• ST, TJ FAW open joint automotive lab in China (2007-12-21) [ Process/Manufacturing ]
• Tower, CMT Medical develop flat-panel X-ray detectors (2007-12-21) [ Process/Manufacturing ]
• Buzz: Three Japan firms in talks on OLED dev't (2007-12-21) [ Process/Manufacturing ]
• Watch out for these wireless trends in 2008 (2007-12-21) [ RF/Wireless ]
• T-Mobile UK, 3 fuse 3G networks (2007-12-21) [ Networking Design ]

• Cypress to let go of Texas fab (2007-12-21) [ Process/Manufacturing ]
• Cisco readies for WLAN takeoff in 2008 (2007-12-21) [ RF/Wireless ]
• Israeli researchers develop 'nano-Bible' (2007-12-21) [ Process/Manufacturing ]
• 700MHz auction draws 266 bidders (2007-12-21) [ RF/Wireless ]
• NEC curbs spending on research, chip factories (2007-12-21) [ Process/Manufacturing ]

• Teardown finds design features unique to iPod Touch (2007-12-21) [ RF/Wireless ]
• SFP optical transceiver doubles bandwidth (2007-12-21) [ Networking Design ]
• GaN transistor touts ultrahigh breakdown voltage (2007-12-21) [ Power Design ]
• Compact 0.25W DC/DC converters roll for portables (2007-12-21) [ Power Design ]
• BLDC MOSFET controller ICs are automotive grade (2007-12-21) [ Power Design ]

• Transceiver claims 100Mbit/s data rate, robust ESD protection (2007-12-21) [ RF/Wireless ]
• Power conversion solution eases buck converter design (2007-12-21) [ Amplifying/Conditioning/Converting ]
• 'Smallest' TVS diodes absorb up to 20kV EDS (2007-12-21) [ EMI/EMC Design ]
• Post amplifiers feature twice the signal gain (2007-12-21) [ Amplifying/Conditioning/Converting ]
• PLL VCO covers 500MHz to 3.5GHz frequencies (2007-12-21) [ RF/Wireless ]

• DSP delivers high-definition audio in wireless platforms (2007-12-21) [ Digital Signal Processing ]
• LAN OTDR offers five-wavelength test capability (2007-12-21) [ Design Test ]
• Charger IC powers up to two Li-ion cells in series (2007-12-21) [ Power Design ]
• Femtocell cooperation benefits 3G operators (2007-12-20) [ RF/Wireless ]
• Organic electronics materials promise $15.8B market (2007-12-20) [ Process/Manufacturing ]

• T-Mobile picks Huawei's PS-CN for European countries (2007-12-20) [ Process/Manufacturing ]
• Shortage of engineering teachers in India broached (2007-12-20) [ EDA/IC Design ]
• MII puts forth energy-saving techs (2007-12-20) [ Power Design ]
• Intel sells telecom assets to Emcore for $85M (2007-12-20) [ Optical Electronics and Display ]
• ChipX, Recognetics team on ASIC for security apps (2007-12-20) [ EDA/IC Design ]

• Toshiba, IBM extend R&D partnership to 32nm (2007-12-20) [ Process/Manufacturing ]
• India's foundry policy attracts applicants (2007-12-20) [ Process/Manufacturing ]
• Consortium zeroes in on camera phone image quality (2007-12-20) [ Optical Electronics and Display ]
• TPL, Patriot settle patent suits with Japanese firms (2007-12-20) [ EDA/IC Design ]
• NXP brings innovation center to the Netherlands (2007-12-20) [ Process/Manufacturing ]

• ASP downturn continues for small/medium-size displays (2007-12-20) [ Optical Electronics and Display ]
• 802.11n chips rolls for carrier market (2007-12-20) [ RF/Wireless ]
• Tiny tuner picks up China's DTV terrestrial signals (2007-12-20) [ RF/Wireless ]
• SMT DC/DC converters ease assembly (2007-12-20) [ Power Design ]
• Wall-mount AC/DC adapters boast mini-USB connectors (2007-12-20) [ Power Design ]

