• Samsung touts 'smallest' 8Mpixel CIS (2007-03-30) [ Sensor Technology ]
• GC-DFB features high optical reflection tolerance (2007-03-30) [ Optical Electronics and Display ]
• ST reduces package size of serial EEPROM line (2007-03-30) [ Test/Packaging ]
• Digital transistors integrate resistors, save space (2007-03-30) [ Amplifying/Conditioning/Converting ]
• Thermocouple sensor measures extreme temperatures in heavy industries (2007-03-30) [ Design Test ]

• Optical transceiver operates in -40°C-85°C range (2007-03-30) [ Optical Electronics and Display ]
• Zigbee platform supports up to 20yrs battery life (2007-03-30) [ RF/Wireless ]
• Tool eases integration of third-party FPGA cores (2007-03-30) [ EDA/IC Design ]
• Ultracompact LED suits mobile phone keypads (2007-03-30) [ Optical Electronics and Display ]
• Ref design cuts time-to-market for DVB-C STBs (2007-03-30) [ EDA/IC Design ]

• Chipset makes global smartphones affordable (2007-03-30) [ RF/Wireless ]
• Zigbee ref design eliminates antenna, RF balun (2007-03-30) [ EDA/IC Design ]
• Hitachi bares manufacturing consolidation plans (2007-03-30) [ Process/Manufacturing ]
• On TD-SCDMA: Let carriers choose, says U.S. official (2007-03-30) [ RF/Wireless ]
• HP files patent infringement case vs. Acer (2007-03-30) [ EDA/IC Design ]

• SK Telecom's HSDPA service goes nationwide (2007-03-30) [ RF/Wireless ]
• ST, China ICT to co-develop Loongson-based chips (2007-03-30) [ Embedded Systems ]
• NEC, Avnet partner on gate arrays (2007-03-30) [ EDA/IC Design ]
• Freescale-Tilcon tandem eyes telematics sol'ns (2007-03-30) [ Optical Electronics and Display ]
• Xilinx to offer training program for China's IC designers (2007-03-30) [ Programmable Logic ]

• A 2H rendezvous for Intel's 45nm chips (2007-03-30) [ Process/Manufacturing ]
• ARC signs key licensing pacts in Asia (2007-03-30) [ EDA/IC Design ]
• MIPS grants license to ST, expands China research center (2007-03-30) [ Embedded Systems ]
• Femtocells pose threat to VoWi-Fi deployment (2007-03-30) [ Buffer/Storage ]
• EE Times-Taiwan: 2007 Embedded Systems Development Survey (2007-03-30) [ Embedded Systems ]

• EE Times-Korea: 2007 Embedded Systems Development Survey (2007-03-30) [ Embedded Systems ]
• EE Times-China: 2007 Embedded Systems Development Survey (2007-03-30) [ Embedded Systems ]
• EE Times-Asia: 2007 Embedded Systems Development Survey (2007-03-30) [ Embedded Systems ]
• NEC extends 10Gbps XFP transceiver reach to 160km (2007-03-29) [ RF/Wireless ]
• Triplexer transceiver platform rolls for FTTH apps (2007-03-29) [ Optical Electronics and Display ]

• TI makes GPS affordable in mobile phones (2007-03-29) [ RF/Wireless ]
• Blue-violet laser diodes eye combo DVD players (2007-03-29) [ Optical Electronics and Display ]
• Real-time clock module enables effective DRM (2007-03-29) [ Security Design ]
• Kemet upgrades Spice modeling software (2007-03-29) [ EDA/IC Design ]
• White LED promises up to 50,000hrs operation (2007-03-29) [ Optical Electronics and Display ]

• Single-chip tuner targets DVB-C STB apps (2007-03-29) [ Digital Signal Processing ]
• Symbian supports ARM Cortex in smartphones (2007-03-29) [ Embedded Systems ]
• Samsung offers 64Gbyte solid-state drive for ultraportables (2007-03-29) [ Buffer/Storage ]
• Liquid level sensors target production equipment (2007-03-29) [ Sensor Technology ]
• Tiny dual-band RF transceiver supports WiMAX, Wi-Fi (2007-03-29) [ RF/Wireless ]

