• Semiconductor spending to hit 8% growth (2007-01-31) [ Process/Manufacturing ]
• iSuppli: Nokia rules but Sony Ericsson 'wows' cellphone market (2007-01-31) [ RF/Wireless ]
• Sematech, TEL advance work on 3D interconnects (2007-01-31) [ Process/Manufacturing ]
• Motorola-TI pact highlights 3G, WiMAX, OMAP (2007-01-31) [ RF/Wireless ]
• Dongbu, ARM extend delivery of IP design for 130nm (2007-01-31) [ EDA/IC Design ]

• Jury favors Broadcom in patent case against Qualcomm (2007-01-31) [ Optical Electronics and Display ]
• UCSB researchers tout blue laser diode breakthrough (2007-01-31) [ Optical Electronics and Display ]
• Kyocera, Runcom collaborate on mobile WiMAX (2007-01-31) [ RF/Wireless ]
• Magma expands in India (2007-01-31) [ EDA/IC Design ]
• Oki moves more design to Faraday (2007-01-31) [ EDA/IC Design ]

• Taiwan to become top equipment buyer (2007-01-31) [ Process/Manufacturing ]
• Micrel ULDOs target ultrathin portable apps (2007-01-31) [ Power Design ]
• Tundra division rolls out Interlaken IP core (2007-01-31) [ EDA/IC Design ]
• NI DAQ devices for USB offer 32 analog inputs (2007-01-31) [ Design Test ]
• Infineon unrolls Vista-ready solution for TPM environs (2007-01-31) [ Security Design ]

• Quadrature modulator enables high-performance GSM base stations (2007-01-31) [ RF/Wireless ]
• Non-volatile memory suits security, DRM apps (2007-01-31) [ Buffer/Storage ]
• Bluetooth ICs boost audio in wireless headsets (2007-01-31) [ RF/Wireless ]
• Multichannel audio codecs roll for flat-panel TVs (2007-01-31) [ Digital Signal Processing ]
• Verification box exceeds 200MHz speeds (2007-01-31) [ EDA/IC Design ]

• Osram expands high-power laser product line (2007-01-31) [ Optical Electronics and Display ]
• Audio SoCs target DTV, MP3 docking stations (2007-01-31) [ Digital Signal Processing ]
• DC motor controller features reduced noise (2007-01-31) [ Control Design ]
• China firms mount FM tuner face-off (2007-01-30) [ RF/Wireless ]
• Epson, Fujitsu complete project on FRAM solution (2007-01-30) [ Process/Manufacturing ]

• Sun acquires patent for Polychip's computing tech (2007-01-30) [ Embedded Systems ]
• Three companies partner to deliver beyond 90nm services (2007-01-30) [ EDA/IC Design ]
• NEC to combine visual display equipment biz (2007-01-30) [ Process/Manufacturing ]
• Sematech unveils solution for high-k CMOS devices (2007-01-30) [ Process/Manufacturing ]
• IBM shifts to high-k metal gates (2007-01-30) [ Process/Manufacturing ]

• ADI, Legend Silicon open Shanghai design lab (2007-01-30) [ EDA/IC Design ]
• PCs with China CPUs set for release (2007-01-30) [ Embedded Systems ]
• IBM tips high-k, metal gates (2007-01-30) [ Process/Manufacturing ]
• Elpida-PSC JV ramps 70nm production (2007-01-30) [ Process/Manufacturing ]
• Litho market shows strong growth (2007-01-30) [ Process/Manufacturing ]

• 3G in China still held up (2007-01-30) [ RF/Wireless ]
• Agilent intros new digital communications analysis tools (2007-01-30) [ Design Test ]
• SIM card connector claims lowest profile (2007-01-30) [ Networking Design ]
• Macraigor announces free Eclipse-compliant debugger (2007-01-30) [ EDA/IC Design ]
• Acceleration sensor targets HMI apps (2007-01-30) [ Sensor Technology ]

• DC/DC converters deliver full-rated output current at high ambient temp (2007-01-30) [ Power Design ]
• Multichannel EMI filters save board space (2007-01-30) [ EMI/EMC Design ]
• Tundra PowerPC host bridge cuts system cost (2007-01-30) [ Interface Design ]
• 1U powershelf supports standard 19-inch racks (2007-01-30) [ Networking Design ]
• Audio DSP simplifies loudspeaker compensation (2007-01-30) [ Digital Signal Processing ]

• USB adapter suits any power socket in the world (2007-01-30) [ Networking Design ]
• Chip resistors target high-voltage apps (2007-01-30) [ EMI/EMC Design ]
• Backplane handles speeds up to 12.5Gbps (2007-01-30) [ Embedded Systems ]
• Samsung intros 'first' 60Gbyte, 1.8inch single drive (2007-01-29) [ Buffer/Storage ]
• Philips Lumileds 'breaks' industry record for light source efficiency (2007-01-29) [ Optical Electronics and Display ]

