• Achieve proper audio-video synchronization in digital broadcast (2007-07-01) [ Amplifiers/Converters ]
• Side-by-side comparison: Agilent 34405A and Fluke 45 digital multimeter (2007-06-29) [ T&M ]
• Easy steps to integrate the 34405A multimeter into a system (2007-06-29) [ T&M ]
• Judgment day: Can the Apple iPhone deliver? (2007-06-29) [ RF/Microwave ]
• A new way to predict LDMOS DC signal behavior (2007-06-29) [ EDA/IP ]

• Connectors integrate HDMI (2007-06-29) [ Processors/DSPs ]
• Development platform rolls for PXA3xx processors (2007-06-29) [ T&M ]
• Service platform for converged networks debuts (2007-06-29) [ Networks ]
• Current monitor measures accurate short circuit current (2007-06-29) [ Power/Alternative Energy ]
• Chip receives digital video broadcast in cars (2007-06-29) [ RF/Microwave ]

• 3D simulation tool simplifies wireless design (2007-06-29) [ T&M ]
• TI echo cancellation tool boosts phone performance (2007-06-29) [ RF/Microwave ]
• Analog ICs gear up for automotive engine control (2007-06-29) [ Controls/MCUs ]
• DTV SoCs power DVB-T, DTR apps (2007-06-29) [ Processors/DSPs ]
• H.264 codecs to turn on flash-based TVs (2007-06-29) [ RF/Microwave ]

• Intel rolls out cables, spec for clusters (2007-06-29) [ EDA/IP ]
• Sampling starts for 65nm multistandard mobile TV chipset (2007-06-29) [ Amplifiers/Converters ]
• Altera sets up EDA/SOPC joint lab at Taiwan University (2007-06-29) [ EDA/IP ]
• IBM muses on chip facility at China site (2007-06-29) [ Manufacturing/Packaging ]
• Winbond, Qimonda extend memory production deal (2007-06-29) [ Manufacturing/Packaging ]

• Applied inaugurates wafer reclaim center in Taiwan (2007-06-29) [ Manufacturing/Packaging ]
• Anadigics amp powers Samsung smart phone (2007-06-29) [ RF/Microwave ]
• Microsoft seals 3-way PC sales pact (2007-06-29) [ Embedded ]
• Indian firms figure in top 20 L-1 visa users list (2007-06-29) [ Manufacturing/Packaging ]
• Global mobile base to exceed 3.25B in 2007, analyst says (2007-06-29) [ RF/Microwave ]

• Germany to invest $483M in organic PV (2007-06-29) [ Power/Alternative Energy ]
• Vietnam drafts master plan for electronics advancement (2007-06-29) [ Manufacturing/Packaging ]
• Singapore's UTAC marked for private equity bid (2007-06-29) [ T&M ]
• LSI drops consumer chip biz, trims workforce (2007-06-29) [ Amplifiers/Converters ]
• Build WiMAX base stations, subscriber stations (2007-06-28) [ Networks ]

• Dual-baseband phone calls multiple standards (2007-06-28) [ RF/Microwave ]
• Embedded eyes multicore to save power (2007-06-28) [ Embedded ]
• DRAM assembly and test houses cautious on expansion (2007-06-28) [ T&M ]
• Intel partners with India IT firm on multicore training program (2007-06-28) [ Embedded ]
• Rohm and Haas spend $60M on litho equipment (2007-06-28) [ Manufacturing/Packaging ]

• China's first UMPC to debut in 2008 (2007-06-28) [ Embedded ]
• TSMC, Cadence team on 65nm wireless design flow (2007-06-28) [ EDA/IP ]
• Macronix struggles in the face of hostile takeover (2007-06-28) [ Manufacturing/Packaging ]
• iPhone faces touchsceen supply glitches (2007-06-28) [ Manufacturing/Packaging ]
• LG Electronics, Harris pitch MPH as mobile DTV spec (2007-06-28) [ Amplifiers/Converters ]

• Economists urge Israel government to boost R&D support (2007-06-28) [ EDA/IP ]
• Flash memory market to see major shuffle (2007-06-28) [ Memory/Storage ]
• Applied Materials fortifies PV biz with acquisition (2007-06-28) [ Manufacturing/Packaging ]
• Altera ships new Cyclone III FPGA one month ahead (2007-06-28) [ FPGAs/PLDs ]
• Small op amps have 5-16V operating range (2007-06-28) [ Amplifiers/Converters ]

