• India's semicon industry 'fares very well' among peers, says study (2007-02-21) [ EDA/IC Design ]
• Working group okays baseline document for IEEE P1900.4 (2007-02-21) [ RF/Wireless ]
• Sharp expands solar module production in Europe (2007-02-21) [ Power Design ]
• SDK records 'highest' emissive frequency for organic EL tech (2007-02-21) [ Process/Manufacturing ]
• Cellphone users in China to hit 500 million (2007-02-21) [ RF/Wireless ]

• Content drives growth in mobiles (2007-02-21) [ RF/Wireless ]
• Huawei supports China Mobile's ALL-IP strategy (2007-02-21) [ RF/Wireless ]
• eDRAM to boost IBM, AMD relationship (2007-02-21) [ Buffer/Storage ]
• Polysilicon shortage could extend to 2012 (2007-02-21) [ Process/Manufacturing ]
• Philips execs bag $1.3M bonus for NXP creation (2007-02-21) [ Process/Manufacturing ]

• SystemVerilog falls short for design (2007-02-21) [ EDA/IC Design ]
• Dell hires Motorola exec for new consumer group (2007-02-21) [ Embedded Systems ]
• Infineon flash MCUs operate at 140°C (2007-02-21) [ Control Design ]
• Freescale 8bit MCU integrates LCD driver (2007-02-21) [ Optical Electronics and Display ]
• NXP, Purple Labs take Linux to 3G handsets (2007-02-21) [ RF/Wireless ]

• Software enables RTOS, general-purpose OS to run simultaneously (2007-02-21) [ Embedded Systems ]
• Power MOSFETs suit ultrathin handheld devices (2007-02-21) [ Power Design ]
• W-CDMA PA promises 25% more talk time (2007-02-21) [ RF/Wireless ]
• ZiLOG unveils new MCU for networking apps (2007-02-21) [ Networking Design ]
• AMD unveils processors for embedded market (2007-02-21) [ Embedded Systems ]

• Memory controllers enable secure, rapid USB data transfers (2007-02-21) [ Buffer/Storage ]
• LED systems target light-guided picking apps (2007-02-21) [ Optical Electronics and Display ]
• H-bridge drivers roll for DC brush motors (2007-02-21) [ Control Design ]
• CMOS imager features digital auto-focus engine (2007-02-21) [ Optical Electronics and Display ]
• SEMI releases 11 tech standards for FPD, MEMS (2007-02-20) [ Process/Manufacturing ]

• Ruling on infringement lawsuit favors TI (2007-02-20) [ Digital Signal Processing ]
• SK Telecom, WJ ink RFID agreement (2007-02-20) [ RF/Wireless ]
• TI enters medical arena (2007-02-20) [ Process/Manufacturing ]
• ESS sells HD-DVD, Blu-ray tech to SiS (2007-02-20) [ Optical Electronics and Display ]
• Cisco extends Apple's deadline again in iPhone suit (2007-02-20) [ RF/Wireless ]

• Silicon Hive powers MagnaChip image sensors (2007-02-20) [ Optical Electronics and Display ]
• LSI to acquire silicon solution developer (2007-02-20) [ Buffer/Storage ]
• ST, Indian tech institutes set up research labs (2007-02-20) [ EDA/IC Design ]
• Indian govt initiatives to drive electronics sector (2007-02-20) [ Process/Manufacturing ]
• RFMD puts shielding tech inside RF modules (2007-02-20) [ Security Design ]

• Actel to showcase advanced solutions at IIC-China (2007-02-20) [ Programmable Logic ]
• HyperTransport consortium welcomes Dell (2007-02-20) [ Networking Design ]
• Mobile WiMAX PA offers high power efficiency (2007-02-20) [ RF/Wireless ]
• LDO features 80V input, 140°C operating temp (2007-02-20) [ Power Design ]
• Devt kit expands capabilities of Acqiris analyzers (2007-02-20) [ Design Test ]

• High-speed cable assemblies deliver 1GHz at 1m (2007-02-20) [ Networking Design ]
• Platform eases automotive infotainment design (2007-02-20) [ Programmable Logic ]
• VGA camera chip suits ultrathin applications (2007-02-20) [ Sensor Technology ]
• MOSFETs enable system efficiency, space optimization in plasma displays (2007-02-20) [ Optical Electronics and Display ]
• GNSS receivers add position location to handsets (2007-02-20) [ RF/Wireless ]

