• In-Stat positive on VoIP IC market outlook (2007-01-19) [ RF/Wireless ]
• EXFO, Roots Communications expand distribution deal (2007-01-19) [ Design Test ]
• Taiwan fabs deliver strong Q4 performance (2007-01-19) [ Process/Manufacturing ]
• Apple records $7B revenue in Q1 (2007-01-19) [ Digital Signal Processing ]
• Intel's Q4 revenue hits $9.7B (2007-01-19) [ Process/Manufacturing ]

• China preps WiMAX rival for Olympics (2007-01-19) [ RF/Wireless ]
• Clear Shape, STARC to develop DFM flow (2007-01-19) [ EDA/IC Design ]
• EU to rule on Intel anti-competition probe (2007-01-19) [ Embedded Systems ]
• EDA, IP revenue up 17% in Q3 '06 (2007-01-19) [ EDA/IC Design ]
• Gold ends platinum dissolution in fuel cells (2007-01-19) [ Power Design ]

• Fabless firms grabbed 20% of IC sales (2007-01-19) [ Process/Manufacturing ]
• Linear Tech posts flat Q2 results (2007-01-19) [ Power Design ]
• DaVinci-based SoC offers power-saving modes (2007-01-19) [ Digital Signal Processing ]
• UWB antenna suppresses out-of-band noise (2007-01-19) [ RF/Wireless ]
• PMC/XMC module features ruggedized design (2007-01-19) [ Embedded Systems ]

• Transceiver targets wireless HID, VoIP markets (2007-01-19) [ RF/Wireless ]
• Compact LDO powers FPGA, MCU apps (2007-01-19) [ Power Design ]
• DIP converters feature 6kV isolation (2007-01-19) [ Power Design ]
• Audio platforms deliver fastest time-to-market, lowest development risk (2007-01-19) [ Networking Design ]
• Power-management IC eases USB host devt (2007-01-19) [ Power Design ]

• Quad-port hybrid transceiver suits avionics apps (2007-01-19) [ Optical Electronics and Display ]
• VXS RAID system operates at up to 2GSps (2007-01-19) [ Embedded Systems ]
• Connectors offer high current carrying capacity (2007-01-19) [ Networking Design ]
• PLX beefs up PCIe product line with new switches (2007-01-19) [ Networking Design ]
• NXP, TSMC expand R&D partnership in CMOS (2007-01-18) [ Process/Manufacturing ]

• OLED-T, Microsharp fuse expertise for backlight solution (2007-01-18) [ Optical Electronics and Display ]
• PCIe 2.0 spec doubles transfer rate to 5GTps (2007-01-18) [ Networking Design ]
• New Libero IDE includes Mentor's Precision Synthesis (2007-01-18) [ Embedded Systems ]
• Silicon Works taps Dongbu for LCD IC production (2007-01-18) [ Process/Manufacturing ]
• India's pool of engineering talent shifts to smaller areas (2007-01-18) [ EDA/IC Design ]

• ST remains committed to Crolles Alliance (2007-01-18) [ Process/Manufacturing ]
• HP touts FPGA breakthrough (2007-01-18) [ Programmable Logic ]
• Qimonda, Ovonyx ink memory device license agreement (2007-01-18) [ Buffer/Storage ]
• Sony Ericsson in talks to buy Intel flash fab, report says (2007-01-18) [ Process/Manufacturing ]
• Intel to sell NOR fab (2007-01-18) [ Process/Manufacturing ]

• NXP withdrawal threatens ST's game plan (2007-01-18) [ Process/Manufacturing ]
• RF amps feature active biasing tech (2007-01-18) [ RF/Wireless ]
• NI offers USB modules for CAN, LIN testing (2007-01-18) [ Design Test ]
• Fanout buffers suit telecom, networking apps (2007-01-18) [ Interface Design ]
• TV controller enables precise color control (2007-01-18) [ Control Design ]

• HVICs enable simple circuit designs (2007-01-18) [ Power Design ]
• LDO with boost preregulator cuts cost, size (2007-01-18) [ Power Design ]
• In-car display processor accepts multiple input formats (2007-01-18) [ Optical Electronics and Display ]
• Synaptics capacitive sensing kit offers configurability (2007-01-18) [ Interface Design ]
• MOSFETs offer advanced thermal performance in PowerPAK ChipFET package (2007-01-18) [ Power Design ]

