• Time domain analysis using a network analyzer (2007-07-11) [ Design Test ]
• Atmel fields 'first' 128Kbit Serial EEPROM in MLP housing (2007-07-11) [ Buffer/Storage ]
• Adlink PXI tools feature smart chassis management (2007-07-11) [ Test/Packaging ]
• Renesas expands line-up of 32bit CISC MCUs (2007-07-11) [ Control Design ]
• HDD read channel achieves over 3Gbps data rates (2007-07-11) [ Buffer/Storage ]

• IR unrolls Class D audio amp reference design (2007-07-11) [ Embedded Systems ]
• Ultramini LED replaces Xenon lamps in digicam flash (2007-07-11) [ Optical Electronics and Display ]
• Video server meets mobile surveillance requirements (2007-07-11) [ Security Design ]
• Mobile I/O companion ICs target portable products (2007-07-11) [ EDA/IC Design ]
• Overvoltage protection regulator suits car, industrial apps (2007-07-11) [ Power Design ]

• RTL synthesis tool eases chip-level interconnect design (2007-07-11) [ EDA/IC Design ]
• Samsung, LM Ericsson ink patent cross-license deal (2007-07-11) [ RF/Wireless ]
• JP Morgan: Cheaper, Nano-based iPhone under wraps (2007-07-11) [ RF/Wireless ]
• On Semi expands Philippine manufacturing plant (2007-07-11) [ Process/Manufacturing ]
• NXP buys Sharp ARM-based MCU product line (2007-07-11) [ Embedded Systems ]

• Intel invests $218.5 in virtualization solutions provider (2007-07-11) [ Embedded Systems ]
• NFC Forum drafts host control interface spec (2007-07-11) [ Interface Design ]
• Is AMD dropping Chartered for TSMC? (2007-07-11) [ Process/Manufacturing ]
• IP standards body VSIA closes shop (2007-07-11) [ EDA/IC Design ]
• Support office serves European EE firms in China (2007-07-11) [ Process/Manufacturing ]

• TI DSPs used in Node B base stations for TD-SCDMA trials (2007-07-11) [ RF/Wireless ]
• ADC requirements for temperature measurement systems (2007-07-11) [ Sensor Technology ]
• ADuC7028 evaluation board reference guide MicroConverter ADuC7028 development system (2007-07-10) [ EDA/IC Design ]
• Configuring the AD7656/AD7657/AD7658 for serial and daisy-chain interface modes of operation (2007-07-10) [ Interface Design ]
• Fake Motorola, Nokia batteries prone to explode (2007-07-10) [ Power Design ]

• Aeroflex, Beijing StarPoint to develop TD-SCDMA protocol tester (2007-07-10) [ Test/Packaging ]
• Adcore-Tech unveils 3.5G W-CDMA mobile tech (2007-07-10) [ RF/Wireless ]
• AMD invests $7.5M in Transmeta (2007-07-10) [ Embedded Systems ]
• China digital STB maker picks Freescale silicon tuner (2007-07-10) [ Embedded Systems ]
• Mechatronics paves way for driverless cars (2007-07-10) [ Control Design ]

• Rumor: 30% price cut up for AMD dual-core Athlon (2007-07-10) [ Embedded Systems ]
• BlackBerry entry could hasten 3G rollout in China (2007-07-10) [ RF/Wireless ]
• Taiwan firm behind iPhone's touchscreen (2007-07-10) [ Optical Electronics and Display ]
• iPhone code crumbs go back to U.K. graphics firm (2007-07-10) [ RF/Wireless ]
• RGB LEDs roll in ultrasmall form factors (2007-07-10) [ Optical Electronics and Display ]

• Terminators, attenuators promise high-frequency performance (2007-07-10) [ RF/Wireless ]
• Op amps enable power savings, extended operation (2007-07-10) [ Power Design ]
• Low-g accelerometer fits battery-powered apps (2007-07-10) [ Sensor Technology ]
• Agilent intros 'first' LXI-compliant power meter (2007-07-10) [ Test/Packaging ]
• UWB chipset handles Wireless USB, Bluetooth, WiMedia (2007-07-10) [ RF/Wireless ]

