• High-intensity LEDs come in CLCC6 ceramic package (2007-08-31) [ Optical Electronics and Display ]
• FPGAView software eases design debugging (2007-08-31) [ Programmable Logic ]
• First Stratix III FPGA chip ships ahead of schedule (2007-08-31) [ Programmable Logic ]
• Step-down converters simplify system designs (2007-08-31) [ Amplifying/Conditioning/Converting ]
• Thermal management chips suit smaller packages (2007-08-31) [ Sensor Technology ]

• PoE controller delivers precise regulation, high efficiency (2007-08-31) [ Power Design ]
• Mobile browser boosts Qtopia platform (2007-08-31) [ Embedded Systems ]
• RISC MCU rolls with on-chip dot matrix LCD driver (2007-08-31) [ Optical Electronics and Display ]
• 2.4GHz transceiver makes for ultracompact USB dongle (2007-08-31) [ RF/Wireless ]
• UWB antenna eases circuit layout, set-up (2007-08-31) [ RF/Wireless ]

• 10Gbps transmitters cover up to 300km (2007-08-31) [ RF/Wireless ]
• Agilent develops 3D electromagnetic simulator (2007-08-31) [ EDA/IC Design ]
• Sumitomo leads silica mining JV in Australia (2007-08-31) [ Process/Manufacturing ]
• Synopsys, SMIC develop low-power sol'n for China mobile TV market (2007-08-31) [ EDA/IC Design ]
• Qualcomm, Malaysian partners test MediaFLO in Kuala Lumpur (2007-08-31) [ RF/Wireless ]

• Dongbu to start SRAM production for EMLSI (2007-08-31) [ Process/Manufacturing ]
• Apple, Volkswagen to co-develop 'iCar', says report (2007-08-31) [ Control Design ]
• Foxconn opens two factories in Vietnam (2007-08-31) [ Process/Manufacturing ]
• Defective mic hampers Nokia E90 rollout (2007-08-31) [ RF/Wireless ]
• Are Chinese telecoms switching to ADSL2+? (2007-08-31) [ RF/Wireless ]

• QuickLogic exits mainstream FPGA market (2007-08-31) [ Process/Manufacturing ]
• DVRs pose threat to advertising, DVDs (2007-08-31) [ Buffer/Storage ]
• More clues point to Google phone (2007-08-31) [ RF/Wireless ]
• Report: Motorola to let go of Germany plant (2007-08-31) [ Process/Manufacturing ]
• Connectors boost medical systems (2007-08-30) [ RF/Wireless ]

• A/V receiver nails cost, performance tradeoff (2007-08-30) [ RF/Wireless ]
• Inductorless DC/DC converter loads up to 50mA (2007-08-30) [ Amplifying/Conditioning/Converting ]
• Diode-OR controller has lower loss than Schottky diodes (2007-08-30) [ Power Design ]
• Serial flash memory with dual I/O clocks at 75MHz (2007-08-30) [ Buffer/Storage ]
• Chip delivers Full HD resolution for flat-panel TVs (2007-08-30) [ Amplifying/Conditioning/Converting ]

• 12.7mm panel pot has up to 1M life cycles (2007-08-30) [ Control Design ]
• Vishay intros AEC Q101-qualified photodiodes (2007-08-30) [ Sensor Technology ]
• Display system solution halves design cycle time (2007-08-30) [ Optical Electronics and Display ]
• 3G base station design for femtocells cuts BOM costs (2007-08-30) [ RF/Wireless ]
• IR linear InGaAs arrays integrate charge amplifying mux (2007-08-30) [ Optical Electronics and Display ]

• Rugged open air resistor handles high power dissipation (2007-08-30) [ Power Design ]
• Blade fuse holder accepts standard, mini sizes (2007-08-30) [ EMI/EMC Design ]
• NEC touts first MCU to pass FlexRay conformance test (2007-08-30) [ Embedded Systems ]
• China firm licenses MIPS processor core for DTV designs (2007-08-30) [ Embedded Systems ]
• Digi-Key, Catalyst ink global distribution deal (2007-08-30) [ Buffer/Storage ]