• DSPs deliver 80GMACs/s performance (2007-02-20) [ Digital Signal Processing ]
• Ultrasmall tactile switch targets handheld devices (2007-02-20) [ Networking Design ]
• ST rolls out 'smallest' 65nm NOR flash memory (2007-02-20) [ Buffer/Storage ]
• UMTS transmit system rolls for multiregion 3G handsets (2007-02-20) [ RF/Wireless ]
• Options for embedded user interfaces (2007-02-19) [ Interface Design ]

• Protected EEPROM operations in MAXQ environments (2007-02-19) [ Buffer/Storage ]
• Power amplifier theory for high-efficiency, low-cost ISM band transmitters (2007-02-19) [ Amplifying/Conditioning/Converting ]
• Using the MAX6951/MAX6950 LED drivers to communicate with MAXQ2000 (2007-02-19) [ Optical Electronics and Display ]
• Power supply, ground design for WiFi transceiver (2007-02-19) [ RF/Wireless ]
• Low-cost PS2 controller matches Sony's version sans the cord (2007-02-19) [ RF/Wireless ]

• Intel's 80-core chip crunches 1Tflop at 3.2GHz (2007-02-19) [ Embedded Systems ]
• Analog control vs. digital in power management (2007-02-19) [ Power Design ]
• HannStar increases investment in China subsidiary (2007-02-19) [ Optical Electronics and Display ]
• Korean engineers tout eco-friendly PCB prod technique (2007-02-19) [ Process/Manufacturing ]
• Japanese org targets DTV transition (2007-02-19) [ Optical Electronics and Display ]

• Top executives to address challenges faced by China's engineers (2007-02-19) [ EDA/IC Design ]
• HeJian partners with Beijing IC Design Park on 0.18µm service (2007-02-19) [ EDA/IC Design ]
• Chipbond to set up facilities for 12inch wafers (2007-02-19) [ Process/Manufacturing ]
• Outsourcing not slowing down, says KPMG study (2007-02-19) [ Process/Manufacturing ]
• IBM, Nortel raise devt of IMS infrastructure (2007-02-19) [ RF/Wireless ]

• Crolles2 continues work despite alliance issues (2007-02-19) [ Process/Manufacturing ]
• IBM to put 48Mbytes on next-gen microprocessor (2007-02-19) [ Buffer/Storage ]
• Sony to follow fab-lite model on semi biz (2007-02-19) [ Process/Manufacturing ]
• Power resistors offer wide resistance range (2007-02-19) [ Amplifying/Conditioning/Converting ]
• Minidrive suits modern motion axis control apps (2007-02-19) [ Control Design ]

• Elektrobit upgrades air interference emulator (2007-02-19) [ Design Test ]
• Infineon claims 'first' silicon-based LNAs (2007-02-19) [ RF/Wireless ]
• Server-class COM features advanced Intel chips (2007-02-19) [ Embedded Systems ]
• LED drivers promise efficient heat management (2007-02-19) [ Optical Electronics and Display ]
• Camera-phone flash LED driver promises improved visual experience (2007-02-19) [ Optical Electronics and Display ]

• Energy-measurement IC adapts to various meter designs (2007-02-19) [ Design Test ]
• MCU integrates 8bit CPU, voice synthesis LSI (2007-02-19) [ Amplifying/Conditioning/Converting ]
• Camera captures clearer images for handsets (2007-02-19) [ Optical Electronics and Display ]
• Broadcom's HEDGE mobile processor targets HSDPA, W-CDMA (2007-02-19) [ RF/Wireless ]
• Microsoft releases .NET toolkit for embedded systems (2007-02-19) [ Embedded Systems ]

• Finisar chair contemplates on fiber's future (2007-02-16) [ EDA/IC Design ]
• Java is ripe for prime time (2007-02-16) [ Programmable Logic ]
• Motorola licenses TTPCom technology to Marvell (2007-02-16) [ RF/Wireless ]
• Choose an oscilloscope with the right bandwidth (2007-02-16) [ Test/Packaging ]
• How to test EMC in semiconductors (2007-02-16) [ Test/Packaging ]

• Current DRAMs step up computing apps (2007-02-16) [ Buffer/Storage ]
• Do DSP simulations in hardware (2007-02-16) [ Embedded Systems ]
• Door zone applications open up for LIN (2007-02-16) [ Networking Design ]
• 3D-graphics core targets mobile devices (2007-02-16) [ EDA/IC Design ]
• Avert attacks in contactless MCUs (2007-02-16) [ RF/Wireless ]

