• Chinese city soon to shift from analog to DTV (2007-10-11) [ Amplifying/Conditioning/Converting ]
• Broadcom, Samsung partner on 3G solutions (2007-10-11) [ RF/Wireless ]
• SiConnect, CEPCA, UPA merge powerline proposals (2007-10-11) [ Networking Design ]
• Dell wages battle vs. carbon, fortifies green crusade (2007-10-11) [ Process/Manufacturing ]
• Analyst: Bleak holidays await LCD market (2007-10-11) [ Optical Electronics and Display ]

• IBM, Google gear students for Internet-scale apps (2007-10-11) [ Networking Design ]
• Thermal pillar copper tech helps cool flip-chips (2007-10-11) [ EMI/EMC Design ]
• NXP picks CEVA DSP core for ULCH solutions (2007-10-11) [ RF/Wireless ]
• HomePlug proposal unites rival powerline camps (2007-10-11) [ Networking Design ]
• AT&T secures 700MHz licenses for $2.5B (2007-10-11) [ RF/Wireless ]

• Atmel deal expands TSMC China fab capacity (2007-10-11) [ Process/Manufacturing ]
• Japan chip industry up for painful restructuring (2007-10-11) [ Process/Manufacturing ]
• Small step-down DC/DC converter rolls for cars (2007-10-11) [ Power Design ]
• Power manager integrates buck regulator, LDO (2007-10-11) [ Power Design ]
• 720W PFC module fits space-constrained apps (2007-10-11) [ Power Design ]

• WiMAX simulator allows efficient area planning (2007-10-11) [ EDA/IC Design ]
• LED light-management IC saves board real estate (2007-10-11) [ Optical Electronics and Display ]
• Tiny W-CDMA duplexer extends handset talk time (2007-10-11) [ RF/Wireless ]
• DAQ boards offer speed, integration, flexibility (2007-10-11) [ Embedded Systems ]
• Power supply controller enables energy-efficient designs (2007-10-11) [ Power Design ]

• Tektronix upgrades signal fidelity of oscilloscopes (2007-10-11) [ Design Test ]
• PLLs tailored for wireless, satellite applications (2007-10-11) [ RF/Wireless ]
• Starter kit eases evaluation of TI floating-point DSCs (2007-10-11) [ EDA/IC Design ]
• Broadband MMIC amp suits high-linearity apps (2007-10-11) [ RF/Wireless ]
• Body fat meter sells for a slim price (2007-10-11) [ Power Design ]

• WiMedia Alliance intros first UWB-certified products (2007-10-10) [ RF/Wireless ]
• Alcatel-Lucent, Sagem co-develop femtocell base stations (2007-10-10) [ RF/Wireless ]
• Gateway offers to acquire Europe's Packard Bell (2007-10-10) [ Process/Manufacturing ]
• Consortium formed to promote SOI technology (2007-10-10) [ Test/Packaging ]
• Design talent drives India's electronics industry (2007-10-10) [ EDA/IC Design ]

• Fairchild CEO: Energy efficiency is industry's next hurdle (2007-10-10) [ Power Design ]
• Motorola bags largest WiMAX deal in Taiwan (2007-10-10) [ RF/Wireless ]
• Japan chip execs see double-digit comeback after flat '07 (2007-10-10) [ Process/Manufacturing ]
• Sony, Samsung push OLED to consumer segment (2007-10-10) [ Optical Electronics and Display ]
• Atmel sells U.K. fab to TSMC, Highbridge Business Park (2007-10-10) [ Process/Manufacturing ]

• Long-time partners Spansion, Saifun sign merger (2007-10-10) [ Process/Manufacturing ]
• ARM bares initiative for physical IP at 32nm (2007-10-10) [ Process/Manufacturing ]
• Long-read-range RFID inlays come in compact form (2007-10-10) [ RF/Wireless ]
• Chipsets cut back IPTV interruptions (2007-10-10) [ Networking Design ]
• SAS RAID offers three PCIe controller choices (2007-10-10) [ Interface Design ]