• RF power terminator, attenuator suit high-frequency apps (2007-12-20) [ Power Design ]
• Staccato design tool aims at wireless USB video apps (2007-12-20) [ Interface Design ]
• Audio DSP adds Dolby Volume sound to DTVs (2007-12-20) [ Digital Signal Processing ]
• Altera unveils full line of 65nm Cyclone III FPGAs (2007-12-20) [ Programmable Logic ]
• Audio DSP kit revs up design of Symphony chips (2007-12-20) [ Digital Signal Processing ]

• Software remotely collects mobile, network data (2007-12-20) [ RF/Wireless ]
• Omron tips 'first' global WiMAX antenna for notebooks (2007-12-20) [ RF/Wireless ]
• Icicle kit underscores low-power FPGA for portables (2007-12-20) [ Programmable Logic ]
• Slide switches feature very low profile (2007-12-20) [ Networking Design ]
• Sony base station streams media content anytime, anywhere (2007-12-20) [ Networking Design ]

• Toshiba licenses Rambus HDTV tech (2007-12-19) [ Buffer/Storage ]
• Bsquare expands Asian biz with new Japan office (2007-12-19) [ Embedded Systems ]
• Philippine school sues Microsoft for copyright violation (2007-12-19) [ Embedded Systems ]
• Emcore to supply PV systems to South Korea firm (2007-12-19) [ Power Design ]
• Navteq joins Wavefront as founding member (2007-12-19) [ RF/Wireless ]

• Qualcomm beefs up mobile portfolio with SoftMax acquisition (2007-12-19) [ RF/Wireless ]
• USB, Kleer hook up DTVs (2007-12-19) [ RF/Wireless ]
• Anxiety high as race begins for high-k 32nm (2007-12-19) [ Process/Manufacturing ]
• WiMedia Alliance heads calls for spectrum division (2007-12-19) [ RF/Wireless ]
• Gartner spins different IC rankings (2007-12-19) [ Process/Manufacturing ]

• HannStar Board endorses alliance with LG.Philips LCD (2007-12-19) [ Buffer/Storage ]
• FBR tallies Q4 scores for pure-play fabs, assembly houses (2007-12-19) [ Process/Manufacturing ]
• ERNI expands 1.27mm SMC connector family (2007-12-19) [ Networking Design ]
• Hysteretic step-down DC/DC regulator is 96% efficient (2007-12-19) [ Power Design ]
• Intel tips ultrasmall solid-state drive for handheld apps (2007-12-19) [ Buffer/Storage ]

• Class D audio subsystems render 3D stereo sound (2007-12-19) [ Amplifying/Conditioning/Converting ]
• Monolithic two-switch forward DC/DC regulator rolls (2007-12-19) [ Power Design ]
• HD video transcoding IC taps DaVinci tech (2007-12-19) [ Digital Signal Processing ]
• 'Smallest' charge protection IC rolls for mobile USB apps (2007-12-19) [ Security Design ]
• MEMS flow sensor keeps dust away (2007-12-19) [ Sensor Technology ]

• MEMS pressure sensor suits calibrators, digital gauges (2007-12-19) [ Sensor Technology ]
• Emulators support multiplexing for SAS, SATA (2007-12-19) [ Embedded Systems ]
• GaAs FET amplifier handles 1.5GHz (2007-12-19) [ RF/Wireless ]
• Transceivers withstand automotive temperature range (2007-12-19) [ EMI/EMC Design ]
• Q3 07: A season of turbulence (2007-12-18) [ Process/Manufacturing ]

• How to build efficient power supplies (2007-12-18) [ Power Design ]
• HGST boosts energy efficiency efforts with 'green' HDDs (2007-12-18) [ Buffer/Storage ]
• Atheros acquires GPS specialist u-Nav (2007-12-18) [ RF/Wireless ]
• ON Semi buys AMIS Holdings for $915M (2007-12-18) [ Power Design ]
• AMD study details worldwide data center energy usage (2007-12-18) [ Power Design ]