• InRob to finalize acquisition of Philippine facility (2007-03-29) [ Process/Manufacturing ]
• Firms ink MSA for 40Gbps optical transceivers (2007-03-29) [ Optical Electronics and Display ]
• HDD capacity, market to outpace flash (2007-03-29) [ Buffer/Storage ]
• Study reveals need for apt VoIP tools (2007-03-29) [ RF/Wireless ]
• Infineon licenses 130nm CMOS tech to HSMC (2007-03-29) [ Process/Manufacturing ]

• RapidIO 1.3 spec passes as new ANSI standard (2007-03-29) [ EDA/IC Design ]
• ISSI puts up sales offices in Singapore, India (2007-03-29) [ Process/Manufacturing ]
• Chirp spread spectrum gains momentum (2007-03-29) [ RF/Wireless ]
• Samsung exec sees a stable memory market (2007-03-29) [ Buffer/Storage ]
• Rural China will be a critical market for optical comms (2007-03-29) [ Optical Electronics and Display ]

• TSMC to start 55nm prototyping service this May (2007-03-29) [ Process/Manufacturing ]
• Konica Minolta partners with GE on OLED lighting (2007-03-29) [ Optical Electronics and Display ]
• Broadband talk still reigns at CTIA (2007-03-28) [ RF/Wireless ]
• Researchers develop driverless car prototype (2007-03-28) [ Sensor Technology ]
• Hitachi to produce plasma TVs in Malaysia (2007-03-28) [ Process/Manufacturing ]

• ABI: It's quality vs. quantity for Qualcomm, Nokia (2007-03-28) [ RF/Wireless ]
• Judge rules in favor of O2Micro on patent suit (2007-03-28) [ Power Design ]
• Silicon Labs sells Aero line to NXP (2007-03-28) [ Process/Manufacturing ]
• Sugar-powered fuel cells, anyone? (2007-03-28) [ Power Design ]
• NXP registers Q4 net loss of $810 million (2007-03-28) [ Process/Manufacturing ]

• Is SMIC searching for private equity partners? (2007-03-28) [ Process/Manufacturing ]
• TSMC widens lead over other foundries (2007-03-28) [ Process/Manufacturing ]
• BenQ rejects $634M claim from bankrupt German mobile unit (2007-03-28) [ RF/Wireless ]
• The other side of the wafer [fab craze] (2007-03-28) [ Process/Manufacturing ]
• RS-485 transceivers need no control channel (2007-03-28) [ RF/Wireless ]

• DC/DC converters drive LEDs at constant current (2007-03-28) [ Optical Electronics and Display ]
• Azimuth performance tester targets FMC devices (2007-03-28) [ Design Test ]
• IBM unveils 'breakthrough' optical transceiver (2007-03-28) [ Optical Electronics and Display ]
• 10Gbps EML driver IC claims lowest power draw (2007-03-28) [ Optical Electronics and Display ]
• DTV middleware offers PVR, interactive functions (2007-03-28) [ Optical Electronics and Display ]

• 32Mbit NOR flash is certified for automotive apps (2007-03-28) [ Buffer/Storage ]
• EV-DO chipset handles 9.3Mbps over 5MHz (2007-03-28) [ RF/Wireless ]
• Next-gen SteelVines chips offer alternatives (2007-03-28) [ Buffer/Storage ]
• Touch-sensing ICs suit medical apps (2007-03-28) [ Sensor Technology ]
• Subsystem IP delivers complete USB solution (2007-03-28) [ Interface Design ]

