• PDC: Plasma display market to see 25% growth (2007-09-28) [ Optical Electronics and Display ]
• Singapore ships to go wireless at sea by 2008 (2007-09-28) [ RF/Wireless ]
• Three firms to develop implantable RFID glucose sensor (2007-09-28) [ Sensor Technology ]
• Sony, Toyota Industries merge mobile display JVs (2007-09-28) [ Optical Electronics and Display ]
• Global WiMAX interoperability effort underway (2007-09-28) [ Design Test ]

• Japan firms to collaborate on biochip research (2007-09-28) [ Design Test ]
• iSuppli slashes semiconductor revenue growth forecast (2007-09-28) [ Process/Manufacturing ]
• U.S. court orders TSMC to pay UniRAM $30.5M (2007-09-28) [ Process/Manufacturing ]
• Report: Hitachi may sell stake in HDD unit (2007-09-28) [ Buffer/Storage ]
• Car applications to steer MCU market growth (2007-09-28) [ Interface Design ]

• Tower in talks with India chip manufacturing groups (2007-09-28) [ Process/Manufacturing ]
• Confirmed: Toshiba NAND capacity sold out (2007-09-28) [ Process/Manufacturing ]
• Op amps push the limits of precision (2007-09-28) [ Amplifying/Conditioning/Converting ]
• MCUs offer IEEE 1588 assist, internetworking (2007-09-28) [ Networking Design ]
• ICs bring terrestrial digital broadcast to handsets (2007-09-28) [ RF/Wireless ]

• Ramtron 8051-based MCU has 2Kbyte FRAM (2007-09-28) [ Embedded Systems ]
• 4.1-inch LCD module enables quality pictures in portable apps (2007-09-28) [ Optical Electronics and Display ]
• Host processor allows robots to see, navigate in 3D (2007-09-28) [ Control Design ]
• AMD tips new 'Black Edition' gaming chip (2007-09-28) [ Embedded Systems ]
• Broadcom 802.11n chip integrates power amp (2007-09-28) [ RF/Wireless ]

• HD interface chips connect CE systems wirelessly (2007-09-28) [ RF/Wireless ]
• POL converter delivers 30A from DOSA footprint (2007-09-28) [ Amplifying/Conditioning/Converting ]
• UHF smart label ICs run in dense reader environs (2007-09-28) [ Sensor Technology ]
• Ultracompact SPXO rolls for wireless telecoms tech (2007-09-28) [ RF/Wireless ]
• Moto Fone packs a punch of simple, elegant features (2007-09-27) [ RF/Wireless ]

• Next-gen terrestrial DTV spec to air next year (2007-09-27) [ RF/Wireless ]
• Personal navigation market continues to flourish: iSuppli (2007-09-27) [ RF/Wireless ]
• WTO launches formal investigation on China piracy case (2007-09-27) [ EDA/IC Design ]
• LG-Quanta patent case reaches U.S. Supreme Court (2007-09-27) [ Control Design ]
• Cisco enters collaborative cooperation with China's Haier (2007-09-27) [ Process/Manufacturing ]

• Infineon, Motorola to develop multimode 3G RFIC (2007-09-27) [ RF/Wireless ]
• Synopsys supports Dubai's first design center (2007-09-27) [ EDA/IC Design ]
• Researchers discover razor-like 'nanoblades' (2007-09-27) [ Process/Manufacturing ]
• Russia's Sitronics mulls 45nm on 300mm plant (2007-09-27) [ Process/Manufacturing ]
• JVC reports job cuts, trims 18% of workforce (2007-09-27) [ Process/Manufacturing ]

• Verizon commences part two of IPv6 transition (2007-09-27) [ Networking Design ]
• SMIC procrastinating on Wuhan fab, says analyst (2007-09-27) [ Process/Manufacturing ]
• Report: Flextronics bids adieu to France (2007-09-27) [ Process/Manufacturing ]
• 2Gbit DDR2 SDRAM achieves 1,066Mbps rates (2007-09-27) [ Buffer/Storage ]
• Mentor fields vendor-independent FPGA synthesis tool (2007-09-27) [ Programmable Logic ]

• Transceivers enable thumb-sized WiMAX terminals (2007-09-27) [ RF/Wireless ]
• FET module saves space in synchronous buck designs (2007-09-27) [ Power Design ]
• Low-voltage PNP transistors suit slim portable apps (2007-09-27) [ Power Design ]
• Quad PSE controller rolls for high-power PoE apps (2007-09-27) [ Networking Design ]
• DDR3 configurable buffer exceeds JEDEC specs (2007-09-27) [ Buffer/Storage ]

• Freescale rolls RFICs for WiMAX base stations (2007-09-27) [ RF/Wireless ]
• IP-phone ref platform runs Windows, Linux (2007-09-27) [ RF/Wireless ]
• In-building WiMAX module eases wireless tech installation (2007-09-27) [ RF/Wireless ]
• POS reference design supports China tax regulations (2007-09-27) [ Security Design ]
• Text-entry algorithm renders Qwerty obsolete (2007-09-27) [ Interface Design ]

