• Tantalum caps find niches in high-reliability markets (2007-12-31) [ Amplifying/Conditioning/Converting ]
• No more waiting in line for a latte, thanks to Apple (2007-12-31) [ RF/Wireless ]
• Enable a robust system design using a linear charger (2007-12-28) [ EDA/IC Design ]
• Commentary: A few fabless fables (2007-12-28) [ Process/Manufacturing ]
• Beyond WiMAX certification: What to look for in an advanced network (2007-12-28) [ EDA/IC Design ]

• DoCoMo gets Google, ups edge in iPhone rights race (2007-12-28) [ RF/Wireless ]
• Newsmakers: The (not so) golden Apple (2007-12-28) [ RF/Wireless ]
• Saifun shareholders approve Spansion merger (2007-12-28) [ Process/Manufacturing ]
• Samsung files complaint vs. Sharp before U.S. ITC (2007-12-28) [ Process/Manufacturing ]
• Russia adds three satellites to Glonass fleet (2007-12-28) [ RF/Wireless ]

• SMIC licenses IBM's 45nm process for 300mm fab (2007-12-28) [ Process/Manufacturing ]
• Intel, ST put off Numonyx debut (2007-12-28) [ Process/Manufacturing ]
• India design houses gear up for business surge (2007-12-28) [ EDA/IC Design ]
• Ford finds way to fuel cars with hydrogen (2007-12-28) [ Power Design ]
• Audio codec/power management IC enhances Core Logic PNDs (2007-12-28) [ Amplifying/Conditioning/Converting ]

• DC/DC controller produces up to 30V output (2007-12-28) [ Amplifying/Conditioning/Converting ]
• ST tips three-axis linear accelerometers (2007-12-28) [ Sensor Technology ]
• EMI suppression devices guard Ethernet apps (2007-12-28) [ EMI/EMC Design ]
• Transceiver streams data over POF at 1.25Gbit/s (2007-12-28) [ RF/Wireless ]
• Tensilica upgrades Xtensa cores, tools (2007-12-28) [ Control Design ]

• Metalink unwraps dual-mode 802.11n chipset (2007-12-28) [ RF/Wireless ]
• Film chip capacitors feature high stability (2007-12-28) [ Sensor Technology ]
• Final roundup: Mixed expectations for '08 top Q4 list (2007-12-27) [ Process/Manufacturing ]
• Backlight control algorithm targets LCD drivers (2007-12-27) [ Optical Electronics and Display ]
• Intel opens FCoE code (2007-12-27) [ Embedded Systems ]

• Instrumentation amps offer autozeroing architecture (2007-12-27) [ Amplifying/Conditioning/Converting ]
• Zilog debuts 1.8V flash MCU (2007-12-27) [ Embedded Systems ]
• Adjustable resistors calibrate precision analog circuits (2007-12-27) [ Power Design ]
• Zigbee stack rolls for wireless MCUs (2007-12-27) [ Networking Design ]
• Linux quick-start package aims at Python SBC (2007-12-27) [ Embedded Systems ]

• Audio DACs tout ground-referenced 2Vrms output (2007-12-27) [ Amplifying/Conditioning/Converting ]
• GloNav acquisition adds GPS to NXP portfolio (2007-12-27) [ RF/Wireless ]
• Sharp, Toshiba ink LCD TV collaboration (2007-12-27) [ Optical Electronics and Display ]
• Hitachi, Canon, Matsushita forge LCD tech alliance (2007-12-27) [ Optical Electronics and Display ]
• Bahrain bank takes 75% stake in Open-Silicon (2007-12-27) [ EDA/IC Design ]

• Analysts see DTV chip market consolidation ahead (2007-12-27) [ Optical Electronics and Display ]
• Consumer confusion hikes HDTV return rate (2007-12-27) [ Optical Electronics and Display ]
• China startup aims for piece of fab-tool market (2007-12-27) [ EDA/IC Design ]
• Applied, AMEC face off over trade secrets (2007-12-27) [ Process/Manufacturing ]
• Marvell IC powers Samsung PDA for Korea (2007-12-26) [ RF/Wireless ]

• Engineous, Fujitsu integrate IT technologies (2007-12-26) [ Embedded Systems ]
• Hitachi details 2025 environmental road map (2007-12-26) [ Process/Manufacturing ]
• Winbond renews patent license deal with Mosaid (2007-12-26) [ Buffer/Storage ]
• iSuppli trims chip revenue forecast for 2008 (2007-12-26) [ Process/Manufacturing ]
• EC gives go ahead to Huawei-Symantec joint venture (2007-12-26) [ Buffer/Storage ]