• New trends rebalance global manufacturing capacity (2007-12-18) [ Process/Manufacturing ]
• Spansion ups cash distribution on Saifun merger (2007-12-18) [ EDA/IC Design ]
• ITU tackles energy efficiency at UN conference (2007-12-18) [ RF/Wireless ]
• Intel upgrades mobile platform, debuts SSDs (2007-12-18) [ Buffer/Storage ]
• Sharp files LCD patent suit against Samsung (2007-12-18) [ Optical Electronics and Display ]

• Greenpeace: Wii tops chemically toxic game consoles (2007-12-18) [ Process/Manufacturing ]
• Hitachi considers Israel for nanotech, software R&D center (2007-12-18) [ Process/Manufacturing ]
• Korea's scientists herald world's fastest nano transistor (2007-12-18) [ RF/Wireless ]
• Free2move, Siemens deploy wireless tracking tech in Malaysia (2007-12-18) [ Security Design ]
• FireWire speeds up to 3.2Gbit/s (2007-12-18) [ Interface Design ]

• FPGAs exceed 1,067Mbit/s DDR3 interface speed (2007-12-18) [ Programmable Logic ]
• Micron announces solid-state drive line (2007-12-18) [ Buffer/Storage ]
• Low-profile relay maintains industry-standard footprint (2007-12-18) [ Networking Design ]
• NEC claims cornerstone in Mobile WiMAX certification (2007-12-18) [ Networking Design ]
• Chips enable direct conversion cellular base stations (2007-12-18) [ RF/Wireless ]

• Verification tool speeds up RFIC designs (2007-12-18) [ Design Test ]
• Rectification controller delivers 50mA at 6.2V (2007-12-18) [ Power Design ]
• ST tips 65nm HDD iterative decoding channel (2007-12-18) [ Buffer/Storage ]
• Fibre Channel controller targets high-performance storage (2007-12-18) [ Networking Design ]
• Gigabit equalizer touts low jitter performance (2007-12-18) [ Programmable Logic ]

• Zilog intros first 1.8V flash MCU (2007-12-18) [ Buffer/Storage ]
• LED driver offers alternative to '604 standard (2007-12-18) [ Optical Electronics and Display ]
• A short history of the remote control (2007-12-17) [ RF/Wireless ]
• Life is still beautiful for EEs (2007-12-17) [ Process/Manufacturing ]
• The importance of the curve (2007-12-17) [ Embedded Systems ]

• Xilinx intensifies commitment to Asia (2007-12-17) [ Programmable Logic ]
• Optical antenna allows submicron laser scans (2007-12-17) [ Design Test ]
• LEDs for uniform illumination (2007-12-17) [ Optical Electronics and Display ]
• HDMI is ready for close-up (2007-12-17) [ Interface Design ]
• HSPA SoC bundles 3G protocols (2007-12-17) [ RF/Wireless ]

• Tune in to in-car entertainment (2007-12-17) [ Interface Design ]
• HVICs deliver improved performance (2007-12-17) [ Power Design ]
• Dealing with interference in GPS-enabled apps (2007-12-17) [ RF/Wireless ]
• Carrying out a Galileo/GPS system design (2007-12-17) [ RF/Wireless ]
• Is IPTV ready for standards? (2007-12-17) [ RF/Wireless ]

• Electronic wires stretch to double their length (2007-12-17) [ Networking Design ]
• 'Chip-on-MEMS' enables wafer-level calibration (2007-12-17) [ Process/Manufacturing ]
• IMEC's 'Apollo' moves closer to goal (2007-12-17) [ EDA/IC Design ]
• NXP to boost India R&D operations (2007-12-17) [ Process/Manufacturing ]
• Blue, violet laser diodes increase variety, cut costs (2007-12-17) [ Optical Electronics and Display ]

