• Improve SNR in multiple ADCs (2008-01-31) [ Signal Conditioning ]
• GPON chips ready to invade homes (2008-01-31) [ Network Design ]
• HKSTP, Mentor to build SoC/IC design training center (2008-01-31) [ EDA ]
• SK Telecom to bring Hollywood movies to handsets (2008-01-31) [ RF/Wireless Design ]
• Multicore Association welcomes NI as new member (2008-01-31) [ EDA ]

• Intel to buy 1.3B kW-hrs of green power (2008-01-31) [ Power Design ]
• Powerchip, IMEC team on sub-32nm memory processes (2008-01-31) [ Power Design ]
• TI solidifies further commitment to China academe (2008-01-31) [ EDA ]
• Fujitsu files patent infringement case against Tellabs (2008-01-31) [ Network Design ]
• Toshiba, Cadence collaborate on 65nm design (2008-01-31) [ EDA ]

• Israeli startup gets multimillion investment from Samsung (2008-01-31) [ Test & Packaging ]
• China analog IDM proposes $75M IPO with U.S. SEC (2008-01-31) [ Process/Manufacturing ]
• SMIC to put up 200mm, 300mm fabs in Shenzhen (2008-01-31) [ Process/Manufacturing ]
• South Korea partners with NASA on satellite R&D (2008-01-31) [ RF/Wireless Design ]
• Aeroflex tips Signal Safari ver. 7.0 (2008-01-31) [ Test & Packaging ]

• BTSC encoder achieves stereo audio sans alignment (2008-01-31) [ Signal Conditioning ]
• PHY device connects Metro Ethernet to 10GbE optical nets (2008-01-31) [ Network Design ]
• TI expands portfolio of battery fuel gauge with LDOs (2008-01-31) [ Power Design ]
• Low-power 8bit MCUs offer below 300nA stop currents (2008-01-31) [ Embedded Systems ]
• 'First' pulse function arbitrary noise generator rolls (2008-01-31) [ Design Test ]

• New offerings fuel battle of octal, mid-speed 12bit ADCs (2008-01-31) [ Signal Conditioning ]
• Cisco AON system adds standalone engine (2008-01-31) [ Network Design ]
• Infineon unveils next-gen powertrain MCUs (2008-01-31) [ Embedded Systems ]
• Radial-leaded inductors suit high-current apps (2008-01-31) [ Power Design ]
• DDR3 SO-DIMMs save power in notebook PCs (2008-01-31) [ Buffer/Storage ]

• Voltage sequencers/monitors ease system troubleshooting (2008-01-31) [ Signal Conditioning ]
• CSR evolves along with Bluetooth (2008-01-31) [ RF/Wireless Design ]
• Nokia to offload automotive biz (2008-01-30) [ Process/Manufacturing ]
• Japanese hydrogen cars in the works (2008-01-30) [ Power Design ]
• Matsushita taps Synopsys compiler for 45nm design (2008-01-30) [ EDA ]

• AMCC processors enable Accusys Raid controllers (2008-01-30) [ Buffer/Storage ]
• DisplaySearch notes surge in Q4 '07 LCD TV panel shipments (2008-01-30) [ Process/Manufacturing ]
• CIGS-based solar cells achieve efficiency breakthrough (2008-01-30) [ Power Design ]
• AMIS, IMEC ink new joint project on smart power tech (2008-01-30) [ Power Design ]
• Dell finalizes EqualLogic buyout (2008-01-30) [ Buffer/Storage ]

• Researchers develop car radar IC on CMOS tech (2008-01-30) [ EDA ]
• Intel chair briefs Israel PM on Fab 28 progress (2008-01-30) [ Process/Manufacturing ]
• SEMI forms group to focus on photovoltaic tech (2008-01-30) [ Power Design ]
• Chartered secures loan to acquire new scanners (2008-01-30) [ Process/Manufacturing ]
• VME/VXS board does high-performance DSP, DAQ (2008-01-30) [ Embedded Systems ]

• Platform provides PCIe interface to NAND flash (2008-01-30) [ Interface Design ]
• Ready for gaming battle: AMD intros two-chip graphics card (2008-01-30) [ Control Design ]
• Wireless ICs simplify radio design, cut costs (2008-01-30) [ RF/Wireless Design ]
• PCIe peripheral controller promises flexible connectivity (2008-01-30) [ Interface Design ]
• High-power RF module handles ZigBee (2008-01-30) [ RF/Wireless Design ]