• IEEE okays standard for transient storage devices (2007-01-29) [ Buffer/Storage ]
• PMC-Sierra steps up China operations (2007-01-29) [ Process/Manufacturing ]
• NXP's Dongguan fab goes into full operation (2007-01-29) [ Process/Manufacturing ]
• SiP lacks EDA tool support (2007-01-29) [ EDA/IC Design ]
• IEEE will rein in Ethernet power (2007-01-29) [ Networking Design ]

• Cypress dismisses buyout proposal (2007-01-29) [ Process/Manufacturing ]
• ST to import CMOS, change Crolles function (2007-01-29) [ Process/Manufacturing ]
• Intel gets its groove back with AMD battle (2007-01-29) [ Embedded Systems ]
• TSMC sticking with Crolles2 (2007-01-29) [ Process/Manufacturing ]
• Intel carries out Moore's 'commandment' (2007-01-29) [ Process/Manufacturing ]

• Digital data storage replaces magnetic tape systems (2007-01-29) [ Buffer/Storage ]
• Voltage supervisors offer broad memory options (2007-01-29) [ Power Design ]
• TI touts 'first' Zigbee 2006-compliant platform (2007-01-29) [ RF/Wireless ]
• Nucleus POSIX adds networking support (2007-01-29) [ Embedded Systems ]
• PHY solutions target growing CE market (2007-01-29) [ Embedded Systems ]

• 12-in touch panel computer rolls for NI LabVIEW (2007-01-29) [ Design Test ]
• Rohm develops high-efficiency H-bridge drivers (2007-01-29) [ Control Design ]
• Tiny DC/DC drives up to 12 white LEDs (2007-01-29) [ Power Design ]
• Backplane meets latest MicroTCA specs (2007-01-29) [ Embedded Systems ]
• Ultrathin crystal unit suits mobile devices (2007-01-29) [ RF/Wireless ]

• Intel draft-n card offers whole-home coverage (2007-01-29) [ RF/Wireless ]
• Israeli startup preps multicore processor (2007-01-29) [ Embedded Systems ]
• ESD protection device simplifies board layout (2007-01-29) [ EMI/EMC Design ]
• Oki unrolls baseband LSI for advanced PHS (2007-01-26) [ RF/Wireless ]
• Toshiba 8bit MCU offers 60Kbyte of SuperFlash (2007-01-26) [ Embedded Systems ]

• GbE switches offer advanced security features (2007-01-26) [ Security Design ]
• Virtex-4-based devt platform speeds embedded system designs (2007-01-26) [ EDA/IC Design ]
• Silicon Lab adds AM/FM receivers to portfolio (2007-01-26) [ RF/Wireless ]
• AMD expands Longevity mobile processor line (2007-01-26) [ Control Design ]
• Op amps claim near-zero drift and input noise (2007-01-26) [ Amplifying/Conditioning/Converting ]

• Precision pots suit heavy sideload apps (2007-01-26) [ Interface Design ]
• Microchip unveils new offerings for Zigbee (2007-01-26) [ RF/Wireless ]
• Aggregator IC fully supports Interlaken spec (2007-01-26) [ Embedded Systems ]
• Spansion develops 'first' 4bit-per-cell flash (2007-01-26) [ Buffer/Storage ]
• Silicon Image picks Agilent's tool for HDMI test (2007-01-26) [ Test/Packaging ]

• STARC to use Mentor's analyzer tool for DFM flow (2007-01-26) [ Embedded Systems ]
• CP-TA, PICMG partner to promote open spec (2007-01-26) [ Test/Packaging ]
• Synopsys contributes virtual platform tech to OSCI (2007-01-26) [ EDA/IC Design ]
• 2.4GHz products to dominate wireless HID sector (2007-01-26) [ RF/Wireless ]
• NEC licenses MIPS processors for digital home solutions (2007-01-26) [ Embedded Systems ]

• CMD, SPEL collaborate on small profile packages (2007-01-26) [ Process/Manufacturing ]
• Qimonda raises Q1 sales, profit (2007-01-26) [ Process/Manufacturing ]
• TI exits 45nm process race (2007-01-26) [ Process/Manufacturing ]
• ST, ARM challenged by TI shift (2007-01-26) [ Process/Manufacturing ]
• Sandisk to deliver 56nm gigabyte NAND flash chips (2007-01-25) [ Process/Manufacturing ]

