Article review (Sorted By Date)
- Apple TV: A work in progress (2007-05-21) [ Embedded Systems ]
- System-on-glass LCDs achieve luminance of 200cd/m² (2007-05-21) [ Optical Electronics and Display ]
- Motorola inks merger agreement with Modulus Video (2007-05-21) [ Amplifying/Conditioning/Converting ]
- Organic advancements drive OLED adoption in Europe (2007-05-21) [ Optical Electronics and Display ]
- Chartered takes $610M loan to ramp up 300mm fab (2007-05-21) [ Process/Manufacturing ]
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- China IC industry down 8.7% in Q1 (2007-05-21) [ EDA/IC Design ]
- Survey: More firms to invest in energy efficiency measures (2007-05-21) [ Power Design ]
- Software to take half of IBM's total profit by 2010 (2007-05-21) [ Embedded Systems ]
- 'Nanoglue' stickier when hot (2007-05-21) [ Process/Manufacturing ]
- Antenova springs Shanghai surprise (2007-05-21) [ RF/Wireless ]
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- iPhone gets green light from FCC (2007-05-21) [ RF/Wireless ]
- Spansion eyes $30B DRAM market (2007-05-21) [ Buffer/Storage ]
- Asia EMS/ODM market to double in next 5yrs (2007-05-21) [ EDA/IC Design ]
- U.S. legislators zero in on Indian firms in H-1B visa issue (2007-05-21) [ EDA/IC Design ]
- Pattern generator cards have 32Gbit on-board memory (2007-05-21) [ EDA/IC Design ]
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- Optocouplers deliver 5,300Vrms isolation voltage (2007-05-21) [ Optical Electronics and Display ]
- Mobile TV demodulator supports multiple standards (2007-05-21) [ RF/Wireless ]
- 8Gbyte microSD card rolls for handset designs (2007-05-21) [ Buffer/Storage ]
- ADC prevails against high-temp environment (2007-05-21) [ Amplifying/Conditioning/Converting ]
- Register manager promises versatility (2007-05-21) [ Embedded Systems ]
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- Development tool features cryptographic algorithms (2007-05-21) [ Design Test ]
- Handset active-matrix OLED is slim at 0.52mm (2007-05-21) [ Optical Electronics and Display ]
- DaVinci platform adds Opera browser (2007-05-21) [ Interface Design ]
- MCUs offer enhanced memory, system features (2007-05-21) [ Control Design ]
- Tiny POL converters deliver up to 780W/inch<SUP>3</SUP> of power (2007-05-21) [ Amplifying/Conditioning/Converting ]
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- Self-test memory system increases chip yield rate (2007-05-18) [ Design Test ]
- Power detector targets closed-loop 3G handset apps (2007-05-18) [ RF/Wireless ]
- Single-side momentary switches slide to the right (2007-05-18) [ Networking Design ]
- Car apps SoC promises more entertaining ride (2007-05-18) [ Embedded Systems ]
- Samsung unveils 8G LCD module prototype (2007-05-18) [ Optical Electronics and Display ]
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- Thermoelectric component adds new features (2007-05-18) [ Security Design ]
- Metal oxide resistors suit industrial power apps (2007-05-18) [ EMI/EMC Design ]
- Surface-mountable capacitors prevent surface arc-over (2007-05-18) [ EMI/EMC Design ]
- Battery charger delivers up to 500W in extreme setups (2007-05-18) [ Power Design ]
- Tool speeds up firmware debugging (2007-05-18) [ Embedded Systems ]
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- Redundant sensors boost safety in critical apps (2007-05-18) [ Sensor Technology ]
- Samsung LCD head cool to rare LG partnership (2007-05-18) [ Optical Electronics and Display ]
- Handheld sales keep downhill slide (2007-05-18) [ RF/Wireless ]
- Panel display market recovers from oversupply, price declines (2007-05-18) [ Optical Electronics and Display ]
- Silicon wafer shipments up slightly in Q1 (2007-05-18) [ Process/Manufacturing ]
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- Sun's Joy: Fighting global warming is profitable (2007-05-18) [ Power Design ]
- ST, SAES team on multi-axis MEMS gyroscopes (2007-05-18) [ Sensor Technology ]
- China okays TD-SCDMA rival standards (2007-05-18) [ RF/Wireless ]
- Cadence buys DFM startup from U.C. Berkeley (2007-05-18) [ EDA/IC Design ]
- Certification program for Wi-Fi draft 2.0 kicks off (2007-05-18) [ RF/Wireless ]
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- Sony in the red despite record-high sales (2007-05-18) [ Process/Manufacturing ]