• Universal SoC promises true 1080/60p (2007-10-10) [ Embedded Systems ]
• High-performance stereo DAC suits high-end audio apps (2007-10-10) [ Amplifying/Conditioning/Converting ]
• DACs draw less than 1µA supply current (2007-10-10) [ Amplifying/Conditioning/Converting ]
• DSP platform adds audio effects to guitars (2007-10-10) [ Digital Signal Processing ]
• SST, Insyde team on flash-based PC storage (2007-10-10) [ Buffer/Storage ]

• Hard disk-flash hybrid drives quicken PC boot up (2007-10-10) [ Buffer/Storage ]
• XLoom weaves optics solution for Infiniband (2007-10-10) [ Optical Electronics and Display ]
• TI intros DOCSIS 3.0 cable modem chipsets (2007-10-10) [ Networking Design ]
• Software makes GPS devices out of smart phones (2007-10-10) [ RF/Wireless ]
• Master the I/O planning puzzle (2007-10-09) [ EDA/IC Design ]

• Choose the optimum switching frequency of a DC/DC converter (2007-10-09) [ Amplifying/Conditioning/Converting ]
• VDC: MECC-Emerson merger a boon to embedded industry (2007-10-09) [ Embedded Systems ]
• Leadis beefs up AMOLED strategy with IP purchase (2007-10-09) [ Process/Manufacturing ]
• Dell, Haier to vie for China's No. 3 PC maker (2007-10-09) [ Process/Manufacturing ]
• Panasonic adds ecological agenda to business plan (2007-10-09) [ Process/Manufacturing ]

• Oki taps Synopsys VMM tech for SoC verification (2007-10-09) [ EDA/IC Design ]
• Analyst: Hard times ahead for LCD panel makers (2007-10-09) [ Process/Manufacturing ]
• Stress sensor aids in man-machine interface research (2007-10-09) [ Sensor Technology ]
• NXP strengthens French operations with new R&D center (2007-10-09) [ EDA/IC Design ]
• The road to success in embedded software (2007-10-09) [ Embedded Systems ]

• Accounting inconsistency claims hound China solar firm (2007-10-09) [ Process/Manufacturing ]
• Taiwan to host first SIM-based NFC trial in Asia (2007-10-09) [ Sensor Technology ]
• Stuck at C: Programming languages unready for multicore (2007-10-09) [ Embedded Systems ]
• Flexible chipset targets 50-500W Class D audio amps (2007-10-09) [ RF/Wireless ]
• Ultralow-power modules ease wireless sensor net designs (2007-10-09) [ RF/Wireless ]

• Half-sized transceivers give full-size performance (2007-10-09) [ Networking Design ]
• Omron power relay gives 40A switching capacity (2007-10-09) [ Networking Design ]
• 16-channel LED driver works in large video displays (2007-10-09) [ Optical Electronics and Display ]
• Switching regulators offer 95% efficiency at full load (2007-10-09) [ Power Design ]
• Trango delivers Cortex-A9 secure virtualization IP (2007-10-09) [ Embedded Systems ]

• TriQuint tips green base station power amp (2007-10-09) [ RF/Wireless ]
• TI claims smallest digital temperature sensor (2007-10-09) [ Sensor Technology ]
• Calibrator chip removes flicker in TFT-LCD panels (2007-10-09) [ Test/Packaging ]
• Resistors rated to 200°C roll for automotive, aerospace apps (2007-10-09) [ EMI/EMC Design ]
• Switching regulator efficiently drives HB-LEDs (2007-10-09) [ Optical Electronics and Display ]