• Laser sensors offer precision tracking for PC mice (2008-01-30) [ Sensor Technology ]
• DDR BGA probe debuts for scopes, logic analyzers (2008-01-30) [ Design Test ]
• Xilinx unveils new XtremeDSP development kits (2008-01-30) [ EDA ]
• Radiation-tolerant FPGA touts 4 million gates (2008-01-30) [ Programmable Logic ]
• Programmable HB LED drivers enable greater versatility (2008-01-30) [ Optical Electronics and Display ]

• HTPS TFT panels display WXGA content (2008-01-30) [ Optical Electronics and Display ]
• Nokia still leads, Samsung unseats Moto in IDC cellphone rankings (2008-01-29) [ RF/Wireless Design ]
• Samsung officials questioned on bribery scandal (2008-01-29) [ Process/Manufacturing ]
• Lenovo denies IBM server biz buyout (2008-01-29) [ Process/Manufacturing ]
• DVD6C cuts royalty rates, offers more licensing options (2008-01-29) [ Buffer/Storage ]

• ST seals Genesis purchase, fortifies DTV foothold (2008-01-29) [ Process/Manufacturing ]
• Nokia Siemens bags mobile TV deal in Indonesia (2008-01-29) [ RF/Wireless Design ]
• Nanochip cooks up terabyte memory ICs (2008-01-29) [ Process/Manufacturing ]
• 700MHz bids hit $3.7B (2008-01-29) [ RF/Wireless Design ]
• Toshiba to defer plans for new flash memory plant? (2008-01-29) [ Process/Manufacturing ]

• Another downturn threatens NAND flash market (2008-01-29) [ Buffer/Storage ]
• No truth to IBM-AMD merger rumor, says source (2008-01-29) [ Process/Manufacturing ]
• Microsoft pie slice shrinks as PC market perks up (2008-01-29) [ Embedded Systems ]
• Synopsys upgrades signal integrity analysis suite (2008-01-29) [ EDA ]
• Hardware platform saves cost for iDTV makers (2008-01-29) [ Embedded Systems ]

• AMD GPUs support DisplayPort, PCIe, DirectX (2008-01-29) [ Control Design ]
• IP controllers deliver SATA Rev. 2.6 features (2008-01-29) [ Buffer/Storage ]
• Inductors shield high-voltage apps from EMI (2008-01-29) [ Power Design ]
• EMI, ESD protection included in these USB connectors (2008-01-29) [ EMI/EMC Design ]
• Buttonless remote control commands digital home (2008-01-29) [ RF/Wireless Design ]

• Spectrum analyzers offer low-cost wireless testing (2008-01-29) [ Design Test ]
• Board-to-board connectors fit high-density mezzanine cards (2008-01-29) [ Embedded Systems ]
• ADCs guarantee operation in automotive temp range (2008-01-29) [ Signal Conditioning ]
• Adhesive gels in 3mins, cures to 3,150psi (2008-01-29) [ Process/Manufacturing ]
• PCIe switches tailored for communications apps (2008-01-29) [ Interface Design ]

• OSRAM powers Cadillac LED headlights (2008-01-28) [ Optical Electronics and Display ]
• South Korea eyes growing solar energy market (2008-01-28) [ Process/Manufacturing ]
• AMCC, IBM expand tie up to embedded processors (2008-01-28) [ Embedded Systems ]
• CCID: China's MCU market hit $2.5B in '07 (2008-01-28) [ Control Design ]
• Fujitsu to put semi house in order (2008-01-28) [ Process/Manufacturing ]

• Japan Customs suspends import of Nanya memories (2008-01-28) [ Buffer/Storage ]
• Infineon RFIC equips Panasonic car TV tuner (2008-01-28) [ RF/Wireless Design ]
• $2.4B offered at U.S. 700MHz auction (2008-01-28) [ RF/Wireless Design ]
• CSR ventures into mobile location with e-GPS (2008-01-28) [ RF/Wireless Design ]
• Handset shipments to reach 1.24B this year (2008-01-28) [ RF/Wireless Design ]

• Nanotech retrofit enables sharper X-ray images (2008-01-28) [ Optical Electronics and Display ]
• Motorola mobile unit needs more time to shape up (2008-01-28) [ RF/Wireless Design ]
• OVP controllers guard Hi-Speed USB signals from ESD (2008-01-28) [ EMI/EMC Design ]
• LDO controller 'digital-enable' feature saves power, space (2008-01-28) [ Power Design ]
• TDK debuts automotive clamp filter (2008-01-28) [ EMI/EMC Design ]

