• Work underway for next-gen terrestrial DTV spec (2007-09-10) [ RF/Wireless ]
• LVDS crosspoint switch delivers 3.125Gbps (2007-09-10) [ Networking Design ]
• Front-end ICs protect systems during charging (2007-09-10) [ EMI/EMC Design ]
• H-bridge driver IC has regulator, watchdog, LIN transceiver (2007-09-10) [ Control Design ]
• Optical filter features wideband phase retardation film (2007-09-10) [ Optical Electronics and Display ]

• ADI releases VISUALDSP++ 5.0 IDE (2007-09-10) [ EDA/IC Design ]
• Agilent enhances DMM line for installation, maintenance apps (2007-09-10) [ Design Test ]
• ADC targets comms equipment, instrumentation apps (2007-09-10) [ Amplifying/Conditioning/Converting ]
• DVB-H composer software generates test transport streams (2007-09-10) [ Design Test ]
• High-security lock switch has spring return for safe operation (2007-09-10) [ Security Design ]

• ATX motherboard supports two quad processors (2007-09-10) [ Embedded Systems ]
• CSR fields new Bluetooth chips for handsets, headsets (2007-09-10) [ RF/Wireless ]
• Noise canceller improves cellphone signal sensitivity (2007-09-10) [ EMI/EMC Design ]
• Angry reaction to iPhone price cut prompts apology from Apple's Jobs (2007-09-10) [ RF/Wireless ]
• Lenovo reclaims No. 3 spot from Acer, but for how long? (2007-09-10) [ Process/Manufacturing ]

• ASE, Mitsui collaborate on HMT packaging tech (2007-09-10) [ Process/Manufacturing ]
• MeshNetics adds Zigbee to Atmel AVR Z-link chipsets (2007-09-10) [ RF/Wireless ]
• Simplay opens HDMI test lab in Germany (2007-09-10) [ Test/Packaging ]
• SK Supreme Court invalidates two FormFactor patent claims (2007-09-10) [ Process/Manufacturing ]
• Spreadtrum, ZTE partner to promote TD-SCDMA (2007-09-10) [ RF/Wireless ]

• In-Stat: CMOS tops CCD in image sensors market (2007-09-10) [ Sensor Technology ]
• Fracture-induced process simplifies nanoimprint litho (2007-09-10) [ Process/Manufacturing ]
• U.S. patent examiners against patent reform proposal (2007-09-10) [ EDA/IC Design ]
• TI only has eyes for smaller analog players (2007-09-10) [ Amplifying/Conditioning/Converting ]
• HD DVD vs. Blu-ray: A high-definition confusion (2007-09-10) [ Optical Electronics and Display ]

• Sensors monitor temperature of computer DIMMs (2007-09-07) [ Sensor Technology ]
• Radar test devices add pulse modulator capability (2007-09-07) [ Design Test ]
• SD video filters require 3.3V single supply (2007-09-07) [ Digital Signal Processing ]
• Microsoft tips Silverlight 1.0, extends support to Linux (2007-09-07) [ Embedded Systems ]
• Solid state relay delivers 0.25Ω on-resistance (2007-09-07) [ Networking Design ]

• Pirelli adds full L-band coverage to tunable solutions (2007-09-07) [ Optical Electronics and Display ]
• Current monitor offers improved temperature drift (2007-09-07) [ Power Design ]
• Multimode RF transceiver IC supports TD-SCDMA (2007-09-07) [ RF/Wireless ]
• Quad-core duel: Caneland vs. Barcelona (2007-09-07) [ Embedded Systems ]
• Video dock makes iPod movies look good on big HD screens (2007-09-07) [ Digital Signal Processing ]

• DAB/DAB+/DMB chip rolls for mobile DTV reception (2007-09-07) [ RF/Wireless ]
• Tool simulates mechanical multibody kinematics (2007-09-07) [ Embedded Systems ]
• Intel to respond to second FTC query on ST merger (2007-09-07) [ Process/Manufacturing ]
• New Apple iPod shines with touchscreen, Wi-Fi (2007-09-07) [ Optical Electronics and Display ]
• NXP, Nokia aid Austrian telelcom in NFC launch (2007-09-07) [ Security Design ]

