• Exhibition caters to China's SoC sector (2008-11-28) [ EDA ]
• Regulators comply with EMI, multi-Gbit Serdes specs (2008-11-28) [ Power Design ]
• FlexRay transceivers up ante for in-car networking (2008-11-28) [ RF/Wireless Design ]
• 'Smallest' NiMH charger boasts fast-charge control (2008-11-28) [ Power Design ]
• SDK simplifies USB device networking (2008-11-28) [ Network Design ]

• LynuxWorks delivers separation kernel/hypervisor (2008-11-28) [ Embedded Systems ]
• Single-chip HDTV processors come fully packed (2008-11-28) [ Embedded Systems ]
• Network security protocols toughen up RTOS (2008-11-28) [ Security Design ]
• LCOS driver chip zoom in on mobile projectors (2008-11-28) [ Optical Electronics and Display ]
• Intel fires back at European Commission (2008-11-28) [ Embedded Systems ]

• Report: Solar panel sales to slide in '09 (2008-11-28) [ Power Design ]
• Cadence downplays Connections membership issue (2008-11-28) [ EDA ]
• HP Labs heralds 3D memristor chip (2008-11-28) [ Process/Manufacturing ]
• Qimonda finalizes sale of Inotera stake to Micron (2008-11-28) [ Process/Manufacturing ]
• iSuppli trims LCD TV outlook, but remains optimistic (2008-11-28) [ Process/Manufacturing ]

• InterDigital, Samsung end patent licensing discord (2008-11-28) [ Process/Manufacturing ]
• Vietnam's Viettel Telecom teams up with Nokia Siemens (2008-11-28) [ RF/Wireless Design ]
• CANOpen protocol promotes safe communications (2008-11-27) [ Control Design ]
• I/O module packs FPGA, four SRIO ports, PCIe (2008-11-27) [ Interface Design ]
• 802.11a/b/g core module enables secure networking (2008-11-27) [ RF/Wireless Design ]

• RC helicopter flies light with few electronics (2008-11-27) [ Control Design ]
• RF transistors deliver high performance at wide bandwidth (2008-11-27) [ RF/Wireless Design ]
• Cadence cuts members from Connections program (2008-11-27) [ EDA ]
• UMC pushes high-k process for 45nm (2008-11-27) [ Process/Manufacturing ]
• Researchers develop fish-like hydropower generator (2008-11-27) [ Power Design ]

• FTC asks Supreme Court to review Rambus antitrust case (2008-11-27) [ Buffer/Storage ]
• ISSCC to unravel next-gen cellphones (2008-11-27) [ Buffer/Storage ]
• Low-power image sensor works in medical devices (2008-11-26) [ Optical Electronics and Display ]
• Integrated battery chargers target portable apps (2008-11-26) [ Power Design ]
• LDMOS transistor delivers 500W RF output power (2008-11-26) [ RF/Wireless Design ]

• aBCD process tech cuts voltage transistor pitch (2008-11-26) [ Process/Manufacturing ]
• Free circuits await LTE base stations on FPGA (2008-11-26) [ EDA ]
• Image processors perform real-time detection (2008-11-26) [ Control Design ]
• Mobile spectrum analyzers suit up for field work (2008-11-26) [ Design Test ]
• Chips aim to resolve H.264/AVC issues (2008-11-26) [ Signal Conditioning ]

• ST: 8bit MCU market is not dead (2008-11-26) [ Control Design ]
• Researchers fuse CMOS circuits, flexible substrates (2008-11-26) [ Process/Manufacturing ]
• Intel's Barrett turns vision to opportunities (2008-11-26) [ Process/Manufacturing ]
• Analysis: China's quest for chip stardom (2008-11-26) [ Process/Manufacturing ]
• Trio works on in-flight mobile broadband system (2008-11-26) [ RF/Wireless Design ]

• 18MW solar power plant rises in Spain (2008-11-26) [ Power Design ]
• SiliconBlue, Magma bolster tech collaboration (2008-11-26) [ EDA ]
• Intel, Micron roll 34nm NAND flash (2008-11-26) [ Process/Manufacturing ]
• Report: Ethernet won't fly at 100Gbit (2008-11-25) [ Network Design ]
• Chipmakers brace for tough times (2008-11-25) [ Process/Manufacturing ]