• ABI: Mobile WiMAX on a roll as trials lead to deployments (2007-10-08) [ RF/Wireless ]
• Nokia, Siemens to keep JV until 2013 (2007-10-08) [ RF/Wireless ]
• Sony likely to sell graphics chip facility (2007-10-08) [ Process/Manufacturing ]
• Numonyx to reactivate ST's 300mm Italy fab (2007-10-08) [ Process/Manufacturing ]
• U.S.-India high-tech VEU program announced (2007-10-08) [ Process/Manufacturing ]

• MIPI Alliance welcomes Cypress as new member (2007-10-08) [ Interface Design ]
• Rumor: ST to close French R&D center (2007-10-08) [ Process/Manufacturing ]
• Toshiba mulls over 450mm fab, EUV litho (2007-10-08) [ Process/Manufacturing ]
• Forum to drive adoption of HD DVD interactivity (2007-10-08) [ Digital Signal Processing ]
• Philips Lumileds scores in LED patent case vs. Epistar (2007-10-08) [ Optical Electronics and Display ]

• TriQuint hits 5M mark in ULCH module shipments (2007-10-08) [ RF/Wireless ]
• Survey: Linux gaining ground in embedded systems (2007-10-08) [ Embedded Systems ]
• Embedded VoIP platform suits industrial, commercial apps (2007-10-08) [ Embedded Systems ]
• Pentaband antenna handles all cellular bands (2007-10-08) [ RF/Wireless ]
• Sun offers virtualization platform (2007-10-08) [ Embedded Systems ]

• ARM tool performs non-intrusive software analysis (2007-10-08) [ Embedded Systems ]
• Mobile GPS chip detects faint signal levels at -162dBm (2007-10-08) [ RF/Wireless ]
• National debuts rail-to-rail, current feedback op amps (2007-10-08) [ Amplifying/Conditioning/Converting ]
• DC/DC converter features internal 2A/42V switch (2007-10-08) [ Amplifying/Conditioning/Converting ]
• Power ICs provide variable speed control (2007-10-08) [ Power Design ]

• Software carries out serial data link analysis (2007-10-08) [ Test/Packaging ]
• NEC unrolls 15-inch LCD modules for industrial equipment (2007-10-08) [ Optical Electronics and Display ]
• HDMI 1.3a buffer IC rolls for large DTV sets (2007-10-08) [ Interface Design ]
• Mentor upgrades TestKompress for 65/45nm nodes (2007-10-08) [ Process/Manufacturing ]
• Tech lets ICs sense surroundings (2007-10-05) [ Sensor Technology ]

• DSPs jazz up guitars with effects (2007-10-05) [ Digital Signal Processing ]
• Atmel licenses Hantro video decoder for 32bit MCUs (2007-10-05) [ Embedded Systems ]
• ARM, partners develop Linux platform for next-gen mobile (2007-10-05) [ Embedded Systems ]
• Winbond mulls creation of logic IC subsidiary (2007-10-05) [ Process/Manufacturing ]
• Asia vendors to capture 4G IP market, says ABI (2007-10-05) [ RF/Wireless ]

• First organic IC self-assembled from nanowires (2007-10-05) [ Amplifying/Conditioning/Converting ]
• Gartner: Fab tool market up in '07, down in '08 (2007-10-05) [ Process/Manufacturing ]
• SunPower sets up 2MW solar plant in Korea (2007-10-05) [ Power Design ]
• Malaysian telco aids Silterra on 90/65nm chip production (2007-10-05) [ Process/Manufacturing ]
• Intel initiates programs for India design houses (2007-10-05) [ EDA/IC Design ]

• Team Nokia-Renault draws up navigation plan (2007-10-05) [ RF/Wireless ]
• Synopsys beefs up verification line with Sandwork acquisition (2007-10-05) [ EDA/IC Design ]
• IR housecleans after CEO's departure (2007-10-05) [ Power Design ]
• 2Mpixel image sensor with antishake targets camera phones (2007-10-05) [ Sensor Technology ]
• One inductor bucks and boosts (2007-10-05) [ Power Design ]