• Dual-output LDOs target portable devices (2007-09-26) [ Power Design ]
• FPGA/Xeon-based ISA provides 1066MHz coprocessing (2007-09-26) [ Programmable Logic ]
• Voice-synthesis LSI allows addition of playback functions (2007-09-26) [ Amplifying/Conditioning/Converting ]
• Mentor delivers FPGA/PCB design tool for PADS (2007-09-26) [ EDA/IC Design ]
• USB stick tool eases wireless MCU development (2007-09-26) [ Embedded Systems ]

• Freescale intros 12 ColdFire microprocessors for Linux (2007-09-26) [ Control Design ]
• Xilinx DSP design kit goes at $300 (2007-09-26) [ Digital Signal Processing ]
• 1Mbit serial EEPROMs operate at up to 125°C (2007-09-26) [ Buffer/Storage ]
• Logic circuits rated for mil-spec temperature (2007-09-26) [ Programmable Logic ]
• Ethernet chip tailors switching to needs of carriers (2007-09-26) [ Networking Design ]

• Nvidia takes on Intel in graphics chip market (2007-09-26) [ Embedded Systems ]
• High-speed amps promise performance, low power draw (2007-09-26) [ Amplifying/Conditioning/Converting ]
• Avnet acquires European passive component distributor (2007-09-26) [ Process/Manufacturing ]
• Atmel picks Arrow as China distributor (2007-09-26) [ Process/Manufacturing ]
• Huawei expands HSPA contract with Japan's EMOBILE (2007-09-26) [ RF/Wireless ]

• Qualcomm, China's BYD ink 3G CDMA license deal (2007-09-26) [ RF/Wireless ]
• FormFactor breaks ground on new Singapore facility (2007-09-26) [ Process/Manufacturing ]
• Singapore drafts regulatory framework for UWB (2007-09-26) [ RF/Wireless ]
• Sequans, PMC-Sierra team on Mobile WiMAX femtocell solution (2007-09-26) [ RF/Wireless ]
• ARC acquires multimedia IP design firm (2007-09-26) [ Control Design ]

• Indian firm jumpstarts utility computing service (2007-09-26) [ Embedded Systems ]
• Tight LCD supply triggers handset shortage (2007-09-26) [ Process/Manufacturing ]
• Intel clears way for WiMAX in Japan (2007-09-26) [ RF/Wireless ]
• OLPC announces laptop sales strategy shift (2007-09-26) [ Embedded Systems ]
• Softbank to team with Nifty for Japan WiMAX license (2007-09-25) [ Networking Design ]

• TV, mobile to get a dose of Armani haute couture (2007-09-25) [ Optical Electronics and Display ]
• Samsung jumps into DTV broadcast patent pool (2007-09-25) [ Amplifying/Conditioning/Converting ]
• National establishes brand for energy-efficient ICs (2007-09-25) [ Amplifying/Conditioning/Converting ]
• Sumitomo acquires P-OLED pioneer for $258M (2007-09-25) [ Process/Manufacturing ]
• China group to set standard for e-waste testing (2007-09-25) [ Process/Manufacturing ]

• TI's million-dollar Rx for medical tech research (2007-09-25) [ Sensor Technology ]
• Remote Vietnam village goes online (2007-09-25) [ RF/Wireless ]
• Ruling favors Power Integrations' patent claims vs. Fairchild (2007-09-25) [ Power Design ]
• Startup drives Active RFID adoption (2007-09-25) [ RF/Wireless ]
• Virtual world market opens doors for chipmakers (2007-09-25) [ Optical Electronics and Display ]

• Toshiba fields 'SpursEngine' for better mobile video (2007-09-25) [ Digital Signal Processing ]
• New Genesys software offers enhanced RF statistical capability (2007-09-25) [ Design Test ]
• From RF to baseband in one demodulator (2007-09-25) [ RF/Wireless ]
• Power conversion ICs deliver up to 150W (2007-09-25) [ Amplifying/Conditioning/Converting ]
• 10Gbps pluggable transceiver tunes into DWDM band (2007-09-25) [ RF/Wireless ]

• ARM9 MCU series suits high-performance apps (2007-09-25) [ Control Design ]
• Dual op amp extends battery life in portable apps (2007-09-25) [ Amplifying/Conditioning/Converting ]
• RF vector signal generator streams data at 25MSps (2007-09-25) [ Design Test ]
• Natural-sounding voice guidance chips roll for embedded apps (2007-09-25) [ Embedded Systems ]
• Passively cooled CPU board works in tough setups (2007-09-25) [ Embedded Systems ]

• Multistring white LED driver has 91% efficiency (2007-09-25) [ Optical Electronics and Display ]
• Industrial-grade UPS touts extra rugged features (2007-09-25) [ Power Design ]
• MAC/PHY chip powers Mobile WiMAX base stations (2007-09-25) [ Networking Design ]
• Internet overload? No, go beyond P2P (2007-09-24) [ Networking Design ]
• Practical design considerations: Ethernet vs. RapidIO standards (2007-09-24) [ Embedded Systems ]

