• AMCC intros evaluation kits for 405EX, 405Exr chips (2007-12-11) [ Design Test ]
• The year in review: Apple's crest (2007-12-11) [ RF/Wireless ]
• Altera develops zero-power CPLDs for portables (2007-12-11) [ Programmable Logic ]
• Tips for testing outsourced software (2007-12-11) [ Embedded Systems ]
• Moversa bridges contactless tech gaps (2007-12-11) [ Security Design ]

• Verigy to acquire Inovys (2007-12-11) [ EDA/IC Design ]
• SunPower inks silicon supply deal with China firm (2007-12-11) [ Process/Manufacturing ]
• China Mobile details energy saving initiative (2007-12-11) [ RF/Wireless ]
• South Korea eyes top spot in LED sector (2007-12-11) [ Process/Manufacturing ]
• Toshiba sets up software lab in Vietnam university (2007-12-11) [ Embedded Systems ]

• Dark stars come from dark matter (2007-12-11) [ Power Design ]
• Bosch invests in car fuel efficiency, safety apps in India (2007-12-11) [ Process/Manufacturing ]
• Pixelplus, Sharp co-develop SoC image sensors (2007-12-11) [ Process/Manufacturing ]
• Analysts see IC industry recovery in 2008 (2007-12-11) [ Process/Manufacturing ]
• Gaming market yet to crown its king (2007-12-11) [ Embedded Systems ]

• Taiwan notebook makers break shipment records (2007-12-11) [ Embedded Systems ]
• Piezoelectric motor pushes 200 times its own weight (2007-12-11) [ Embedded Systems ]
• Low-noise DAC targets DAQ, ATE (2007-12-11) [ Amplifying/Conditioning/Converting ]
• LEDs support local-dimming LCD backlights (2007-12-11) [ Optical Electronics and Display ]
• Driver for blinking LED indicators draws ultralow power (2007-12-11) [ Optical Electronics and Display ]

• Tiny 24bit audio DAC integrates high-output headphone amp (2007-12-11) [ Amplifying/Conditioning/Converting ]
• Tensilica adds trace support to Xtensa, Diamond processors (2007-12-11) [ Control Design ]
• Wave radar level transmitters roll from Siemens (2007-12-11) [ RF/Wireless ]
• NEC touts fastest SRAM-compatible MRAM (2007-12-11) [ Buffer/Storage ]
• LED drivers have optimized synchronization, timing (2007-12-11) [ Optical Electronics and Display ]

• Test system reduces cost of SoC testing (2007-12-11) [ Design Test ]
• Samtec advances power offerings (2007-12-11) [ Networking Design ]
• UHF receiver/transmitter line targets industrial apps (2007-12-11) [ RF/Wireless ]
• Taiwan's Tatung taps NEC for Mobile WiMAX systems (2007-12-10) [ RF/Wireless ]
• Alcatel-Lucent aids GPON rollout in Hong Kong (2007-12-10) [ Optical Electronics and Display ]

• Digi-Key, SkyeTek authorize distribution deal (2007-12-10) [ RF/Wireless ]
• IBM brings ASUSTeK infringement complaint to ITC (2007-12-10) [ EDA/IC Design ]
• GSA appoints European execs for leadership assembly (2007-12-10) [ Process/Manufacturing ]
• Intel forms new group for SoC design venture (2007-12-10) [ Process/Manufacturing ]
• Researchers tout Mach-Zehnder electro-optic modulator (2007-12-10) [ Optical Electronics and Display ]

• 10.8% CAGR seen for automotive sensors (2007-12-10) [ Sensor Technology ]
• ZTE inks AVS-IPTV deal with China Netcom (2007-12-10) [ Amplifying/Conditioning/Converting ]
• Dell moves hardware R&D unit out of India (2007-12-10) [ EDA/IC Design ]
• Secure SoC for HDDs qualifies for FIPS 140-2 Level 3 list (2007-12-10) [ Security Design ]
• Tiny DC/DC converters reduce footprint by 20% (2007-12-10) [ Amplifying/Conditioning/Converting ]

