• Taiwan's Tatung taps NEC for Mobile WiMAX systems (2007-12-10) [ RF/Microwave ]
• Alcatel-Lucent aids GPON rollout in Hong Kong (2007-12-10) [ Optoelectronics/Displays ]
• Digi-Key, SkyeTek authorize distribution deal (2007-12-10) [ RF/Microwave ]
• IBM brings ASUSTeK infringement complaint to ITC (2007-12-10) [ EDA/IP ]
• GSA appoints European execs for leadership assembly (2007-12-10) [ Manufacturing/Packaging ]

• Intel forms new group for SoC design venture (2007-12-10) [ Manufacturing/Packaging ]
• Researchers tout Mach-Zehnder electro-optic modulator (2007-12-10) [ Optoelectronics/Displays ]
• 10.8% CAGR seen for automotive sensors (2007-12-10) [ Sensors/MEMS ]
• ZTE inks AVS-IPTV deal with China Netcom (2007-12-10) [ Amplifiers/Converters ]
• Dell moves hardware R&D unit out of India (2007-12-10) [ EDA/IP ]

• Secure SoC for HDDs qualifies for FIPS 140-2 Level 3 list (2007-12-10) [ Memory/Storage ]
• Tiny DC/DC converters reduce footprint by 20% (2007-12-10) [ Amplifiers/Converters ]
• High-speed MOSFET driver supports step-down/-up DC/DCs (2007-12-10) [ Power/Alternative Energy ]
• 60A filter cuts differential mode noise, transients (2007-12-10) [ RF/Microwave ]
• Tool designs massively parallel processors (2007-12-10) [ Embedded ]

• OVP controllers protect low-voltage systems up to 28V (2007-12-10) [ Power/Alternative Energy ]
• Video-over-USB ref designs accelerate H.264 encoding (2007-12-10) [ RF/Microwave ]
• Low noise, high accuracy typify DAC (2007-12-10) [ Amplifiers/Converters ]
• Satellite SoC eases STB design complexity (2007-12-10) [ RF/Microwave ]
• Agilent beefs up DisplayPort test capability (2007-12-10) [ T&M ]

• Nokia Siemens inks NGN IMS deal with Taiwan telco (2007-12-07) [ Networks ]
• SigmaTel chips win spots in PMPs by China OEMs (2007-12-07) [ Processors/DSPs ]
• RFMD supplies EDGE power amps for Huawei 3G handsets (2007-12-07) [ RF/Microwave ]
• South Korea allots $36.6M for greenhouse research (2007-12-07) [ Manufacturing/Packaging ]
• Nokia ups investment in India facility (2007-12-07) [ Manufacturing/Packaging ]

• Continental details automotive R&D plans (2007-12-07) [ Embedded ]
• LCD TV OEMs increase outsourcing, says DisplaySearch (2007-12-07) [ Manufacturing/Packaging ]
• ON Semi opens IC protection test lab in China (2007-12-07) [ T&M ]
• iPhones get some Google action (2007-12-07) [ RF/Microwave ]
• Notetaking tool for blind students levels the classroom (2007-12-07) [ Interface ]

• India's Reliance funds U.S. wireless comms firm (2007-12-07) [ RF/Microwave ]
• Gartner: Tough times ahead as industry shifts to 32nm (2007-12-07) [ Manufacturing/Packaging ]
• Gate optocoupler combines high output peak current, UVLO (2007-12-07) [ Optoelectronics/Displays ]
• 8m cable transmits at 800Mbits/s, meets 1394b spec (2007-12-07) [ Networks ]
• Single-chip GbE router cuts chip count, BOM (2007-12-07) [ EDA/IP ]

• Software eases standard compliance for MCU-based appliances (2007-12-07) [ Embedded ]
• Low-ESR tantalum capacitors target embedded controls (2007-12-07) [ Embedded ]
• RFID devices with crypto engine prevent counterfeiting (2007-12-07) [ RF/Microwave ]
• One-box RF tester anticipates future tech developments (2007-12-07) [ T&M ]
• ESD protectors safeguard high-speed handset interfaces (2007-12-07) [ Amplifiers/Converters ]

• 10GbE test module rolls for MACSec link security (2007-12-07) [ T&M ]
• Software aids in DisplayPort compliance testing (2007-12-07) [ T&M ]
• LDOs fit space-constrained, noise-sensitive apps (2007-12-07) [ Power/Alternative Energy ]
• PC mice sensors support tilt-wheel function in Vista (2007-12-07) [ Sensors/MEMS ]
• Sony PSP kicks in slimmer form (2007-12-06) [ Embedded ]