• HP extends China recycling service to individual users (2007-09-07) [ Process/Manufacturing ]
• Nanyang, Rice U nanotech initiative eyes probabilistic CMOS (2007-09-07) [ EDA/IC Design ]
• Intel World Ahead takes root in India (2007-09-07) [ Embedded Systems ]
• Anadigics buys Fairchild RF biz assets (2007-09-07) [ RF/Wireless ]
• Survey: U.S. consumers go for 'green' products (2007-09-07) [ Process/Manufacturing ]

• Analyst: Yahoo buyout may cost Microsoft $53B (2007-09-07) [ Embedded Systems ]
• MPC pays $90M for Gateway business unit (2007-09-07) [ Process/Manufacturing ]
• LSI beefs up networking portfolio with acquisition (2007-09-07) [ Networking Design ]
• Dell takes neutral stance on AMD, Intel war (2007-09-07) [ Embedded Systems ]
• Daring the students to imagine (2007-09-07) [ EDA/IC Design ]

• CCID: Flat TV, PMP segments drive China CE market in 1H07 (2007-09-06) [ Optical Electronics and Display ]
• Rambus, Cadence partner on verified PCIe solutions (2007-09-06) [ EDA/IC Design ]
• Atheros, TI technologies deliver video via Wi-Fi (2007-09-06) [ RF/Wireless ]
• Broadcom SoC powers Samsung dual-format player (2007-09-06) [ Embedded Systems ]
• Court grants green light to Qualcomm antitrust case (2007-09-06) [ Process/Manufacturing ]

• Faraday counts PixArt among USB IP customers (2007-09-06) [ Interface Design ]
• Toshiba, SanDisk open 300mm Yokkaichi fab (2007-09-06) [ Process/Manufacturing ]
• MEMC power outage disrupts polysilicon supply (2007-09-06) [ Process/Manufacturing ]
• Delayed IC policy cost India an Intel plant (2007-09-06) [ Process/Manufacturing ]
• AMD, Qimonda partner on 32nm CMOS simulation (2007-09-06) [ Process/Manufacturing ]

• Are SMIC and HHNEC in merger talks? (2007-09-06) [ Process/Manufacturing ]
• Taiwan, India semiconductor associations ink pact (2007-09-06) [ EDA/IC Design ]
• 100W multiple output power supplies suit medical apps (2007-09-06) [ Power Design ]
• Broadcom debuts 65nm GbE switch (2007-09-06) [ Networking Design ]
• Step-down regulator delivers 12A output at 0.6V (2007-09-06) [ Power Design ]

• NXP single-chip solution enables ultralow-cost handsets (2007-09-06) [ RF/Wireless ]
• Renesas updates MCU family with on-chip flash memory (2007-09-06) [ Control Design ]
• Winbond launches new mobile memory lines (2007-09-06) [ Buffer/Storage ]
• Small WLED drivers tout 92% efficiency (2007-09-06) [ Optical Electronics and Display ]
• Crosspoint switch has 10ps jitter at 3.125Gbps (2007-09-06) [ Interface Design ]

• Eighth-brick DC/DC converter delivers 24V output (2007-09-06) [ Amplifying/Conditioning/Converting ]
• Boards transition from SDH/SONET to packet switching (2007-09-06) [ Embedded Systems ]
• Cisco to ship draft 802.11n WLAN gear in October (2007-09-06) [ Networking Design ]
• Software eases PCB, package designs (2007-09-06) [ Test/Packaging ]
• iPhone clones outdo original? (2007-09-06) [ RF/Wireless ]

• Design Class D audio amps into portable applications (Part 1) (2007-09-05) [ Embedded Systems ]
• Altera takes SOPC World 2007 to six cities in Asia (2007-09-05) [ Programmable Logic ]
• Fujitsu wins SDRAM patent suit vs. Nanya Japan (2007-09-05) [ Buffer/Storage ]
• Mentor, China university set up joint lab for automotive design (2007-09-05) [ EDA/IC Design ]
• Applied drives down cost of solar module production (2007-09-05) [ Process/Manufacturing ]