• High-speed MOSFET driver supports step-down/-up DC/DCs (2007-12-10) [ Power Design ]
• 60A filter cuts differential mode noise, transients (2007-12-10) [ RF/Wireless ]
• Tool designs massively parallel processors (2007-12-10) [ Embedded Systems ]
• OVP controllers protect low-voltage systems up to 28V (2007-12-10) [ Power Design ]
• Video-over-USB ref designs accelerate H.264 encoding (2007-12-10) [ RF/Wireless ]

• Low noise, high accuracy typify DAC (2007-12-10) [ Amplifying/Conditioning/Converting ]
• Satellite SoC eases STB design complexity (2007-12-10) [ RF/Wireless ]
• Agilent beefs up DisplayPort test capability (2007-12-10) [ Design Test ]
• Nokia Siemens inks NGN IMS deal with Taiwan telco (2007-12-07) [ Networking Design ]
• SigmaTel chips win spots in PMPs by China OEMs (2007-12-07) [ Embedded Systems ]

• RFMD supplies EDGE power amps for Huawei 3G handsets (2007-12-07) [ RF/Wireless ]
• South Korea allots $36.6M for greenhouse research (2007-12-07) [ Process/Manufacturing ]
• Nokia ups investment in India facility (2007-12-07) [ Process/Manufacturing ]
• Continental details automotive R&D plans (2007-12-07) [ Embedded Systems ]
• LCD TV OEMs increase outsourcing, says DisplaySearch (2007-12-07) [ Process/Manufacturing ]

• ON Semi opens IC protection test lab in China (2007-12-07) [ Test/Packaging ]
• iPhones get some Google action (2007-12-07) [ RF/Wireless ]
• Notetaking tool for blind students levels the classroom (2007-12-07) [ Interface Design ]
• India's Reliance funds U.S. wireless comms firm (2007-12-07) [ RF/Wireless ]
• Gartner: Tough times ahead as industry shifts to 32nm (2007-12-07) [ Process/Manufacturing ]

• Gate optocoupler combines high output peak current, UVLO (2007-12-07) [ Optical Electronics and Display ]
• 8m cable transmits at 800Mbits/s, meets 1394b spec (2007-12-07) [ Networking Design ]
• Single-chip GbE router cuts chip count, BOM (2007-12-07) [ EDA/IC Design ]
• Software eases standard compliance for MCU-based appliances (2007-12-07) [ Embedded Systems ]
• Low-ESR tantalum capacitors target embedded controls (2007-12-07) [ Embedded Systems ]

• RFID devices with crypto engine prevent counterfeiting (2007-12-07) [ Security Design ]
• One-box RF tester anticipates future tech developments (2007-12-07) [ Design Test ]
• ESD protectors safeguard high-speed handset interfaces (2007-12-07) [ EMI/EMC Design ]
• 10GbE test module rolls for MACSec link security (2007-12-07) [ Test/Packaging ]
• Software aids in DisplayPort compliance testing (2007-12-07) [ Test/Packaging ]

• LDOs fit space-constrained, noise-sensitive apps (2007-12-07) [ Power Design ]
• PC mice sensors support tilt-wheel function in Vista (2007-12-07) [ Sensor Technology ]
• Sony PSP kicks in slimmer form (2007-12-06) [ Embedded Systems ]
• Sharp breaks ground on LCD, solar cell 'manufacturing complex' (2007-12-06) [ Process/Manufacturing ]
• Tower plans job cuts, outsourcing to reduce costs (2007-12-06) [ Process/Manufacturing ]

• Hitachi sets up business support center in India (2007-12-06) [ EDA/IC Design ]
• DoCoMo taps Nokia Siemens, Panasonic for LTE project (2007-12-06) [ RF/Wireless ]
• Apple, AT&T face lawsuit over iPhone voice mail tech (2007-12-06) [ RF/Wireless ]
• IBM, ATMI collaborate on implanted photoresists (2007-12-06) [ Process/Manufacturing ]
• High-k process for CMOS cancels gate leakage (2007-12-06) [ Process/Manufacturing ]

• Fujitsu sets up WiMAX JV with Taiwan's III (2007-12-06) [ RF/Wireless ]
• Class D audio amp market to hit $688M by 2011 (2007-12-06) [ Amplifying/Conditioning/Converting ]
• Bromine forum counters Greenpeace electronics report (2007-12-06) [ Process/Manufacturing ]
• China outlines energy law (2007-12-06) [ Power Design ]
• China, Finland ally on nanotech research (2007-12-06) [ EDA/IC Design ]

