• FMS6363 evaluation board application note (2007-07-20) [ EDA/IC Design ]
• Intel-ST flash joint venture christened 'Numonyx' (2007-07-20) [ Buffer/Storage ]
• WTO says Japan's tariff on Hynix chips illegal (2007-07-20) [ Buffer/Storage ]
• China starts producing 'self-designed' TFT LCDs (2007-07-20) [ Process/Manufacturing ]
• CSR adds wireless connectivity to Freescale's i.MX31 kit (2007-07-20) [ RF/Wireless ]

• Printed, organic lighting market to hit $2.9B by 2012 (2007-07-20) [ Process/Manufacturing ]
• Apple flash demand triggers shortage fears (2007-07-20) [ Process/Manufacturing ]
• SDK to expand GaN-based blue LED chip production (2007-07-20) [ Process/Manufacturing ]
• Ericsson bags $2B expansion deal with Indian telco (2007-07-20) [ RF/Wireless ]
• EC grants green light to DVB-H mobile TV spec (2007-07-20) [ RF/Wireless ]

• Intel, AMD pitch divergent formulas for industry progress (2007-07-20) [ Process/Manufacturing ]
• Technical problems bug Internet TV design (2007-07-20) [ Amplifying/Conditioning/Converting ]
• Eight new members sign up with Power.org (2007-07-20) [ Power Design ]
• IEEE 802.20 working group revises voting procedure (2007-07-20) [ RF/Wireless ]
• Adlink launches touchscreen embedded panel PC (2007-07-20) [ Interface Design ]

• 'Fastest' PCIe digital I/O boards roll from Strategic Test (2007-07-20) [ Design Test ]
• LIN SBCs integrate voltage regulator, watchdog (2007-07-20) [ Embedded Systems ]
• Picture quality analyzer uses Human Vision Model (2007-07-20) [ Design Test ]
• Epoxy cures at room temperature, withstands 235°C (2007-07-20) [ Process/Manufacturing ]
• 20W adapter plugs into any power outlet worldwide (2007-07-20) [ Amplifying/Conditioning/Converting ]

• 8bit, 2GSps ADC is optimized for second Nyquist zone (2007-07-20) [ Amplifying/Conditioning/Converting ]
• Supervisory ICs need no external components (2007-07-20) [ Power Design ]
• Switching regulator eliminates heat sink, boost diode (2007-07-20) [ EMI/EMC Design ]
• Free software eases short-range radio design (2007-07-20) [ RF/Wireless ]
• SST ships samples of all-in-one memory chip (2007-07-20) [ Buffer/Storage ]

• RGB LED driver suits fun lighting in portable apps (2007-07-20) [ Optical Electronics and Display ]
• The quest for digital broadcast quality: Addressing quality hotspots (2007-07-19) [ Digital Signal Processing ]
• Analog video signal requirements: Similarities and differences (Part 1) (2007-07-19) [ Amplifying/Conditioning/Converting ]
• Cellphone conquers elements (2007-07-19) [ RF/Wireless ]
• Chips rev up GPON systems (2007-07-19) [ Digital Signal Processing ]

• IMI debuts Zigbee Gateway platform (2007-07-19) [ Networking Design ]
• Epson intros vision system for industrial robots (2007-07-19) [ Process/Manufacturing ]
• WiMAX test system revs up production throughput (2007-07-19) [ Process/Manufacturing ]
• Laser diode driver supports combo DVD formats (2007-07-19) [ Optical Electronics and Display ]
• Silicon tuner device is extra small (2007-07-19) [ RF/Wireless ]

• Ultrasmall detection switch targets handheld devices (2007-07-19) [ Networking Design ]
• Osram preps red chip with 300 lumens of brightness (2007-07-19) [ Optical Electronics and Display ]
• Handheld XRF analyzer touts improved detection limits (2007-07-19) [ Test/Packaging ]
• Othello chip suits 3G TD-SCDMA wireless handsets (2007-07-19) [ RF/Wireless ]
• Intel launches Solaris telecom servers (2007-07-19) [ Embedded Systems ]