• Xilinx ISE upgrade shortens FPGA design cycles (2007-01-18) [ EDA/IC Design ]
• Low-profile TCVCXO delivers frequency stability (2007-01-18) [ RF/Wireless ]
• Test sockets accept 0.40mm pitch devices (2007-01-18) [ Design Test ]
• Mini chip inductor needs less mounting space (2007-01-18) [ Amplifying/Conditioning/Converting ]
• NXP to sever ties with Crolles2 Alliance (2007-01-17) [ Process/Manufacturing ]

• ProMOS to build 'first' China plant, to invest $365M (2007-01-17) [ Process/Manufacturing ]
• NME secures patent for versatile multilayer disc tech (2007-01-17) [ Buffer/Storage ]
• IEEE okays amendment on rail car electronics (2007-01-17) [ Networking Design ]
• Market buzz: Intel to set up key plant in China (2007-01-17) [ Process/Manufacturing ]
• Renesas, Powerchip form JV on memory product design (2007-01-17) [ EDA/IC Design ]

• Matsushita's three-year plan targets global sales (2007-01-17) [ Process/Manufacturing ]
• Patent dispute breaks Canon-Toshiba JV (2007-01-17) [ Process/Manufacturing ]
• Intel countersues Transmeta, reports say (2007-01-17) [ Embedded Systems ]
• Chinese city vies for Intel chip plant (2007-01-17) [ Process/Manufacturing ]
• Samsung to provide mobile WiMAX to Saudi Arabia (2007-01-17) [ RF/Wireless ]

• Video processing IC enables thin RPTVs (2007-01-17) [ Amplifying/Conditioning/Converting ]
• MIMO smart antennas boost .11n throughput (2007-01-17) [ RF/Wireless ]
• 802.11n devices are fully compatible with .11b/g (2007-01-17) [ RF/Wireless ]
• WiMAX devt platform is 'most comprehensive' (2007-01-17) [ EDA/IC Design ]
• GPS receiver touts 'smallest' footprint (2007-01-17) [ RF/Wireless ]

• Sigrity ports signal integrity tools to Linux platforms (2007-01-17) [ EDA/IC Design ]
• CAT 6a jacks deliver enhanced electrical performance (2007-01-17) [ Networking Design ]
• HD IP STB platform supports Windows Embedded CE 6.0 (2007-01-17) [ Embedded Systems ]
• RF switch promises superior linearity performance (2007-01-17) [ RF/Wireless ]
• SVGA TFT-LCD has digital RGB TTL interface (2007-01-17) [ Optical Electronics and Display ]

• Heat sinks cool high-output LEDs (2007-01-17) [ EMI/EMC Design ]
• Chips simplify Wi-Fi security for consumers (2007-01-17) [ Security Design ]
• Hong Kong S&T Park exec tackles China RoHS (2007-01-16) [ EDA/IC Design ]
• Crusade against counterfeit chips (2007-01-16) [ EDA/IC Design ]
• 'Extreme' engineer pays attention to details (2007-01-16) [ EDA/IC Design ]

• Benefits of thermally aware design (2007-01-16) [ EDA/IC Design ]
• Optimization improves analog IC performance (2007-01-16) [ RF/Wireless ]
• Protect satellite antenna from lightning (2007-01-16) [ EMI/EMC Design ]
• New materials expand wireless options (2007-01-16) [ RF/Wireless ]
• New Bluesim supports virtual prototyping (2007-01-16) [ EDA/IC Design ]

• Tek suite expands support for IMS (2007-01-16) [ Test/Packaging ]
• Jennic offers evaluation kit for large nets (2007-01-16) [ Networking Design ]
• Linux IDE beta version promises full Eclipse compliance (2007-01-16) [ Programmable Logic ]
• IP cores gear for competing standards (2007-01-16) [ RF/Wireless ]
• SiCortex tips x86 ASIC for HPC clusters (2007-01-16) [ Digital Signal Processing ]

• IP pact expands use of MIPS cores (2007-01-16) [ Control Design ]
• Microchip offers full-Zigbee, MiWi options (2007-01-16) [ RF/Wireless ]
• Low-cost handsets push 3G adoption in Asia (2007-01-16) [ RF/Wireless ]
• More apps to spur semiconductor growth (2007-01-16) [ Optical Electronics and Display ]
• Gyroscopes take MEMS to consumer devices (2007-01-16) [ Sensor Technology ]