• AMC ref kit features dual-core PowerPC processor (2007-07-10) [ Embedded Systems ]
• Virtex-5 FPGA powers rugged embedded computing devices (2007-07-10) [ Programmable Logic ]
• Power monitor offers high-accuracy current sensing (2007-07-10) [ Power Design ]
• AMD GPUs deliver immersive HD video to PCs (2007-07-10) [ Control Design ]
• A 2.xGHz WiMAX direct conversion transmitter (2007-07-09) [ RF/Wireless ]

• Mobile handset taps capacitive-touch sensing (2007-07-09) [ Sensor Technology ]
• LEDs feature oval-shaped radiation pattern (2007-07-09) [ Optical Electronics and Display ]
• ST touch sensors use ATLabs capacitive technology (2007-07-09) [ EDA/IC Design ]
• MOSFET drivers promise excellent latch-up immunity (2007-07-09) [ Power Design ]
• E-paper display features improved color brightness (2007-07-09) [ Optical Electronics and Display ]

• Verification tool for ARM-based wireless systems debuts (2007-07-09) [ Design Test ]
• Small two-phase DC/DC controllers feature 95% efficiency (2007-07-09) [ Power Design ]
• USB-based sensors operate even without power meter (2007-07-09) [ Test/Packaging ]
• Tool speeds up development of non-volatile FPGAs (2007-07-09) [ EDA/IC Design ]
• Samsung ships samples of WSVGA mobile displays (2007-07-09) [ Optical Electronics and Display ]

• AMD to ship quad-core Barcelona processors in August (2007-07-09) [ Control Design ]
• Tiny, low-voltage varistor fits portable CE devices (2007-07-09) [ Amplifying/Conditioning/Converting ]
• Logic module simplifies system integration (2007-07-09) [ Programmable Logic ]
• Motorola charged $101M due to job cuts (2007-07-09) [ Process/Manufacturing ]
• Toshiba takes legal action vs. German DVD maker (2007-07-09) [ Buffer/Storage ]

• Eight firms sued over Compact ISA-Bus patent (2007-07-09) [ Interface Design ]
• Expanded Xbox warranty to cost Microsoft $1B (2007-07-09) [ Interface Design ]
• UMC, Melexis develop 0.18µm embedded flash for cars (2007-07-09) [ Process/Manufacturing ]
• Samsung moves camera module plant to China (2007-07-09) [ Process/Manufacturing ]
• Solar cell plant to break ground in Singapore (2007-07-09) [ Process/Manufacturing ]

• Blog buzz: Is iPhone Nano in Apple's game plan? (2007-07-09) [ Sensor Technology ]
• RF power amp pioneer opens Japan, China offices (2007-07-09) [ Amplifying/Conditioning/Converting ]
• Intel, AMD respin server chips for virtualization (2007-07-09) [ EDA/IC Design ]
• Hong Kong's Rami Technology buys Raltron (2007-07-09) [ Amplifying/Conditioning/Converting ]
• Broadcom: 'Bush veto would affect global IP policy' (2007-07-06) [ RF/Wireless ]

• Measure ADC driving-circuit settling time by shifting sampling edge (2007-07-06) [ Amplifying/Conditioning/Converting ]
• Simplifying board bringup: Porting a CodeWarrior initialization file to your system (2007-07-06) [ EDA/IC Design ]
• FPC connectors offer up to 80 pins (2007-07-06) [ Networking Design ]
• SFF enterprise HDDs store up to 147Gbytes (2007-07-06) [ Buffer/Storage ]
• Altera ships production-qualified Arria GX FPGAs (2007-07-06) [ Programmable Logic ]

• Ballast ICs save space in CFL, LFL lightning apps (2007-07-06) [ Optical Electronics and Display ]
• Compact digitizer offers simultaneous acquisition, readout (2007-07-06) [ Test/Packaging ]
• Bus Doctor: Finisar's prescription for Asia's CE makers (2007-07-06) [ Test/Packaging ]
• PoE controller supports any DC/DC converter topology (2007-07-06) [ Amplifying/Conditioning/Converting ]
• Circular plastic connectors roll for medical apps (2007-07-06) [ Networking Design ]