• Carl Icahn denies Samsung buyout plan (2007-07-19) [ Process/Manufacturing ]
• U.S. antitrust body okays Flextronics' rival buyout (2007-07-19) [ Process/Manufacturing ]
• ADI, TSMC bring 65nm tech into baseband processors (2007-07-19) [ RF/Wireless ]
• Amkor, IMEC sign 3D wafer-level packaging pact (2007-07-19) [ Process/Manufacturing ]
• Startup brews 'perfect storm' for R&D (2007-07-19) [ EDA/IC Design ]

• Sematech doubles 450mm efforts (2007-07-19) [ Process/Manufacturing ]
• GES Vietnam scores tech center permit (2007-07-19) [ Process/Manufacturing ]
• Digi-Key, ATS ink global distribution deal (2007-07-19) [ Process/Manufacturing ]
• RFMD expands Beijing plant capability (2007-07-19) [ Process/Manufacturing ]
• CDT bags grant to develop EDA for organic electronics (2007-07-19) [ EDA/IC Design ]

• Osram starts construction of Malaysia LED plant (2007-07-19) [ Process/Manufacturing ]
• Architecture and component selection for SDR applications (2007-07-18) [ RF/Wireless ]
• Intel fields first Extreme mobile processor, tips new desktop chip (2007-07-18) [ Control Design ]
• XP Power rolls 'smallest' AC/DC power supplies (2007-07-18) [ Power Design ]
• Power input module design fits ATCA applications (2007-07-18) [ Interface Design ]

• Pickering Interfaces fields two LXI matrix switching solutions (2007-07-18) [ EMI/EMC Design ]
• Stereo codec has dual PCM interfaces (2007-07-18) [ Amplifying/Conditioning/Converting ]
• Buck control IC supports single, two outputs (2007-07-18) [ Power Design ]
• EMF simulator offers power rail extraction (2007-07-18) [ Design Test ]
• Codec boosts audio fidelity in PCs, supports VoIP (2007-07-18) [ Amplifying/Conditioning/Converting ]

• Tiny DC/DC converter powers up to seven WLEDs (2007-07-18) [ Amplifying/Conditioning/Converting ]
• Quad SPST CMOS analog switch debuts (2007-07-18) [ Networking Design ]
• IBM, HKSTP team to promote IC foundry services in APAC (2007-07-18) [ Process/Manufacturing ]
• Altera touts support for new JEDEC standard (2007-07-18) [ Programmable Logic ]
• HP to recycle 2 billion pounds by 2010 (2007-07-18) [ Process/Manufacturing ]

• China MII releases 3G videophone standard (2007-07-18) [ RF/Wireless ]
• Tessera, Alps ink wafer level-optics license deal (2007-07-18) [ Process/Manufacturing ]
• Infineon first to licenses MIPS32 74K core (2007-07-18) [ EDA/IC Design ]
• Philips to cut stakes in NXP, LG.Philips (2007-07-18) [ Process/Manufacturing ]
• Samsung up one notch in top handset supplier list (2007-07-18) [ Process/Manufacturing ]

• Toshiba picks Cortex-M3 for car apps (2007-07-18) [ Embedded Systems ]
• Synopsys acquires Mosaid mem tech, IP (2007-07-18) [ EDA/IC Design ]
• Lab concocts more potent, brighter OLEDs (2007-07-18) [ Optical Electronics and Display ]
• Designing home appliances with FPGAs (2007-07-17) [ Programmable Logic ]
• SMK unveils multipoled connector for car audio systems (2007-07-17) [ Networking Design ]

• Wavecom tips 'first' automotive-grade 3G wireless CPU (2007-07-17) [ Networking Design ]
• EMMA-based turnkey solution eases STB development (2007-07-17) [ EDA/IC Design ]
• Small power solution IC integrates battery charger, diode, LDO (2007-07-17) [ Power Design ]
• Isolators deliver higher magnetic immunity, longer life (2007-07-17) [ EDA/IC Design ]
• Software test suite rolls for 3GPP LTE products (2007-07-17) [ Test/Packaging ]