- Microsoft wins partners for new home server (2007-05-18) [ Buffer/Storage ]
- China tech industry to reach $1.45T by 2010 (2007-05-18) [ Process/Manufacturing ]
- AMD Phenom, Barcelona quad-cores feature '10h' architecture (2007-05-17) [ Control Design ]
- Test suite minimizes probing damage (2007-05-17) [ Design Test ]
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- Step-down controller delivers very low duty cycles (2007-05-17) [ Power Design ]
- Programmable clock generators offer sub-75ps jitter (2007-05-17) [ Test/Packaging ]
- Scalable storage architectures support SAN (2007-05-17) [ Buffer/Storage ]
- LVDTs withstand high temperature, mild radiation (2007-05-17) [ Sensor Technology ]
- PCIe chips push decoder integration into PC-TVs (2007-05-17) [ Control Design ]
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- DC/DC converters reduce heat, component stress (2007-05-17) [ Amplifying/Conditioning/Converting ]
- Tools feature embedded cryptographic security (2007-05-17) [ Security Design ]
- Platforms upgrade custom IC, PCB design (2007-05-17) [ EDA/IC Design ]
- Multiport video decoders suit DVR security apps (2007-05-17) [ Security Design ]
- S/PDIF transceivers suppress jitter in audio band (2007-05-17) [ Amplifying/Conditioning/Converting ]
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- Akustica HD digital mics to go on show (2007-05-17) [ Digital Signal Processing ]
- Nokia scores $2.5B order from China Postel (2007-05-17) [ RF/Wireless ]
- Intel settles infringement spat with China firm (2007-05-17) [ Embedded Systems ]
- Taiwan inks MOU with NEC, Nortel, R&S for WiMAX (2007-05-17) [ RF/Wireless ]
- South Korean carrier readies HSUPA service (2007-05-17) [ RF/Wireless ]
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- Survey: Software piracy still hurts businesses (2007-05-17) [ Embedded Systems ]
- Apple patent filing hints touchscreen for iPods (2007-05-17) [ Optical Electronics and Display ]
- NXP, DSP Group merge cordless, VoIP terminals biz (2007-05-17) [ RF/Wireless ]
- TSMC to produce Spansion flash at 40nm, below (2007-05-17) [ Process/Manufacturing ]
- Cypress exits PSRAM, sells biz to Taiwan's ESMT (2007-05-17) [ Buffer/Storage ]
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- U.S. Senate bills seek to reform H-1B visa program (2007-05-17) [ EDA/IC Design ]
- R&D center for high-end packaging opens in Singapore (2007-05-17) [ Test/Packaging ]
- WiMAX rival to see action in Beijing Olympics (2007-05-17) [ RF/Wireless ]
- Linear Edge power amps enable longer talk-time (2007-05-16) [ RF/Wireless ]
- Chipmakers urge lower ESD target levels (2007-05-16) [ Test/Packaging ]
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- Look back, then peek into the future of test (2007-05-16) [ Test/Packaging ]
- Devising a system-level solution for EDA (2007-05-16) [ EDA/IC Design ]
- Avoid wireless USB pitfalls (2007-05-16) [ EDA/IC Design ]
- Opening doors to low-cost home security (2007-05-16) [ Sensor Technology ]
- Handy tips on embedded software development (2007-05-16) [ Embedded Systems ]
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- Analyze source code for Net app flaws (2007-05-16) [ Embedded Systems ]
- Multicore DSP targets China MP3 market (2007-05-16) [ Digital Signal Processing ]
- VoIP code supports handset protocols (2007-05-16) [ RF/Wireless ]
- QAM demodulator rolls for China cable TVs (2007-05-16) [ Amplifying/Conditioning/Converting ]
- Tool lowers system cost for handsets (2007-05-16) [ Networking Design ]
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- Renesas' Zigbee move signals shift in deals (2007-05-16) [ RF/Wireless ]
- Multicore spurs RTOS, tool revisions (2007-05-16) [ Embedded Systems ]
- Oozing robot mimics amoeba locomotion (2007-05-16) [ Sensor Technology ]
- Survey: Taiwan IC design aims for high-end CE (2007-05-16) [ EDA/IC Design ]
- Optical transceiver moves data at speed of light (2007-05-16) [ Optical Electronics and Display ]
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- Group pitches enhanced Ethernet for data centers (2007-05-16) [ Interface Design ]
- Lack of tools, expertise stalls multicore progress (2007-05-16) [ EDA/IC Design ]
- Foundries face obstacle course in 45nm race (2007-05-16) [ EDA/IC Design ]
- WiMAX SoC first to support 5.8GHz band (2007-05-16) [ Networking Design ]
