• Alps touts thinnest header-type connector for microSD cards (2007-04-30) [ Networking Design ]
• LabVIEW SignalExpress simplifies data logging, instrument control (2007-04-30) [ Design Test ]
• Power amp cuts system-level cost in Wi-Fi apps (2007-04-30) [ RF/Wireless ]
• High-density interconnects support 92 signal pairs (2007-04-30) [ Networking Design ]
• DIO cards feature 128 opto-isolated channels (2007-04-30) [ Interface Design ]

• Microchip unveils sub-microampere op amps (2007-04-30) [ Amplifying/Conditioning/Converting ]
• LSI combines USB/SD host, MP3 decoder, system controller (2007-04-30) [ Buffer/Storage ]
• Dual comparator suits power-sensitive apps (2007-04-30) [ Power Design ]
• X-ray inspection system delivers high-throughput 3D coverage (2007-04-30) [ Process/Manufacturing ]
• High-current inductor comes in small package (2007-04-30) [ Power Design ]

• Mobile TV receiver has multistandard baseband (2007-04-30) [ RF/Wireless ]
• TI offers free downloadable Zigbee stack (2007-04-30) [ RF/Wireless ]
• Cell-powered mainframes to create virtual world apps (2007-04-30) [ Embedded Systems ]
• Corning to bring Gen 8 capability to Taiwan (2007-04-30) [ Process/Manufacturing ]
• Sony PlayStation inventor retires from executive post (2007-04-30) [ Digital Signal Processing ]

• For the meantime, $100 laptop costs $75 more (2007-04-30) [ Digital Signal Processing ]
• BenQ spins off branded business (2007-04-30) [ Process/Manufacturing ]
• Samsung to run WiBro trial for U.S. military (2007-04-30) [ RF/Wireless ]
• Hynix to construct 12-inch wafer facility in Cheongju (2007-04-30) [ Process/Manufacturing ]
• Funding from Google, Intel, Microsoft spices up robot 'recipes' (2007-04-30) [ Programmable Logic ]

• ISO acknowledges South Korea's mobile RFID technology (2007-04-30) [ RF/Wireless ]
• Philips division spins off semiconductor IP supplier (2007-04-30) [ EDA/IC Design ]
• Mobile WiMAX fueling growth of chipset market (2007-04-30) [ RF/Wireless ]
• China's IT growth slows in Q1; comeback seen ahead (2007-04-30) [ Process/Manufacturing ]
• Acer recalls 27,000 Sony-made laptop batteries (2007-04-27) [ Power Design ]

• IMI opens subsidiary in Tokyo (2007-04-27) [ EDA/IC Design ]
• SanDisk, Qimonda to develop MCPs for mobile apps (2007-04-27) [ Buffer/Storage ]
• Intel, Micron sample 50nm multilevel cell NAND flash (2007-04-27) [ Buffer/Storage ]
• AUO denies plans for 8G LCD plant (2007-04-27) [ Process/Manufacturing ]
• Qimonda expands Asia footprint with 300mm facility (2007-04-27) [ Process/Manufacturing ]

• New science center to highlight South Korea's R&D efforts (2007-04-27) [ Embedded Systems ]
• VC firm boosts presence in China, creates $360 million fund (2007-04-27) [ RF/Wireless ]
• Study: MEMS market poised for solid growth (2007-04-27) [ Sensor Technology ]
• iSuppli downgrades forecast for CE market to 3.6% (2007-04-27) [ Digital Signal Processing ]
• New notebook battery guidelines move to IEC (2007-04-27) [ Power Design ]

• Dell offers flash drive option in its laptops (2007-04-27) [ Buffer/Storage ]
• Hitachi unrolls three enterprise-class hard drives (2007-04-27) [ Buffer/Storage ]
• 32bit MCU enables 3-phase motor control in one chip (2007-04-27) [ Control Design ]
• Atmel intros $69 AVR32 kit with full Linux support (2007-04-27) [ Embedded Systems ]
• DC/DC controller eases flyback converter design (2007-04-27) [ Power Design ]

• ATX reference design meets Energy Star specs (2007-04-27) [ EDA/IC Design ]
• TI, Techwell team on low-cost DVR security tech (2007-04-27) [ Security Design ]
• Low-cost in-circuit test system targets CE, PC motherboards (2007-04-27) [ Design Test ]
• New Fusiv processors suit residential gateways (2007-04-27) [ Embedded Systems ]
• Photomicrosensors detect motion, position (2007-04-27) [ Sensor Technology ]

• Industrial-grade LCD features wide viewing cone (2007-04-27) [ Optical Electronics and Display ]
• Metering IC features embedded flash memory (2007-04-27) [ Embedded Systems ]
• Handset tunes in to One-Seg DTV (2007-04-26) [ RF/Wireless ]
• DC/DC controller supports single-, dual-output operation (2007-04-26) [ Power Design ]
• Four-channel power managers suit CE apps (2007-04-26) [ Power Design ]

