• Verification tool eases embedded development (2007-11-30) [ Design Test ]
• PCIe cards stores up to 4 billion samples on board (2007-11-30) [ Buffer/Storage ]
• Avago intros optocoupler for hybrid electric vehicles (2007-11-30) [ Amplifying/Conditioning/Converting ]
• Toshiba SDD unveils 80GB automotive HDD (2007-11-30) [ Buffer/Storage ]
• Mobile gizmos to get single-chip RFID reader (2007-11-30) [ RF/Wireless ]

• Flat-panel monitor displays detailed medical images (2007-11-30) [ Optical Electronics and Display ]
• Data acquisition made easy (2007-11-30) [ Test/Packaging ]
• Freescale banks on touch sensing technology (2007-11-30) [ Sensor Technology ]
• 320GB 2.5inch HDD moves data at 300MBps (2007-11-30) [ Buffer/Storage ]
• Tiny PMU for mobiles touts above 95% efficiency (2007-11-30) [ Power Design ]

• ARM-compliant processor offers low-power 32bit RISC (2007-11-30) [ Embedded Systems ]
• Side tank indicator works with Modbus interface (2007-11-30) [ Design Test ]
• Indian startup seeks funds for ATMP facility for flip-chips (2007-11-30) [ Process/Manufacturing ]
• Organic transistors, memory market to grow to $22B (2007-11-30) [ Power Design ]
• TSMC 55nm process tips knowledge-based processors (2007-11-30) [ Process/Manufacturing ]

• Largest solar silicon ingot factory in Korea starts rolling (2007-11-30) [ Process/Manufacturing ]
• ST favors Mentor's place and route system (2007-11-30) [ EDA/IC Design ]
• Taiwan sees huge market for solar energy (2007-11-30) [ Process/Manufacturing ]
• Micron goes full force on solid-state drives (2007-11-30) [ Process/Manufacturing ]
• WTO upholds ruling against Japan (2007-11-30) [ Process/Manufacturing ]

• HP turns to sun, wind to power facilities (2007-11-30) [ Embedded Systems ]
• California Micro Devices opens design center in India (2007-11-30) [ EDA/IC Design ]
• Motorola loses grip of handset market (2007-11-30) [ RF/Wireless ]
• AMD 'accelerated computing' initiative gains ground (2007-11-30) [ EDA/IC Design ]
• Nintendo, Microsoft, Philips fail Greenpeace toxic test (2007-11-29) [ Process/Manufacturing ]

• Philips to buy U.S. lighting firm for $2.7B (2007-11-29) [ Process/Manufacturing ]
• Google details renewable energy initiative (2007-11-29) [ Power Design ]
• DisplaySearch: OLED sales, shipments drop in Q3 (2007-11-29) [ Optical Electronics and Display ]
• Microsoft hires 1,000 more engineers for China office (2007-11-29) [ EDA/IC Design ]
• ASMI, Hitachi Kakusai sign ALD licensing deal (2007-11-29) [ Process/Manufacturing ]

• Hynix signs on partner for image sensor venture (2007-11-29) [ Process/Manufacturing ]
• Samsung in talks for printer, handset plant in Vietnam (2007-11-29) [ Process/Manufacturing ]
• Qualcomm looks for workaround to Broadcom injunction (2007-11-29) [ RF/Wireless ]
• Nanotechnology R&D flourishes in Israel (2007-11-29) [ Process/Manufacturing ]
• Toshiba, NEC extend partnership to 32nm (2007-11-29) [ Process/Manufacturing ]

• AMD-TSMC fab deal rumor persists (2007-11-29) [ Process/Manufacturing ]
• Zigbee module achieves sight range of 4km (2007-11-29) [ RF/Wireless ]
• Quad high-side solid-state relay halves Rds(on) (2007-11-29) [ Networking Design ]
• Synchronous driver rolls for n-channel MOSFETs (2007-11-29) [ Power Design ]
• NI cuts CompactRIO cost to suit high-volume machines builders (2007-11-29) [ Programmable Logic ]

• Carrier-class FPGA-based network timing solution debuts (2007-11-29) [ Programmable Logic ]
• Encoder chip measures linear position, off-axis rotation (2007-11-29) [ Sensor Technology ]
• Gigabit-LAN switch offers ±15kV ESD protection (2007-11-29) [ EMI/EMC Design ]
• Toolset simplifies testing process (2007-11-29) [ Test/Packaging ]
• Tiny duplexer handles W-CDMA Bands V/VI (2007-11-29) [ RF/Wireless ]