• RF software does multiple simulations from single license (2008-01-28) [ Design Test ]
• Ref kit creates photo frame with Bluetooth (2008-01-28) [ RF/Wireless Design ]
• Bluetooth chip rolls with FM radio transceiver (2008-01-28) [ RF/Wireless Design ]
• Most compact front-end touts Bluetooth, WLAN (2008-01-28) [ RF/Wireless Design ]
• Low-capacitance diode arrays aim at portable devices (2008-01-28) [ EMI/EMC Design ]

• Via positions 64bit processor for x86 market (2008-01-28) [ Process/Manufacturing ]
• Device integrates power MOSFET, Schottky barrier diode (2008-01-28) [ Power Design ]
• Connector moves data at 10Gbit/s+ rates (2008-01-28) [ Network Design ]
• Camera IP ensures frown-free photos (2008-01-28) [ Optical Electronics and Display ]
• OS is key to next-gen POS terminals (2008-01-25) [ Interface Design ]

• Samsung, Hynix partner on next-gen memory R&D (2008-01-25) [ Process/Manufacturing ]
• Report: Vietnam SMBs to spend $1.4B on ICT (2008-01-25) [ RF/Wireless Design ]
• Bharti Airtel, IBM fortify partnership with new deal (2008-01-25) [ RF/Wireless Design ]
• Panasonic expands China factory (2008-01-25) [ Process/Manufacturing ]
• Cisco joins ranks of ip.access investors (2008-01-25) [ RF/Wireless Design ]

• Honeywell, industry group collaborate on flexible electronics (2008-01-25) [ Optical Electronics and Display ]
• Motorola to design UMTS 3G phones with Qualcomm chips (2008-01-25) [ RF/Wireless Design ]
• CSR, Telechips develop Wi-Fi photo frame platform (2008-01-25) [ RF/Wireless Design ]
• Airlines buckle up for Wi-Fi takeoff (2008-01-25) [ RF/Wireless Design ]
• PC chip shipments hit record high in Q4 '07 (2008-01-25) [ Process/Manufacturing ]

• ST to maximize Crolles2 wafer capacity (2008-01-25) [ Process/Manufacturing ]
• Siemens tech addresses PoE issues in 802.11n (2008-01-25) [ RF/Wireless Design ]
• Processor eases shift from TDM to VoIP MSANs (2008-01-25) [ Embedded Systems ]
• Flat-panel touchscreen monitors fit for industrial use (2008-01-25) [ Optical Electronics and Display ]
• Video amp handles analog output for HD devices (2008-01-25) [ Signal Conditioning ]

• Multiband tuner enables anytime, anywhere TV viewing (2008-01-25) [ RF/Wireless Design ]
• IAR Workbench supports System Semi's motion control kit (2008-01-25) [ EDA ]
• Stratix II GX FPGAs prop up 50Gbit/s SFI-5 interface (2008-01-25) [ Programmable Logic ]
• CMOS image sensor performs in low-light conditions (2008-01-25) [ Sensor Technology ]
• DSP redefines acoustic guitar subtleties (2008-01-25) [ Digital Signal Processing ]

• Temperature measurement device delivers RTD inputs (2008-01-25) [ Test & Packaging ]
• LED assembly cuts power draw in medical equipment (2008-01-25) [ Optical Electronics and Display ]
• 500KSps ADCs dissipate minimal power (2008-01-25) [ Signal Conditioning ]
• Meter shunt resistor enhances electric meter accuracy (2008-01-25) [ Design Test ]
• 45nm: What Intel didn't tell you (2008-01-25) [ Process/Manufacturing ]

• GPS to see huge market in 2013, reports ABI (2008-01-24) [ RF/Wireless Design ]
• ITC probes Samsung-Sharp LCD patent dispute (2008-01-24) [ Optical Electronics and Display ]
• Freescale, Microstaq team on superheat control for HVAC (2008-01-24) [ Sensor Technology ]
• IBM sets up software dev't lab in Malaysia (2008-01-24) [ Embedded Systems ]
• Founder expands China fab with Intel tools (2008-01-24) [ Process/Manufacturing ]

• Electronic contact lenses promise virtual display (2008-01-24) [ Optical Electronics and Display ]
• EDA trio offers UPF-based products (2008-01-24) [ EDA ]
• Microsoft inks IPTV JV in South Korea (2008-01-24) [ RF/Wireless Design ]
• India's first semi fab project fizzles (2008-01-24) [ Process/Manufacturing ]
• U.S. updates export control policy (2008-01-24) [ Process/Manufacturing ]