• Tool taps clock gating for IC power optimization (2007-03-28) [ EDA/IC Design ]
• It's a four-way battle for the backplane (2007-03-27) [ Networking Design ]
• It's official: Intel to build 300mm wafer fab in China (2007-03-27) [ Process/Manufacturing ]
• South Korea to implement e-passport system in '08 (2007-03-27) [ Security Design ]
• Tech group submits modeling spec to W3C (2007-03-27) [ Embedded Systems ]

• UMC taps Ulvac for solar cell biz (2007-03-27) [ Process/Manufacturing ]
• On Semi, Hisense co-establish power lab (2007-03-27) [ Optical Electronics and Display ]
• NXP to close a German facility, open lab in China (2007-03-27) [ Test/Packaging ]
• No mobile phone from Google (2007-03-27) [ RF/Wireless ]
• Samsung to invest $5.99B in China (2007-03-27) [ Process/Manufacturing ]

• In-flight phoning: FCC snubs, Europe replies (2007-03-27) [ RF/Wireless ]
• The dilemma of two languages in low-power design (2007-03-27) [ EDA/IC Design ]
• US 'revising' tech export policy (2007-03-27) [ Process/Manufacturing ]
• EDA industry grew 11% in 2006, says report (2007-03-27) [ EDA/IC Design ]
• Audio processors promise optimum performance (2007-03-27) [ Amplifying/Conditioning/Converting ]

• WLED driver features integrated Schottky diode (2007-03-27) [ Optical Electronics and Display ]
• Digipot integrates temperature sensor, ADC, LUT (2007-03-27) [ Interface Design ]
• Optek, IRC develop LED design kit for solid-state lighting (2007-03-27) [ Optical Electronics and Display ]
• STB chip integrates demodulator, MPEG decoder (2007-03-27) [ Amplifying/Conditioning/Converting ]
• Stepper motor card offers fast control, smooth motion (2007-03-27) [ Embedded Systems ]

• Microprocessors integrate Ethernet controller, USB connectivity (2007-03-27) [ Interface Design ]
• Digital controllers target time/temperature apps (2007-03-27) [ Control Design ]
• EMI filters double ESD protection, cut PCB space (2007-03-27) [ EMI/EMC Design ]
• GaN HEMTs boost WiMAX power amplification (2007-03-27) [ Amplifying/Conditioning/Converting ]
• Pre-standard 802.3at PoE chips deliver 36W (2007-03-27) [ Networking Design ]

• Nano-ITX mainboard tailored for compact CE (2007-03-27) [ Embedded Systems ]
• Samsung takes interesting route in media player race (2007-03-26) [ Optical Electronics and Display ]
• Semicon foundries fret over the downturn (2007-03-26) [ Process/Manufacturing ]
• Implement effective design data management (2007-03-26) [ Embedded Systems ]
• Growth defines China's smartphone, display markets (2007-03-26) [ RF/Wireless ]

• Philips, Swarovski to deliver 'fashionable' electronics (2007-03-26) [ Interface Design ]
• New policy offers lifetime support for Korean scientists, engineers (2007-03-26) [ Process/Manufacturing ]
• Nokia to open research center in Transylvania (2007-03-26) [ Process/Manufacturing ]
• Winbond sells 200mm fab for $251M (2007-03-26) [ Process/Manufacturing ]
• India counts on IC policy to attract foreign investments (2007-03-26) [ Process/Manufacturing ]

• Survey reveals execs confident about IC market, China (2007-03-26) [ Process/Manufacturing ]
• Autosar partners roll 2.1 specs (2007-03-26) [ Embedded Systems ]
• Japanese association compiles global electronics production statistics (2007-03-26) [ Process/Manufacturing ]
• Hitachi to consolidate manufacturing, cut 4,500 jobs (2007-03-26) [ Buffer/Storage ]
• PA cuts battery drain in mobile WiMAX terminals (2007-03-26) [ RF/Wireless ]