• TI floating point DSCs enable power savings (2007-07-06) [ Digital Signal Processing ]
• Panasonic revs up Blu-ray disc writing speed (2007-07-06) [ Optical Electronics and Display ]
• LED series features 50° viewing angle (2007-07-06) [ Optical Electronics and Display ]
• 3-D EMF simulator handles massive, complex models (2007-07-06) [ EDA/IC Design ]
• DisplaySearch: Strong TFT LCD market spurs FPD revenues (2007-07-06) [ Process/Manufacturing ]

• Russia holds high hopes for nanotechnology (2007-07-06) [ Process/Manufacturing ]
• Alcatel, Datang Mobile deploy TD-SCDMA trials in China (2007-07-06) [ RF/Wireless ]
• Sanyo Electric ratchets up battery line (2007-07-06) [ Power Design ]
• Microchip slaps piracy suit on China's Haier (2007-07-06) [ Embedded Systems ]
• LG sues Quanta for use of patented DVD tech (2007-07-06) [ Buffer/Storage ]

• Samsung advances technology for green electronics (2007-07-06) [ Sensor Technology ]
• PicoChip, Systems4Silicon partner on MIMO (2007-07-06) [ RF/Wireless ]
• Ciranova plans to donate p-cell tech to Si2 (2007-07-06) [ EDA/IC Design ]
• Carbon nanotube transistors run at 30GHz (2007-07-06) [ Amplifying/Conditioning/Converting ]
• KLA, Applied face off in defect review market (2007-07-06) [ Process/Manufacturing ]

• Secret is out on femtocharge-based low-power ADC (2007-07-06) [ Amplifying/Conditioning/Converting ]
• MSC8144 SmartDSP OS Ethernet demonstration using the Java GUI (2007-07-05) [ EDA/IC Design ]
• Bidirectional translators offer ±15kV ESD protection (2007-07-05) [ Power Design ]
• Platform puts talking caller ID in handsfree apps (2007-07-05) [ Digital Signal Processing ]
• Transistors address power efficiency in portable apps (2007-07-05) [ Power Design ]

• Fujitsu launches three SAS HDD series (2007-07-05) [ Buffer/Storage ]
• microSDHC card for cellphones offers 4Gbytes (2007-07-05) [ Buffer/Storage ]
• Bluetooth 2.0+EDR RTL and software stack rolls (2007-07-05) [ RF/Wireless ]
• Op amp features 10MHz unity gain bandwidth (2007-07-05) [ Power Design ]
• Pretec unveils 35MBps flash memory card (2007-07-05) [ Buffer/Storage ]

• Secure MCU suits low-priced contact bank cards (2007-07-05) [ Control Design ]
• Pushbutton controller has voltage monitor, timer (2007-07-05) [ Power Design ]
• WiMAX tester quantifies actual user experience (2007-07-05) [ Design Test ]
• RF power transistors overcome Doherty limits (2007-07-05) [ RF/Wireless ]
• Rosy 2008 seen for China's terrestrial DTV IC market (2007-07-05) [ Embedded Systems ]

• Nokia Siemens wins lucrative network expansion deal in India (2007-07-05) [ RF/Wireless ]
• LG cellphones to feature YouTube service (2007-07-05) [ RF/Wireless ]
• DRAM module market to hit $31B this year, says iSuppli (2007-07-05) [ Process/Manufacturing ]
• China to topple India as top offshoring center by '11 (2007-07-05) [ Process/Manufacturing ]
• Fairchild, RedMere ink HDMI supply pact (2007-07-05) [ Interface Design ]

• ST fields capacitive sensor to simplify user interfaces (2007-07-05) [ Sensor Technology ]
• Synopsys, UMC partner on 65/90nm connectivity IP (2007-07-05) [ EDA/IC Design ]
• DRAM spot prices down, contract prices up (2007-07-05) [ Process/Manufacturing ]
• India pushes bid to be solar-industry hub (2007-07-05) [ Process/Manufacturing ]
• DVD group, Kaleidescape clash on digital media security (2007-07-05) [ Buffer/Storage ]

• Semico drops IC industry growth forecast to -0.5% (2007-07-05) [ Process/Manufacturing ]
• RF startup gets more than cash from Intel Capital (2007-07-05) [ RF/Wireless ]
• FMS6418B evaluation board application note (2007-07-04) [ EDA/IC Design ]
• Ultramini stereo codec integrates headphone amp (2007-07-04) [ RF/Wireless ]
• FB-DIMMs to drive energy savings in data centers (2007-07-04) [ Buffer/Storage ]

