• Interface market continues to evolve (2008-12-01) [ Interface ]
• Nüvi 205 expands horizon for GPS navigation system (2008-12-01) [ RF/Microwave ]
• VoIP goes into video (2008-12-01) [ Processors/DSPs ]
• Flexible controllers adopt power-efficient strategies (2008-12-01) [ Controls/MCUs ]
• Power connectors boost system airflow (2008-12-01) [ Networks ]

• Save power with on-off keying (2008-12-01) [ RF/Microwave ]
• Surpass LTE requirements, goals (2008-12-01) [ RF/Microwave ]
• IMEC pushes SDR effort forward (2008-12-01) [ RF/Microwave ]
• Trees energize wireless networks (2008-12-01) [ Sensors/MEMS ]
• ASML reveals 22nm litho road map (2008-12-01) [ Manufacturing/Packaging ]

• Telehealth age dawns (2008-12-01) [ RF/Microwave ]
• MCU helps secure e-Government services (2008-12-01) [ Embedded ]
• Motor controller delivers all-in-one solution (2008-12-01) [ Embedded ]
• Plastic-encapsulated parts gear up for military apps (2008-12-01) [ Embedded ]
• DC/DC converter targets for portable apps (2008-12-01) [ Power/Alternative Energy ]

• Is Intel working on industrial-, automotive-grade Atom? (2008-12-01) [ Controls/MCUs ]
• PCIe suits up for backplane task (2008-12-01) [ Interface ]
• NXP, Phonak collaborate on enhanced acoustics (2008-12-01) [ RF/Microwave ]
• Elpida touts low-power 50nm SDRAM (2008-12-01) [ Memory/Storage ]
• Exhibition caters to China's SoC sector (2008-11-28) [ EDA/IP ]

• Regulators comply with EMI, multi-Gbit Serdes specs (2008-11-28) [ Power/Alternative Energy ]
• FlexRay transceivers up ante for in-car networking (2008-11-28) [ RF/Microwave ]
• 'Smallest' NiMH charger boasts fast-charge control (2008-11-28) [ Power/Alternative Energy ]
• SDK simplifies USB device networking (2008-11-28) [ Networks ]
• LynuxWorks delivers separation kernel/hypervisor (2008-11-28) [ Embedded ]

• Single-chip HDTV processors come fully packed (2008-11-28) [ Processors/DSPs ]
• Network security protocols toughen up RTOS (2008-11-28) [ Embedded ]
• LCOS driver chip zoom in on mobile projectors (2008-11-28) [ Optoelectronics/Displays ]
• Intel fires back at European Commission (2008-11-28) [ Processors/DSPs ]
• Report: Solar panel sales to slide in '09 (2008-11-28) [ Power/Alternative Energy ]

• Cadence downplays Connections membership issue (2008-11-28) [ EDA/IP ]
• HP Labs heralds 3D memristor chip (2008-11-28) [ Manufacturing/Packaging ]
• Qimonda finalizes sale of Inotera stake to Micron (2008-11-28) [ Manufacturing/Packaging ]
• iSuppli trims LCD TV outlook, but remains optimistic (2008-11-28) [ Manufacturing/Packaging ]
• InterDigital, Samsung end patent licensing discord (2008-11-28) [ Manufacturing/Packaging ]

• Vietnam's Viettel Telecom teams up with Nokia Siemens (2008-11-28) [ RF/Microwave ]
• CANOpen protocol promotes safe communications (2008-11-27) [ Controls/MCUs ]
• I/O module packs FPGA, four SRIO ports, PCIe (2008-11-27) [ Interface ]
• 802.11a/b/g core module enables secure networking (2008-11-27) [ RF/Microwave ]
• RC helicopter flies light with few electronics (2008-11-27) [ Controls/MCUs ]

• RF transistors deliver high performance at wide bandwidth (2008-11-27) [ RF/Microwave ]
• Cadence cuts members from Connections program (2008-11-27) [ EDA/IP ]
• UMC pushes high-k process for 45nm (2008-11-27) [ Manufacturing/Packaging ]
• Researchers develop fish-like hydropower generator (2008-11-27) [ Power/Alternative Energy ]
• FTC asks Supreme Court to review Rambus antitrust case (2008-11-27) [ Memory/Storage ]

• ISSCC to unravel next-gen cellphones (2008-11-27) [ Memory/Storage ]
• Low-power image sensor works in medical devices (2008-11-26) [ Optoelectronics/Displays ]
• Integrated battery chargers target portable apps (2008-11-26) [ Power/Alternative Energy ]
• LDMOS transistor delivers 500W RF output power (2008-11-26) [ RF/Microwave ]
• aBCD process tech cuts voltage transistor pitch (2008-11-26) [ Manufacturing/Packaging ]

• Free circuits await LTE base stations on FPGA (2008-11-26) [ EDA/IP ]
• Image processors perform real-time detection (2008-11-26) [ Controls/MCUs ]
• Mobile spectrum analyzers suit up for field work (2008-11-26) [ T&M ]
• Chips aim to resolve H.264/AVC issues (2008-11-26) [ Amplifiers/Converters ]
• ST: 8bit MCU market is not dead (2008-11-26) [ Controls/MCUs ]