• NI: The future of test is virtual (2007-02-16) [ EDA/IC Design ]
• Playing darts with performance claims (2007-02-16) [ Optical Electronics and Display ]
• Less pixels mean better Webcam performance (2007-02-16) [ Optical Electronics and Display ]
• AMD bares first details of 45nm plan (2007-02-16) [ Embedded Systems ]
• Ominous signs dim IC growth outlook (2007-02-16) [ Process/Manufacturing ]

• EDA growth to continue this year (2007-02-16) [ EDA/IC Design ]
• Tbyte drive, notebook flash set HDD milestones (2007-02-16) [ Buffer/Storage ]
• Integrate RF signal chains with CMOS (2007-02-16) [ RF/Wireless ]
• Integrate 'hard' IP into an SoC (2007-02-16) [ Embedded Systems ]
• Video output enhances mobile viewing (2007-02-16) [ RF/Wireless ]

• Open-source APIs up multimedia performance (2007-02-16) [ Digital Signal Processing ]
• Startup demos interface for HDTV video (2007-02-16) [ Optical Electronics and Display ]
• Embedded controllers 'first' to support IR, SPI (2007-02-16) [ Embedded Systems ]
• DSP duo supports multiple HD audio (2007-02-16) [ Digital Signal Processing ]
• Data center power still a major concern (2007-02-16) [ Power Design ]

• Zetex revamps LNB design with new IF switch (2007-02-16) [ RF/Wireless ]
• Long way to go for multicore (2007-02-16) [ Embedded Systems ]
• Home network remains unconquered (2007-02-16) [ RF/Wireless ]
• Digital content issues still unresolved (2007-02-16) [ RF/Wireless ]
• Guidelines when selecting an embedded mobile/consumer SoC (2007-02-16) [ Embedded Systems ]

• Emulate SIMD in software (2007-02-16) [ Embedded Systems ]
• Ultrasmall camera flash LED driver loads 700mA (2007-02-16) [ Optical Electronics and Display ]
• Dual SIM/Smart card power supply suits 3G apps (2007-02-16) [ Power Design ]
• LIN node SiP rolls for automotive actuator apps (2007-02-16) [ Control Design ]
• 1Gbit mobile DRAM targets multimedia phones (2007-02-16) [ Buffer/Storage ]

• 'Statistically accurate' PVT corner extraction rolls (2007-02-16) [ EDA/IC Design ]
• Module integrates GPS radio IC and antenna (2007-02-16) [ RF/Wireless ]
• Wide-band IR sensor targets code learning apps (2007-02-16) [ Sensor Technology ]
• Power amp optimizes battery life of 3G handsets (2007-02-16) [ Amplifying/Conditioning/Converting ]
• Broadcom, Skyworks roll out EDGE solutions for mobile phones (2007-02-16) [ RF/Wireless ]

• DVB-H receiver enables smaller mobile TVs (2007-02-16) [ RF/Wireless ]
• Platform 'tricklecasts' media files to mobile TV (2007-02-16) [ RF/Wireless ]
• Converter enables car passengers to listen to different FM stations simultaneously (2007-02-16) [ RF/Wireless ]
• Osram, AV Concept ink distribution agreement for South Asia (2007-02-15) [ Process/Manufacturing ]
• China gears up for biggest IC and system design event (2007-02-15) [ EDA/IC Design ]

• Infineon chips support both DVB-H, DVB-T (2007-02-15) [ RF/Wireless ]
• Current sense amp touts 'exceptional' flexibility (2007-02-15) [ Amplifying/Conditioning/Converting ]
• PMC employs advanced graphics processor (2007-02-15) [ Embedded Systems ]
• Inductors offer high frequencies, low inductance (2007-02-15) [ Amplifying/Conditioning/Converting ]
• In-system programmer targets flash MCUs (2007-02-15) [ EDA/IC Design ]

• RFMD intros complementary components for multimode 3G handsets (2007-02-15) [ RF/Wireless ]
• HB-LED drivers suit automotive lighting apps (2007-02-15) [ Optical Electronics and Display ]
• Chipnuts makes 'platform' for sub-$200 smartphones (2007-02-15) [ RF/Wireless ]
• ADI touts 'tightest' integrated 3G transceivers (2007-02-15) [ RF/Wireless ]
• AMD unveils media processors for mobile apps (2007-02-15) [ Embedded Systems ]