• DC/DC converter claims 'very low' quiescent current (2007-07-17) [ Amplifying/Conditioning/Converting ]
• Xilinx releases free ISE WebPACK 9.2I (2007-07-17) [ Programmable Logic ]
• Digital TCXO delivers high frequency accuracy, stability (2007-07-17) [ RF/Wireless ]
• DSP promises 112 GMACs of compute performance (2007-07-17) [ Digital Signal Processing ]
• South Korea puts up $241.9M fund for tech developments (2007-07-17) [ Process/Manufacturing ]

• Canon builds new image sensor plant in Japan (2007-07-17) [ Process/Manufacturing ]
• DoCoMo kicks-off Super 3G trial (2007-07-17) [ RF/Wireless ]
• Intel joins OLPC project (2007-07-17) [ Embedded Systems ]
• Cadence acquires pattern-synthesis tech developer (2007-07-17) [ EDA/IC Design ]
• Broadcom offers free IC license for public safety (2007-07-17) [ RF/Wireless ]

• LCD TV poised to top television market, report says (2007-07-17) [ Process/Manufacturing ]
• Key proposals push broadband over powerline specs (2007-07-17) [ Networking Design ]
• Rise of mixed-signal SoCs hints at changing analog market (2007-07-17) [ Amplifying/Conditioning/Converting ]
• Reports point to a possible takeover at Samsung (2007-07-17) [ Process/Manufacturing ]
• Designing and using FPGAs for double-precision floating-point math (2007-07-16) [ Programmable Logic ]

• Reduce interference in GPS-enabled applications (2007-07-16) [ RF/Wireless ]
• Taiwan shows to dish out new design solutions (2007-07-16) [ EDA/IC Design ]
• SMK launches 14Mbps PLC module (2007-07-16) [ Digital Signal Processing ]
• 3G LSI chip combines advanced low-power techs (2007-07-16) [ RF/Wireless ]
• Low-cost platform revs up flash MCU evaluation (2007-07-16) [ Design Test ]

• ROM emulation tool for voice-guidance ICs debuts (2007-07-16) [ Interface Design ]
• Secure MCUs boast 'impressive' cryptographic features (2007-07-16) [ Security Design ]
• ADI unveils 65nm baseband processors (2007-07-16) [ Digital Signal Processing ]
• How-swap IC integrates Hall-effect current sensing (2007-07-16) [ Interface Design ]
• Mini-ITX motherboard rolls for multimedia-intensive nets (2007-07-16) [ Embedded Systems ]

• DC/DC converters suit railway, transportation applications (2007-07-16) [ Amplifying/Conditioning/Converting ]
• TI clock generators offer low jitter performance (2007-07-16) [ Amplifying/Conditioning/Converting ]
• FPGA-based coprocessors ease ASIC emulation (2007-07-16) [ Programmable Logic ]
• Lattice challenges big rivals at 90nm FPGAs (2007-07-16) [ Programmable Logic ]
• Linear's chief architect on power loss, IC design (2007-07-16) [ Amplifying/Conditioning/Converting ]

• Fight IC piracy with OTP memory (2007-07-16) [ EDA/IC Design ]
• Techniques to beat the heat problem (2007-07-16) [ EMI/EMC Design ]
• Verify designs with assertions (2007-07-16) [ EDA/IC Design ]
• Use hardware-based acceleration wisely (2007-07-16) [ Amplifying/Conditioning/Converting ]
• Tips for a peaceful Bluetooth/Wi-Fi coexistence (2007-07-16) [ RF/Wireless ]