- Switching power IC allows faster charge time (2007-05-16) [ Power Design ]
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- GbE PHY cuts package size by 60% (2007-05-16) [ Networking Design ]
- Solder paste with SACX alloy delivers high throughput (2007-05-16) [ Process/Manufacturing ]
- Notebook HDD provides 200Gbyte, encryption tech (2007-05-16) [ Buffer/Storage ]
- Discrete GPUs deliver immersive visual experience (2007-05-16) [ Control Design ]
- IC offers level shifting for data transfer in multivoltage systems (2007-05-16) [ Amplifying/Conditioning/Converting ]
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- Hybrid backplane eases migration from cPCI to CPCIe (2007-05-16) [ Control Design ]
- Current-sense amps handle small differential signals (2007-05-16) [ Amplifying/Conditioning/Converting ]
- Low-power IC design kit enables representative design (2007-05-16) [ EDA/IC Design ]
- LG.Philips comes out with A4 color e-paper (2007-05-16) [ Optical Electronics and Display ]
- MEMS sensor tracks down ultrasonic sound in air (2007-05-16) [ Sensor Technology ]
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- Software-centric path to FPGAs (2007-05-16) [ Programmable Logic ]
- Clamshell handset receives DVB-H TV programs (2007-05-15) [ RF/Wireless ]
- Intel Core 2 Duo spices up COM Express module (2007-05-15) [ Embedded Systems ]
- TFT LCD modules match industry-use requirements (2007-05-15) [ Optical Electronics and Display ]
- RF tuners handle digital radio, mobile TV (2007-05-15) [ RF/Wireless ]
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- Multicore MCUs operate up to 200MHz (2007-05-15) [ Control Design ]
- White LEDs showcase 280mcd luminous intensity (2007-05-15) [ Optical Electronics and Display ]
- USB 2.0 mux interfaces USB, non-USB devices (2007-05-15) [ Interface Design ]
- Low-cost current sense amplifier is versatile (2007-05-15) [ Amplifying/Conditioning/Converting ]
- I/P converter IC enables multivideo input (2007-05-15) [ Amplifying/Conditioning/Converting ]
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- Visible LED Lab solution evaluates LED specs (2007-05-15) [ Design Test ]
- Portable tester identifies ONTs on FTTx F2 fibers (2007-05-15) [ Test/Packaging ]
- Handheld DAQ device offers 100MBps recording speed (2007-05-15) [ Amplifying/Conditioning/Converting ]
- Chipset for cable modems supports Docsis 3.0 (2007-05-15) [ RF/Wireless ]
- CCID report: China consumers spent $92.15M for MP4 players in Q1 (2007-05-15) [ Amplifying/Conditioning/Converting ]
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- Taiwan notebook OEMs cool to Intel's Santa Rosa (2007-05-15) [ Process/Manufacturing ]
- Acer seeks suppliers' help in HP suit (2007-05-15) [ Embedded Systems ]
- Maxim exits standalone high-speed, high-res ADC market (2007-05-15) [ Amplifying/Conditioning/Converting ]
- Mosaid, LSI ink exclusive patent licensing agreement (2007-05-15) [ Embedded Systems ]
- Nokia first to offer energy-saving alerts on mobile phones (2007-05-15) [ Power Design ]
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- Dune, Bay Micro team on Carrier Ethernet design (2007-05-15) [ Networking Design ]
- CE sector boom could ease out small players, chip execs warn (2007-05-15) [ EDA/IC Design ]
- China earmarks $286M for local standards devt (2007-05-15) [ Buffer/Storage ]
- SMIC to buy $2B worth of fab gear from the U.S. (2007-05-15) [ Process/Manufacturing ]
- ST to explore fuel cell, plastic electronics markets (2007-05-15) [ Process/Manufacturing ]
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- Renesas seeks own platform for 32nm, beyond (2007-05-15) [ Process/Manufacturing ]
- DAQ takes advantage of Vista functionality (2007-05-14) [ Embedded Systems ]
- DDR2 IP and configurability (2007-05-14) [ EDA/IC Design ]
- Study: iPods not for heart patients (2007-05-14) [ EMI/EMC Design ]
- China software industry to reach $143B by 2010 (2007-05-14) [ Embedded Systems ]
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- European taxpayers to finance Galileo project (2007-05-14) [ RF/Wireless ]
- Intel Capital to invest $31M in six companies (2007-05-14) [ EDA/IC Design ]
- Ericsson ready for new era of global comms, says CEO (2007-05-14) [ RF/Wireless ]
- Epson Toyocom sets up new plants in Thailand, China (2007-05-14) [ Process/Manufacturing ]