• Embedded GPS software offers very short TTFF (2007-02-15) [ RF/Wireless ]
• CMOS sensors take quality images for mobiles (2007-02-15) [ Sensor Technology ]
• ST adopts Synopsys compiler for ASIC design (2007-02-15) [ Embedded Systems ]
• Renesas, Matsushita advance on-chip SRAM process at 45nm (2007-02-15) [ Process/Manufacturing ]
• CMO, Neurok Optics form joint venture (2007-02-15) [ Optical Electronics and Display ]

• CEVA designs programmable multimedia solution (2007-02-15) [ Digital Signal Processing ]
• Renesas licenses ARM processor for low-cost mobile devices (2007-02-15) [ RF/Wireless ]
• Wafer shipments up 20% in '06 (2007-02-15) [ Process/Manufacturing ]
• Infineon closes Israeli UWB R&D site (2007-02-15) [ Process/Manufacturing ]
• No new partners for Crolles2 (2007-02-15) [ Process/Manufacturing ]

• More than 1B Wi-Fi chips to ship in 2012, report says (2007-02-15) [ RF/Wireless ]
• Wireless industry to face slowdown (2007-02-15) [ Process/Manufacturing ]
• ST delays DVB-H development (2007-02-15) [ Optical Electronics and Display ]
• eInfochips expands presence in India (2007-02-14) [ Embedded Systems ]
• China's HB-LED industry eyes mainstream lighting apps (2007-02-14) [ Process/Manufacturing ]

• Intersil opens another office in China (2007-02-14) [ Process/Manufacturing ]
• Comneon, Infineon, FSMLabs team on Linux-based phone sol'ns (2007-02-14) [ RF/Wireless ]
• SiRF, NXP partner on GPS-enabled 3G handsets (2007-02-14) [ RF/Wireless ]
• AUO hits $860 million for January (2007-02-14) [ Process/Manufacturing ]
• China sets up 'first' domestic LCD fab (2007-02-14) [ Process/Manufacturing ]

• ST, AMD ink mobile graphics licensing deal (2007-02-14) [ Optical Electronics and Display ]
• HDMI adoption in PCs increases (2007-02-14) [ Interface Design ]
• Wi-Fi/Bluetooth combos continue to spread (2007-02-14) [ RF/Wireless ]
• China IT exports up 35% in '06 (2007-02-14) [ Process/Manufacturing ]
• Huawei sales spike, eyes MBMS-based mobile TV (2007-02-14) [ Process/Manufacturing ]

• W-CDMA protocol analyzer tests partial designs (2007-02-14) [ Design Test ]
• Solution enables Bluetooth, WLAN coexistence in handsets (2007-02-14) [ RF/Wireless ]
• Mentor upgrades Board Station design flow (2007-02-14) [ EDA/IC Design ]
• Stellaris LM3S811 kit rolls with IAR devt tools (2007-02-14) [ EDA/IC Design ]
• LEDs suit portable, solar-powered outdoor signs (2007-02-14) [ Optical Electronics and Display ]

• PWM controller suits synchronous DC/DC apps (2007-02-14) [ Power Design ]
• Temperature sensor delivers ±0.5°C accuracy (2007-02-14) [ Sensor Technology ]
• Signal generator has four phase synchronous channels (2007-02-14) [ Design Test ]
• RFIC switch features single-voltage control (2007-02-14) [ RF/Wireless ]
• Statistical tool avoids overdesign with excessive margins (2007-02-14) [ EDA/IC Design ]

• Transceiver eases EDGE handset designs (2007-02-14) [ RF/Wireless ]
• TI offers multicore DSP for wireless apps (2007-02-14) [ RF/Wireless ]
• Micron tips 25nm NAND (2007-02-13) [ Buffer/Storage ]
• Spansion drafts MirrorBit HD-SIM roadmap (2007-02-13) [ Process/Manufacturing ]
• LG.Philips LCD to increase Korean fab capacity (2007-02-13) [ Process/Manufacturing ]

• Market buzz: FITI to buy shares in HPO, AOT (2007-02-13) [ Optical Electronics and Display ]
• Qualcomm, Huawei demo MBMS mobile TV sol'n (2007-02-13) [ RF/Wireless ]
• Analogix disputes lawsuit charges by Silicon Image (2007-02-13) [ RF/Wireless ]
• Intel packs teraflop capacity on a chip (2007-02-13) [ EDA/IC Design ]
• New PCIe architecture extends 'outside the box' (2007-02-13) [ Networking Design ]