• NXP equips BenQ handsets with NFC features (2007-08-30) [ Security Design ]
• Fujitsu spins off shared tech, design divisions (2007-08-30) [ EDA/IC Design ]
• Green concerns climb corporate IT agenda in Asia (2007-08-30) [ Process/Manufacturing ]
• Motorola sues Aruba for patent infringement (2007-08-30) [ RF/Wireless ]
• Sony bio battery generates power from sugar (2007-08-30) [ Power Design ]

• Acer-Gateway merger puts Lenovo under pressure (2007-08-30) [ Process/Manufacturing ]
• Process makes leaded devices Pb-free (2007-08-30) [ Process/Manufacturing ]
• CMOS image sensor market heads downhill (2007-08-30) [ Sensor Technology ]
• Symbian opens China R&D center (2007-08-30) [ RF/Wireless ]
• iSuppli sees DRAM market relapse (2007-08-30) [ Buffer/Storage ]

• SoC supports 80-segment LCD displays (2007-08-29) [ Optical Electronics and Display ]
• IRC rolls out precision voltage divider (2007-08-29) [ Power Design ]
• IGBT offers ultralow conduction loss in low-frequency apps (2007-08-29) [ Power Design ]
• Intel VPro beefs up security for desktops (2007-08-29) [ Security Design ]
• Fujitsu unrolls transmitter modules for W-CDMA cellphones (2007-08-29) [ RF/Wireless ]

• ADI touts 'first' HDMI transmitter with on-chip CEC support (2007-08-29) [ Interface Design ]
• Supervisory circuits ease power-supply monitoring (2007-08-29) [ Power Design ]
• Verification kit supports advanced techniques (2007-08-29) [ EDA/IC Design ]
• SMD chip resistors offer high anti-surge function (2007-08-29) [ EMI/EMC Design ]
• PC/104-Plus boards have two StarFabric interfaces (2007-08-29) [ EDA/IC Design ]

• Optical switch links up to 16 ports in ATE systems (2007-08-29) [ Design Test ]
• C-to-FPGA compiler adds six Xilinx Virtex-5 platforms (2007-08-29) [ Programmable Logic ]
• Toyota, Sony partner on robotics for intelligent car (2007-08-29) [ Embedded Systems ]
• Huawei deploys APAC's first HSUPA net in Singapore (2007-08-29) [ Networking Design ]
• Taiwan's Acer acquires Gateway (2007-08-29) [ Embedded Systems ]

• Matsushita to cover costs of Nokia battery recalls (2007-08-29) [ Power Design ]
• Mixed market conditions noted for microcomponents (2007-08-29) [ Digital Signal Processing ]
• Software, IP solutions dominate ESC-Taiwan, EDA&T-Taiwan (2007-08-29) [ EDA/IC Design ]
• EC charges Rambus of antitrust violations (2007-08-29) [ Buffer/Storage ]
• Nortel partners with universities for 4G research (2007-08-29) [ RF/Wireless ]

• Japan fabless firm ups flash programming speed (2007-08-29) [ Buffer/Storage ]
• Samsung to bring WiBro to New York (2007-08-29) [ RF/Wireless ]
• MIPS boosts analog IP line with Chipidea acquisition (2007-08-29) [ EDA/IC Design ]
• Report: ST in partnership talks with China firms (2007-08-29) [ Process/Manufacturing ]
• Solar, Q-Cells ink supply deal for India PV plant (2007-08-29) [ Process/Manufacturing ]

• System, IC teardowns critical to 'business intelligence' (2007-08-29) [ EDA/IC Design ]
• Smart security improves battery life (2007-08-28) [ Security Design ]
• India is Nokia's second largest market in Q2 (2007-08-28) [ Process/Manufacturing ]
• Nokia Siemens beefs up China R&D center (2007-08-28) [ RF/Wireless ]
• Cree to triple white LED capacity in China (2007-08-28) [ Process/Manufacturing ]

• Microsoft issues recall of overheating Xbox racing wheel (2007-08-28) [ Embedded Systems ]
• Japan's NSCore licenses NV SRAM tech to Rohm (2007-08-28) [ Process/Manufacturing ]
• Applied Materials completes acquisition of HCT (2007-08-28) [ Process/Manufacturing ]
• Maxim acquires Vitesse's storage products biz (2007-08-28) [ Buffer/Storage ]
• Mix of sensors seen in future driver assistance systems (2007-08-28) [ Sensor Technology ]