• Noise canceler IC suits DVB-H, cellular handsets (2007-01-16) [ RF/Wireless ]
• Space telescope to see distant past (2007-01-16) [ Amplifying/Conditioning/Converting ]
• RTOS girded up against cyberattacks (2007-01-16) [ Security Design ]
• Cell processors rev OPC in nm designs (2007-01-16) [ EDA/IC Design ]
• China faces bumpy road to 300mm (2007-01-16) [ Process/Manufacturing ]

• Jumble of network formats seen in 4G (2007-01-16) [ RF/Wireless ]
• QFN packaging guidelines for RF designers (2007-01-16) [ Test/Packaging ]
• Test platform supports entire A-GPS devt cycle (2007-01-16) [ Design Test ]
• Lattix delivers effective architecture governance (2007-01-16) [ Embedded Systems ]
• Microwave testers offer broadband capability (2007-01-16) [ Design Test ]

• POF port brings fiber optic benefits to the home (2007-01-16) [ Optical Electronics and Display ]
• Power inductors provide shielding to space-constrained apps (2007-01-16) [ Power Design ]
• Adjustable-DC DIN supplies deliver greater flexibility (2007-01-16) [ Power Design ]
• UHF TV RF modulators shorten time-to-market (2007-01-16) [ RF/Wireless ]
• HDTV processor promises sharp images, colors (2007-01-16) [ Amplifying/Conditioning/Converting ]

• Submini slide switches suit logic-level apps (2007-01-16) [ Networking Design ]
• CCD sensors target inspection apps (2007-01-16) [ Sensor Technology ]
• Fuse terminals have blown fuse indicator (2007-01-16) [ EMI/EMC Design ]
• Design a smaller, more efficient AC/DC power supply (2007-01-16) [ Power Design ]
• Macronix reworks SONOS for next-gen flash (2007-01-15) [ Process/Manufacturing ]

• Choose the right OS for your consumer devices (2007-01-15) [ Embedded Systems ]
• Let metrics help with verification (2007-01-15) [ EDA/IC Design ]
• SMT software market to hit $558M in 2013 (2007-01-15) [ Process/Manufacturing ]
• Cypress joins Universal Powerline Association (2007-01-15) [ Networking Design ]
• Matsushita, Toray to build the 'largest' PDP plant (2007-01-15) [ Process/Manufacturing ]

• Xilinx puts up R&D team in Singapore (2007-01-15) [ Process/Manufacturing ]
• aRfic, NTU partner on RFIC research (2007-01-15) [ RF/Wireless ]
• Renesas expands China operations (2007-01-15) [ Process/Manufacturing ]
• Sisvel extends MPEG patent dispute with SanDisk (2007-01-15) [ Buffer/Storage ]
• Surplus semiconductor inventories linger through '07 (2007-01-15) [ Process/Manufacturing ]

• Mentor, EVE settle infringement suit (2007-01-15) [ Embedded Systems ]
• WiMAX, metro Wi-Fi beat cellular on power efficiency (2007-01-15) [ RF/Wireless ]
• Apple unlikely to go to trial over iPhone trademark suit (2007-01-15) [ RF/Wireless ]
• Mistral claims 'first' VITA 46 DSP engine (2007-01-15) [ Embedded Systems ]
• SBC supports Intel's latest dual-core processor (2007-01-15) [ Embedded Systems ]

• Emulation tool rolls for Microchip MCUs, DSCs (2007-01-15) [ EDA/IC Design ]
• Maxim touts 'smallest' 500mA DC/DC converter (2007-01-15) [ Power Design ]
• Buck regulator suits latest DSPs, MCUs (2007-01-15) [ Power Design ]
• Novocell nonvolatile memory IP in 0.18µm CMOS (2007-01-15) [ Buffer/Storage ]
• New RF capacitors operate up to 2,500Vdc (2007-01-15) [ Power Design ]

• Vista-compatible IR remote control unit rolls (2007-01-15) [ Optical Electronics and Display ]
• 65nm HD decoder supports HD-DVD, Blu-ray (2007-01-15) [ Amplifying/Conditioning/Converting ]
• Nano imaging sensor discards flash in digicams (2007-01-15) [ Sensor Technology ]
• TI unrolls target boards for portable designs (2007-01-15) [ EDA/IC Design ]
• Liquid cooling tech anticipates heat production (2007-01-15) [ EMI/EMC Design ]