• RadioPulse intros 2.4GHz Zigbee RF module (2007-03-26) [ RF/Wireless ]
• Toshiba offers LED-backlit LCDs for notebooks (2007-03-26) [ Optical Electronics and Display ]
• Standalone battery charger draws power from wall adapter, USB (2007-03-26) [ Power Design ]
• Evaluation board eases PFC module testing (2007-03-26) [ Design Test ]
• Power manager allows system operation while charging (2007-03-26) [ Power Design ]

• SMK claims 'shortest' slide switch for portables (2007-03-26) [ Networking Design ]
• Interface IC eyes high-volume multisensor apps (2007-03-26) [ Sensor Technology ]
• TFT-LCD display has digital RGB TTL interface (2007-03-26) [ Optical Electronics and Display ]
• MCUs suit embedded motion control applications (2007-03-26) [ Embedded Systems ]
• Transducers operate from one 5V power supply (2007-03-26) [ Amplifying/Conditioning/Converting ]

• NXP readies 'smallest' Wi-Fi chip (2007-03-26) [ RF/Wireless ]
• Emerson unveils 300W, 642W bus converters (2007-03-23) [ Power Design ]
• NXP announces power-saving bipolar transistors (2007-03-23) [ RF/Wireless ]
• Equalizer extends DVI, HDMI cable reach (2007-03-23) [ Networking Design ]
• ADSL2+ SoC for CPE rolls for emerging markets (2007-03-23) [ Embedded Systems ]

• VoIP processors support various storage types (2007-03-23) [ Embedded Systems ]
• Power-management ICs offer integrated charger (2007-03-23) [ Power Design ]
• Rohm touts 'smallest' Zener, Schottky diodes (2007-03-23) [ Power Design ]
• Video switch supports SD, ED, HD resolutions (2007-03-23) [ Optical Electronics and Display ]
• Fast-recovery diodes suit 500/600V medical apps (2007-03-23) [ Power Design ]

• Kit enhances voice quality in hands-free apps (2007-03-23) [ Embedded Systems ]
• NKK unveils tiny electromechanical switches (2007-03-23) [ Networking Design ]
• Enhanced LEDs deliver warm white indoor lighting (2007-03-23) [ Optical Electronics and Display ]
• UWB platform approved as ISO/IEC standard (2007-03-23) [ RF/Wireless ]
• China's MII to take advantage of 3G development, says official (2007-03-23) [ RF/Wireless ]

• Broadcom urges import ban on phones with Qualcomm chips (2007-03-23) [ RF/Wireless ]
• Dell delivers low-cost desktop PCs to China (2007-03-23) [ Process/Manufacturing ]
• SanDisk, Hynix ink NAND joint venture project (2007-03-23) [ Buffer/Storage ]
• Applied Materials to build $83M devt center in China (2007-03-23) [ Process/Manufacturing ]
• NAND flash up in March (2007-03-23) [ Process/Manufacturing ]

• Micron opens first China manufacturing facility (2007-03-23) [ Process/Manufacturing ]
• Malaysian fabless firm ponders U.K., U.S. design centers (2007-03-23) [ RF/Wireless ]
• Hope fades for IC power standards union (2007-03-23) [ Power Design ]
• Intel invests $40M in Legend Silicon (2007-03-23) [ Optical Electronics and Display ]
• Get your own Apple TV for $299 (2007-03-23) [ Optical Electronics and Display ]

• Hittite unveils MMIC LNA, frequency multiplier (2007-03-22) [ RF/Wireless ]
• Back to the BenQ brand for handsets (2007-03-22) [ RF/Wireless ]
• Probe set for MS-Alcatel-Lucent patent fray (2007-03-22) [ Embedded Systems ]
• Hitachi puts removable drives in HDTVs (2007-03-22) [ Optical Electronics and Display ]
• Taiwan okays TSMC's 0.18µm move to China (2007-03-22) [ Process/Manufacturing ]