• Engineers in medical sector told to learn from nature (2007-08-28) [ EDA/IC Design ]
• Motorola defends 2nd spot in Gartner's list (2007-08-28) [ RF/Wireless ]
• DTV chips ease transition from analog to digital TV (2007-08-28) [ RF/Wireless ]
• HB LED driver powers common-anode LEDs (2007-08-28) [ Optical Electronics and Display ]
• HTPS panel touts improved aperture ratio (2007-08-28) [ Optical Electronics and Display ]

• Transcoder converts MPEG-2 video to full HD H.264 (2007-08-28) [ Amplifying/Conditioning/Converting ]
• Hall-effect sensor promises 360° infinite rotation (2007-08-28) [ Sensor Technology ]
• LiMnO<SUB>2</SUB> hybrid battery cells have longer life, higher capacity (2007-08-28) [ Power Design ]
• Nordic launches wireless desktop protocol stack (2007-08-28) [ Networking Design ]
• UHF RF transceiver draws less than 3mA in RX mode (2007-08-28) [ RF/Wireless ]

• Toshiba tips 320Gbyte laptop disk drive (2007-08-28) [ Buffer/Storage ]
• Tuner delivers high-definition DVB-S2 broadcast (2007-08-27) [ RF/Wireless ]
• Low-ESR devices roll for portable electronics (2007-08-27) [ EMI/EMC Design ]
• Interface solutions suit vibration applications (2007-08-27) [ Networking Design ]
• Low-noise regulator touts high PSRR, efficiency (2007-08-27) [ Power Design ]

• Image sensor integrates MIPI receiver (2007-08-27) [ Sensor Technology ]
• TI switches suit DVI, HDMI applications (2007-08-27) [ Interface Design ]
• Toshiba debuts 32Gbyte SDHC card (2007-08-27) [ Buffer/Storage ]
• Mobile hydraulic sensor touts CAN bus interface (2007-08-27) [ Sensor Technology ]
• PSoC Express design tool adds real-time debugging, tuning (2007-08-27) [ EDA/IC Design ]

• VeriSilicon offers DTS, SRS Labs audio for its DSPs (2007-08-27) [ Digital Signal Processing ]
• DRM functions secure programmable connectivity platforms (2007-08-27) [ Security Design ]
• Configurable processor drives video surveillance systems (2007-08-27) [ Security Design ]
• ODMs, EMS providers ride on LCD TV market boom (2007-08-27) [ Process/Manufacturing ]
• China pure-audio MP3 sales drop to half in 1H07 (2007-08-27) [ Buffer/Storage ]

• China cellphone users exceed 500 million (2007-08-27) [ RF/Wireless ]
• IBM, Omron expand IT services contract in Europe (2007-08-27) [ Networking Design ]
• Siemens PG builds cogeneration power plant in Singapore (2007-08-27) [ Power Design ]
• Google likely to bid for 700MHz (2007-08-27) [ RF/Wireless ]
• Continental merges four Japan R&D facilities (2007-08-27) [ Process/Manufacturing ]

• Dull cellphone designs bog down Motorola (2007-08-27) [ RF/Wireless ]
• Sharp LCD TV out to transform living spaces (2007-08-27) [ Optical Electronics and Display ]
• Digi-Key inks distribution deal with capacitor maker (2007-08-27) [ Power Design ]
• Fine tuning process clears way for denser MRAM (2007-08-27) [ Process/Manufacturing ]
• Commentary: Infineon after LSI customers, not technology (2007-08-27) [ RF/Wireless ]

• Analog video signal requirements: Similarities and differences (Part 5) (2007-08-24) [ EMI/EMC Design ]
• Free design tool implements DDR2-400 interface (2007-08-24) [ Buffer/Storage ]
• Bipolar transistors drive MOSFET gates faster (2007-08-24) [ Power Design ]
• 3D comb filter targets analog, digital TVs (2007-08-24) [ Digital Signal Processing ]
• Agilent launches new optical polarization solutions (2007-08-24) [ Design Test ]

• White LEDs emit 7cd at medium-range current (2007-08-24) [ Optical Electronics and Display ]
• Mainboard cuts idle power of Vista PCs to 24W (2007-08-24) [ Control Design ]
• Mentor's Nucleus, Edge target IBM Cell/B.E. processor (2007-08-24) [ Embedded Systems ]
• RF power amp handles military communications band (2007-08-24) [ Amplifying/Conditioning/Converting ]
• 4U blade server has eight processing modules (2007-08-24) [ Control Design ]