• AMD puts Samsung GDDR4 memory in Radeon HD series (2007-07-04) [ Buffer/Storage ]
• HDMI/DVI switch maintains high signal integrity (2007-07-04) [ Optical Electronics and Display ]
• Media gateway modules are low-cost, scalable (2007-07-04) [ RF/Wireless ]
• LDO regulators source up to 300mA output currents (2007-07-04) [ Power Design ]
• Xilinx delivers ISE 9.2i with lower memory requirements (2007-07-04) [ EDA/IC Design ]

• Ultrasmall antenna suits wireless 2.4GHz apps (2007-07-04) [ RF/Wireless ]
• Video filter removes glitch noise, extends battery life (2007-07-04) [ Digital Signal Processing ]
• ICs control two three-phase motors simultaneously (2007-07-04) [ Control Design ]
• Embedded processor counts cost for wireless hotspots (2007-07-04) [ Embedded Systems ]
• Multirate limiting post amp fits SFP transceivers (2007-07-04) [ Amplifying/Conditioning/Converting ]

• All systems go for LG's 8-up PDP production (2007-07-04) [ Process/Manufacturing ]
• Avago finalizes Infineon fiber biz buyout (2007-07-04) [ Optical Electronics and Display ]
• PS3 Japan sales trail behind Wii, 6:1 (2007-07-04) [ Embedded Systems ]
• Asia Pacific to see $122.8B FPD market in 2013 (2007-07-04) [ Process/Manufacturing ]
• India consumer A/V market to hit $6.6B by 2011 (2007-07-04) [ Process/Manufacturing ]

• Cypress, InPhase team on holographic storage drive (2007-07-04) [ Sensor Technology ]
• Analysis: Hardware takes nearly half the iPhone's cost (2007-07-04) [ RF/Wireless ]
• Macronix survives PowerChip's takeover bid (2007-07-04) [ Process/Manufacturing ]
• IEEE mulls compromise standard for 40/100GbE (2007-07-04) [ Networking Design ]
• Femtocell pioneers form forum (2007-07-04) [ Networking Design ]

• Siafun acquires 90nm know-how from SMIC (2007-07-04) [ Process/Manufacturing ]
• Power handling capability of electromechanical switches (2007-07-03) [ Networking Design ]
• IC Insights: Big 10 hold 48% of global fab capacity (2007-07-03) [ Process/Manufacturing ]
• Intel's China fab eyes August groundbreaking (2007-07-03) [ Process/Manufacturing ]
• Korea, China draft engineering cooperation road map (2007-07-03) [ Process/Manufacturing ]

• Qualcomm says 'no deal' to Broadcom settlement offer (2007-07-03) [ RF/Wireless ]
• Philips sells shares in GaAs IC manufacturer (2007-07-03) [ Process/Manufacturing ]
• ST, French tech org team on mini energy sources (2007-07-03) [ Power Design ]
• SanDisk, Ritek settle dispute, ink license pact (2007-07-03) [ Buffer/Storage ]
• Micron posts $225M loss, drives cost-saving schemes (2007-07-03) [ Process/Manufacturing ]

• Mosaid drops semi IP biz (2007-07-03) [ Process/Manufacturing ]
• AMD assures Barcelona is shipping on schedule (2007-07-03) [ Embedded Systems ]
• South Korea first to dial Motorola's iPhone challenger (2007-07-03) [ RF/Wireless ]
• Analysts crack open the iPhone, reveal chip suppliers (2007-07-03) [ RF/Wireless ]
• Serial flash takes steps to overtake parallel flash (2007-07-03) [ Buffer/Storage ]

• Ethernet platform eases migration to SFP+ form factor (2007-07-03) [ Networking Design ]
• External cabling device extends PCIe slot function (2007-07-03) [ Interface Design ]
• LED driver enables real-time automatic luminance control (2007-07-03) [ Optical Electronics and Display ]
• Power supply IC saves space in car navigation systems (2007-07-03) [ Power Design ]
• Chip resistor offers improved solder joint reliability (2007-07-03) [ Power Design ]

