedded Systems ]
• Rise time accelerator suits 400kHZ operation (2008-02-04) [ Signal Conditioning ]

• AMD teraflop GPU pushes game realism beyond HD (2008-02-04) [ Embedded Systems ]
• 'First' programmable multimode LTE modem rolls (2008-02-04) [ RF/Wireless Design ]
• Data converter toolkit speeds up design time (2008-02-04) [ Embedded Systems ]
• Video amp with load detect saves up to 75% power (2008-02-04) [ Signal Conditioning ]
• Enhanced signal generators deal with CDMA 1xEVDO (2008-02-04) [ Test & Packaging ]

• Contact interface promises high density, speed (2008-02-04) [ Interface Design ]
• VoIP echo canceller handles up to 512ms round-trip delays (2008-02-04) [ EMI/EMC Design ]
• Resistors offer resistance values up to 10GΩ (2008-02-04) [ Power Design ]
• IR receivers resist noise, disturbance signals (2008-02-04) [ EMI/EMC Design ]
• Audio DAC extends mobile music playback time (2008-02-04) [ Signal Conditioning ]

• High-speed connector platform comes in stacking version (2008-02-04) [ Network Design ]
• ESD architecture simplifies design, cuts cost (2008-02-01) [ EMI/EMC Design ]
• Parametric probe cards reduce cost of tests at 45nm (2008-02-01) [ Process/Manufacturing ]
• Voltage supervisors promise up to 4.65V threshold (2008-02-01) [ Power Design ]
• SoC ready for simultaneous still, video shots (2008-02-01) [ Control Design ]

• Freescale fortifies S08 MCU family (2008-02-01) [ Control Design ]
• Power management IC tipped for Intel's Montevina platform (2008-02-01) [ Power Design ]
• ARM-based MCU suits USB-enabled embedded control apps (2008-02-01) [ Interface Design ]
• High-speed SRAMs roll into production (2008-02-01) [ Buffer/Storage ]
• Industrial keyboard features new function keys (2008-02-01) [ Interface Design ]

• WLED driver enables large LCDs in portable apps (2008-02-01) [ Optical Electronics and Display ]
• Multimedia codec integrates power management (2008-02-01) [ Signal Conditioning ]
• Car MCUs tailored for new emission standards (2008-02-01) [ Embedded Systems ]
• Select the right network connection for your MCU-based M2M app (2008-02-01) [ Interface Design ]
• Awaiting the bountiful organic chip harvest (2008-02-01) [ Process/Manufacturing ]

• Saving Moore's Law and reinventing transistors (2008-02-01) [ Process/Manufacturing ]
• Development kits are easier to use now (2008-02-01) [ Embedded Systems ]
• Steer the wheels with microcontrollers (2008-02-01) [ Embedded Systems ]
• Sensor improvements usher cars to safety (2008-02-01) [ Sensor Technology ]
• External adapter unites TiVo, Cable TV (2008-02-01) [ Interface Design ]

• ARC pushes mobile multimedia SoC design (2008-02-01) [ RF/Wireless Design ]
• Enabling e-paper displays (2008-02-01) [ Optical Electronics and Display ]
• Integration key to 802.11n success (2008-02-01) [ RF/Wireless Design ]
• Clean tech to get more VC funding (2008-02-01) [ Process/Manufacturing ]
• It's a full house for digital TV links (2008-02-01) [ RF/Wireless Design ]

• Maximize mobile WiMAX opportunities (2008-02-01) [ RF/Wireless Design ]