• Clock generators roll for Intel platforms (2007-11-01) [ Control Design ]
• FPGA-based dev't platform eases migration to structured ASICs (2007-11-01) [ Interface Design ]
• Key-switch controller detects multiple press/release events (2007-11-01) [ Networking Design ]
• Oscilloscope probe withstands extreme temperatures (2007-11-01) [ Design Test ]
• Mobile WiMAX Wave2 chipset eyes low power (2007-11-01) [ RF/Wireless ]

• PGI compiler suite for HPC gets upgrade (2007-11-01) [ Embedded Systems ]
• TFT LCD driver powers wQVGA displays (2007-11-01) [ Optical Electronics and Display ]
• Packet accelerator meets needs of next-gen networks (2007-11-01) [ Embedded Systems ]
• HEMT transistor handles Ku band (2007-11-01) [ RF/Wireless ]
• Filter connectors endure repeated shock, vibration (2007-11-01) [ Networking Design ]

• ZTE claims 'first' W-CDMA commercial femtocell (2007-11-01) [ RF/Wireless ]
• Middleware for SH-Mobile descrambles DVB-H (2007-11-01) [ Embedded Systems ]
• Behold the power of USB (2007-11-01) [ Interface Design ]
• Opportunity abounds in MEMS/nanotech (2007-11-01) [ Sensor Technology ]
• Spread spectrum confronts EMI (2007-11-01) [ Programmable Logic ]

• Chips address lighting challenge (2007-11-01) [ Optical Electronics and Display ]
• Chips make charging portables safer (2007-11-01) [ Power Design ]
• LCDs turn to LEDs for lighting (2007-11-01) [ Optical Electronics and Display ]
• Playing with assembly code can be fun (2007-11-01) [ Buffer/Storage ]
• Obtaining best differential signaling results (2007-11-01) [ EDA/IC Design ]

• Software drives prototyping for ASICs, SoCs (2007-11-01) [ EDA/IC Design ]
• Dealing with IP at 65nm and below (2007-11-01) [ EDA/IC Design ]
• Addressing the issues of process node transition (2007-11-01) [ EDA/IC Design ]
• 45nm designs demand efficient floorplans (2007-11-01) [ EDA/IC Design ]
• New tech complex gears HKSTP for the future (2007-11-01) [ EDA/IC Design ]

• Wireless networks pave way for e-health era (2007-11-01) [ RF/Wireless ]
• Group pits USB 3.0 against FireWire (2007-11-01) [ Interface Design ]
• NOR market heats up despite tumultuous times (2007-11-01) [ Process/Manufacturing ]
• It's a survival race for mobile TV chip suppliers (2007-11-01) [ RF/Wireless ]
• Processor battle moves to the cores (2007-11-01) [ Embedded Systems ]

• Altera executive bets big on Asia (2007-11-01) [ EDA/IC Design ]
• Video content analysis is essential in security and surveillance applications (2007-10-31) [ Security Design ]
• China PC market up for grabs between Lenovo, Acer (2007-10-31) [ Embedded Systems ]
• ZTE debuts handsets with TD-SCDMA support (2007-10-31) [ RF/Wireless ]
• Taiwan fabs appeal for softer policy on China investment (2007-10-31) [ Process/Manufacturing ]

• Ex-UMC chief cleared of illegal investment charges (2007-10-31) [ Process/Manufacturing ]
• Atmel, ASTRI collaborate on MCU-based SoC solutions (2007-10-31) [ Control Design ]
• Fab tool vendors on 450mm move: 'Flawed and misguided' (2007-10-31) [ Process/Manufacturing ]
• IC Insights notes shuffle in top-10 chip rankings (2007-10-31) [ Process/Manufacturing ]
• Air Products to supply nitrogen to Rexchip fabs (2007-10-31) [ Process/Manufacturing ]

• Sun spearheads 'eco consortium' in India (2007-10-31) [ Process/Manufacturing ]
• U.S. Senate hikes up foreign workers fee (2007-10-31) [ EDA/IC Design ]
• Pentax may sue for damages from Matsushita plant fire (2007-10-31) [ Process/Manufacturing ]
• Electronic nose sniffs sweet, sour, spicy aromas (2007-10-31) [ Process/Manufacturing ]
• MAC/PHY, RF chipsets support Mobile WiMAX, WiBro (2007-10-31) [ RF/Wireless ]