• Researchers fuse CMOS circuits, flexible substrates (2008-11-26) [ Manufacturing/Packaging ]
• Intel's Barrett turns vision to opportunities (2008-11-26) [ Manufacturing/Packaging ]
• Analysis: China's quest for chip stardom (2008-11-26) [ Manufacturing/Packaging ]
• Trio works on in-flight mobile broadband system (2008-11-26) [ RF/Microwave ]
• 18MW solar power plant rises in Spain (2008-11-26) [ Power/Alternative Energy ]

• SiliconBlue, Magma bolster tech collaboration (2008-11-26) [ EDA/IP ]
• Intel, Micron roll 34nm NAND flash (2008-11-26) [ Manufacturing/Packaging ]
• Report: Ethernet won't fly at 100Gbit (2008-11-25) [ Networks ]
• Chipmakers brace for tough times (2008-11-25) [ Manufacturing/Packaging ]
• Buzz: Elpida muses on Powerchip buyout (2008-11-25) [ Memory/Storage ]

• Startup secures funding despite slowdown (2008-11-25) [ RF/Microwave ]
• Optimism brews in high-power RFIC market (2008-11-25) [ RF/Microwave ]
• Renesas turns over fab to Silicon Foundry (2008-11-25) [ Manufacturing/Packaging ]
• Cavium Networks buys W&W Communications (2008-11-25) [ Networks ]
• ST works with MIT on MCU development (2008-11-25) [ Controls/MCUs ]

• Fingerprint access device achieves 700 matches in 1sec (2008-11-25) [ Processors/DSPs ]
• Sensor amp offers programmable gain, offset (2008-11-25) [ Amplifiers/Converters ]
• IR emitter claims highest radiant intensity (2008-11-25) [ Optoelectronics/Displays ]
• RFMD beefs up 3G front end lineup (2008-11-25) [ RF/Microwave ]
• FireWire ICs deliver multiple options (2008-11-25) [ Interface ]

• High-frequency DC/DC regulator is extra small (2008-11-25) [ Power/Alternative Energy ]
• Epson Toyocom heralds QMEMS process (2008-11-25) [ Manufacturing/Packaging ]
• Xilinx's Virtex FPGAs conform to PCIe V2.0 (2008-11-25) [ FPGAs/PLDs ]
• Hacking down on video game energy use (2008-11-24) [ Power/Alternative Energy ]
• AC/DC power supplies boast energy efficiency stamps (2008-11-24) [ Power/Alternative Energy ]

• 16bit MCU with stop mode suits DAQ apps (2008-11-24) [ Controls/MCUs ]
• Multichannel ADCs save up to 50% PCB space (2008-11-24) [ Amplifiers/Converters ]
• Space-saving protection IC targets portable apps (2008-11-24) [ Power/Alternative Energy ]
• VoIP processor earmarked for multimedia phones (2008-11-24) [ Processors/DSPs ]
• RTOS hypervisor eyes mobile device apps (2008-11-24) [ Embedded ]

• I/O module carries interruptible event sense (2008-11-24) [ Interface ]
• MCP accords memory for OMAP35x processors (2008-11-24) [ T&M ]
• Slowdown hits Japan fab-tool market, too (2008-11-24) [ Manufacturing/Packaging ]
• Fear and hope cloud IC industry (2008-11-24) [ Manufacturing/Packaging ]
• Research claims optical chips could run cooler, pack more bits (2008-11-24) [ Manufacturing/Packaging ]

• Analysis: Merger sparks hope for UWB market (2008-11-24) [ RF/Microwave ]
• Freescale, Synerject rev up performance of Ducati bikes (2008-11-24) [ Embedded ]
• iSuppli: WiMAX, 3G will bring good tidings to India (2008-11-24) [ RF/Microwave ]
• The Portand Group, AMD collaborate on compiler tech (2008-11-24) [ Embedded ]
• Staccato, Artimi combine, gain financing (2008-11-24) [ RF/Microwave ]

• Consumer electronics with a twist (2008-11-21) [ Embedded ]
• N-channel MOSFET claims 'lowest' on-resistance (2008-11-21) [ Power/Alternative Energy ]
• High voltage LDO delivers 3&#181A quiescent current (2008-11-21) [ Power/Alternative Energy ]
• Hot-plug switch cuts component count in backplanes (2008-11-21) [ Networks ]
• SiliconDrive SDDs meet critical OEM specs (2008-11-21) [ Memory/Storage ]

• CMSIS allows flexible programming in MCUs (2008-11-21) [ Interface ]
• Agilent tips solutions for TDD-LTE designs (2008-11-21) [ T&M ]
• Infineon optimizes mobile phone chips (2008-11-21) [ RF/Microwave ]
• Step-down DC/DC converter extends battery life (2008-11-21) [ Power/Alternative Energy ]
• Report: Power systems embrace smart grid web (2008-11-21) [ Power/Alternative Energy ]

• iSuppli: Setbacks in some China IC firms linger (2008-11-21) [ Manufacturing/Packaging ]
• Actel turns to UMC for 65nm eFlash FPGAs (2008-11-21) [ Manufacturing/Packaging ]
• Micrel, Zilog co-develop sub-system modules (2008-11-21) [ RF/Microwave ]
• Firms push mobile connectivity for CE, industrial apps (2008-11-21) [ RF/Microwave ]
• Wafer-level packaging achieves prominence (2008-11-21) [ EDA/IP ]

• Nokia strengthens TD-SCDMA efforts (2008-11-21) [ RF/Microwave ]
• Confab to highlight nanotech for bio (2008-11-21) [ EDA/IP ]