• Sharp breaks ground on LCD, solar cell 'manufacturing complex' (2007-12-06) [ Manufacturing/Packaging ]
• Tower plans job cuts, outsourcing to reduce costs (2007-12-06) [ Manufacturing/Packaging ]
• Hitachi sets up business support center in India (2007-12-06) [ EDA/IP ]
• DoCoMo taps Nokia Siemens, Panasonic for LTE project (2007-12-06) [ RF/Microwave ]
• Apple, AT&T face lawsuit over iPhone voice mail tech (2007-12-06) [ RF/Microwave ]

• IBM, ATMI collaborate on implanted photoresists (2007-12-06) [ Manufacturing/Packaging ]
• High-k process for CMOS cancels gate leakage (2007-12-06) [ Manufacturing/Packaging ]
• Fujitsu sets up WiMAX JV with Taiwan's III (2007-12-06) [ RF/Microwave ]
• Class D audio amp market to hit $688M by 2011 (2007-12-06) [ Amplifiers/Converters ]
• Bromine forum counters Greenpeace electronics report (2007-12-06) [ Manufacturing/Packaging ]

• China outlines energy law (2007-12-06) [ Power/Alternative Energy ]
• China, Finland ally on nanotech research (2007-12-06) [ EDA/IP ]
• GPON residential gateway enables Gbit/s IPv4, IPv6 routing (2007-12-06) [ Networks ]
• Receiver/transmitter line rolls for industrial RF systems (2007-12-06) [ RF/Microwave ]
• Intelligent battery ups ante in electric vehicle power storage (2007-12-06) [ Power/Alternative Energy ]

• Powerline modem chips target multimedia apps (2007-12-06) [ Amplifiers/Converters ]
• Crosspoint switch promises high signal integrity (2007-12-06) [ Networks ]
• Test tool maintains FTTx, short-range optical nets (2007-12-06) [ T&M ]
• Low-power, high-speed ADC suits optical networking (2007-12-06) [ Amplifiers/Converters ]
• Wideband amplifiers tout fast slew rate (2007-12-06) [ Amplifiers/Converters ]

• Virtex-5 FPGA solutions fit SPI-4.2, SFI-4.1 interfaces (2007-12-06) [ FPGAs/PLDs ]
• Driver plus FET modules trim power losses (2007-12-06) [ Power/Alternative Energy ]
• HD transcoder performs changes in real-time (2007-12-06) [ FPGAs/PLDs ]
• RF detector raises bar in accuracy, response time (2007-12-06) [ RF/Microwave ]
• HP inches away from Dell in PC race, says iSuppli (2007-12-05) [ Controls/MCUs ]

• CCID: Innovation is key to audio MP3 market's survival (2007-12-05) [ Memory/Storage ]
• PS3 bounces back, trumps Wii sales in Japan (2007-12-05) [ Embedded ]
• ContentGuard, Sharp sign global DRM licensing deal (2007-12-05) [ RF/Microwave ]
• Filtronic to sell compound semi division (2007-12-05) [ Manufacturing/Packaging ]
• SIA: PCs push October chip sales beyond targets (2007-12-05) [ Manufacturing/Packaging ]

• FSA rechristened as Global Semiconductor Alliance (2007-12-05) [ Manufacturing/Packaging ]
• Wavecom partners with Singapore, Vietnam universities (2007-12-05) [ Embedded ]
• IDT readies for DisplayPort shift in digital displays (2007-12-05) [ Interface ]
• TI takes Chipcon founder to court (2007-12-05) [ Manufacturing/Packaging ]
• Samsung, Toshiba ink reciprocal deal on premium NAND flash (2007-12-05) [ Memory/Storage ]

• Energy harvesting finds spot in sensor nets (2007-12-05) [ Sensors/MEMS ]
• Agilent adds 3GPP LTE option to signal analysis software (2007-12-05) [ T&M ]
• USB 2.0 controller runs two ports simultaneously (2007-12-05) [ Networks ]
• Lit-up power-rated switches target industrial apps (2007-12-05) [ Power/Alternative Energy ]
• Multiple-output controllers save space, cut BOM (2007-12-05) [ Power/Alternative Energy ]

• 5.7-inch QVGA TFT module enables reading in sunlight (2007-12-05) [ Optoelectronics/Displays ]
• PCIe AWG card has up to 4GSamples memory (2007-12-05) [ Interface ]
• CSR brings Bluetooth to Ford cars (2007-12-05) [ Interface ]
• Real-time location system taps TI MCU, RF chipset (2007-12-05) [ RF/Microwave ]
• RF connector interface suits Wi-Fi, WiMAX apps (2007-12-05) [ RF/Microwave ]

• Bright LED lamps come in small packages (2007-12-05) [ Optoelectronics/Displays ]
• Cable connector touts improved EMC shielding (2007-12-05) [ Amplifiers/Converters ]
• Power MOSFET features micro-ohm Rds(on) (2007-12-05) [ Power/Alternative Energy ]
• Converter face-off: SEPIC vs. flyback (2007-12-05) [ Amplifiers/Converters ]
• Intro to the six basic audio measurements - Part 1 (2007-12-04) [ T&M ]