• Universal players fast-tracks end to format war, says ABI (2007-01-25) [ Process/Manufacturing ]
• NAND caching tech war, no winner yet (2007-01-25) [ Buffer/Storage ]
• Virage Logic joins Low Power Coalition (2007-01-25) [ Power Design ]
• MEMS devices gained inroads in consumer apps, reports industry group (2007-01-25) [ Digital Signal Processing ]
• Renesas, Key Stream collaborate on WLAN solutions (2007-01-25) [ RF/Wireless ]

• Freescale joins IBM tech alliance (2007-01-25) [ Process/Manufacturing ]
• Japan seeks higher mobile phone security (2007-01-25) [ Security Design ]
• India should play more active role, SIA says (2007-01-25) [ EDA/IC Design ]
• Toshiba, Broadcom ink IP licensing deal with ARM (2007-01-25) [ EDA/IC Design ]
• IBM not interested in joining Crolles2 (2007-01-25) [ Process/Manufacturing ]

• Linux-based WiMAX baseband reference kit rolls (2007-01-25) [ EDA/IC Design ]
• CW counter covers up to 60GHz (2007-01-25) [ Design Test ]
• Rectifiers promise ultralow voltage drop (2007-01-25) [ Power Design ]
• Innocor unrolls 40/43Gbps test modules (2007-01-25) [ Design Test ]
• LSI intros low-cost enterprise-class SAN solution (2007-01-25) [ Buffer/Storage ]

• NEC rolls CB-55L platform for cell-based ICs (2007-01-25) [ Programmable Logic ]
• 2GB DDR2 memory module features 800MHz operating speed (2007-01-25) [ Buffer/Storage ]
• MOCVD platform suits HB-LED production (2007-01-25) [ Process/Manufacturing ]
• Free USB software kit rolls for ST's 32bit MCUs (2007-01-25) [ Embedded Systems ]
• Rocker switches come in two light options (2007-01-25) [ Networking Design ]

• Wall-mount AC/DCs meet Energy Star standard (2007-01-25) [ Power Design ]
• Sealed contactor switches up to 750V (2007-01-25) [ Networking Design ]
• Slender BlackBerry boasts more consumer appeal (2007-01-24) [ RF/Wireless ]
• Chipmakers to curb equipment shopping spree in '07 (2007-01-24) [ Process/Manufacturing ]
• Adding UARTs to ARM7 for free (2007-01-24) [ RF/Wireless ]

• Hitachi adopts new scheme for terabyte drives (2007-01-24) [ Buffer/Storage ]
• China BAK to build R&D center in Shenzhen (2007-01-24) [ Process/Manufacturing ]
• Efun to invest $2M in Kunshan plant (2007-01-24) [ Process/Manufacturing ]
• MagnaChip expands IP offering (2007-01-24) [ Digital Signal Processing ]
• DNP to build photomask plant in Taiwan (2007-01-24) [ Process/Manufacturing ]

• NXP sets up Asia's 'first' die-level failure analysis center (2007-01-24) [ Test/Packaging ]
• WiMAX trails in 4G race (2007-01-24) [ RF/Wireless ]
• Sun, Intel announce strategic alliance (2007-01-24) [ Embedded Systems ]
• Actel, Mentor expand OEM partnership (2007-01-24) [ EDA/IC Design ]
• Platform Solutions countersues IBM (2007-01-24) [ Embedded Systems ]

• HP, IBM, Intel back Linux Foundation (2007-01-24) [ Embedded Systems ]
• ProMOS eyes 'leased' fab in Chongqing (2007-01-24) [ Process/Manufacturing ]
• Sun-Intel deal puts heat on AMD, report says (2007-01-24) [ Process/Manufacturing ]
• Optical transceiver ups GPON performance (2007-01-24) [ Optical Electronics and Display ]
• Transceivers come in new operating temperature options (2007-01-24) [ Optical Electronics and Display ]

• Actiontec expands IPTV-capable CPE offerings (2007-01-24) [ Networking Design ]
• Navman unveils fully integrated GPS receiver, antenna (2007-01-24) [ RF/Wireless ]
• MOSFETs offer better thermal performance (2007-01-24) [ EMI/EMC Design ]
• Mosaid touts first 65nm memory controller IP (2007-01-24) [ Buffer/Storage ]
• Emulator handles 100 million gates at 20MHz (2007-01-24) [ Test/Packaging ]

• TI adds 210MSps devices to ADC line (2007-01-24) [ Amplifying/Conditioning/Converting ]
• Pumping lines integrate 10 laser diode arrays (2007-01-24) [ Optical Electronics and Display ]
• Programmable AC/DCs deliver up to 270W (2007-01-24) [ Power Design ]
• Low-cost DC/DC targets PC/104 apps (2007-01-24) [ Power Design ]
• Tiny AC/DC eliminates EMI sans input filter (2007-01-24) [ EMI/EMC Design ]