• Bluetooth, Wi-Fi: No brawl over 2.4GHz (2007-07-16) [ RF/Wireless ]
• Multivoltage verification solution eases low-power design (2007-07-16) [ EDA/IC Design ]
• AMCC fields dual-core PowerPC for high-end apps (2007-07-16) [ Embedded Systems ]
• Touchscreens, 3D, OLEDs drive new displays (2007-07-16) [ Sensor Technology ]
• China mobile TV spec gains strong backers (2007-07-16) [ Optical Electronics and Display ]

• Malaysia fights to keep post in electronics race (2007-07-16) [ Process/Manufacturing ]
• TSMC pulls curtains off 45nm design process (2007-07-16) [ EDA/IC Design ]
• Automotive platform faces roadblocks (2007-07-16) [ Embedded Systems ]
• India, China cellphone markets go head-to-head (2007-07-16) [ RF/Wireless ]
• Multicore reshapes EDA landscape (2007-07-16) [ EDA/IC Design ]

• Tools simplify FlexRay designs (2007-07-16) [ Digital Signal Processing ]
• FMS6419 evaluation board application note (2007-07-13) [ EDA/IC Design ]
• VIA fields new devices to aid PC2.0 transition (2007-07-13) [ EDA/IC Design ]
• Adapter meets energy-efficiency standards (2007-07-13) [ Amplifying/Conditioning/Converting ]
• Tool ups efficiency of GE-PON, IPTV QoS measurements (2007-07-13) [ Test/Packaging ]

• Polymer capacitors fit portable consumer electronics (2007-07-13) [ Power Design ]
• GbE development kit with 65nm Virtex-5 FPGA debuts (2007-07-13) [ EDA/IC Design ]
• Industry's most highly integrated mobile DTV chip? (2007-07-13) [ RF/Wireless ]
• FET plus driver saves board space by 80% (2007-07-13) [ Power Design ]
• Adcore-Tech ships samples of W-CDMA baseband processor (2007-07-13) [ RF/Wireless ]

• Module extends Bluetooth range to 1km (2007-07-13) [ RF/Wireless ]
• R-C filters protect LCD interfaces in 3G handsets (2007-07-13) [ EMI/EMC Design ]
• IC equipment spending to increase this year, Gartner says (2007-07-13) [ Process/Manufacturing ]
• Virtualization startup bags $16M financing (2007-07-13) [ Embedded Systems ]
• Coming soon: Pause TV (2007-07-13) [ Buffer/Storage ]

• Micron CEO says layoffs difficult but necessary (2007-07-13) [ Process/Manufacturing ]
• ST licenses smart power process tech to Bosch (2007-07-13) [ Process/Manufacturing ]
• O2Micro wins battery charging patent (2007-07-13) [ Power Design ]
• Atmel sells network storage line to MoSys (2007-07-13) [ Buffer/Storage ]
• Survey: U.S. still holds venture capital appeal (2007-07-13) [ EDA/IC Design ]

• IBM researchers drive SRAM speed to 6GHz (2007-07-13) [ Buffer/Storage ]
• Laird Technologies opens India research lab (2007-07-13) [ RF/Wireless ]
• Report: MediaTek may buy ADI's wireless chip biz (2007-07-13) [ RF/Wireless ]
• MCU architecture touts optimized peripheral data management (2007-07-12) [ Embedded Systems ]
• Mattel develops radar gun from inexpensive components (2007-07-12) [ Test/Packaging ]

• XMOS fields software-defined silicon (2007-07-12) [ Control Design ]
• Design simple, inexpensive FlexRay nodes (2007-07-12) [ Interface Design ]
• 6000 series oscilloscopes performance guide using 89600 vector signal analyzer software (2007-07-12) [ Design Test ]
• Making a distance-to-fault measurement using the Agilent CSA (2007-07-12) [ Design Test ]
• Tektronix upgrades software to support HDMI 1.3 (2007-07-12) [ Design Test ]