• SATA flash drive has massive capacity (2007-10-31) [ Buffer/Storage ]
• Card endows PC with DVB-H, HSDPA TV (2007-10-31) [ RF/Wireless ]
• Graphics cards use fanless cooling method (2007-10-31) [ EMI/EMC Design ]
• EL lamp drivers backlight quietly (2007-10-31) [ Optical Electronics and Display ]
• Cooling modules increase LED illumination (2007-10-31) [ EMI/EMC Design ]

• Tiny PWM controllers fit motherboard, POL apps (2007-10-31) [ Embedded Systems ]
• NEC supercomputer is 'world's fastest' at 839TFLOPS (2007-10-31) [ Control Design ]
• Startup rolls automated device driver generator (2007-10-31) [ EDA/IC Design ]
• Fujitsu Siemens tips offering for board computer market (2007-10-31) [ Embedded Systems ]
• On-axis lights address challenging vision-sensing apps (2007-10-31) [ Sensor Technology ]

• Smart extruder collects data on its own operation (2007-10-31) [ Process/Manufacturing ]
• Asian markets hold promise for integrated telematics (2007-10-30) [ Security Design ]
• Nokia Siemens wins GSM-R contract in China (2007-10-30) [ RF/Wireless ]
• Power Integrations, Epson ink foundry deal (2007-10-30) [ Process/Manufacturing ]
• Intel exec calls for advanced test tools for next-gen SoC (2007-10-30) [ Process/Manufacturing ]

• Apple sets up iPhone software development center (2007-10-30) [ Embedded Systems ]
• AUO next-gen LCD plant to go online in 2009 (2007-10-30) [ Process/Manufacturing ]
• austriamicrosystems, IDS team up on RFID reader chip (2007-10-30) [ RF/Wireless ]
• Powerline spec scorecard: HomePlug-1, DS2-0 (2007-10-30) [ Networking Design ]
• 450mm tool testing facility in Sematech's agenda (2007-10-30) [ Process/Manufacturing ]

• iSuppli: Qualcomm, TI outran wireless chip market in Q2 (2007-10-30) [ Process/Manufacturing ]
• MagnaChip may find rival in former parent Hynix (2007-10-30) [ Process/Manufacturing ]
• Manufacturing glitch delays OLPC laptops (2007-10-30) [ Process/Manufacturing ]
• Mini-ITX motherboard features Intel Core 2 Duo (2007-10-30) [ Embedded Systems ]
• Single-chip bistable display driver provides flexible waveforms (2007-10-30) [ Optical Electronics and Display ]

• PLX debuts PCI-to-USB 2.0 controller (2007-10-30) [ Interface Design ]
• High-power SLDs feature sharper directivity (2007-10-30) [ Optical Electronics and Display ]
• 2Gbyte DDR2 SO-DIMMs suit ATCA systems (2007-10-30) [ Buffer/Storage ]
• Test tool 'first' to validate IPTV QoE on IPv6 nets (2007-10-30) [ Design Test ]
• High-brightness LED driver powers 15W systems (2007-10-30) [ Optical Electronics and Display ]

• SiGe:C LNA steps up GPS systems sensitivity (2007-10-30) [ Amplifying/Conditioning/Converting ]
• Tiny RF connector tailored for wireless apps (2007-10-30) [ RF/Wireless ]
• Qualcomm fields Gobi chip for mobile Internet (2007-10-30) [ RF/Wireless ]
• TFT LCD module has switchable viewing angle (2007-10-30) [ Optical Electronics and Display ]
• LDO integrates two 300mA regulators (2007-10-30) [ Power Design ]

• Changing your walls: The world of digital photo frames (2007-10-29) [ Optical Electronics and Display ]
• New Intel fab ramps up 45nm chip production (2007-10-29) [ Process/Manufacturing ]
• Tight LCD TV supply spurs 32-inch PDP comeback (2007-10-29) [ Process/Manufacturing ]
• Freescale expands China presence with new design center (2007-10-29) [ EDA/IC Design ]
• NetLogic enters interface market with Aelus acquisition (2007-10-29) [ Interface Design ]

• Nanoelectronics group aims for energy savings (2007-10-29) [ Power Design ]
• Atom smasher discovers new Si, Al, Mg isotopes (2007-10-29) [ EDA/IC Design ]
• Microsoft bows to EU ruling—will Linux now rise? (2007-10-29) [ Embedded Systems ]
• Kyocera, Siemens partner on CDMA, GSM M2M modules (2007-10-29) [ RF/Wireless ]
• Firms form DTV testing group in Hong Kong (2007-10-29) [ Design Test ]