• Sub-$100 Nokia phones go after emerging markets (2008-01-24) [ RF/Wireless Design ]
• Apple Q1 outlook disappoints investors (2008-01-24) [ RF/Wireless Design ]
• DC/DC converter suits cold-crank conditions in cars (2008-01-24) [ Signal Conditioning ]
• Audio buffer promises 'lowest' distortion, noise (2008-01-24) [ Signal Conditioning ]
• Tool speeds up design of optoelectronic devices (2008-01-24) [ EDA ]

• Japan's Starc uses Cadence's CPF tech in ref flow (2008-01-24) [ EDA ]
• Stratix III FPGA features 340K logic elements (2008-01-24) [ Programmable Logic ]
• RF front-end modules simplify Wi-Fi system design (2008-01-24) [ RF/Wireless Design ]
• Mentor launches third-gen TestBench Xpress (2008-01-24) [ EDA ]
• DC/DC converter saves power in industrial equipment (2008-01-24) [ Signal Conditioning ]

• Single-chip mobile TV receiver works with global standards (2008-01-24) [ RF/Wireless Design ]
• High-brightness laser engine ICs are customizable (2008-01-24) [ Optical Electronics and Display ]
• 815-1,000MHz SiGe passive mixer rolls for 2.5/3G base stations (2008-01-24) [ Signal Conditioning ]
• Tiny HSPA multimedia baseband packs advanced features (2008-01-24) [ RF/Wireless Design ]
• National streamlines manufacturing efforts (2008-01-23) [ Process/Manufacturing ]

• CSR allies with Samsung on mobile GPS modules (2008-01-23) [ RF/Wireless Design ]
• Coming soon: Foldable-screen handsets (2008-01-23) [ Optical Electronics and Display ]
• Vietnam debuts in microchip market (2008-01-23) [ Process/Manufacturing ]
• Sanyo, Kyocera seal mobile biz transfer (2008-01-23) [ Process/Manufacturing ]
• New licensing model seeks to reduce IP legal suits (2008-01-23) [ Embedded Systems ]

• IBM, Intel, Cisco launch HPC center in France (2008-01-23) [ Test & Packaging ]
• IMEC, U.S. university partner on EUV litho research (2008-01-23) [ Process/Manufacturing ]
• Avnet, Xilinx open training lab in Singapore (2008-01-23) [ EDA ]
• Schott to set up PV facility in the United States (2008-01-23) [ Process/Manufacturing ]
• Intel CTO: Software delivery must keep pace with hardware (2008-01-23) [ Embedded Systems ]

• Market watchers see mixed signals in analog (2008-01-23) [ Signal Conditioning ]
• 24bit audio DAC puts Hi-Fi sound in mobile apps (2008-01-23) [ Signal Conditioning ]
• Video decoder with 3D comb filter aims at HDTVs (2008-01-23) [ Digital Signal Processing ]
• Broadband solid-state PIN diode switch has high isolation (2008-01-23) [ Design Test ]
• Freescale licenses ColdFire online via IPextreme (2008-01-23) [ Optical Electronics and Display ]

• Octal ADCs claim 'lowest' power draw, 'smallest' size (2008-01-23) [ Signal Conditioning ]
• PLX ships samples of Gen 2 PCIe switch family (2008-01-23) [ Interface Design ]
• Xilinx introduces three new Virtex-5 FPGAs (2008-01-23) [ Programmable Logic ]
• GUI MCU supports 'smart' control panel apps (2008-01-23) [ Interface Design ]
• Optical fibers give PHY chipset low power loss (2008-01-23) [ Optical Electronics and Display ]

• Compact LAN oscilloscope claims high benchtop performance (2008-01-23) [ Design Test ]
• Oscilloscope function steps up system integrity analysis (2008-01-23) [ Design Test ]
• dPMR processor touts GMSK functionality (2008-01-23) [ RF/Wireless Design ]
• Plant shutdown sparks anti-Nokia move in Germany (2008-01-22) [ Process/Manufacturing ]
• Fujitsu cooks semi biz spin off, reports say (2008-01-22) [ Process/Manufacturing ]

• Microsoft slapped with new IPR suit in China (2008-01-22) [ Embedded Systems ]
• Greenpeace: Car industry's green claims a fairy tale (2008-01-22) [ EDA ]
• IMEC opens Taiwan office (2008-01-22) [ EDA ]
• Cars still safe in face of electric power failure, say automakers (2008-01-22) [ Power Design ]
• AMD beefs up Xilleon chips with DivX video tech (2008-01-22) [ Embedded Systems ]