• 'Smallest' power meter rolls for DWDM networks (2007-12-17) [ Design Test ]
• SI solution provides multimode/corner capability for 65/45nm (2007-12-17) [ EDA/IC Design ]
• Tiny MOSFETs target high-efficiency DC/DC conversion (2007-12-17) [ Amplifying/Conditioning/Converting ]
• USB battery charger detector intelligently powers mobiles (2007-12-17) [ Power Design ]
• DAC features six software-programmable output ranges (2007-12-17) [ Amplifying/Conditioning/Converting ]

• Windows Embedded CE 6.0 BSP rolls for Atmel's AT91CAP9 kits (2007-12-17) [ EDA/IC Design ]
• MIMO RFIC delivers dual transmit/receive for Mobile WiMAX (2007-12-17) [ RF/Wireless ]
• Low-cost stepper controller has wider step size range (2007-12-17) [ Control Design ]
• Micron claims 'smallest' 1Gbit DDR2 chip (2007-12-17) [ Process/Manufacturing ]
• Xilinx-powered RASC speeds up bioinformatics app (2007-12-17) [ Security Design ]

• DAC targets industrial process control, test equipment (2007-12-17) [ Amplifying/Conditioning/Converting ]
• Newsmakers: Shades of Green (2007-12-14) [ Process/Manufacturing ]
• Intel, Comstar take Mobile WiMAX to Russia (2007-12-14) [ RF/Wireless ]
• Xilinx exec: India, China will drive digital convergence (2007-12-14) [ Process/Manufacturing ]
• iSuppli: China IC market on track to meet growth targets (2007-12-14) [ Process/Manufacturing ]

• Toshiba details 32nm advancements for system LSIs (2007-12-14) [ Process/Manufacturing ]
• Brazil's Ceitec inks CMOS deal with X-FAB (2007-12-14) [ Process/Manufacturing ]
• Microsoft buys U.K. online map service provider (2007-12-14) [ Embedded Systems ]
• Peking University, Spreadtrum open joint lab (2007-12-14) [ EDA/IC Design ]
• Firms unite to deliver CMMB solutions for China's mobile DTV (2007-12-14) [ RF/Wireless ]

• Cypress opens Asian operations center in Shanghai (2007-12-14) [ EDA/IC Design ]
• EU implements revised patent convention (2007-12-14) [ EDA/IC Design ]
• AMD preps Meyer to be Ruiz successor (2007-12-14) [ Control Design ]
• Mobile WiMAX ready to take flight (2007-12-14) [ RF/Wireless ]
• Class-D driver IP meets advanced SoC requirements (2007-12-14) [ EDA/IC Design ]

• Li-ion/polymer chargers feature auto USB, AC source selection (2007-12-14) [ Power Design ]
• Drivers load up to 150mA to three HB LED strings (2007-12-14) [ Optical Electronics and Display ]
• Smallest load switches give 60% space savings (2007-12-14) [ Power Design ]
• Post amps tout LOS or SD for copper, fiber modules (2007-12-14) [ Amplifying/Conditioning/Converting ]
• Controller delivers fastest handset download (2007-12-14) [ Digital Signal Processing ]

• Toshiba debuts SSDs with MLC NAND flash (2007-12-14) [ Buffer/Storage ]
• Temperature switch operates over 'largest' voltage range (2007-12-14) [ Sensor Technology ]
• 'First '10Gbit/s transimpedance amps offer improved sensitivity (2007-12-14) [ Amplifying/Conditioning/Converting ]
• MOSFET/Schottky device up DC/DC converter efficiency (2007-12-14) [ Amplifying/Conditioning/Converting ]
• Industry's thinnest, brightest chip LED rolls (2007-12-14) [ Optical Electronics and Display ]

• GaAs MMIC has gain stage, passive doubler (2007-12-14) [ RF/Wireless ]
• TSMC, Altera, Synopsys collaborate on 45nm extraction tool (2007-12-14) [ EDA/IC Design ]
• Transparent OLED prototype shows clear advantage (2007-12-13) [ Optical Electronics and Display ]
• High costs prompt Toshiba to delay OLED TV plans (2007-12-13) [ Process/Manufacturing ]
• IBM to aid Hollywood's green efforts (2007-12-13) [ Process/Manufacturing ]