• SanDisk brings 25 companies to court (2007-10-29) [ Process/Manufacturing ]
• Slow sales push Hitachi out of home PC biz (2007-10-29) [ Process/Manufacturing ]
• India hinges hope on embedded design (2007-10-29) [ EDA/IC Design ]
• ATPG offers improved low power management (2007-10-29) [ Design Test ]
• ADI provides codecs gratis (2007-10-29) [ Digital Signal Processing ]

• LNA provides high gain for GPS, Galileo apps (2007-10-29) [ EMI/EMC Design ]
• CableCard power controller suits high-volume apps (2007-10-29) [ Power Design ]
• WEBENCH ships LED/driver prototypes in 24hrs (2007-10-29) [ EDA/IC Design ]
• Controller drives brushless DC motors sans sensors (2007-10-29) [ Control Design ]
• Agilent VEE programming tool supports Vista (2007-10-29) [ Embedded Systems ]

• Switching regulator handles cold-crank in cars (2007-10-29) [ Power Design ]
• Smart card connectors protect against theft (2007-10-29) [ Security Design ]
• Motion control modules handle demanding applications (2007-10-29) [ Control Design ]
• PoE adapter loads 80W over single Ethernet port (2007-10-29) [ Networking Design ]
• Module adds Zigbee sans additional programming (2007-10-29) [ RF/Wireless ]

• Fires halt Sony, Kyocera California operations (2007-10-26) [ Process/Manufacturing ]
• Spansion taps SMIC for 65nm MirrorBit production (2007-10-26) [ Process/Manufacturing ]
• Samsung muses on 10G LCD line (2007-10-26) [ Process/Manufacturing ]
• ST fab utilization rate flat without flash (2007-10-26) [ Process/Manufacturing ]
• AMD puts 450mm fab transition on hold (2007-10-26) [ Process/Manufacturing ]

• Hisense phones to flaunt Qualcomm's MEMS displays (2007-10-26) [ Sensor Technology ]
• Agilent, Sequans join on Wave 2 Mobile WiMAX testing (2007-10-26) [ Design Test ]
• ATCA advocates seek to open up software features (2007-10-26) [ Interface Design ]
• Toshiba taps optical lithography in fabs (2007-10-26) [ Optical Electronics and Display ]
• Intel settles dispute with Transmeta for $250M (2007-10-26) [ Process/Manufacturing ]

• India researchers push new design methodology (2007-10-26) [ EDA/IC Design ]
• SIA welcomes international effort vs. counterfeiting (2007-10-26) [ Process/Manufacturing ]
• Thin mobile display approaches LCD TV image quality (2007-10-26) [ Optical Electronics and Display ]
• Quad equalizer extends reach of serial buses (2007-10-26) [ Networking Design ]
• ERNI completes ERmetZD connector line (2007-10-26) [ Interface Design ]

• Single transmitters offer ±16.5kV ESD protection (2007-10-26) [ EMI/EMC Design ]
• Samsung debuts 64Gbit MLC NAND flash memory (2007-10-26) [ Buffer/Storage ]
• MEMS inclinometer makes tilt sensing affordable (2007-10-26) [ Sensor Technology ]
• Wi-Fi SoC extends battery life in sensor net apps (2007-10-26) [ Sensor Technology ]
• Altium Designer adds support for LatticeSC/M FPGA (2007-10-26) [ Programmable Logic ]

• Field-mountable connectors ease solar installations (2007-10-26) [ Networking Design ]
• Memory module pair tops JEDEC specs (2007-10-26) [ Buffer/Storage ]
• Reference design enables low-cost Bluetooth mice (2007-10-26) [ EDA/IC Design ]
• Solution tests PCIe, HDMI, DisplayPort compliance (2007-10-26) [ Design Test ]
• OFDMA pioneer welcomes WiMAX inclusion in 3G IMT-2000 (2007-10-25) [ RF/Wireless ]

• STATS ChipPAC opens second China facility (2007-10-25) [ Process/Manufacturing ]
• Cisco snaps up Navini Networks (2007-10-25) [ RF/Wireless ]
• ABI Research sees big numbers for navigation devices (2007-10-25) [ RF/Wireless ]
• Intersil opens joint R&D lab with China university (2007-10-25) [ Power Design ]
• Nokia bares vision for next-gen mobile technologies (2007-10-25) [ RF/Wireless ]

• iPod gives Apple Macintosh second wind (2007-10-25) [ Embedded Systems ]
• Sunic System, Novaled partner on TFE advancement (2007-10-25) [ Process/Manufacturing ]
• ZTE, Telekom Malaysia sign power supply purchase deal (2007-10-25) [ RF/Wireless ]
• EDA's big three unready for 3D chip packaging (2007-10-25) [ EDA/IC Design ]
• Signs point to fab-lite route for Renesas (2007-10-25) [ Process/Manufacturing ]