• Improve CMRR in CAT-5 video links (2007-12-04) [ Processors/DSPs ]
• PixelPlus, MagnaChip patent dispute ends (2007-12-04) [ Sensors/MEMS ]
• EU oks spectrum farming for 3G, cool to DVB-H mandate (2007-12-04) [ RF/Microwave ]
• To check messages and battery, shake that phone (2007-12-04) [ Sensors/MEMS ]
• Report: DSL downstream speeds increase in APAC (2007-12-04) [ Networks ]

• The year in review: First-quarter storm (2007-12-04) [ EDA/IP ]
• Raid uncovers Samsung slush fund evidence (2007-12-04) [ Manufacturing/Packaging ]
• USB 3.0 group seeks contributors for spec draft (2007-12-04) [ Interface ]
• Lancor sues OLPC for patent infringement (2007-12-04) [ EDA/IP ]
• Qimonda cuts 200mm capacities in favor of 300mm (2007-12-04) [ Manufacturing/Packaging ]

• Zander exits, Brown takes over as Motorola CEO (2007-12-04) [ Manufacturing/Packaging ]
• Good or bad news: Google confirms 700MHz entry (2007-12-04) [ RF/Microwave ]
• Ruiz: AMD bent on bouncing back (2007-12-04) [ Processors/DSPs ]
• Atmel intros evaluation platform for FlexRay nets (2007-12-04) [ Embedded ]
• Freescale expands 8bit S08 MCU line (2007-12-04) [ Embedded ]

• 300V IGBTs can replace power MOSFETs (2007-12-04) [ Power/Alternative Energy ]
• NEC asserts world's fastest MRAM (2007-12-04) [ Memory/Storage ]
• Power inductors offer extended inductance (2007-12-04) [ Power/Alternative Energy ]
• MLCCs tout ultrahigh capacitance (2007-12-04) [ Sensors/MEMS ]
• DC/DC converter modules meet military requirements (2007-12-04) [ Amplifiers/Converters ]

• Regulators simplify embedded power designs (2007-12-04) [ Power/Alternative Energy ]
• IDE promises flexible multicore programming for ANSI C (2007-12-04) [ Embedded ]
• Samsung GDDR5 is world's fastest at 6Gbit/s (2007-12-04) [ Memory/Storage ]
• Small GPS ref design suits consumer handhelds (2007-12-04) [ EDA/IP ]
• Universal GPS, Galileo RFIC comes in tested die (2007-12-04) [ RF/Microwave ]

• Stereo audio selectors deliver low distortion (2007-12-03) [ Amplifiers/Converters ]
• Increased demand toughens resistors (2007-12-03) [ Amplifiers/Converters ]
• Cortex-A9 boasts refined ARM architecture (2007-12-03) [ Embedded ]
• Step-down converters rev up efficiency (2007-12-03) [ Power/Alternative Energy ]
• Computer-on-module extend dual-channel memory support (2007-12-03) [ Embedded ]

• Power management chip boosts energy efficiency (2007-12-03) [ Power/Alternative Energy ]
• A/V interface card plugs into FPGAs (2007-12-03) [ Processors/DSPs ]
• High-speed gate drivers come in compact form (2007-12-03) [ Controls/MCUs ]
• Aeroflex 6113 base station tester supports A5/3 encryption (2007-12-03) [ T&M ]
• KickStart Kit aids Atmel AVR32 development projects (2007-12-03) [ EDA/IP ]

• Full bridge flourescent backlight controllers suit LCD TVs (2007-12-03) [ Optoelectronics/Displays ]
• All set for shift to mobile broadband (2007-12-03) [ RF/Microwave ]
• Recipe for an embedded success story (2007-12-03) [ Embedded ]
• Deploy your apps to market quickly (2007-12-03) [ Embedded ]
• What to do with trade-offs (2007-12-03) [ EDA/IP ]

• Achieve processor energy savings with AVS (2007-12-03) [ Power/Alternative Energy ]
• Enabling energy-efficient PCs, handhelds (2007-12-03) [ Embedded ]
• Here come supercapacitors (2007-12-03) [ Embedded ]
• Model-based approach for safer batteries (2007-12-03) [ T&M ]
• Spend on product innovation, not on fabs (2007-12-03) [ EDA/IP ]

• Old-fashioned models work for analog IDMs (2007-12-03) [ EDA/IP ]
• Collaboration is key, say IP experts (2007-12-03) [ EDA/IP ]
• Is it a fab-lite diet for analogs, too? (2007-12-03) [ Manufacturing/Packaging ]
• Avnet Logistics gains stronger foothold in Asia (2007-12-03) [ Manufacturing/Packaging ]