• GPON residential gateway enables Gbit/s IPv4, IPv6 routing (2007-12-06) [ Networking Design ]
• Receiver/transmitter line rolls for industrial RF systems (2007-12-06) [ RF/Wireless ]
• Intelligent battery ups ante in electric vehicle power storage (2007-12-06) [ Power Design ]
• Powerline modem chips target multimedia apps (2007-12-06) [ Amplifying/Conditioning/Converting ]
• Crosspoint switch promises high signal integrity (2007-12-06) [ Networking Design ]

• Test tool maintains FTTx, short-range optical nets (2007-12-06) [ Design Test ]
• Low-power, high-speed ADC suits optical networking (2007-12-06) [ Amplifying/Conditioning/Converting ]
• Wideband amplifiers tout fast slew rate (2007-12-06) [ Amplifying/Conditioning/Converting ]
• Virtex-5 FPGA solutions fit SPI-4.2, SFI-4.1 interfaces (2007-12-06) [ Programmable Logic ]
• Driver plus FET modules trim power losses (2007-12-06) [ Power Design ]

• HD transcoder performs changes in real-time (2007-12-06) [ Programmable Logic ]
• RF detector raises bar in accuracy, response time (2007-12-06) [ RF/Wireless ]
• HP inches away from Dell in PC race, says iSuppli (2007-12-05) [ Control Design ]
• CCID: Innovation is key to audio MP3 market's survival (2007-12-05) [ Buffer/Storage ]
• PS3 bounces back, trumps Wii sales in Japan (2007-12-05) [ Embedded Systems ]

• ContentGuard, Sharp sign global DRM licensing deal (2007-12-05) [ Security Design ]
• Filtronic to sell compound semi division (2007-12-05) [ Process/Manufacturing ]
• SIA: PCs push October chip sales beyond targets (2007-12-05) [ Process/Manufacturing ]
• FSA rechristened as Global Semiconductor Alliance (2007-12-05) [ Process/Manufacturing ]
• Wavecom partners with Singapore, Vietnam universities (2007-12-05) [ Embedded Systems ]

• IDT readies for DisplayPort shift in digital displays (2007-12-05) [ Interface Design ]
• TI takes Chipcon founder to court (2007-12-05) [ Process/Manufacturing ]
• Samsung, Toshiba ink reciprocal deal on premium NAND flash (2007-12-05) [ Buffer/Storage ]
• Energy harvesting finds spot in sensor nets (2007-12-05) [ Sensor Technology ]
• Agilent adds 3GPP LTE option to signal analysis software (2007-12-05) [ Test/Packaging ]

• USB 2.0 controller runs two ports simultaneously (2007-12-05) [ Networking Design ]
• Lit-up power-rated switches target industrial apps (2007-12-05) [ Power Design ]
• Multiple-output controllers save space, cut BOM (2007-12-05) [ Power Design ]
• 5.7-inch QVGA TFT module enables reading in sunlight (2007-12-05) [ Optical Electronics and Display ]
• PCIe AWG card has up to 4GSamples memory (2007-12-05) [ Interface Design ]

• CSR brings Bluetooth to Ford cars (2007-12-05) [ Interface Design ]
• Real-time location system taps TI MCU, RF chipset (2007-12-05) [ RF/Wireless ]
• RF connector interface suits Wi-Fi, WiMAX apps (2007-12-05) [ RF/Wireless ]
• Bright LED lamps come in small packages (2007-12-05) [ Optical Electronics and Display ]
• Cable connector touts improved EMC shielding (2007-12-05) [ EMI/EMC Design ]

• Power MOSFET features micro-ohm Rds(on) (2007-12-05) [ Power Design ]
• Converter face-off: SEPIC vs. flyback (2007-12-05) [ Amplifying/Conditioning/Converting ]
• Intro to the six basic audio measurements - Part 1 (2007-12-04) [ Test/Packaging ]
• Improve CMRR in CAT-5 video links (2007-12-04) [ Digital Signal Processing ]
• PixelPlus, MagnaChip patent dispute ends (2007-12-04) [ Sensor Technology ]