• Nokia Siemens locks in new GSM-R deal in China (2007-12-13) [ RF/Wireless ]
• IMEC reports progress on high-k metal gates at 32nm (2007-12-13) [ Process/Manufacturing ]
• DS2 chief makes case for powerline in home nets (2007-12-13) [ Amplifying/Conditioning/Converting ]
• ST to boost DTV initiatives with Genesis acquisition (2007-12-13) [ Amplifying/Conditioning/Converting ]
• SanDisk forms Vietnam partnerships for flash cards (2007-12-13) [ Buffer/Storage ]

• Fujitsu finds R&D partner to expand China operations (2007-12-13) [ Process/Manufacturing ]
• South Korea woos U.S. investors, seeks to break free of Japan (2007-12-13) [ Process/Manufacturing ]
• AMD comes clean on Barcelona glitch (2007-12-13) [ Control Design ]
• Dell aims touchscreen tablet PC at Gen Y workers (2007-12-13) [ Optical Electronics and Display ]
• PMC-Sierra licenses ARM processors for ASIC, PON (2007-12-13) [ Embedded Systems ]

• Survey: India is top destination for job offshoring (2007-12-13) [ EDA/IC Design ]
• 3U cPCI processor blades target military apps (2007-12-13) [ Interface Design ]
• ADI unrolls direct digital synthesis device (2007-12-13) [ RF/Wireless ]
• 16bit MCUs enable ultralow-power applications (2007-12-13) [ Control Design ]
• Clock dividers feature fail-safe input protection (2007-12-13) [ Amplifying/Conditioning/Converting ]

• Ultralow-ohmic chip resistors fit compact power supplies (2007-12-13) [ Amplifying/Conditioning/Converting ]
• PLL-based clock generators create ultralow jitter (2007-12-13) [ Amplifying/Conditioning/Converting ]
• Aeroflex beefs up A-GPS testers with OMA SUPL support (2007-12-13) [ Design Test ]
• Demodulator aims at broad TV market (2007-12-13) [ RF/Wireless ]
• WLED driver has two LDOs for portable systems (2007-12-13) [ Optical Electronics and Display ]

• Programmable DC power supplies tout high power density (2007-12-13) [ Power Design ]
• Current monitor simplifies high-voltage circuit protection (2007-12-13) [ EMI/EMC Design ]
• Ramtron adds 4Kbit FRAM to Grade 1 automotive line (2007-12-13) [ Buffer/Storage ]
• Viewer turns iPod video into big virtual hit (2007-12-13) [ Optical Electronics and Display ]
• Phosphorescent materials cut cost in large-area OLEDs (2007-12-12) [ Optical Electronics and Display ]

• Corning to make Gen 10 glass substrates at Sharp's plant (2007-12-12) [ Process/Manufacturing ]
• SMIC switches on 300mm fab in Shanghai (2007-12-12) [ Process/Manufacturing ]
• SK Telecom sets up first commercial HSUPA network (2007-12-12) [ Networking Design ]
• Partners provide Silicon Aware IP to China, Singapore, Taiwan (2007-12-12) [ EDA/IC Design ]
• U.S. VC funds prefer Israel, China, India, Canada (2007-12-12) [ Process/Manufacturing ]

• Tessera files new patent complaint before U.S. ITC (2007-12-12) [ Test/Packaging ]
• Vitesse ups investment in India design center (2007-12-12) [ EDA/IC Design ]
• AMD, Intel take rivalry to SoC arena (2007-12-12) [ EDA/IC Design ]
• IBM 'fab club' sets stage for 32nm debut (2007-12-12) [ Process/Manufacturing ]
• ST moves chips to 45nm CMOS RF tech (2007-12-12) [ RF/Wireless ]