• EU commissioner's DVB-H pick criticized (2007-03-22) [ RF/Wireless ]
• Freescale opens new design house in India (2007-03-22) [ Process/Manufacturing ]
• Guessing game: Will Intel build a 90nm fab in China? (2007-03-22) [ Process/Manufacturing ]
• China firm eyes One Laptop per Child project (2007-03-22) [ Digital Signal Processing ]
• No more patent discord for Toshiba and Hynix (2007-03-22) [ Buffer/Storage ]

• Taiwan's Inotera to built more 12inch fabs, to spend $6B (2007-03-22) [ Process/Manufacturing ]
• Qualcomm: Nokia complaints a 'maneuver to delay judicial determinations' (2007-03-22) [ RF/Wireless ]
• 10Gbps optical receivers suit XMD-MSA apps (2007-03-22) [ Optical Electronics and Display ]
• Tundra offers RapidIO Endpoint IP for license (2007-03-22) [ Interface Design ]
• MCU family offers flexibility for automotive apps (2007-03-22) [ Control Design ]

• RF spectrum analyzer targets cost-sensitive apps (2007-03-22) [ Design Test ]
• DC/DC converter transformers roll for PoE apps (2007-03-22) [ Power Design ]
• SMK develops Type B Micro-USB connectors (2007-03-22) [ Networking Design ]
• Sensor interface offers six user-configurable I/O channels (2007-03-22) [ Sensor Technology ]
• FPGAs feature ARM soft processor core (2007-03-22) [ Programmable Logic ]

• PCIe devices manage comms in bladed systems (2007-03-22) [ Interface Design ]
• Digital pot offers one-time wiper programmability (2007-03-22) [ Interface Design ]
• 1.8V TCXO aids in miniaturization of GPS designs (2007-03-21) [ RF/Wireless ]
• TI DSPs deliver 4800MMACs for telecom apps (2007-03-21) [ Digital Signal Processing ]
• AVR flash MCUs roll for high-volume USB apps (2007-03-21) [ Interface Design ]

• MIPS-based platform enables advanced PON apps (2007-03-21) [ Networking Design ]
• Programmable fuel gauge suits 1- or 2-cell apps (2007-03-21) [ Design Test ]
• Pickering intros PXI solid-state multiplexers (2007-03-21) [ RF/Wireless ]
• Wi-Fi radio ref platform enables $79 audio systems (2007-03-21) [ RF/Wireless ]
• MEMS flow sensors target medical apps (2007-03-21) [ Sensor Technology ]

• IP solutions enable low-cost multimedia devices (2007-03-21) [ RF/Wireless ]
• High-directivity coupler offers ultra-tight tolerance (2007-03-21) [ RF/Wireless ]
• 1.1GHz TV tuners support MoCA home net specs (2007-03-21) [ Amplifying/Conditioning/Converting ]
• Connectivity platform suits emerging mobile apps (2007-03-21) [ Interface Design ]
• Chin-Poon sells Suzhou plant (2007-03-21) [ Process/Manufacturing ]

• Malaysia rolls 2.3GHz broadband exercise (2007-03-21) [ RF/Wireless ]
• Samsung, TI team on nex-gen HD A/V networking suites (2007-03-21) [ Embedded Systems ]
• Is a Google phone in the works? (2007-03-21) [ RF/Wireless ]
• Xantrex, SPTD partner on 'green' electronics facility (2007-03-21) [ Process/Manufacturing ]
• IC equipment sales up 23% in '06 (2007-03-21) [ Process/Manufacturing ]

• China Mobile invites bids for 3G (2007-03-21) [ RF/Wireless ]
• Alps to sell HDD head assets to TDK (2007-03-21) [ Process/Manufacturing ]
• TI to shake up 'corporate culture' and revamp fab strategies (2007-03-21) [ Process/Manufacturing ]
• Leading electronics companies form Open IPTV Forum (2007-03-21) [ Optical Electronics and Display ]
• Nokia, Qualcomm lawsuit saga continues, Nokia files complaints (2007-03-21) [ RF/Wireless ]

• DRAM segment continues to plunge, product tags drop 44% (2007-03-21) [ Buffer/Storage ]