• Clock generator eases configuration in multiple ICs (2008-11-10) [ Interface ]
• Hypercore design tools upgrade multicore processing (2008-11-10) [ Processors/DSPs ]
• RF MEMS switches can operate digital signals (2008-11-10) [ Sensors/MEMS ]
• Switches allow multiple audio signals sharing (2008-11-10) [ Networks ]
• Low-cost Bluetooth chip meets V2.0+EDR spec (2008-11-10) [ RF/Microwave ]

• Low output voltage regulator suits digital apps (2008-11-10) [ Power/Alternative Energy ]
• Controller ICs ready for assorted capacitive touch apps (2008-11-10) [ Sensors/MEMS ]
• Video buffer powers up battery life in mobile (2008-11-10) [ Interface ]
• Cypress, India U to build joint PSoC lab (2008-11-10) [ Embedded ]
• Rambus files infringement complaint vs. Nvidia (2008-11-10) [ Memory/Storage ]

• ST-NXP Wireless restructures, plans 500 job cuts (2008-11-10) [ Manufacturing/Packaging ]
• AMD seeks to add more fabs in Germany (2008-11-10) [ Manufacturing/Packaging ]
• DRAM vendors struggle to overcome 'insolvency' (2008-11-10) [ Memory/Storage ]
• Skyworks overtakes Spreadtrum in iPhone arena (2008-11-10) [ RF/Microwave ]
• LG suspends JV plan with Conergy (2008-11-10) [ Manufacturing/Packaging ]

• IPO candidates await market recovery (2008-11-10) [ EDA/IP ]
• FAQs: getting started with USB (2008-11-07) [ Interface ]
• TSMC tips high voltage .13µ process (2008-11-07) [ Manufacturing/Packaging ]
• SanDisk readies better format for SSDs (2008-11-07) [ Memory/Storage ]
• Validus taps IMI for powered cards (2008-11-07) [ Manufacturing/Packaging ]

• Sun fuels multicore design in Europe (2008-11-07) [ EDA/IP ]
• Analysis: Emergence of wireless TV spectrum set (2008-11-07) [ Optoelectronics/Displays ]
• Amimon boasts WHDI tech in HDTV design win (2008-11-07) [ Optoelectronics/Displays ]
• Restructuring befalls Cadence (2008-11-07) [ EDA/IP ]
• Order delays haunt LCD tool makers (2008-11-07) [ T&M ]

• Dual-core MCUs meet automotive safety standards (2008-11-07) [ Controls/MCUs ]
• Boost converters require 8.5µA quiescent (2008-11-07) [ Power/Alternative Energy ]
• Capacitors boast low impedance, high ripple current (2008-11-07) [ Amplifiers/Converters ]
• DC/DC converter ensures flexible power system (2008-11-07) [ Power/Alternative Energy ]
• Compact modulator carries AGC for comm devices (2008-11-07) [ RF/Microwave ]

• DSP to deliver faster base station programmability (2008-11-07) [ RF/Microwave ]
• MCUs tout digital security features (2008-11-07) [ Controls/MCUs ]
• Digital audio receiver includes sample-rate converter (2008-11-07) [ Processors/DSPs ]
• Can the old school of analog designers really hack it in today's digital CMOS world? (2008-11-06) [ EDA/IP ]
• LG, Microsoft join forces on mobile convergence (2008-11-06) [ RF/Microwave ]

• Nokia plans further cuts in operations (2008-11-06) [ Manufacturing/Packaging ]
• Renesas, NXP partner to drive MIFARE contactless services (2008-11-06) [ RF/Microwave ]
• Analysis: Group preps for next portable digital spec (2008-11-06) [ Optoelectronics/Displays ]
• New wave of collaboration to roll in 4G segment (2008-11-06) [ RF/Microwave ]
• Intel withdraws UWB R&D effort amid shakeout (2008-11-06) [ Manufacturing/Packaging ]

• Fujitsu to gain Siemens' share in JV (2008-11-06) [ Embedded ]
• VC funding for chip firms slows down (2008-11-06) [ EDA/IP ]
• Tool enables CAN, FlexRay system integration (2008-11-06) [ Networks ]
• High-res oscilloscopes hasten analysis processing (2008-11-06) [ T&M ]
• Improved adapters, VIP comply with system app needs (2008-11-06) [ EDA/IP ]

• 45V buck converter suits always-on automotive apps (2008-11-06) [ Power/Alternative Energy ]
• Smart card ICs get security stamp for payment, identity apps (2008-11-06) [ Embedded ]
• DC/DC converter highlights light-load efficiency (2008-11-06) [ Power/Alternative Energy ]
• Downconversion mixer is highly integrated (2008-11-06) [ RF/Microwave ]
• Image sensor seeks out machine vision, industrial apps (2008-11-06) [ Optoelectronics/Displays ]

• Building ultra-reliable automotive systems—Part 2 (2008-11-05) [ FPGAs/PLDs ]
• SoC Designer brings customized platform solutions (2008-11-05) [ EDA/IP ]
• Ferrite chip beads suit handheld electronics (2008-11-05) [ Amplifiers/Converters ]
• Dev't platform supports dual processor embedded systems (2008-11-05) [ FPGAs/PLDs ]
• Smart card interface IC boasts ±8kV ESD protection (2008-11-05) [ Interface ]