• TSMC develops 32nm process sans high-k (2007-12-12) [ Process/Manufacturing ]
• Boost converter has integrated 1.2A switch (2007-12-12) [ Amplifying/Conditioning/Converting ]
• Accelerometer provides thermal stability, global accuracy (2007-12-12) [ Design Test ]
• Cadence, ARM co-develop multicore ref design kits (2007-12-12) [ Embedded Systems ]
• Gain compression tool enhances network analyzer (2007-12-12) [ Design Test ]

• Resistor terminator meets needs of space, military customers (2007-12-12) [ Amplifying/Conditioning/Converting ]
• Step-down regulators integrate low-on-resistance MOSFETs (2007-12-12) [ Power Design ]
• Standalone equivalence checker tailored for FPGA market (2007-12-12) [ EDA/IC Design ]
• 400mA linear regulators withstand 6V (2007-12-12) [ Amplifying/Conditioning/Converting ]
• Firewall-on-a-chip aids M2M public Internet link (2007-12-12) [ Programmable Logic ]

• Microwave mux switches 75Ω, signals up to 2.5GHz (2007-12-12) [ RF/Wireless ]
• LC EMI filters guard wireless data interfaces (2007-12-12) [ Sensor Technology ]
• Current sense amp operates as high- or low-side monitor (2007-12-12) [ Amplifying/Conditioning/Converting ]
• AMCC intros evaluation kits for 405EX, 405Exr chips (2007-12-11) [ Design Test ]
• The year in review: Apple's crest (2007-12-11) [ RF/Wireless ]

• Altera develops zero-power CPLDs for portables (2007-12-11) [ Programmable Logic ]
• Tips for testing outsourced software (2007-12-11) [ Embedded Systems ]
• Moversa bridges contactless tech gaps (2007-12-11) [ Security Design ]
• Verigy to acquire Inovys (2007-12-11) [ EDA/IC Design ]
• SunPower inks silicon supply deal with China firm (2007-12-11) [ Process/Manufacturing ]

• China Mobile details energy saving initiative (2007-12-11) [ RF/Wireless ]
• South Korea eyes top spot in LED sector (2007-12-11) [ Process/Manufacturing ]
• Toshiba sets up software lab in Vietnam university (2007-12-11) [ Embedded Systems ]
• Dark stars come from dark matter (2007-12-11) [ Power Design ]
• Bosch invests in car fuel efficiency, safety apps in India (2007-12-11) [ Process/Manufacturing ]

• Pixelplus, Sharp co-develop SoC image sensors (2007-12-11) [ Process/Manufacturing ]
• Analysts see IC industry recovery in 2008 (2007-12-11) [ Process/Manufacturing ]
• Gaming market yet to crown its king (2007-12-11) [ Embedded Systems ]
• Taiwan notebook makers break shipment records (2007-12-11) [ Embedded Systems ]
• Piezoelectric motor pushes 200 times its own weight (2007-12-11) [ Embedded Systems ]

• Low-noise DAC targets DAQ, ATE (2007-12-11) [ Amplifying/Conditioning/Converting ]
• LEDs support local-dimming LCD backlights (2007-12-11) [ Optical Electronics and Display ]
• Driver for blinking LED indicators draws ultralow power (2007-12-11) [ Optical Electronics and Display ]
• Tiny 24bit audio DAC integrates high-output headphone amp (2007-12-11) [ Amplifying/Conditioning/Converting ]
• Tensilica adds trace support to Xtensa, Diamond processors (2007-12-11) [ Control Design ]

• Wave radar level transmitters roll from Siemens (2007-12-11) [ RF/Wireless ]
• NEC touts fastest SRAM-compatible MRAM (2007-12-11) [ Buffer/Storage ]
• LED drivers have optimized synchronization, timing (2007-12-11) [ Optical Electronics and Display ]
• Test system reduces cost of SoC testing (2007-12-11) [ Design Test ]
• Samtec advances power offerings (2007-12-11) [ Networking Design ]

• UHF receiver/transmitter line targets industrial apps (2007-12-11) [ RF/Wireless ]