• Holiday CE sales slower than last year, says report (2007-12-26) [ Process/Manufacturing ]
• 'Moshi moshi,' Apple says to DoCoMo? (2007-12-26) [ RF/Wireless ]
• RFMD acquires Filtronic Semi for $24.8M (2007-12-26) [ Process/Manufacturing ]
• Apple closes down 'Think Secret' site (2007-12-26) [ Embedded Systems ]
• Report: Software errors to delay hybrid drive takeoff (2007-12-26) [ Buffer/Storage ]

• AMD: Barcelona ramp issues trickle down to channel (2007-12-26) [ Process/Manufacturing ]
• Cypress image sensor powers ARRI camera (2007-12-26) [ Sensor Technology ]
• Dual 100V linear regulator frees up space (2007-12-26) [ Power Design ]
• Car contact monitors, level shifters draw miniscule power (2007-12-26) [ Amplifying/Conditioning/Converting ]
• EPIC with Joule effect ignition debuts (2007-12-26) [ Power Design ]

• Current sensors make automotive cut (2007-12-26) [ Sensor Technology ]
• Software delivers Vista Aero on multiple USB displays (2007-12-26) [ Embedded Systems ]
• ODM test module targets fiber-optic networks (2007-12-26) [ Design Test ]
• Reactive power splitter does 5-way split (2007-12-26) [ Power Design ]
• STB decoder aims at standard-definition apps (2007-12-26) [ RF/Wireless ]

• PCIe-to-PCI extension systems rolls from Adlink (2007-12-26) [ Interface Design ]
• Strategic Test tips i.MX27 processor DIMM module (2007-12-26) [ EDA/IC Design ]
• Hybrid ASIC cuts SoC development costs (2007-12-26) [ EDA/IC Design ]
• HD audio nixes interference, maintains power budget (2007-12-24) [ RF/Wireless ]
• Synthetic fuel recipe mixes reclaimed CO<SUB>2</SUB>, water, sunlight (2007-12-24) [ Power Design ]

• ST, TJ FAW open joint automotive lab in China (2007-12-21) [ Process/Manufacturing ]
• Tower, CMT Medical develop flat-panel X-ray detectors (2007-12-21) [ Process/Manufacturing ]
• Buzz: Three Japan firms in talks on OLED dev't (2007-12-21) [ Process/Manufacturing ]
• Watch out for these wireless trends in 2008 (2007-12-21) [ RF/Wireless ]
• T-Mobile UK, 3 fuse 3G networks (2007-12-21) [ Networking Design ]

• Cypress to let go of Texas fab (2007-12-21) [ Process/Manufacturing ]
• Cisco readies for WLAN takeoff in 2008 (2007-12-21) [ RF/Wireless ]
• Israeli researchers develop 'nano-Bible' (2007-12-21) [ Process/Manufacturing ]
• 700MHz auction draws 266 bidders (2007-12-21) [ RF/Wireless ]
• NEC curbs spending on research, chip factories (2007-12-21) [ Process/Manufacturing ]

• Teardown finds design features unique to iPod Touch (2007-12-21) [ RF/Wireless ]
• SFP optical transceiver doubles bandwidth (2007-12-21) [ Networking Design ]
• GaN transistor touts ultrahigh breakdown voltage (2007-12-21) [ Power Design ]
• Compact 0.25W DC/DC converters roll for portables (2007-12-21) [ Power Design ]
• BLDC MOSFET controller ICs are automotive grade (2007-12-21) [ Power Design ]

• Transceiver claims 100Mbit/s data rate, robust ESD protection (2007-12-21) [ RF/Wireless ]
• Power conversion solution eases buck converter design (2007-12-21) [ Amplifying/Conditioning/Converting ]
• 'Smallest' TVS diodes absorb up to 20kV EDS (2007-12-21) [ EMI/EMC Design ]
• Post amplifiers feature twice the signal gain (2007-12-21) [ Amplifying/Conditioning/Converting ]
• PLL VCO covers 500MHz to 3.5GHz frequencies (2007-12-21) [ RF/Wireless ]

• DSP delivers high-definition audio in wireless platforms (2007-12-21) [ Digital Signal Processing ]
• LAN OTDR offers five-wavelength test capability (2007-12-21) [ Design Test ]
• Charger IC powers up to two Li-ion cells in series (2007-12-21) [ Power Design ]