• Stackable DC/DC controller eyes high-density servers (2007-06-28) [ Amplifiers/Converters ]
• Chipset shrinks powertrain footprint by 45% (2007-06-28) [ Amplifiers/Converters ]
• LG's Flexible AMOLED first to use a-Si technology (2007-06-28) [ Optoelectronics/Displays ]
• Input module offers mouse-like pointing solution (2007-06-28) [ Sensors/MEMS ]
• DC/DC regulator takes up only 1.35cm² (2007-06-28) [ Amplifiers/Converters ]

• 8/32bit MCUs promise pin-for-pin compatibility (2007-06-28) [ Controls/MCUs ]
• Atmel rolls additional AVR 32bit MCUs (2007-06-28) [ Processors/DSPs ]
• Integrated passive device tools target wireless apps (2007-06-28) [ Manufacturing/Packaging ]
• Clean room machines cut energy usage by 30% (2007-06-27) [ Manufacturing/Packaging ]
• Infineon sets sights on TI's DSL biz (2007-06-27) [ Networks ]

• Fujitsu to bring GaN HEMTs to wireless comms market (2007-06-27) [ RF/Microwave ]
• TSMC qualifies Magma Quartz tech for 65nm, 0.13µm (2007-06-27) [ EDA/IP ]
• Huawei bags $700M GSM contract from China Mobile (2007-06-27) [ RF/Microwave ]
• Certification testing for Wi-Fi .11n draft 2.0 starts (2007-06-27) [ T&M ]
• GSM operators group pushes for 3G at 900MHz (2007-06-27) [ RF/Microwave ]

• Nokia business-class phones debut ahead of iPhone (2007-06-27) [ RF/Microwave ]
• IMEC ready to license SVC source code (2007-06-27) [ Embedded ]
• HDD makers explore ways to up areal density (2007-06-27) [ Memory/Storage ]
• VeriSilicon adds IBM PowerPC processors to offerings (2007-06-27) [ Processors/DSPs ]
• DSCs advance motor control, sensor processing (2007-06-27) [ Processors/DSPs ]

• 16bit delta-sigma ADC ups system accuracy (2007-06-27) [ Processors/DSPs ]
• 1.8-inch, 64Gbyte solid state drives eye mobile PCs (2007-06-27) [ Memory/Storage ]
• ROADM achieves 40Gbps transmission rates (2007-06-27) [ Networks ]
• Samtec launches sealed circular cable systems (2007-06-27) [ Networks ]
• DC/DC converter has five op amps (2007-06-27) [ Amplifiers/Converters ]

• Class-D amplifiers target portable applications (2007-06-27) [ Power/Alternative Energy ]
• Analog ICs aid low-power handset designs (2007-06-27) [ RF/Microwave ]
• DC cooling fans suit servers, power supplies (2007-06-27) [ Embedded ]
• Xilinx integrates FlexRay IP into FPGAs (2007-06-27) [ FPGAs/PLDs ]
• Reliable, low-ESR capacitors roll for safety-critical apps (2007-06-27) [ Amplifiers/Converters ]

• Toshiba unrolls RISC-based SoC for car TFT displays (2007-06-27) [ Optoelectronics/Displays ]
• PolyFuel defines role in mobile lifestyle quest (2007-06-26) [ Power/Alternative Energy ]
• China GrenTech wins Olympic WLAN contract (2007-06-26) [ RF/Microwave ]
• SIA slashes 2007 chip sales forecast (2007-06-26) [ Manufacturing/Packaging ]
• NXP design center aims to up RFID adoption (2007-06-26) [ T&M ]

• IBM expands data center with green touch (2007-06-26) [ Manufacturing/Packaging ]
• MOEA: 12-inch fabs drive Taiwan's chip industry (2007-06-26) [ Manufacturing/Packaging ]
• Mosaid licenses patents to Taiwan DRAM vendor (2007-06-26) [ Memory/Storage ]
• ST opens car EMC research center in Italy (2007-06-26) [ Amplifiers/Converters ]
• Patent battles brew in Wi-Fi industry (2007-06-26) [ RF/Microwave ]

• Intel tips 'next big thing' in supercomputing (2007-06-26) [ RF/Microwave ]
• Freescale eases out of Crolles2 alliance (2007-06-26) [ Manufacturing/Packaging ]
• Elpida sees promising 2H, halts DRAM price war (2007-06-26) [ Memory/Storage ]
• ITC denies Qualcomm request for ban order stay (2007-06-26) [ RF/Microwave ]
• MCUs offer high performance at lower power, cost (2007-06-26) [ Embedded ]