• ABI: Japan unlikely to see U-SAM benefits in near future (2007-09-05) [ Sensor Technology ]
• Renesas restructures Taiwan, Singapore operations (2007-09-05) [ Process/Manufacturing ]
• Osram, Seoul Semi ink cross-licensing deal (2007-09-05) [ Optical Electronics and Display ]
• Report: Freescale puts two Scottish fabs on sale (2007-09-05) [ Process/Manufacturing ]
• Hynix scraps planned sale of 200mm fab (2007-09-05) [ Process/Manufacturing ]

• Austrian firm mulls taking FlexRay beyond cars (2007-09-05) [ Embedded Systems ]
• Cidana partners with Isreali firm on mobile DTV (2007-09-05) [ RF/Wireless ]
• Gartner lists top 10 fabs based on 1H07 sales (2007-09-05) [ Process/Manufacturing ]
• Channel stacking switches ease single-cable installations (2007-09-05) [ RF/Wireless ]
• LCD driver supports WQVGA resolution in handsets (2007-09-05) [ Optical Electronics and Display ]

• New LEGO MINDSTORMS NXT software supports Vista (2007-09-05) [ EDA/IC Design ]
• Video postprocessor IC removes blur in HDTVs (2007-09-05) [ Optical Electronics and Display ]
• Ten-dollar DaVinci delivers HD at 400mW (2007-09-05) [ Digital Signal Processing ]
• Communication analyzers enable TD-SCDMA testing (2007-09-05) [ Design Test ]
• NEC ups 32bit ARM processor core performance (2007-09-05) [ Embedded Systems ]

• DsPIC, PIC24 get open-source RTOS (2007-09-05) [ Digital Signal Processing ]
• Sensor-actuator connectors meet field bus specs (2007-09-05) [ Networking Design ]
• LXI trigger box touts precise synchronization over LAN (2007-09-05) [ Design Test ]
• WLAN baseband LSIs integrate 802.1x protocol (2007-09-05) [ RF/Wireless ]
• A/V decoder chip rolls for China's AVS standard (2007-09-05) [ Amplifying/Conditioning/Converting ]

• Control power and cost for multiple LEDs (2007-09-04) [ Optical Electronics and Display ]
• TSMC: Design issues call for industry partnership (2007-09-04) [ EDA/IC Design ]
• NXP single-chip solution soon to power Samsung handsets (2007-09-04) [ RF/Wireless ]
• Hong Kong 3G services auction to open at $9.75M (2007-09-04) [ RF/Wireless ]
• Green Grid adds LSI as new member (2007-09-04) [ Buffer/Storage ]

• AES to buy IBM-Infineon JV firm (2007-09-04) [ Process/Manufacturing ]
• Opteron beats Xeon in power efficiency: benchmark firm (2007-09-04) [ Embedded Systems ]
• Chartered teams with university on nanoscale CMOS R&D (2007-09-04) [ Process/Manufacturing ]
• Qualcomm joins IMEC's 45nm design program (2007-09-04) [ EDA/IC Design ]
• AMD unveils code-reducing tech for x86 (2007-09-04) [ Embedded Systems ]

• IBM tech hints at supercomputer the size of dust (2007-09-04) [ Buffer/Storage ]
• US FTC seeks additional info on Intel-ST JV (2007-09-04) [ Process/Manufacturing ]
• Indian chip market falls short of revenue forecast (2007-09-04) [ EDA/IC Design ]
• Is a DSP core firm next in MIPS' acquisition list? (2007-09-04) [ Digital Signal Processing ]
• Precision op amp eases portable designs (2007-09-04) [ Amplifying/Conditioning/Converting ]

• Oscilloscope-based DDR3 compliance software debuts (2007-09-04) [ Design Test ]
• 12bit ADC features 500KSps throughput (2007-09-04) [ Amplifying/Conditioning/Converting ]
• SMT analog reflective encoder has 180 LPI resolution (2007-09-04) [ Optical Electronics and Display ]
• Copper substrates target high-current, power module apps (2007-09-04) [ Power Design ]
• FPGA development card has MRAM, on-board programmer (2007-09-04) [ EDA/IC Design ]