• Evaluation kits address motion detection, port expansion (2007-04-26) [ EDA/IC Design ]
• High-speed digital I/O modules offer connector type options (2007-04-26) [ Embedded Systems ]
• UV sensor packs analog voltage output in a single chip (2007-04-26) [ Sensor Technology ]
• USB 2.0 connector features 10.5mm profile (2007-04-26) [ Networking Design ]
• Rotary pot withstands harsh industrial environs (2007-04-26) [ Amplifying/Conditioning/Converting ]

• Fujitsu's 'Jade' targets automotive graphics apps (2007-04-26) [ Embedded Systems ]
• Occupant sensors deliver improved accuracy (2007-04-26) [ Sensor Technology ]
• T-Spice simulator promises up to 80% faster runtimes (2007-04-26) [ EDA/IC Design ]
• Freescale unveils tool for Symphony audio DSPs (2007-04-26) [ EDA/IC Design ]
• MOSFETs reduce heat in servers, notebook PCs (2007-04-26) [ Power Design ]

• Chip enhances LIN-based in-vehicle networking (2007-04-26) [ Embedded Systems ]
• China to put up fund to help local LCD firms (2007-04-26) [ Optical Electronics and Display ]
• Blu-ray Disc sales surpassed 1 million mark (2007-04-26) [ Optical Electronics and Display ]
• Digital camera market to shrink by 2011 (2007-04-26) [ Optical Electronics and Display ]
• LG to deliver handsets with tactile feature (2007-04-26) [ RF/Wireless ]

• Report: DRAM prices may soon hit bottom (2007-04-26) [ Buffer/Storage ]
• RFMD Shanghai facility to include R&D (2007-04-26) [ Process/Manufacturing ]
• China cautions U.S. piracy complaint will damage trade ties (2007-04-26) [ EDA/IC Design ]
• Hitachi files PDP patent infringement suit against LG (2007-04-26) [ Optical Electronics and Display ]
• Elpida reports 103% sales growth in '06 (2007-04-26) [ Buffer/Storage ]

• DSP market to see moderate growth this year (2007-04-26) [ Digital Signal Processing ]
• Sony joins blue-violet laser market (2007-04-26) [ Process/Manufacturing ]
• iSuppli lowers 2007 chip forecast to 8.1% (2007-04-26) [ Process/Manufacturing ]
• TI revenue drops 8% in Q1 (2007-04-25) [ Digital Signal Processing ]
• Q1 handset shipments miss 20% growth mark (2007-04-25) [ RF/Wireless ]

• Huawei, Symantec to establish joint venture (2007-04-25) [ RF/Wireless ]
• Motion sensor-equipped cellphones elevate gaming to next level (2007-04-25) [ Sensor Technology ]
• Motorola acquires video processing company for $140M (2007-04-25) [ Amplifying/Conditioning/Converting ]
• Samsung develops 'first' all-DRAM stacked package using TSV tech (2007-04-25) [ Test/Packaging ]
• Common Platform partners deliver 65nm reference flow (2007-04-25) [ EDA/IC Design ]

• TSMC's IP moves stir up concern among providers (2007-04-25) [ EDA/IC Design ]
• IT forum to bring together North, South Korea (2007-04-25) [ Digital Signal Processing ]
• Akita Elpida claims densest multichip package (2007-04-25) [ Test/Packaging ]
• Microchip inaugurates new design center in Romania (2007-04-25) [ Control Design ]
• IBM researchers tout highest resolution MRI (2007-04-25) [ Process/Manufacturing ]

• Packet transport network tech offers high reliability (2007-04-25) [ Networking Design ]
• Fujitsu ships 5.8GHz WiMAX baseband chip (2007-04-25) [ RF/Wireless ]
• SIM card connector suits Japan's mobile number portability service (2007-04-25) [ Networking Design ]
• 3.5-inch SBC features ultralow-power processor (2007-04-25) [ Embedded Systems ]
• TI unrolls early development ecosystem for LTE (2007-04-25) [ EDA/IC Design ]

• Secure MCUs roll for 2.5G, 3G mobile SIM cards (2007-04-25) [ Security Design ]
• Wintegra intros single-chip mobile WiMAX processor (2007-04-25) [ RF/Wireless ]
• Microwave spectrum analyzers measure 9kHz to 20GHz signals (2007-04-25) [ RF/Wireless ]
• Device-native verification tool rolls for FPGAs (2007-04-25) [ EDA/IC Design ]
• AMD boosts Barcelona integer performance (2007-04-25) [ Embedded Systems ]

• WiMAX front-end module targets 4G applications (2007-04-25) [ RF/Wireless ]
• Data-management platform enables scalable, collaborative IC design (2007-04-24) [ EDA/IC Design ]
• Optically coupled isolators offer 6kVdc isolation (2007-04-24) [ EMI/EMC Design ]
• Buck-boost DC/DC is qualified for automotives (2007-04-24) [ Power Design ]
• Synthesis solution boosts IC performance (2007-04-24) [ EDA/IC Design ]