• Clock oscillators meet FCC interference standards (2008-11-05) [ Sensors/MEMS ]
• Motherboards welcome 10GbE (2008-11-05) [ Interface ]
• New library beefs up ST MCUs (2008-11-05) [ Embedded ]
• Quartus II software version 8.1 rolls (2008-11-05) [ FPGAs/PLDs ]
• Firm anticipates brake in TFT-LCD equipment spending (2008-11-05) [ Manufacturing/Packaging ]

• Optek joins Osram's LED network as partner (2008-11-05) [ Optoelectronics/Displays ]
• Alereon buys Stonestreet One's wireless USB tech (2008-11-05) [ RF/Microwave ]
• Market researcher softens IC forecast (2008-11-05) [ Manufacturing/Packaging ]
• WiQuest closes shop due to UWB's low demand (2008-11-05) [ Networks ]
• Internet TV: Next attraction (2008-11-05) [ Optoelectronics/Displays ]

• Infineon, Micron see beyond 128Mbyte HD-SIM cards (2008-11-05) [ Memory/Storage ]
• NAND deals with dwindling revenues (2008-11-05) [ Memory/Storage ]
• FAQs: RF design (2008-11-04) [ RF/Microwave ]
• The Energy Impact of Grid Computing (2008-11-04) [ Embedded ]
• Qualcomm establishes APAC test center in Singapore (2008-11-04) [ T&M ]

• Intel's Moblin to spur Taiwan's mobile market (2008-11-04) [ RF/Microwave ]
• ST, Arkados co-develop 'first' HomePlug AV SoC (2008-11-04) [ Networks ]
• Comment: Motorola struggles to overcome market woes (2008-11-04) [ RF/Microwave ]
• Bozotti cites key points for ST's rehabilitation (2008-11-04) [ EDA/IP ]
• Freescale to slash 10% workforce amid losses (2008-11-04) [ Manufacturing/Packaging ]

• Maxim, Anpec resolve DirectDrive patent suit (2008-11-04) [ Manufacturing/Packaging ]
• HDMI is interface of choice for 3DTV (2008-11-04) [ Interface ]
• EM design platform hastens circuit development (2008-11-04) [ EDA/IP ]
• Simulation tech enhances mixed-signal designs (2008-11-04) [ EDA/IP ]
• Optical films boost energy capacity for LCD TVs (2008-11-04) [ Optoelectronics/Displays ]

• 1394 CE PHY devices secure content (2008-11-04) [ Interface ]
• Digital radio test set meets DMR standards (2008-11-04) [ T&M ]
• Smart card processors promise high security in cellphones (2008-11-04) [ Embedded ]
• 3G dev kit eyes TI OMAP35x, Windows CE 6 (2008-11-04) [ EDA/IP ]
• Batteries get a boost via portable audio codec (2008-11-04) [ Amplifiers/Converters ]

• Trimming standby power supply consumption (2008-11-03) [ Power/Alternative Energy ]
• A less visible, yet important, ballot is underway: P1801 (2008-11-03) [ EDA/IP ]
• LED drivers promise simplified configurations (2008-11-03) [ Optoelectronics/Displays ]
• Open protector secures control path during LED failure (2008-11-03) [ Optoelectronics/Displays ]
• Actel boasts compact, low-cost FPGAs (2008-11-03) [ EDA/IP ]

• Frequency synthesizer offers sub-picosecond jitter (2008-11-03) [ Networks ]
• Compact power supplies are PICMG 2.11 compliant (2008-11-03) [ Power/Alternative Energy ]
• ADC finds way to effectively dissipate power (2008-11-03) [ Amplifiers/Converters ]
• ST caters to vision-based driver assistance systems (2008-11-03) [ Sensors/MEMS ]
• Teardowns provide renewed opportunities for Apple (2008-11-03) [ Embedded ]

• Getting a grip on embedded (2008-11-03) [ Embedded ]
• NXP seeks leadership in remaining units (2008-11-03) [ Manufacturing/Packaging ]
• Move up the design value chain (2008-11-03) [ EDA/IP ]
• Wrong directions (2008-11-03) [ RF/Microwave ]
• Composites beat steel as surveillance system case (2008-11-03) [ Optoelectronics/Displays ]

• Crime fighters get PL edge (2008-11-03) [ FPGAs/PLDs ]
• Chips reembrace multicore architecture (2008-11-03) [ Processors/DSPs ]
• Flexible screens crawl to market (2008-11-03) [ Optoelectronics/Displays ]
• Big players move into MEMS mic space (2008-11-03) [ Sensors/MEMS ]
• NEC pioneers change in Japan electronics (2008-11-03) [ Manufacturing/Packaging ]

• Electronics follow curves (2008-11-03) [ Manufacturing/Packaging ]
• What’s required for RF4CE? (2008-11-03) [ T&M ]