• Media converter drives visible red light over POF (2007-11-29) [ Networking Design ]
• LED shines 70% brighter than previous parts (2007-11-29) [ Optical Electronics and Display ]
• CAN transceivers suit long-wire industrial apps (2007-11-29) [ Embedded Systems ]
• Commentary: Revisiting heterogeneous vs. homogeneous (2007-11-29) [ Digital Signal Processing ]
• Analog devices improve processor system reliability (2007-11-28) [ Sensor Technology ]

• Make IP telephony as reliable as a POTS device with PoE (2007-11-28) [ Amplifying/Conditioning/Converting ]
• Samsung kept $215M slush fund, says former exec (2007-11-28) [ Process/Manufacturing ]
• Taiwan's Gintech to supply solar cells to Canadian firm (2007-11-28) [ Process/Manufacturing ]
• Alcatel-Lucent secures $1.1B mobile contract in China (2007-11-28) [ RF/Wireless ]
• eASIC, Tensilica team on low-cost customized ASICs (2007-11-28) [ EDA/IC Design ]

• Taiwan VC fund bets on Israeli image sensor startup (2007-11-28) [ Sensor Technology ]
• 'Super-satellite' for broadband access gets go signal (2007-11-28) [ RF/Wireless ]
• Synplicity joins Xilinx ESL design group (2007-11-28) [ Programmable Logic ]
• Report reveals China solar panel vendors to slash prices (2007-11-28) [ Process/Manufacturing ]
• Hoku, Solarfun ink 8-year polysilicon supply agreement (2007-11-28) [ Process/Manufacturing ]

• Dubai fund invests in Sony (2007-11-28) [ Process/Manufacturing ]
• Rambus shows alternative way to terabyte memory (2007-11-28) [ Buffer/Storage ]
• Car safety electronics go for system-level approach (2007-11-28) [ Security Design ]
• Evaluation kit makes PSoC mixed-array design a snap (2007-11-28) [ EDA/IC Design ]
• NXP expands PCTV product line (2007-11-28) [ Digital Signal Processing ]

• Ethernet connector comes in right-angle version (2007-11-28) [ Networking Design ]
• Nanosilica-filled epoxy cures rapidly (2007-11-28) [ Test/Packaging ]
• High-voltage DC/DCs load 36V input, 10V output (2007-11-28) [ Power Design ]
• Kit eases evaluation of Nios II processor (2007-11-28) [ Embedded Systems ]
• Faster flash chips support new-generation OS (2007-11-28) [ Buffer/Storage ]

• PCB/FPGA design goes 3D with Altium tool (2007-11-28) [ Programmable Logic ]
• DDR2 DIMM ready for AMD Phenom processor (2007-11-28) [ Buffer/Storage ]
• Illuminated tactile switch touts 'see-hear-touch' effect (2007-11-28) [ Interface Design ]
• HDTV decoders carry analog copy protection (2007-11-28) [ Security Design ]
• Sensor signal conditioner has 14bit ADC (2007-11-28) [ Sensor Technology ]

• S.A.B.Re ICs take new approach to power management (2007-11-28) [ Amplifying/Conditioning/Converting ]
• Network security market expands in China (2007-11-27) [ Security Design ]
• Korean lawmakers pass bill to probe Samsung scandal (2007-11-27) [ Process/Manufacturing ]
• Nokia Siemens details environment business plan (2007-11-27) [ Process/Manufacturing ]
• ST opens R&D facility in Vietnam (2007-11-27) [ Process/Manufacturing ]

• Intel teams with China DTV provider on digital STBs (2007-11-27) [ RF/Wireless ]
• Flat-panel TVs high on holiday gift lists (2007-11-27) [ Optical Electronics and Display ]
• ASE places litho order with Suss MicroTec (2007-11-27) [ Process/Manufacturing ]
• Power.org welcomes NI as new member (2007-11-27) [ Power Design ]
• Car networking node market to grow to $1B (2007-11-27) [ Interface Design ]

• Broadcom scores again in dispute with Qualcomm (2007-11-27) [ RF/Wireless ]
• Slight increase in chipmaking equipment billings noted (2007-11-27) [ Process/Manufacturing ]
• Report: Regulatory hurdles top 2008 business risks (2007-11-27) [ Process/Manufacturing ]
• Xeon-based servers roll for Southeast Asia (2007-11-27) [ Networking Design ]
• Handheld spectrum analyzer operates up to 7.5GHz (2007-11-27) [ Design Test ]