• IRC expands resistance, size of thin-film resistors (2007-04-24) [ Amplifying/Conditioning/Converting ]
• Multipin plug/socket suits portable audio devices (2007-04-24) [ Networking Design ]
• WiMAX transceiver minimizes component count (2007-04-24) [ RF/Wireless ]
• 32bit MCU suits motor-control home appliances (2007-04-24) [ Control Design ]
• Renesas rolls multicore sol'n for embedded apps (2007-04-24) [ Embedded Systems ]

• Audio processor supports next-gen DVD formats (2007-04-24) [ Amplifying/Conditioning/Converting ]
• In-car GPS features dead-reckoning tech (2007-04-24) [ Sensor Technology ]
• White LED drivers suit dual-display phones (2007-04-24) [ Optical Electronics and Display ]
• Omron unveils TOSA/ROSA for HD video market (2007-04-24) [ Optical Electronics and Display ]
• Report: Taiwan should reassess chip regulation with China (2007-04-24) [ Process/Manufacturing ]

• Microsoft to set up R&D parks in China, says Gates (2007-04-24) [ Process/Manufacturing ]
• GNOME initiative eyes mobile phone, embedded apps (2007-04-24) [ Programmable Logic ]
• SunPower to invest $570M in Philippine facility (2007-04-24) [ Process/Manufacturing ]
• Agilent opens headquarters campus, open lab in China (2007-04-24) [ Test/Packaging ]
• Mobile phone market continues to grow, reports IDC (2007-04-24) [ RF/Wireless ]

• China to remain neutral on 3G licensing (2007-04-24) [ RF/Wireless ]
• Waning wired broadband adoption to push wireless growth (2007-04-24) [ RF/Wireless ]
• IBM-austriamicro project zeroes in on HV process (2007-04-24) [ Process/Manufacturing ]
• Japan groups tip safety guidelines for Li-ion batteries (2007-04-24) [ Power Design ]
• AMD is nearly out of cash, warns analyst (2007-04-24) [ Control Design ]

• Price pressure pulls down Nokia's profit (2007-04-24) [ Process/Manufacturing ]
• DFD bridges gap between system validation engineer, designer (2007-04-23) [ Embedded Systems ]
• Renesas unveils contactless smart card MCU (2007-04-23) [ Control Design ]
• 32bit RISC-based MCU targets automotive, industrial apps (2007-04-23) [ Control Design ]
• Ultrathin boost converter delivers 87% efficiency (2007-04-23) [ Power Design ]

• 2.7-inch QVGA TFT LCD delivers high luminance (2007-04-23) [ Optical Electronics and Display ]
• Open-frame DC/DCs offer floating dual outputs (2007-04-23) [ Power Design ]
• Micro-USB connectors enable sleeker portables (2007-04-23) [ Networking Design ]
• Sensor cuts image blurring in camera phones (2007-04-23) [ Sensor Technology ]
• TI intros 200mA LDOs for battery-run portables (2007-04-23) [ Power Design ]

• Tool accelerates fixed-point MATLAB algorithms (2007-04-23) [ EDA/IC Design ]
• PMC-Sierra announces enterprise-class SAS/SATA controllers (2007-04-23) [ Buffer/Storage ]
• PCIe card-edge connectors feature SMT retention clips (2007-04-23) [ Digital Signal Processing ]
• 2.4GHz amp supports 802.11b/g apps (2007-04-23) [ Amplifying/Conditioning/Converting ]
• Samsung, Microsoft ink patent licensing pact (2007-04-23) [ Embedded Systems ]

• PC shipments up 9% in Q1, Gartner says (2007-04-23) [ Process/Manufacturing ]
• Europe's AVC STB market to flourish, says report (2007-04-23) [ Optical Electronics and Display ]
• PIDA: Taiwan dominates blue LED chip capacity segment (2007-04-23) [ Test/Packaging ]
• China to open bidding for 3G handsets (2007-04-23) [ RF/Wireless ]
• India's foreign direct investment up threefold in '06 (2007-04-23) [ Process/Manufacturing ]

• Report: China, India to lead mobile market growth by 2011 (2007-04-23) [ RF/Wireless ]
• Lenovo global workforce reduction to reach 1,400 (2007-04-23) [ Embedded Systems ]
• Gartner trims outlook on capital equipment spending (2007-04-23) [ Process/Manufacturing ]
• Infineon to acquire 'some equity' in HSMC (2007-04-23) [ Process/Manufacturing ]
• Another Samsung exec pleads guilty in DRAM scandal (2007-04-23) [ Process/Manufacturing ]

• US electronics industry backs calls for H-1B visa increase (2007-04-23) [ Process/Manufacturing ]