• Dawning of the micromachine revolution (2007-01-23) [ Process/Manufacturing ]
• NXP to reorganize operations in Netherlands (2007-01-23) [ Digital Signal Processing ]
• Nitto Denko to build new optical film plant in Shenzhen (2007-01-23) [ Process/Manufacturing ]
• Fujitsu unveils new process for terabit recording (2007-01-23) [ Buffer/Storage ]
• December shipments of large-sized panels slip (2007-01-23) [ Process/Manufacturing ]

• Hoku Materials preps for new facility (2007-01-23) [ Process/Manufacturing ]
• ONFI speeds time-to-market for NAND-based products (2007-01-23) [ Buffer/Storage ]
• Analyst sees mixed outlook for Renesas (2007-01-23) [ Process/Manufacturing ]
• Xilinx sees weak outlook (2007-01-23) [ Process/Manufacturing ]
• SEMI's book-to-bill up in Dec. '06 (2007-01-23) [ Process/Manufacturing ]

• Singapore JV ramps 300mm wafer supply (2007-01-23) [ Process/Manufacturing ]
• DC/DC delivers 600mA continuous output (2007-01-23) [ Power Design ]
• Digicam platform integrates Wireless USB (2007-01-23) [ Optical Electronics and Display ]
• Wireless docking design enables 'wireless office' (2007-01-23) [ RF/Wireless ]
• Video filter/driver improves system reliability (2007-01-23) [ Amplifying/Conditioning/Converting ]

• IAR Systems rolls out new MCU devt tools (2007-01-23) [ EDA/IC Design ]
• TFT display targets PMP apps (2007-01-23) [ Optical Electronics and Display ]
• NEC solar battery package powers LCD desktop monitors (2007-01-23) [ Optical Electronics and Display ]
• GbE CCD camera runs at 200fps (2007-01-23) [ Optical Electronics and Display ]
• Aeroflex claims 'ultimate' field radio tester (2007-01-23) [ Design Test ]

• Linear pot promises 10 million cycles (2007-01-23) [ Interface Design ]
• New overmold housing rolls for M12 cordsets (2007-01-23) [ Networking Design ]
• Photoelectric sensor sees transparent objects (2007-01-23) [ Sensor Technology ]
• Taiwan panel makers post weak December sales (2007-01-22) [ Process/Manufacturing ]
• UTAC: China testing, packaging industry yet to mature (2007-01-22) [ Test/Packaging ]

• LG.Philips cuts losses in Q4 (2007-01-22) [ Optical Electronics and Display ]
• IPTV finds favorable market in China (2007-01-22) [ RF/Wireless ]
• iPhone to boost 50% margin for Apple (2007-01-22) [ RF/Wireless ]
• PC shipments grew 1.4% below forecast (2007-01-22) [ Embedded Systems ]
• Nanotech industry should develop safety standards (2007-01-22) [ Process/Manufacturing ]

• Dell remains on top in PC shipments (2007-01-22) [ Process/Manufacturing ]
• IBM unlikely to report big gains for '06, analysts say (2007-01-22) [ Embedded Systems ]
• RFID to get smarter in 2007 (2007-01-22) [ RF/Wireless ]
• Sanyo, Hoku ink polysilicon deal (2007-01-22) [ Process/Manufacturing ]
• Cswitch sets up EDA dev't center in India (2007-01-22) [ EDA/IC Design ]

• Intersil touts 'true' narrow Vdc charger controller (2007-01-22) [ Power Design ]
• Double-action push switch suits camera phones (2007-01-22) [ Interface Design ]
• RFID readers deliver consistent tag reads (2007-01-22) [ Sensor Technology ]
• Mobile DVR ref design targets in-car displays (2007-01-22) [ EDA/IC Design ]
• RMI unveils media and navigation processors (2007-01-22) [ Embedded Systems ]

• Storage device offers 16GB in 1.8-inch form factor (2007-01-22) [ Buffer/Storage ]
• Spansion starts sampling 65nm flash for handsets (2007-01-22) [ Buffer/Storage ]
• DC/DC features adjustable operating frequency (2007-01-22) [ Power Design ]
• Thales rolls out dual head graphics XMC mezzanine card (2007-01-22) [ Embedded Systems ]
• Codecs deliver hi-fi audio for headsets, digicams (2007-01-22) [ Amplifying/Conditioning/Converting ]

• NI unrolls low-cost DMMs for PCI, PCIe (2007-01-22) [ Design Test ]
• Pattern generators offer jitter injection capability (2007-01-22) [ Design Test ]