• Mathematician tips blueprint for invisibility tunnels (2007-10-25) [ Optical Electronics and Display ]
• Low-offset op amp family suits portable apps (2007-10-25) [ Amplifying/Conditioning/Converting ]
• HDD delivers up to 59% power efficiency (2007-10-25) [ Buffer/Storage ]
• DC/DC converter suits unregulated transformer inputs (2007-10-25) [ Amplifying/Conditioning/Converting ]
• High-voltage driver lights up 72 white LEDs (2007-10-25) [ Optical Electronics and Display ]

• Network services manager measures experiential quality (2007-10-25) [ Networking Design ]
• Medical LCD modules deliver 950cd/m² luminance (2007-10-25) [ Optical Electronics and Display ]
• Audio processors exclusive for digital cinema (2007-10-25) [ Amplifying/Conditioning/Converting ]
• Wireless EEG system runs on body heat (2007-10-25) [ RF/Wireless ]
• Virage Logic advances 65nm design (2007-10-25) [ Embedded Systems ]

• Eighth-brick DC/DC converters eye industrial apps (2007-10-25) [ Amplifying/Conditioning/Converting ]
• DC/AC converter maximizes EL lamp brightness (2007-10-25) [ Amplifying/Conditioning/Converting ]
• Enhanced OmniVision system serves drivers better (2007-10-25) [ RF/Wireless ]
• Counterfeit parts: Baiting the trap (Part 2) (2007-10-25) [ Control Design ]
• CEVA eyes brilliant future in DSP (2007-10-25) [ RF/Wireless ]

• Samsung to close two LCD facilities in China (2007-10-24) [ Process/Manufacturing ]
• Microsoft submits to EC's antirust decision (2007-10-24) [ Embedded Systems ]
• Nanocrystalline market to hit $2.5B by 2015 (2007-10-24) [ Process/Manufacturing ]
• Collaboration by Elpida, UMC to boost low-k, PRAM (2007-10-24) [ Process/Manufacturing ]
• Trolltech on Greenphones: 'Mission accomplished' (2007-10-24) [ RF/Wireless ]

• IBM, MediaTek promise fast HDTV streaming sans wires (2007-10-24) [ RF/Wireless ]
• ITU approves South Korea's WiBro as 3G standard (2007-10-24) [ RF/Wireless ]
• Proprietary wireless hi-fi tech beats Wi-Fi, Bluetooth (2007-10-24) [ RF/Wireless ]
• Quest on for next 'big thing' in semiconductor industry (2007-10-24) [ Process/Manufacturing ]
• CoorsTek beefs up ceramics production in South Korea (2007-10-24) [ Process/Manufacturing ]

• NXP, Cadence ink multiyear EDA partnership deal (2007-10-24) [ EDA/IC Design ]
• Taiwan earmarks $664M for WiMAX development (2007-10-24) [ RF/Wireless ]
• Platform ups VoIP, IMS protocol testing capacity (2007-10-24) [ Design Test ]
• Fast-recovery rectifier keeps EMI quiet (2007-10-24) [ Power Design ]
• Synchronous SRAMs come in standard, no-wait options (2007-10-24) [ Buffer/Storage ]

• Power managers for OLEDs offer 90% efficiency (2007-10-24) [ Optical Electronics and Display ]
• ATPG with on-chip compression promises better testing (2007-10-24) [ Test/Packaging ]
• 16bit MCUs with on-chip flash up system performance (2007-10-24) [ Buffer/Storage ]
• All-in-one LCD integrates touch panel, cover (2007-10-24) [ Sensor Technology ]
• Motors, drives support CANopen communication (2007-10-24) [ Embedded Systems ]

• Servo drive tackles military, harsh setups (2007-10-24) [ Amplifying/Conditioning/Converting ]
• SPI interface characterizes digital potentiometers (2007-10-24) [ Amplifying/Conditioning/Converting ]
• Omron RFID reader supports Microsoft BizTalk (2007-10-24) [ RF/Wireless ]
• LSI compresses full-HD image to half its size (2007-10-24) [ Embedded Systems ]
• Guidelines out on HDMI trademark, logo usage (2007-10-23) [ Interface Design ]