• Small form factor MCU doubles flash code space (2007-09-24) [ Control Design ]
• HDMI 1.3a switch promises high-quality 20m transmission (2007-09-24) [ Optical Electronics and Display ]
• LabVIEW 8.5 works with Blackfin, ColdFire processors (2007-09-24) [ Embedded Systems ]
• Nexperia solutions simplify Edge handset dev't (2007-09-24) [ RF/Wireless ]
• RF solution pair targets low-power wireless apps (2007-09-24) [ RF/Wireless ]

• UMPC power management LSI complies with LPIA spec (2007-09-24) [ Embedded Systems ]
• Semiconductor light source plugs directly into AC power outlets (2007-09-24) [ Optical Electronics and Display ]
• Network analyzers support embedded LO measurement (2007-09-24) [ Design Test ]
• Coverity raises the bar for static analysis (2007-09-24) [ Embedded Systems ]
• Intel eyes business PC market with Nehalem (2007-09-24) [ Control Design ]

• Ericsson HSPA modules to duel witth Qualcomm, Intel's WiMAX (2007-09-24) [ Networking Design ]
• Pericom tips Display Port, PCIe products (2007-09-24) [ Interface Design ]
• Choose the best inductor, capacitor for DC/DC converters in portables (2007-09-24) [ Amplifying/Conditioning/Converting ]
• iSuppli: Supplier shuffle marks new iPod nano (2007-09-24) [ RF/Wireless ]
• Firms collaborate to address 65nm FPGA design verification (2007-09-24) [ Design Test ]

• Magma, UMC deliver verification, DFM tools for 65nm (2007-09-24) [ Process/Manufacturing ]
• Sharp, Pioneer ink business, capital alliance (2007-09-24) [ Process/Manufacturing ]
• Report: The need to redirect China's GPS market (2007-09-24) [ RF/Wireless ]
• Nokia gears up new handset with UMA tech (2007-09-24) [ RF/Wireless ]
• Hisense ramps China's first LCD TV facility (2007-09-24) [ Process/Manufacturing ]

• Samsung: Fab unscathed despite unstable power (2007-09-24) [ Process/Manufacturing ]
• Plans to open up 900MHz in U.K. revealed (2007-09-24) [ RF/Wireless ]
• Atmel equips MCUs with Quantum capacitive touch tech (2007-09-24) [ Sensor Technology ]
• Tower bags 2008 wafer order from U.S. IDM (2007-09-24) [ Process/Manufacturing ]
• Intel to push for a hyper-connected world (2007-09-24) [ Networking Design ]

• COM Express group adds new members (2007-09-24) [ EDA/IC Design ]
• Resistor network offers low TCR at tight tolerance (2007-09-21) [ Power Design ]
• Tiny Class D audio subsystem touts high output power (2007-09-21) [ Amplifying/Conditioning/Converting ]
• Freescale updates ColdFire portfolio with 10 MCUs (2007-09-21) [ Embedded Systems ]
• 200Mbps integrated powerline chipset unveiled (2007-09-21) [ Networking Design ]

• High-side power switches roll for consumer devices (2007-09-21) [ Power Design ]
• Anritsu intros 'first' handheld Mobile WiMAX test solution (2007-09-21) [ Design Test ]
• TFT modules are sunlight-readable (2007-09-21) [ Optical Electronics and Display ]
• 10GbE transceivers handle several protocols (2007-09-21) [ RF/Wireless ]
• Precision op amps feature low noise (2007-09-21) [ Power Design ]

• Zilog breaks into 32bit market with Zatara SoC (2007-09-21) [ Buffer/Storage ]
• NI upgrades Vision Development Module for machine designers (2007-09-21) [ EDA/IC Design ]
• WLAN chip drives Wi-Fi in high-volume segments (2007-09-21) [ RF/Wireless ]
• Secure MCUs enable EMV migration to SDA (2007-09-21) [ Security Design ]
• HP boosts Taiwan operations, doubles manpower (2007-09-21) [ Process/Manufacturing ]

• Spansion starts production of NOR flash at Japan fab (2007-09-21) [ Process/Manufacturing ]
• Israel grants first community-wide WiMAX license (2007-09-21) [ RF/Wireless ]
• Silicon Labs MCUs support open standard for wireless apps (2007-09-21) [ RF/Wireless ]
• Microsoft, Cadence enter cross-license patent agreement (2007-09-21) [ Embedded Systems ]
• UMC taps Synopsys memory IP design tool (2007-09-21) [ EDA/IC Design ]

• Analyst: Automotive ASIC market on 8.2% growth rate (2007-09-21) [ Amplifying/Conditioning/Converting ]
• Moore musings: The man behind the law speaks (2007-09-21) [ Process/Manufacturing ]
• Intel's bag of chips reveals liking for iPhone-like gizmos (2007-09-21) [ Control Design ]
• T-Mobile brings iPhone to Germany (2007-09-21) [ RF/Wireless ]
• Firms join forces to advance DFM (2007-09-21) [ EDA/IC Design ]

• Patent portfolio stirs up Google phone talks anew (2007-09-21) [ RF/Wireless ]