• China's film capacitor industry on track for 10% growth (2007-01-12) [ Process/Manufacturing ]
• Cellphone battery market steadies (2007-01-12) [ Buffer/Storage ]
• TEL acquires GCIB technology provider (2007-01-12) [ Process/Manufacturing ]
• Cisco files lawsuit vs. Apple for iPhone (2007-01-12) [ RF/Wireless ]
• Motorola acquires Symbol for network enterprise biz (2007-01-12) [ Networking Design ]

• Power efficiency impacts chip design (2007-01-12) [ EDA/IC Design ]
• Discretix gets $20M boost from VC groups (2007-01-12) [ Security Design ]
• Struggling Chinese LCD firms to merge (2007-01-12) [ Process/Manufacturing ]
• Micron settles DRAM suit (2007-01-12) [ Buffer/Storage ]
• IC industry in midst of fundamental change, says Infineon CEO (2007-01-12) [ Process/Manufacturing ]

• Matsushita to double PDP fab capacity by '09 (2007-01-12) [ Process/Manufacturing ]
• Digital cable tuner turns PC into PVR (2007-01-12) [ RF/Wireless ]
• High-side driver ASSP controls LEDs, relays (2007-01-12) [ Power Design ]
• Baseband receiver supports Internet, DAB, FM stations (2007-01-12) [ RF/Wireless ]
• TV demodulators perform in diverse signal conditions (2007-01-12) [ Embedded Systems ]

• Jennic touts sub-$3 price for new wireless MCUs (2007-01-12) [ RF/Wireless ]
• Fingerprint sensors shrink swipe area (2007-01-12) [ Sensor Technology ]
• AC/DC supply offers Class II system protection (2007-01-12) [ Power Design ]
• Universal board features Intel Xeon processor (2007-01-12) [ Embedded Systems ]
• Voltage reference draws 180µA max (2007-01-12) [ Power Design ]

• 2W PA targets 800MHz-1GHz-band apps (2007-01-12) [ RF/Wireless ]
• Audio processors improve flat-panel TV sound (2007-01-12) [ Amplifying/Conditioning/Converting ]
• Dell joins green initiative to cut carbon emissions (2007-01-11) [ Power Design ]
• Synopsys, UMC enhance 90nm ref flow (2007-01-11) [ EDA/IC Design ]
• Freescale, Axentra team on digital media platform (2007-01-11) [ Embedded Systems ]

• Verbatim/MKM touts 50Gbyte dual-layer Blu-ray media (2007-01-11) [ Buffer/Storage ]
• IPTV market growth in Asia Pacific intensifies (2007-01-11) [ Digital Signal Processing ]
• MP3 makers in China to cut prices in 2007 (2007-01-11) [ Buffer/Storage ]
• VLSI sees 'pressure points' in '07 (2007-01-11) [ Process/Manufacturing ]
• Greenpeace spoils Apple's party (2007-01-11) [ Process/Manufacturing ]

• Intel, Samsung back DisplayPort (2007-01-11) [ Interface Design ]
• Sentex to bid for BenQ Mobile (2007-01-11) [ Process/Manufacturing ]
• ProMOS invests $10M in image sensor start-up (2007-01-11) [ Sensor Technology ]
• Anritsu unrolls portable spectrum analyzers (2007-01-11) [ Design Test ]
• WNPU unlocks full potential of 802.11n (2007-01-11) [ RF/Wireless ]

• Samtec adds new options to connector systems (2007-01-11) [ Networking Design ]
• FP laser chip cuts costs of diplexers, triplexers (2007-01-11) [ Optical Electronics and Display ]
• Video decoders target PVR-enabled STBs (2007-01-11) [ Amplifying/Conditioning/Converting ]
• HDMI chips deliver signal conditioning features (2007-01-11) [ Interface Design ]
• USB 2.0 transceiver includes UART multiplexing mode (2007-01-11) [ RF/Wireless ]

• Hitachi intros 'world's first' 1Tbyte hard drive (2007-01-11) [ Buffer/Storage ]
• STB chip supports advanced security features (2007-01-11) [ Security Design ]
• Storage processor has automatic drive locking (2007-01-11) [ Security Design ]
• Rad-hard 16Mbit SRAM MCM suits space apps (2007-01-11) [ Test/Packaging ]
• XYZ-axis accelerometers roll for mobile CE apps (2007-01-11) [ Sensor Technology ]