• Seed laser is small but powerful (2007-08-24) [ Optical Electronics and Display ]
• Niobium oxide capacitors outclass aluminum electrolytics (2007-08-24) [ Amplifying/Conditioning/Converting ]
• Connectors offer flexibility for backplane designs (2007-08-24) [ Networking Design ]
• Paramount, DreamWorks drop Blu-ray support (2007-08-24) [ Optical Electronics and Display ]
• South Korea to build robot industrial city (2007-08-24) [ Process/Manufacturing ]

• TriQuint to acquire fabless RF firm (2007-08-24) [ RF/Wireless ]
• Dow Corning shifts to solar power at German facility (2007-08-24) [ Power Design ]
• Matsushita forms task force for battery recalls (2007-08-24) [ EMI/EMC Design ]
• SunPower, NorSun ink ingot, polysilicon deals (2007-08-24) [ Power Design ]
• Qimonda, SMIC expand DRAM foundry deal (2007-08-24) [ Process/Manufacturing ]

• Intel, UCSB demo 'first' mode-locked silicon laser (2007-08-24) [ Optical Electronics and Display ]
• Infineon preps power semi JV with Siemens (2007-08-24) [ Power Design ]
• Brocade, Cisco agree on Fibre Channel over Ethernet format (2007-08-24) [ RF/Wireless ]
• Litho blocks NAND scaling, says Micron exec (2007-08-24) [ Process/Manufacturing ]
• Gemalto, NXP team on SIM-based NFC solutions (2007-08-24) [ RF/Wireless ]

• Industry heavyweights address EEs in Taiwan (2007-08-23) [ EDA/IC Design ]
• AMD rolls dual-core chip for consumer channel (2007-08-23) [ Control Design ]
• Adhesive solution cures fast sans external heat (2007-08-23) [ Process/Manufacturing ]
• NXP claims 'first' USB digital audio headset solution (2007-08-23) [ RF/Wireless ]
• LDO extends operating time of low-power applications (2007-08-23) [ Power Design ]

• Clock modulators reduce EMI in large-format LCD panels (2007-08-23) [ EMI/EMC Design ]
• Software tests wireless devices for hearing-aid compatibility (2007-08-23) [ Design Test ]
• Step-down converter keeps quiescent current under 75&#181;A (2007-08-23) [ Amplifying/Conditioning/Converting ]
• RF vector generator software supports TD-SCDMA (2007-08-23) [ Design Test ]
• Graphic cards feature unique cooling method (2007-08-23) [ EMI/EMC Design ]

• Decoder outputs HD, SD video simultaneously (2007-08-23) [ Amplifying/Conditioning/Converting ]
• ADCs target WiMAX, 3G wireless applications (2007-08-23) [ RF/Wireless ]
• ADCs combine low power draw, high performance (2007-08-23) [ Amplifying/Conditioning/Converting ]
• Tilera starts shipping 64-way multiprocessor (2007-08-23) [ Control Design ]
• Inside Kawasaki's Moto-GP racing bike (2007-08-23) [ Embedded Systems ]

• Singapore launches clean energy testing program (2007-08-23) [ Process/Manufacturing ]
• ROOTS, Motorola expand APAC distribution deal (2007-08-23) [ RF/Wireless ]
• TSMC begins 0.13&#181; embedded flash production (2007-08-23) [ Process/Manufacturing ]
• Foxconn opens first software base in China (2007-08-23) [ Process/Manufacturing ]
• Tundra Serial RapidIO switch wins Huawei design-in (2007-08-23) [ Networking Design ]

• Intel moves embedded NOR products to 65nm (2007-08-23) [ Process/Manufacturing ]
• 4G smart phones ship for Korea's WiBro (2007-08-23) [ RF/Wireless ]
• Bosch maps out future trends in automotives (2007-08-23) [ Control Design ]
• More vendors dip in ultralow-cost handset market (2007-08-23) [ Process/Manufacturing ]
• Firm supplies InGaN substrates for LED production (2007-08-23) [ Process/Manufacturing ]