• RF generator accommodates larger waveforms (2007-07-03) [ Test/Packaging ]
• Fujitsu fields SAN system for ASEAN markets (2007-07-03) [ Buffer/Storage ]
• Energy-metering chips deliver complete meter system (2007-07-03) [ Digital Signal Processing ]
• Diode arrays shield high-speed interfaces from ESD (2007-07-03) [ Power Design ]
• Freescale platform simplifies migration to multicore (2007-07-03) [ Embedded Systems ]

• Signal integrity toolkit checks jitter, boasts new Serdes lib (2007-07-03) [ EDA/IC Design ]
• Coaxial electromechanical switches: How operating life and repeatability of Agilent?s electromechanical switches minimize system uncertainty (2007-07-02) [ Networking Design ]
• Tame signal integrity in the fast lane (2007-07-02) [ EDA/IC Design ]
• SMT digital color sensors suit small portable apps (2007-07-02) [ Sensor Technology ]
• Green chip lights up to 180 lumens (2007-07-02) [ Optical Electronics and Display ]

• Samsung fields multiband mobile TV chipset (2007-07-02) [ RF/Wireless ]
• ARM-based secure MCU eyes embedded systems (2007-07-02) [ Security Design ]
• GNSS receiver achieves cascaded NF of 1.4dB (2007-07-02) [ RF/Wireless ]
• Ultrasmall 16bit audio codec LSIs roll (2007-07-02) [ Digital Signal Processing ]
• Codec with speaker, video buffer is small at 4-by-4mm (2007-07-02) [ Amplifying/Conditioning/Converting ]

• Low-profile subscriber interface suits vDSL systems (2007-07-02) [ Networking Design ]
• Universal SMT contact innovates interfaces (2007-07-02) [ EDA/IC Design ]
• Chip displays 4,096x2,400 resolution at 20,000:1 ratio (2007-07-02) [ Optical Electronics and Display ]
• Efficient boost controller does away with heat sink (2007-07-02) [ Power Design ]
• i.MX27 processor fits multimedia apps (2007-07-02) [ Embedded Systems ]

• Microchip CEO anticipates 'historical challenge' (2007-07-02) [ Process/Manufacturing ]
• Break the innovation barrier with test (2007-07-02) [ EDA/IC Design ]
• Dealing with the processor design dilemma (2007-07-02) [ Embedded Systems ]
• Manage design data effectively (2007-07-02) [ EDA/IC Design ]
• MRAM enters embedded arena (2007-07-02) [ Buffer/Storage ]

• Tap capacitive sensor UI in next-gen CE devices (2007-07-02) [ Sensor Technology ]
• Design interfaces for device partners (2007-07-02) [ Interface Design ]
• Modern IDEs redefine 'integrated' (2007-07-02) [ Interface Design ]
• Low-cost FPGAs prop up GbE, PCIe, RapidIO (2007-07-02) [ Programmable Logic ]
• PON player makes broader push into gigabit (2007-07-02) [ Optical Electronics and Display ]

• Coprocessor integrates multicore development (2007-07-02) [ EDA/IC Design ]
• Power connectors maximize cooling in hot ICs (2007-07-02) [ Design Test ]
• Web compiler supports embedded memory IP (2007-07-02) [ EDA/IC Design ]
• 10GbE chips migrate to computer servers (2007-07-02) [ Interface Design ]
• ICs tap alternative energy sources (2007-07-02) [ RF/Wireless ]

• EDA tools add MEMS capability (2007-07-02) [ EDA/IC Design ]
• Image chip makes car vision affordable (2007-07-02) [ Sensor Technology ]
• Silicon IP vendors size up China challenge (2007-07-02) [ EDA/IC Design ]
• Euro fabs take niche path to avoid TSMC (2007-07-02) [ Process/Manufacturing ]
• AMD, Intel elevate rivalry to laptop arena (2007-07-02) [ Embedded Systems ]

• Class conflict hounds mobile WiMAX (2007-07-02) [ RF/Wireless ]
• Mobile software clash splits Java community (2007-07-02) [ Embedded Systems ]
• OLEDs glow in efficient lighting quest (2007-07-02) [ Optical Electronics and Display ]
• A comparison of line driver and line receiver varieties (2007-07-02) [ Interface Design ]
• The anatomy of the digital home (2007-07-02) [ Digital Signal Processing ]

• Achieve proper audio-video synchronization in digital broadcast (2007-07-01) [ Amplifying/Conditioning/Converting ]