• UPS targets scalable protection for nets, data centers (2007-11-27) [ Power Design ]
• Sun solutions enable open petascale computing (2007-11-27) [ Embedded Systems ]
• TFT-LCD notebook panel is dirt-resistant (2007-11-27) [ Optical Electronics and Display ]
• Solenoid driver targets car, industrial apps (2007-11-27) [ EMI/EMC Design ]
• DAQs boost standalone solutions, offer 384 I/O channels (2007-11-27) [ Design Test ]

• Tiny tact switches achieve long operational life (2007-11-27) [ Networking Design ]
• Power rocker switch touts protection from dust, liquid (2007-11-27) [ Networking Design ]
• Tactile switches feature reliable dome tech (2007-11-27) [ Networking Design ]
• TSMC taps Synopsys' design-to-mask data processing software (2007-11-27) [ EDA/IC Design ]
• LDOs promise 'outstanding' noise performance (2007-11-27) [ Power Design ]

• Design-for-debug offers inside look at signal data (2007-11-27) [ Design Test ]
• IT security investment growing among Asia-Pacific SMBs (2007-11-26) [ Security Design ]
• AMD qualifies Micron's DDR2 for Phenom processors (2007-11-26) [ Buffer/Storage ]
• Foxconn to build new facilities in China, Vietnam (2007-11-26) [ Process/Manufacturing ]
• Samsung ups LCD production for large-screen TVs (2007-11-26) [ Process/Manufacturing ]

• TEAC buys MMP portfolio license (2007-11-26) [ Embedded Systems ]
• 65nm RF design kit rolls from Mentor Graphics, TSMC (2007-11-26) [ EDA/IC Design ]
• RF MEMS switch market to balloon in five years (2007-11-26) [ RF/Wireless ]
• Intel validates Hynix 1Gbit DDR2 DRAM (2007-11-26) [ Buffer/Storage ]
• Camera pinpoints nuclear hotspots from afar (2007-11-26) [ Optical Electronics and Display ]

• Robotics project aims to help people with disabilities (2007-11-26) [ Control Design ]
• Apple resolves patent quarrel with Burst.com (2007-11-26) [ Process/Manufacturing ]
• UN study: EU falls behind e-waste recycling targets (2007-11-26) [ Process/Manufacturing ]
• picoChip unrolls single-chip WiMAX Wave 2 femtocell (2007-11-26) [ RF/Wireless ]
• Ultrasmall sensor interface is versatile DAQ device (2007-11-26) [ Sensor Technology ]

• Power switches cut losses by 500mW (2007-11-26) [ Power Design ]
• GaAs FET amp targets European WiMAX transceiver stations (2007-11-26) [ RF/Wireless ]
• TFT LCD controller supports WQVGA (2007-11-26) [ Optical Electronics and Display ]
• PXI switch integrates solid state switching (2007-11-26) [ Interface Design ]
• ESD protection chip works with HDMI 1.3 spec (2007-11-26) [ EMI/EMC Design ]

• Video multiplexers boost seamless signal switching (2007-11-26) [ Networking Design ]
• Bus bar connectors aim at high-current telco systems (2007-11-26) [ Networking Design ]
• Samtec updates high-speed cable system portfolio (2007-11-26) [ Networking Design ]
• Quick-fit terminals come in two mounting styles (2007-11-26) [ Networking Design ]
• CSR puts RealAudio codec in Internet radio design (2007-11-26) [ RF/Wireless ]

• Lack of subscribers prompts Malaysia to cancel WiMAX licenses (2007-11-23) [ RF/Wireless ]
• EC grants green light to Emerson-Motorola deal (2007-11-23) [ Embedded Systems ]
• MagnaChip dips into power-management market (2007-11-23) [ Process/Manufacturing ]
• Gates sees looming shortage of U.S. tech professionals (2007-11-23) [ Process/Manufacturing ]
• Report: Sanyo hinges hope on battery biz (2007-11-23) [ Process/Manufacturing ]

• IBM tips open source tech for senior workers (2007-11-23) [ Embedded Systems ]
• Chip design complexity raises risks, warns cryptographer (2007-11-23) [ EDA/IC Design ]
• MEMS poised to penetrate CE market (2007-11-23) [ Sensor Technology ]
• Innovation center expands Freescale India operations (2007-11-23) [ Process/Manufacturing ]
• Maxwell, China battery maker develop 'hybrid' energy storage (2007-11-23) [ Power Design ]