• Synopsys left out in SystemVerilog OVM initiative (2007-08-23) [ EDA/IC Design ]
• Report: UWB to overtake Wi-Fi in market volume (2007-08-23) [ RF/Wireless ]
• Smart selection of compilation options in DSP applications (2007-08-22) [ Digital Signal Processing ]
• Video switch IC rolls for car entertainment systems (2007-08-22) [ Digital Signal Processing ]
• Pressure transmitters operate in humid setups (2007-08-22) [ Sensor Technology ]

• Instrumentation amp claims 'unmatched' DC precision, AC bandwidth (2007-08-22) [ Amplifying/Conditioning/Converting ]
• Transceivers offer extended temperature range, high ESD protection (2007-08-22) [ RF/Wireless ]
• Faraday to unveil H.264, WiMedia solutions at ESC-Taiwan (2007-08-22) [ Digital Signal Processing ]
• Drivers roll for electronic paper displays (2007-08-22) [ Optical Electronics and Display ]
• CSS chips eye European, Asian DBS markets (2007-08-22) [ RF/Wireless ]

• Logarithmic amplifiers need no external attenuators (2007-08-22) [ Amplifying/Conditioning/Converting ]
• Car sensor operates in day and night vision modes (2007-08-22) [ Sensor Technology ]
• Modular jacks shrink for Fast Ethernet, GbE apps (2007-08-22) [ Networking Design ]
• Rotary DIP switch suits medical, security equipment (2007-08-22) [ Networking Design ]
• Passive rejustor automates temperature compensation (2007-08-22) [ EMI/EMC Design ]

• 3G propels China's communication power supply market (2007-08-22) [ RF/Wireless ]
• Nokia takes Qualcomm patent dispute to ITC (2007-08-22) [ RF/Wireless ]
• CMD, MagnaChip sign foundry, process tech deal (2007-08-22) [ Process/Manufacturing ]
• Cadence, Mentor team on SystemVerilog methodology (2007-08-22) [ EDA/IC Design ]
• TDK, IBM form R&D partnership on MRAM (2007-08-22) [ Buffer/Storage ]

• LSI sells mobility products biz to Infineon (2007-08-22) [ Process/Manufacturing ]
• Plant usage inches up but excess inventory persists (2007-08-22) [ Process/Manufacturing ]
• Toshiba exec: Micro fuel cells unready for market (2007-08-22) [ Power Design ]
• LED to outshine CCFL in backlight applications (2007-08-22) [ Optical Electronics and Display ]
• Fujitsu, partner aim for terabit disk density (2007-08-22) [ Buffer/Storage ]

• Boeing satellite delivers broadband Internet (2007-08-22) [ RF/Wireless ]
• Apple designs impact global chip supply chain (2007-08-22) [ Embedded Systems ]
• Using op amps as comparators (2007-08-21) [ Amplifying/Conditioning/Converting ]
• Carbon nanotube elastic property enhances LCD TV quality (2007-08-21) [ Optical Electronics and Display ]
• Sony sets up US electronics recycling program (2007-08-21) [ Process/Manufacturing ]

• Japanese networking firm mulls WiMAX partnership (2007-08-21) [ RF/Wireless ]
• IBM, Sun Micro expand partnership in Solaris OS (2007-08-21) [ Embedded Systems ]
• Cadence acquires DFM firm Clear Shape (2007-08-21) [ EDA/IC Design ]
• China says no to Microsoft's latest doc standard (2007-08-21) [ Embedded Systems ]
• Purdue U: Ionic winds can cool that chip (2007-08-21) [ Power Design ]

• A $60M funding for TSMC's packaging tech (2007-08-21) [ Process/Manufacturing ]
• PWM controller targets notebook PC systems (2007-08-21) [ Power Design ]
• PowerMOSFET touts ultralow on-state resistance (2007-08-21) [ Power Design ]
• Capacitance-type sensor detects absolute pressure (2007-08-21) [ Sensor Technology ]
• Four-channel LIN transceiver lowers system costs (2007-08-21) [ Embedded Systems ]

• COTS feed-thru EMI filter meets QPL requirements (2007-08-21) [ EMI/EMC Design ]
• Digipot can store EEPROM info for 150 years (2007-08-21) [ Buffer/Storage ]
• MOSFETs feature up to 8kV ESD voltage protection (2007-08-21) [ EMI/EMC Design ]
• SRAMs offer temperature range options (2007-08-21) [ Buffer/Storage ]