• Tiny LEDs trim surface area by 70% (2007-06-26) [ Optoelectronics/Displays ]
• Ericsson rolls pinned version of DC/DC module (2007-06-26) [ Amplifiers/Converters ]
• Power resistors target high-speed pulse apps (2007-06-26) [ Power/Alternative Energy ]
• Anritsu fields handheld vector network analyzer (2007-06-26) [ T&M ]
• Flash memory supports SLC, MLC on same chip (2007-06-26) [ Memory/Storage ]

• Tiny buck regulator ups system thermal performance (2007-06-26) [ Amplifiers/Converters ]
• ARM debugger adds flash memory breakpoints (2007-06-26) [ Memory/Storage ]
• Tool rolls for BDF conformance testing (2007-06-26) [ T&M ]
• Line drivers suit 100Mbps VDSL2 apps (2007-06-26) [ Amplifiers/Converters ]
• DSPs promise high-fidelity audio (2007-06-26) [ Processors/DSPs ]

• 25MSps, 14bit ADC fits high-temp apps (2007-06-26) [ Amplifiers/Converters ]
• Commentary: Hope emerges for analog layout automation (2007-06-25) [ EDA/IP ]
• Designing in the age of 3D systems (2007-06-25) [ EDA/IP ]
• Optical components market drops 4% in Q1 (2007-06-25) [ Optoelectronics/Displays ]
• Bosch allots $90M for APAC base in Singapore (2007-06-25) [ Manufacturing/Packaging ]

• MediaFLO trials set for Hong Kong mobile TV (2007-06-25) [ RF/Microwave ]
• ST, Freescale sound progress in automotive design (2007-06-25) [ EDA/IP ]
• India to host Sony Ericsson R&D lab (2007-06-25) [ EDA/IP ]
• MagnaChip applies CUP tech to cut chip size (2007-06-25) [ Manufacturing/Packaging ]
• Sony learns from mistakes, vows a comeback (2007-06-25) [ Embedded ]

• Intel drafts inverse litho to cover EUV delay (2007-06-25) [ EDA/IP ]
• Gateway recalls 14,000 fire-hazard batteries (2007-06-25) [ Power/Alternative Energy ]
• IMEC energy harvester yields power from vibrations (2007-06-25) [ Sensors/MEMS ]
• iSuppli crops chip revenue outlook (2007-06-25) [ Manufacturing/Packaging ]
• Asian telco giants clash on future mobile tech (2007-06-25) [ RF/Microwave ]

• Fail-safe system basis chips eye in-vehicle networking (2007-06-25) [ Amplifiers/Converters ]
• Surface-mountable CW laser is ultracompact (2007-06-25) [ EDA/IP ]
• LVDS drivers offer 800Mbps at 300ps pulse skew (2007-06-25) [ Networks ]
• Toshiba launches GaAs FETs, RF devices (2007-06-25) [ RF/Microwave ]
• Capacitive touch sensors enable smart user interfaces (2007-06-25) [ Sensors/MEMS ]

• Devices extend frequencies for signal analyzers (2007-06-25) [ T&M ]
• Dual-output converter powers AMOLED panels (2007-06-25) [ Optoelectronics/Displays ]
• Platform leverages Serial RapidIO technology (2007-06-25) [ EDA/IP ]
• DC/DC converter integrates high-side switch (2007-06-25) [ Amplifiers/Converters ]
• GPUs gives Teraflop-computing capacity to PCs (2007-06-25) [ Embedded ]

• Optical sensor rolls for mini-mice (2007-06-25) [ Sensors/MEMS ]
• TI unrolls high-power WLED driver IC (2007-06-25) [ Optoelectronics/Displays ]
• DC/DC converters have synchronous rectifying system (2007-06-22) [ Amplifiers/Converters ]
• Digital front-end tool rolls for TD-SCDMA (2007-06-22) [ EDA/IP ]
• Boundary-scan development software adds functions (2007-06-22) [ T&M ]

• Chips suit Ku-band digital video broadcast (2007-06-22) [ RF/Microwave ]
• MEMS switches target ATE apps (2007-06-22) [ T&M ]
• Negative charge offers optimized light management (2007-06-22) [ Amplifiers/Converters ]
• ATA controller LSI suit apps with built-in HDDs (2007-06-22) [ Controls/MCUs ]
• 3Gbps Serdes touts lowest output jitter of 50ps (2007-06-22) [ Processors/DSPs ]