• Sealed cable systems has power, high-density versions (2007-09-04) [ Networking Design ]
• MEMS-based ICs keep chips cool (2007-09-04) [ Sensor Technology ]
• Industrial MCU lowers Ethernet packet jitter (2007-09-04) [ Embedded Systems ]
• Solution supports DivX playback in DVD players (2007-09-04) [ Embedded Systems ]
• Speaker amp LSI suits portable apps (2007-09-04) [ Amplifying/Conditioning/Converting ]

• New ThreadX RTOS targets Microchip's dsPIC, PIC24 (2007-09-04) [ Embedded Systems ]
• Extend DSP design to heterogeneous hardware platforms (2007-09-03) [ EDA/IC Design ]
• Front monitor diode suits HD DVD, Blu-ray drives (2007-09-03) [ Optical Electronics and Display ]
• Hot Swap controller drives ATCA mezzanine cards (2007-09-03) [ Networking Design ]
• Front-end ICs fit Wi-Fi, Bluetooth systems (2007-09-03) [ RF/Wireless ]

• Tool speeds up IP phone development (2007-09-03) [ RF/Wireless ]
• Low-cost mux supports multiple card formats (2007-09-03) [ Networking Design ]
• Software verbally guides cable, wire harness assembly (2007-09-03) [ Design Test ]
• Capacitive touch chip manages power efficiently (2007-09-03) [ Sensor Technology ]
• LED driver has on-chip oscillator for brightness control (2007-09-03) [ Optical Electronics and Display ]

• Stereo codecs extend battery life in portable audio apps (2007-09-03) [ Amplifying/Conditioning/Converting ]
• Secure supervisor chip meets PCI-PED requirements (2007-09-03) [ Security Design ]
• New COG mounting tech rolls for next-gen LCD (2007-09-03) [ Process/Manufacturing ]
• 500MHz processor draws 1W peak power (2007-09-03) [ Embedded Systems ]
• Bring Zigbee designs to high volume (2007-09-03) [ RF/Wireless ]

• DSP silicon takes many forms (2007-09-03) [ Digital Signal Processing ]
• Supply chain shifts affect components strategy (2007-09-03) [ Process/Manufacturing ]
• Infineon keeps faith in tech development (2007-09-03) [ Process/Manufacturing ]
• ULP Bluetooth spawns lower-power apps (2007-09-03) [ RF/Wireless ]
• DSP cores target 3G, VoIP (2007-09-03) [ Digital Signal Processing ]

• Accelerometer slims down for consumer sensors (2007-09-03) [ Sensor Technology ]
• Clock generators tout low jitter, low power (2007-09-03) [ Amplifying/Conditioning/Converting ]
• ADCs reveal femtocharge secret (2007-09-03) [ Amplifying/Conditioning/Converting ]
• Low-cost FPGAs offer high-speed Serdes (2007-09-03) [ Programmable Logic ]
• Limiting post amplifier introduced for fiber-optic receivers (2007-09-03) [ Amplifying/Conditioning/Converting ]

• DSCs combine best of MCUs, DSPs (2007-09-03) [ Digital Signal Processing ]
• GPON systems enable triple-play services (2007-09-03) [ Interface Design ]
• Welcoming STB into the digital home (2007-09-03) [ Amplifying/Conditioning/Converting ]
• FPGAs: On a mission to help the color-blind (2007-09-03) [ Optical Electronics and Display ]
• Tips for successful structured ASIC designs (2007-09-03) [ EDA/IC Design ]

• To bridge or not to bridge: When, why to go PCIe-native (2007-09-03) [ Interface Design ]
• Tune in to key mobile TV trends, success factors (2007-09-03) [ RF/Wireless ]
• Implement DTV receivers with cost-effective demodulator (2007-09-03) [ RF/Wireless ]
• The worldwide woe of delivering DTV content (2007-09-03) [ Amplifying/Conditioning/Converting ]
• IC firms tread unfamiliar platform terrain (2007-09-03) [ EDA/IC Design ]

• Electronics zero in on cancer cells (2007-09-03) [ Control Design ]
• Perpendicular recording gets new lease on life (2007-09-03) [ Buffer/Storage ]
• Microsoft sees shift to parallel in 10yrs (2007-09-03) [ EDA/IC Design ]