• EU oks spectrum farming for 3G, cool to DVB-H mandate (2007-12-04) [ RF/Wireless ]
• To check messages and battery, shake that phone (2007-12-04) [ Sensor Technology ]
• Report: DSL downstream speeds increase in APAC (2007-12-04) [ Networking Design ]
• The year in review: First-quarter storm (2007-12-04) [ EDA/IC Design ]
• Raid uncovers Samsung slush fund evidence (2007-12-04) [ Process/Manufacturing ]

• USB 3.0 group seeks contributors for spec draft (2007-12-04) [ Interface Design ]
• Lancor sues OLPC for patent infringement (2007-12-04) [ EDA/IC Design ]
• Qimonda cuts 200mm capacities in favor of 300mm (2007-12-04) [ Process/Manufacturing ]
• Zander exits, Brown takes over as Motorola CEO (2007-12-04) [ Process/Manufacturing ]
• Good or bad news: Google confirms 700MHz entry (2007-12-04) [ RF/Wireless ]

• Ruiz: AMD bent on bouncing back (2007-12-04) [ Embedded Systems ]
• Atmel intros evaluation platform for FlexRay nets (2007-12-04) [ Embedded Systems ]
• Freescale expands 8bit S08 MCU line (2007-12-04) [ Embedded Systems ]
• 300V IGBTs can replace power MOSFETs (2007-12-04) [ Power Design ]
• NEC asserts world's fastest MRAM (2007-12-04) [ Buffer/Storage ]

• Power inductors offer extended inductance (2007-12-04) [ Power Design ]
• MLCCs tout ultrahigh capacitance (2007-12-04) [ Sensor Technology ]
• DC/DC converter modules meet military requirements (2007-12-04) [ Amplifying/Conditioning/Converting ]
• Regulators simplify embedded power designs (2007-12-04) [ Power Design ]
• IDE promises flexible multicore programming for ANSI C (2007-12-04) [ Embedded Systems ]

• Samsung GDDR5 is world's fastest at 6Gbit/s (2007-12-04) [ Buffer/Storage ]
• Small GPS ref design suits consumer handhelds (2007-12-04) [ EDA/IC Design ]
• Universal GPS, Galileo RFIC comes in tested die (2007-12-04) [ RF/Wireless ]
• Stereo audio selectors deliver low distortion (2007-12-03) [ Amplifying/Conditioning/Converting ]
• Increased demand toughens resistors (2007-12-03) [ EMI/EMC Design ]

• Cortex-A9 boasts refined ARM architecture (2007-12-03) [ Embedded Systems ]
• Step-down converters rev up efficiency (2007-12-03) [ Power Design ]
• Computer-on-module extend dual-channel memory support (2007-12-03) [ Embedded Systems ]
• Power management chip boosts energy efficiency (2007-12-03) [ Power Design ]
• A/V interface card plugs into FPGAs (2007-12-03) [ Digital Signal Processing ]

• High-speed gate drivers come in compact form (2007-12-03) [ Control Design ]
• Aeroflex 6113 base station tester supports A5/3 encryption (2007-12-03) [ Design Test ]
• KickStart Kit aids Atmel AVR32 development projects (2007-12-03) [ EDA/IC Design ]
• Full bridge flourescent backlight controllers suit LCD TVs (2007-12-03) [ Optical Electronics and Display ]
• All set for shift to mobile broadband (2007-12-03) [ RF/Wireless ]

• Recipe for an embedded success story (2007-12-03) [ Embedded Systems ]
• Deploy your apps to market quickly (2007-12-03) [ Embedded Systems ]
• What to do with trade-offs (2007-12-03) [ EDA/IC Design ]
• Achieve processor energy savings with AVS (2007-12-03) [ Power Design ]
• Enabling energy-efficient PCs, handhelds (2007-12-03) [ Embedded Systems ]

• Here come supercapacitors (2007-12-03) [ Embedded Systems ]
• Model-based approach for safer batteries (2007-12-03) [ Design Test ]
• Spend on product innovation, not on fabs (2007-12-03) [ EDA/IC Design ]
• Old-fashioned models work for analog IDMs (2007-12-03) [ EDA/IC Design ]
• Collaboration is key, say IP experts (2007-12-03) [ EDA/IC Design ]

• Is it a fab-lite diet for analogs, too? (2007-12-03) [ Process/Manufacturing ]
• Avnet Logistics gains stronger foothold in Asia (2007-12-03) [ Process/Manufacturing ]