• Multistandard video decoder LSI works outdoors (2007-07-12) [ Digital Signal Processing ]
• Quad EMI filter array integrates ESD protection (2007-07-12) [ EMI/EMC Design ]
• Car audio LSI promises home-theater sound quality (2007-07-12) [ Digital Signal Processing ]
• Tiny Li-ion chargers enable safe fast-charging (2007-07-12) [ Power Design ]
• RF antenna switch claims highest throw count (2007-07-12) [ RF/Wireless ]

• ADCs target high-speed, high-density applications (2007-07-12) [ Amplifying/Conditioning/Converting ]
• Step-up DC/DC has ultralow quiescent current (2007-07-12) [ Amplifying/Conditioning/Converting ]
• Headlamp LED delivers 620 lumens at 700mA (2007-07-12) [ Optical Electronics and Display ]
• Freescale expands MRAM product line (2007-07-12) [ Buffer/Storage ]
• Consortium claims 32/22nm SRAM breakthrough (2007-07-12) [ Process/Manufacturing ]

• Faraday leads IP sharing effort with UR-IP Center (2007-07-12) [ Interface Design ]
• iSuppli: Bright future awaits large-sized LCD panels (2007-07-12) [ Process/Manufacturing ]
• Anadigics sets up GaAs wafer fab in China (2007-07-12) [ Process/Manufacturing ]
• Cadence, STARC team to address 65nm DFM issues (2007-07-12) [ EDA/IC Design ]
• Microsoft cooks up 'smaller, quieter' Xbox (2007-07-12) [ Embedded Systems ]

• AMD slashes up to 50% off desktop processor price (2007-07-12) [ Embedded Systems ]
• Nanotero tries HP inkjet tech on nanotube memory (2007-07-12) [ Process/Manufacturing ]
• Microfluidic chip detects diseases at less cost, time (2007-07-12) [ Amplifying/Conditioning/Converting ]
• ST to shut down U.S. manufacturing operations (2007-07-12) [ Process/Manufacturing ]
• Time domain analysis using a network analyzer (2007-07-11) [ Design Test ]

• Atmel fields 'first' 128Kbit Serial EEPROM in MLP housing (2007-07-11) [ Buffer/Storage ]
• Adlink PXI tools feature smart chassis management (2007-07-11) [ Test/Packaging ]
• Renesas expands line-up of 32bit CISC MCUs (2007-07-11) [ Control Design ]
• HDD read channel achieves over 3Gbps data rates (2007-07-11) [ Buffer/Storage ]
• IR unrolls Class D audio amp reference design (2007-07-11) [ Embedded Systems ]

• Ultramini LED replaces Xenon lamps in digicam flash (2007-07-11) [ Optical Electronics and Display ]
• Video server meets mobile surveillance requirements (2007-07-11) [ Security Design ]
• Mobile I/O companion ICs target portable products (2007-07-11) [ EDA/IC Design ]
• Overvoltage protection regulator suits car, industrial apps (2007-07-11) [ Power Design ]
• RTL synthesis tool eases chip-level interconnect design (2007-07-11) [ EDA/IC Design ]

• Samsung, LM Ericsson ink patent cross-license deal (2007-07-11) [ RF/Wireless ]
• JP Morgan: Cheaper, Nano-based iPhone under wraps (2007-07-11) [ RF/Wireless ]
• On Semi expands Philippine manufacturing plant (2007-07-11) [ Process/Manufacturing ]
• NXP buys Sharp ARM-based MCU product line (2007-07-11) [ Embedded Systems ]
• Intel invests $218.5 in virtualization solutions provider (2007-07-11) [ Embedded Systems ]

• NFC Forum drafts host control interface spec (2007-07-11) [ Interface Design ]
• Is AMD dropping Chartered for TSMC? (2007-07-11) [ Process/Manufacturing ]
• IP standards body VSIA closes shop (2007-07-11) [ EDA/IC Design ]
• Support office serves European EE firms in China (2007-07-11) [ Process/Manufacturing ]
• TI DSPs used in Node B base stations for TD-SCDMA trials (2007-07-11) [ RF/Wireless ]

• ADC requirements for temperature measurement systems (2007-07-11) [ Sensor Technology ]