• Freescale tops auto IC market in '06 (2007-02-13) [ Embedded Systems ]
• ITC to investigate Hynix on NAND importation (2007-02-13) [ Buffer/Storage ]
• Taiwanese foundries post decline in January sales (2007-02-13) [ Process/Manufacturing ]
• DRAM ASP plunges 30% (2007-02-13) [ Process/Manufacturing ]
• SMK touts 'smallest' microSD card connector (2007-02-13) [ Networking Design ]

• Avago tailors LNA for WLAN, WiMAX apps (2007-02-13) [ RF/Wireless ]
• Ambient light sensor achieves human eye's spectral sensitivity (2007-02-13) [ Sensor Technology ]
• Edge card connectors offer high-speed flexibility (2007-02-13) [ Networking Design ]
• High-power LED delivers 7.4lm output at 50mA (2007-02-13) [ Optical Electronics and Display ]
• Wireless nodes offer 4KHz real-time streaming (2007-02-13) [ RF/Wireless ]

• HB LED drivers deliver 94 percent efficiency (2007-02-13) [ Optical Electronics and Display ]
• Next-gen phone platform targets Japan market (2007-02-13) [ RF/Wireless ]
• Quantum processor solves NP-complete problems in record time (2007-02-13) [ Embedded Systems ]
• Accelerometer helps meet vehicle safety requirements (2007-02-13) [ Sensor Technology ]
• RMI launches midrange to entry-level processors (2007-02-13) [ Embedded Systems ]

• Serdes cuts number of interconnect leads (2007-02-13) [ Interface Design ]
• Managing electromigration at the start of nanometer designs (2007-02-12) [ EMI/EMC Design ]
• Kurita proposes solid-state methanol for fuel cells (2007-02-12) [ Power Design ]
• Intel readies Tolapai processor for industrial apps, report says (2007-02-12) [ Embedded Systems ]
• NXP to buy Silicon Labs' cellular unit for $285M (2007-02-12) [ RF/Wireless ]

• Spansion tops NOR market (2007-02-12) [ Process/Manufacturing ]
• Memory, logic products push Winbond sales (2007-02-12) [ Process/Manufacturing ]
• Nikon ventures in LCD photomask sector (2007-02-12) [ Process/Manufacturing ]
• National Semi lowers revenue forecast (2007-02-12) [ Power Design ]
• Motech to build wafer fab in Kunshan (2007-02-12) [ Process/Manufacturing ]

• Omron, RS Components expand distribution to Europe (2007-02-12) [ Embedded Systems ]
• LCD TV sector to hit 106.2M in 2011 (2007-02-12) [ Process/Manufacturing ]
• India to face financial challenges if it upgrades fabs, says Gartner analyst (2007-02-12) [ EDA/IC Design ]
• PAM, TSMC to develop Bipolar-CMOS-DMOS tech (2007-02-12) [ Power Design ]
• Corning expands Japan Gen 8 capacity (2007-02-12) [ Process/Manufacturing ]

• Six firms to jointly develop 3G handset platform (2007-02-12) [ RF/Wireless ]
• CSR joins Bluetooth, Wi-Fi, FM bandwagon (2007-02-12) [ RF/Wireless ]
• Frontier claims first '4-in-1' digital radio module (2007-02-12) [ RF/Wireless ]
• MOSFET gate drivers target industrial apps (2007-02-12) [ Power Design ]
• Freescale solution accelerates 3G design time to market (2007-02-12) [ RF/Wireless ]

• Catalyst touts smallest, highest efficiency charge pump (2007-02-12) [ Power Design ]
• Coaxial device design tool provides 2D electromagnetic simulation (2007-02-12) [ Design Test ]
• Current sense amps promise high precision (2007-02-12) [ Amplifying/Conditioning/Converting ]
• Calibrator boosts wafer-level RF measurement (2007-02-12) [ Process/Manufacturing ]
• ST unveils 2Mpixel camera subsystem (2007-02-12) [ Optical Electronics and Display ]

• OM tags withstand extreme environments (2007-02-12) [ Sensor Technology ]
• LEDs deliver high reliability in small package (2007-02-12) [ Optical Electronics and Display ]
• CSR Bluetooth headset chip offers $6 eBOM (2007-02-12) [ RF/Wireless ]
• PXI embedded controllers double system performance (2007-02-12) [ Networking Design ]