• Macrovision acquires Blu-ray content security tech (2007-11-23) [ Security Design ]
• China telco aims for 'green' Olympics with Nokia Siemens tech (2007-11-23) [ RF/Wireless ]
• Driver amplifier trims component count in designs (2007-11-23) [ Networking Design ]
• RF transceiver supports next-generation LTE (2007-11-23) [ RF/Wireless ]
• Super-bright LED achieves 250 lumens (2007-11-23) [ Optical Electronics and Display ]

• MCU secures mobile payment, mobile TV transactions (2007-11-23) [ Security Design ]
• Automotive FET pre-driver touts industry's widest voltage range (2007-11-23) [ Power Design ]
• Mentor tips optimized FPGA design flow (2007-11-23) [ Programmable Logic ]
• 500mA LDO features ceramic capacitor compatibility (2007-11-23) [ Power Design ]
• Thermostat chip first with temperature switching (2007-11-23) [ Sensor Technology ]

• Hynix touts first 1Gbit GDDR5 DRAM (2007-11-23) [ Buffer/Storage ]
• 10GbE switch makes data centers green (2007-11-23) [ Networking Design ]
• DVB-H external antenna is thin, compact (2007-11-23) [ RF/Wireless ]
• GPS modules acquire satellites in less than a sec (2007-11-23) [ RF/Wireless ]
• Up close and personal with Intel's 45nm high-k guys (2007-11-22) [ Process/Manufacturing ]

• Applied to acquire PV cell test system provider (2007-11-22) [ Design Test ]
• CEVA, ROHM co-develop Bluetooth 2.0+EDR ref design (2007-11-22) [ EDA/IC Design ]
• Printed ICs prep up for mainstream entry (2007-11-22) [ Process/Manufacturing ]
• Growing MoCA foothold drives call for home-net standard (2007-11-22) [ Networking Design ]
• Biological memory chip hints at cyborg machines (2007-11-22) [ Buffer/Storage ]

• India plays major role in Synplicity R&D road map (2007-11-22) [ EDA/IC Design ]
• NEC jumpstarts 40nm process, eDRAM tech (2007-11-22) [ Process/Manufacturing ]
• Automotive RF receivers cover 300-930MHz band (2007-11-22) [ RF/Wireless ]
• TFFC LED shines 200 lumens in cool-white (2007-11-22) [ Optical Electronics and Display ]
• Power amplifier puts 802.11g in embedded (2007-11-22) [ Amplifying/Conditioning/Converting ]

• Panel potentiometers fit music industry apps (2007-11-22) [ Digital Signal Processing ]
• Quad-channel buck converter has dual output (2007-11-22) [ Amplifying/Conditioning/Converting ]
• High-frequency crystal oscillator produces low jitter (2007-11-22) [ Design Test ]
• ABI Research sees steady growth in RFID sector (2007-11-21) [ RF/Wireless ]
• Micrel bags multimillion-dollar solar cell deal (2007-11-21) [ Process/Manufacturing ]

• Report cites China espionage as top threat to U.S. tech (2007-11-21) [ EDA/IC Design ]
• White LEDs outshine light bulbs (2007-11-21) [ Optical Electronics and Display ]
• Self-tuning 'robot' guitar ready for spotlight (2007-11-21) [ Sensor Technology ]
• Intel CEO to tool makers: 'Let's cooperate on 450mm' (2007-11-21) [ Process/Manufacturing ]
• GSM Association favors LTE for 4G (2007-11-21) [ RF/Wireless ]

• Low-cost starter kit rolls for Atmel customizable MCUs (2007-11-21) [ Programmable Logic ]
• 16M-color DDI rolls for AMOLED handset displays (2007-11-21) [ Optical Electronics and Display ]
• SBC subassembly integrates Freescale multimedia chips (2007-11-21) [ Embedded Systems ]
• CSR toolkit designs sub-$10 MP3 players (2007-11-21) [ EDA/IC Design ]
• AMD fields Phenom in race against Penryn (2007-11-21) [ Control Design ]

• Magnetic sensors claim 'thinnest' profile (2007-11-21) [ Sensor Technology ]
• Commentary: AMD, Abu Dhabi and America's xenophobia (2007-11-21) [ Embedded Systems ]