• ATX power supply reference design debuts (2007-06-22) [ EDA/IP ]
• 5.7-inch TFT display includes LED backlight (2007-06-22) [ Optoelectronics/Displays ]
• Pretec samples high-speed CF card (2007-06-22) [ Memory/Storage ]
• TI rolls out low-jitter network clock generator (2007-06-22) [ Amplifiers/Converters ]
• 3G phones with Qualcomm's 65nm chipsets debut (2007-06-22) [ RF/Microwave ]

• European Parliament: E.U. should finance Galileo (2007-06-22) [ RF/Microwave ]
• Actions, SigmaTel settle lawsuits, ink license pact (2007-06-22) [ Manufacturing/Packaging ]
• New factory sets China as Sony Ericsson's strategic base (2007-06-22) [ Manufacturing/Packaging ]
• Cadence aids HHNEC in first 0.18µm EEPROM PDK (2007-06-22) [ EDA/IP ]
• Murata buys C&D Tech's power electronics division for $85M (2007-06-22) [ Manufacturing/Packaging ]

• O2Micro bags PWM generator patent (2007-06-22) [ Amplifiers/Converters ]
• Dialog turns to India's KPIT Cummins to boost R&D (2007-06-22) [ EDA/IP ]
• U.S. tech firms in Malaysia cut revenue forecast (2007-06-22) [ Manufacturing/Packaging ]
• MIPS plays down ARM expansion threat (2007-06-22) [ Embedded ]
• Ubuntu, Red Hat reject Microsoft licensing deal (2007-06-22) [ Embedded ]

• RFID looks good to tech firms, vague to customers (2007-06-22) [ Sensors/MEMS ]
• Connectors stack up for increased functionality (2007-06-22) [ Networks ]
• Trimmer Nintendo DS Lite plays up consumer appeal (2007-06-21) [ Interface ]
• Manufacturers ride the PON wave (2007-06-21) [ Optoelectronics/Displays ]
• Growing MEMS popularity puts TeraVicta in the spotlight (2007-06-21) [ Sensors/MEMS ]

• Matsushita starts system LSI mass production at 45nm (2007-06-21) [ Manufacturing/Packaging ]
• Reported Cadence private-equity buyout hangs (2007-06-21) [ EDA/IP ]
• Fujitsu develops tech for low-power 45nm logic chips (2007-06-21) [ Manufacturing/Packaging ]
• Future is bright for touchscreens, iSuppli predicts (2007-06-21) [ Sensors/MEMS ]
• ABI: $400M market awaits car head-up displays in 2012 (2007-06-21) [ Optoelectronics/Displays ]

• AMIS, MagnaChip extend pact to 0.35µm SmartPower, ULP tech (2007-06-21) [ Manufacturing/Packaging ]
• Security spec proposed for HDDs (2007-06-21) [ Memory/Storage ]
• Purchase completes Philips' solid-state lighting portfolio (2007-06-21) [ Manufacturing/Packaging ]
• Sony battery fire prompts Toshiba to up recall efforts (2007-06-21) [ Power/Alternative Energy ]
• Kaleidescape battles DVD group's copy ban move (2007-06-21) [ Memory/Storage ]

• Despite Apple's promise, applications still iPhone's weakness (2007-06-21) [ RF/Microwave ]
• Header-type connector for microSD is thin at 1.6mm (2007-06-21) [ Networks ]
• Digitizer maximizes measurement throughput (2007-06-21) [ T&M ]
• Automation software supports Vista (2007-06-21) [ EDA/IP ]
• Synthesizer allows multiple spur-reduction channels (2007-06-21) [ T&M ]

• Mobile WiMAX systems enhance network efficiency (2007-06-21) [ RF/Microwave ]
• 1MHz converter suits DSPs with 3.3V I/O rail (2007-06-21) [ Amplifiers/Converters ]
• IR discrete emitters boast design flexibility (2007-06-21) [ Optoelectronics/Displays ]
• Ultrathin, highly flexible printed circuit debuts (2007-06-21) [ Processors/DSPs ]
• Fanout buffers prevent unwanted oscillations (2007-06-21) [ FPGAs/PLDs ]

• x86 platform eyes smaller PC systems (2007-06-21) [ Embedded ]
• OVP controllers boast low supply current draw (2007-06-21) [ Power/Alternative Energy ]
• New ST MCUs feature high performance gains (2007-06-21) [ Controls/MCUs ]