• Kyocera boosts India facility for wireless initiatives (2008-01-22) [ Process/Manufacturing ]
• U.S. Senate to tackle patent reform bill (2008-01-22) [ EDA ]
• austriamicrosystems finalizes investment in New Scale Technologies (2008-01-22) [ Process/Manufacturing ]
• 450mm fabs unlikely to come soon, says analyst (2008-01-22) [ Process/Manufacturing ]
• Planet protection patents pushed to public domain (2008-01-22) [ Process/Manufacturing ]

• Fujitsu servers tout UltraSPARC T2 processors (2008-01-22) [ Buffer/Storage ]
• Half-duplex transceiver tailored for remote apps (2008-01-22) [ RF/Wireless Design ]
• Tuner card handles China HDTV broadcast (2008-01-22) [ EDA ]
• Elpida tips x64bit I/O Mobile RAM (2008-01-22) [ Buffer/Storage ]
• Avago debuts 10GbE SFP+ transceiver (2008-01-22) [ RF/Wireless Design ]

• Panel pot lasts to 1 million cycles (2008-01-22) [ Signal Conditioning ]
• Solid-state GaAs amplifier delivers high linearity (2008-01-22) [ RF/Wireless Design ]
• Audio processor has USB interface (2008-01-22) [ Digital Signal Processing ]
• 600V gate driver adds extra channel (2008-01-22) [ EMI/EMC Design ]
• Femtocell ref design 'first' to support TD-SCDMA (2008-01-22) [ EDA ]

• Low on-resistance for this power MOSFET (2008-01-22) [ Power Design ]
• LED drivers feature 16 constant-current output channels (2008-01-22) [ Optical Electronics and Display ]
• SunPower inks polysilicon supply deals (2008-01-21) [ Process/Manufacturing ]
• ATI buyout widens AMD Q4 losses (2008-01-21) [ Process/Manufacturing ]
• ST to complete Genesis acquisition (2008-01-21) [ Process/Manufacturing ]

• Hitachi, Fujitsu shed small hard-drive lines (2008-01-21) [ Buffer/Storage ]
• Infineon CEO: Chipmakers must build systems, not fabs (2008-01-21) [ Process/Manufacturing ]
• Haier, NXP bring Edge to China mobile users (2008-01-21) [ RF/Wireless Design ]
• PC shipments post strong results in '07 (2008-01-21) [ Process/Manufacturing ]
• Fab tool industry up for a challenging year (2008-01-21) [ Process/Manufacturing ]

• Signage of the future to highlight printable, organic electronics (2008-01-21) [ Optical Electronics and Display ]
• Hynix CEO sees DRAM price rebound in Q2 (2008-01-21) [ Process/Manufacturing ]
• France to tax 'new means of communication' (2008-01-21) [ RF/Wireless Design ]
• Solar inverters get efficiency boost from SiC transistors (2008-01-21) [ Power Design ]
• Hot-plug power controllers support PCIe 2.0 (2008-01-21) [ Power Design ]

• Qimonda ships 512Mb XDR DRAM samples (2008-01-21) [ Buffer/Storage ]
• Multiport midspans tip pre-standard IEEE 802.3 specs (2008-01-21) [ Network Design ]
• 25A step-down regulator fits in 8mm x 8mm TQFN (2008-01-21) [ Power Design ]
• Processor companion family gets a boost (2008-01-21) [ Buffer/Storage ]
• LED driver has silent error detection feature (2008-01-21) [ Optical Electronics and Display ]

• Cisco connects home devices via IP home gateway (2008-01-21) [ Network Design ]
• LED drivers fit for mid-size LCD panels (2008-01-21) [ Optical Electronics and Display ]
• Agilent automates UMTS cellular mobile stress test (2008-01-21) [ Design Test ]
• Solution adds 'gesture interface' to notebooks (2008-01-21) [ Interface Design ]
• RoHS-compliant SBC operates at high temperatures (2008-01-21) [ Embedded Systems ]

• Tool deploys Simulink code to Green Hills IDE (2008-01-21) [ Digital Signal Processing ]
• Address power management issues in mobiles (2008-01-21) [ Power Design ]
• 'Open' is (not) just a four-letter word (2008-01-21) [ EDA ]
• Tested, effective methods for optimizing DSP algorithms (2008-01-21) [ Digital Signal Processing ]