• Buzz: Elpida muses on Powerchip buyout (2008-11-25) [ Buffer/Storage ]
• Startup secures funding despite slowdown (2008-11-25) [ RF/Wireless Design ]
• Optimism brews in high-power RFIC market (2008-11-25) [ RF/Wireless Design ]
• Renesas turns over fab to Silicon Foundry (2008-11-25) [ Process/Manufacturing ]
• Cavium Networks buys W&W Communications (2008-11-25) [ Network Design ]

• ST works with MIT on MCU development (2008-11-25) [ Control Design ]
• Fingerprint access device achieves 700 matches in 1sec (2008-11-25) [ Embedded Systems ]
• Sensor amp offers programmable gain, offset (2008-11-25) [ Signal Conditioning ]
• IR emitter claims highest radiant intensity (2008-11-25) [ Optical Electronics and Display ]
• RFMD beefs up 3G front end lineup (2008-11-25) [ RF/Wireless Design ]

• FireWire ICs deliver multiple options (2008-11-25) [ Interface Design ]
• High-frequency DC/DC regulator is extra small (2008-11-25) [ Power Design ]
• Epson Toyocom heralds QMEMS process (2008-11-25) [ Process/Manufacturing ]
• Xilinx's Virtex FPGAs conform to PCIe V2.0 (2008-11-25) [ Programmable Logic ]
• Hacking down on video game energy use (2008-11-24) [ Power Design ]

• AC/DC power supplies boast energy efficiency stamps (2008-11-24) [ Power Design ]
• 16bit MCU with stop mode suits DAQ apps (2008-11-24) [ Control Design ]
• Multichannel ADCs save up to 50% PCB space (2008-11-24) [ Signal Conditioning ]
• Space-saving protection IC targets portable apps (2008-11-24) [ Power Design ]
• VoIP processor earmarked for multimedia phones (2008-11-24) [ Digital Signal Processing ]

• RTOS hypervisor eyes mobile device apps (2008-11-24) [ Embedded Systems ]
• I/O module carries interruptible event sense (2008-11-24) [ Interface Design ]
• MCP accords memory for OMAP35x processors (2008-11-24) [ Test & Packaging ]
• Slowdown hits Japan fab-tool market, too (2008-11-24) [ Process/Manufacturing ]
• Fear and hope cloud IC industry (2008-11-24) [ Process/Manufacturing ]

• Research claims optical chips could run cooler, pack more bits (2008-11-24) [ Process/Manufacturing ]
• Analysis: Merger sparks hope for UWB market (2008-11-24) [ RF/Wireless Design ]
• Freescale, Synerject rev up performance of Ducati bikes (2008-11-24) [ Embedded Systems ]
• iSuppli: WiMAX, 3G will bring good tidings to India (2008-11-24) [ RF/Wireless Design ]
• The Portand Group, AMD collaborate on compiler tech (2008-11-24) [ Embedded Systems ]

• Staccato, Artimi combine, gain financing (2008-11-24) [ RF/Wireless Design ]
• Consumer electronics with a twist (2008-11-21) [ Embedded Systems ]
• N-channel MOSFET claims 'lowest' on-resistance (2008-11-21) [ Power Design ]
• High voltage LDO delivers 3&#181A quiescent current (2008-11-21) [ Power Design ]
• Hot-plug switch cuts component count in backplanes (2008-11-21) [ Network Design ]

• SiliconDrive SDDs meet critical OEM specs (2008-11-21) [ Buffer/Storage ]
• CMSIS allows flexible programming in MCUs (2008-11-21) [ Interface Design ]
• Agilent tips solutions for TDD-LTE designs (2008-11-21) [ Design Test ]
• Infineon optimizes mobile phone chips (2008-11-21) [ RF/Wireless Design ]
• Step-down DC/DC converter extends battery life (2008-11-21) [ Power Design ]

• Report: Power systems embrace smart grid web (2008-11-21) [ Power Design ]
• iSuppli: Setbacks in some China IC firms linger (2008-11-21) [ Process/Manufacturing ]
• Actel turns to UMC for 65nm eFlash FPGAs (2008-11-21) [ Process/Manufacturing ]
• Micrel, Zilog co-develop sub-system modules (2008-11-21) [ RF/Wireless Design ]
• Firms push mobile connectivity for CE, industrial apps (2008-11-21) [ RF/Wireless Design ]

• Wafer-level packaging achieves prominence (2008-11-21) [ EDA ]
• Nokia strengthens TD-SCDMA efforts (2008-11-21) [ RF/Wireless Design ]
• Confab to highlight nanotech for bio (2008-11-21) [ EDA ]