• IC Insights upgrades 2007 IC growth forecast (2007-10-23) [ Process/Manufacturing ]
• ITU adds WiMAX in 3G standard suite (2007-10-23) [ RF/Wireless ]
• Large LCD panels expect big numbers in Q3 (2007-10-23) [ Process/Manufacturing ]
• Tower fabs image sensors for Taiwan CCTV firm (2007-10-23) [ Process/Manufacturing ]
• Report: Japan's NTT cuts fiber-optic subscribers target (2007-10-23) [ Optical Electronics and Display ]

• Court junks Nokia's ITC complaint vs. Qualcomm (2007-10-23) [ RF/Wireless ]
• Fujitsu, Vivante team on system LSI for mobile devices (2007-10-23) [ RF/Wireless ]
• Bosch sets up new HQ in South Korea (2007-10-23) [ Process/Manufacturing ]
• NRC: U.S. should allow 'open science,' despite risks (2007-10-23) [ Process/Manufacturing ]
• Pixelplus offloads all shares in Taiwan subsidiary (2007-10-23) [ Optical Electronics and Display ]

• Five firms named VEU of U.S. tech exports to China (2007-10-23) [ Process/Manufacturing ]
• SXGA CMOS sensor first with snapshot shutter, LVDS outputs (2007-10-23) [ Sensor Technology ]
• Multicore platform tackles multiple car navigation apps (2007-10-23) [ Embedded Systems ]
• High-precision voltage divider is very stable (2007-10-23) [ Power Design ]
• ADC with I²C interface draws less power (2007-10-23) [ Power Design ]

• MCUs help motorcycle makers meet emission standards (2007-10-23) [ Control Design ]
• Safety controller features multiple input devices (2007-10-23) [ Control Design ]
• Startup releases free parameterized cores over the Web (2007-10-23) [ Embedded Systems ]
• 32Mbit SDRAM design cuts cost of SiPs for handsets (2007-10-23) [ Buffer/Storage ]
• DS2 tips 400Mbps powerline chip (2007-10-23) [ Networking Design ]

• RF module carries out testing of RF SoC devices (2007-10-23) [ Test/Packaging ]
• Compiler/debugger supports ARM Cortex-M1 (2007-10-23) [ Embedded Systems ]
• Free configuration tool rolls for Turck RFID system (2007-10-23) [ RF/Wireless ]
• Wanted: an IP manager (2007-10-22) [ Embedded Systems ]
• PCIe hot-plug controllers ups design flexibility (2007-10-22) [ Networking Design ]

• Oscilloscopes deliver 5GSps at 1GHz (2007-10-22) [ Design Test ]
• RapidIO switch slashes 3G baseband costs (2007-10-22) [ RF/Wireless ]
• 600V gate drivers target three-phase applications (2007-10-22) [ Control Design ]
• MR16 LED chipset saves board real-estate (2007-10-22) [ Optical Electronics and Display ]
• Car navigation processor features embedded GPS (2007-10-22) [ RF/Wireless ]

• Clairvoyante displays offer PenTile backlight control (2007-10-22) [ Optical Electronics and Display ]
• Network processors roll for Ethernet access market (2007-10-22) [ Networking Design ]
• Networking solutions showcase at Interop 2007 (2007-10-22) [ Networking Design ]
• Power relays work in hybrid vehicles, fuel cells (2007-10-22) [ Power Design ]
• Miniature slide switches fit space-limited PCBs (2007-10-22) [ Networking Design ]

• A-GPS platform meets demand for multiwireless solutions (2007-10-22) [ RF/Wireless ]
• China OLED tech lags behind Asian neighbors, says CCID (2007-10-22) [ Process/Manufacturing ]
• Intel gets antitrust clearance to set up Numonyx (2007-10-22) [ Process/Manufacturing ]
• Consortium drafts IC test interface extension standard (2007-10-22) [ Test/Packaging ]
• Mobile Linux makes headway in handset industry (2007-10-22) [ RF/Wireless ]

• Ralink partners with AMD in Better by Design program (2007-10-22) [ RF/Wireless ]
• FCoE chips rolling from Emulex, Nuova team-up (2007-10-22) [ RF/Wireless ]
• Seashells inspire ultrathin yet ultrastrong materials (2007-10-22) [ Process/Manufacturing ]
• Jasper, Wavecom co-develop wireless M2M infrastructure (2007-10-22) [ RF/Wireless ]
• Hynix cuts 2008 capex, revives non-memory biz (2007-10-22) [ Process/Manufacturing ]

• DRAM market stays upbeat (2007-10-22) [ Process/Manufacturing ]
• Renesas opens LSI design facility in Vietnam (2007-10-22) [ Process/Manufacturing ]
• Going fab-lite: Sony offloads fabs to Toshiba (2007-10-22) [ Process/Manufacturing ]