- ADI appoints Avnet as first pan-Asian distributor (2007-05-14) [ Process/Manufacturing ]
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- Bill Gates: Address parallel programming in multicores (2007-05-14) [ Embedded Systems ]
- Google-inspired eye tracker counts every look (2007-05-14) [ Sensor Technology ]
- TI takes single-chip cellphone offerings to 65nm (2007-05-14) [ RF/Wireless ]
- Component, assembly markets weaken this year (2007-05-14) [ Process/Manufacturing ]
- W-CDMA handsets to drive DSP growth till 2011 (2007-05-14) [ RF/Wireless ]
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- 65nm DTV chip handles VSB, QAM signals (2007-05-14) [ RF/Wireless ]
- Class-D amplifier guarantees 90% efficiency (2007-05-14) [ Amplifying/Conditioning/Converting ]
- Test software enables enterprise-wide collaboration (2007-05-14) [ Test/Packaging ]
- 200V ICs target low-voltage motor drive apps (2007-05-14) [ Control Design ]
- Wireless sensor network node features Zigbee support (2007-05-14) [ Sensor Technology ]
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- CSR concocts Bluetooth radio-flash union for headsets (2007-05-14) [ Buffer/Storage ]
- Image controller IC props vehicle-mounted cameras (2007-05-14) [ Control Design ]
- UV laser promises high reliability for 24/7 industrial apps (2007-05-14) [ Process/Manufacturing ]
- LED package delivers high luminance, wide viewing angle (2007-05-14) [ Test/Packaging ]
- Rectifiers offer up to 85% higher reverse avalanche energy rating (2007-05-14) [ Amplifying/Conditioning/Converting ]
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- Video platform supports analog HD/SD input/output (2007-05-14) [ Amplifying/Conditioning/Converting ]
- 'Personality modules' shape signal-conditioning systems (2007-05-14) [ Amplifying/Conditioning/Converting ]
- Establishing mobile security (2007-05-14) [ Sensor Technology ]
- Designing high-performance automotive electronics (2007-05-14) [ Embedded Systems ]
- Simplify device data replication, synchronization (2007-05-14) [ Embedded Systems ]
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- Mobile TV to push gaming, music in the shadows (2007-05-11) [ RF/Wireless ]
- IBM to spend $1B for greener computing centers (2007-05-11) [ Power Design ]
- Samsung bests rivals in Q1 NOR flash sales (2007-05-11) [ Buffer/Storage ]
- EU Galileo project may be facing dead end (2007-05-11) [ RF/Wireless ]
- China inks $4.3B tech purchase with U.S. (2007-05-11) [ Process/Manufacturing ]
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- Osram to put up LED wafer fab in Malaysia (2007-05-11) [ Process/Manufacturing ]
- Philips to offload TSMC shares (2007-05-11) [ Process/Manufacturing ]
- CMO charges LG Philips of patent infringement (2007-05-11) [ Optical Electronics and Display ]
- Agilent, Mentor team on automotive network design (2007-05-11) [ EDA/IC Design ]
- Intel's Santa Rosa chip drives mobile connectivity (2007-05-11) [ RF/Wireless ]
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- ST cuts shares, Hynix invests more in China fab JV (2007-05-11) [ Process/Manufacturing ]
- Sun tips Java for iPhone clone (2007-05-11) [ Embedded Systems ]
- NI MATRIXx 8.0 delivers project-based development env't (2007-05-11) [ EDA/IC Design ]
- Ultracompact LEDs consume less than 50% energy (2007-05-11) [ Optical Electronics and Display ]
- Nonvolatile DCPs function from -40°C to 125°C (2007-05-11) [ Control Design ]
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- Direct step down from 60V for this controller (2007-05-11) [ Power Design ]
- Real-time clocks feature nonvolatile FRAM (2007-05-11) [ Test/Packaging ]
- Puma 5 cable modem chip jumps on Docsis 3.0 shift (2007-05-11) [ Amplifying/Conditioning/Converting ]
- ST reports 65nm multistandard HDD physical layer IP (2007-05-11) [ Process/Manufacturing ]
- Overclocking memory modules provide EPP support (2007-05-11) [ Buffer/Storage ]
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- Small LED drivers target portable apps (2007-05-11) [ Optical Electronics and Display ]
- Fiber patch cables roll with low-smoke zero-halogen jacket (2007-05-11) [ Optical Electronics and Display ]
- PCB design environment supports high-speed devices (2007-05-11) [ EDA/IC Design ]
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