• Automotive image sensor gives intuition (2007-10-05) [ Sensor Technology ]
• Low-power voltage reference comes in micro package (2007-10-05) [ Power Design ]
• Quartus II FPGA design software version 7.2 debuts (2007-10-05) [ Programmable Logic ]
• COM Express modules are scalable (2007-10-05) [ Networking Design ]
• HDTV SoCs deliver 10bit video quality processing (2007-10-05) [ Digital Signal Processing ]

• Audio ICs promise heightened HDTV experience (2007-10-05) [ Amplifying/Conditioning/Converting ]
• X2Y capacitors offer low inductance (2007-10-05) [ Sensor Technology ]
• System LSI puts 3G in handsets (2007-10-05) [ RF/Wireless ]
• 'Nano' MEMS roll for consumer, industrial markets (2007-10-05) [ Sensor Technology ]
• Flash LED driver suits cellphones with video recording (2007-10-05) [ Optical Electronics and Display ]

• Acer extends Gateway buyout offer to Oct. 10 (2007-10-04) [ Embedded Systems ]
• LSI sells Thailand facility to STATS ChipPAC (2007-10-04) [ Test/Packaging ]
• Epson, Murata to develop wireless quick battery charger (2007-10-04) [ Power Design ]
• Sun combines storage, server teams (2007-10-04) [ Buffer/Storage ]
• Infineon, Hosiden co-develop silicon microphones (2007-10-04) [ Sensor Technology ]

• NEC subsidiaries in Singapore merge to form APAC HQ (2007-10-04) [ RF/Wireless ]
• Panasonic appoints Digi-Key distributor of Zigbee modules (2007-10-04) [ RF/Wireless ]
• Matsushita to use 45nm chips in Blu-rays in November (2007-10-04) [ Process/Manufacturing ]
• Report: Flash capacity to overtake DRAM next year (2007-10-04) [ Process/Manufacturing ]
• IBM pushes for open RFID standards (2007-10-04) [ RF/Wireless ]

• Three 3G HTC Touch phones roll as Google keeps mum on gPhone (2007-10-04) [ RF/Wireless ]
• Infineon's Ziebart: European chip industry needs subsidies (2007-10-04) [ EDA/IC Design ]
• Pre-tilted gyro-sensor suits in-dash navigation systems (2007-10-04) [ Sensor Technology ]
• Compact camera modules use Dynastron technology (2007-10-04) [ Optical Electronics and Display ]
• EEPROM secures products from cloning, counterfeiting (2007-10-04) [ Security Design ]

• New MATLAB software generates C code (2007-10-04) [ Digital Signal Processing ]
• Flexible EM wave film withstands 2 million folds (2007-10-04) [ Process/Manufacturing ]
• Wavecom gives free MPU design licensing for service contract (2007-10-04) [ Embedded Systems ]
• Fuel gauge IC says how much power is left, accurately (2007-10-04) [ Power Design ]
• Be free of power lines with PoE interface controllers (2007-10-04) [ Networking Design ]

• Prototype 3G wireless base station boasts 900Mbps downlink speed (2007-10-04) [ RF/Wireless ]
• Chip adds HD video, 12MP digicam, 3G games to mobiles (2007-10-04) [ Optical Electronics and Display ]
• Non-volatile SRAM controller has tamper detection (2007-10-04) [ Security Design ]
• Compression codec transmits HD video wirelessly (2007-10-04) [ RF/Wireless ]
• Image sensor, processing at heart of digital SLR (2007-10-04) [ Sensor Technology ]

• AMD native quad-core hits x86 market (2007-10-04) [ Control Design ]
• Security in silicon: A guide to secure, high-speed SoC devices (Part I) (2007-10-04) [ Security Design ]
• Nokia nets navigation firm Navteq (2007-10-03) [ RF/Wireless ]
• EC investigates antitrust allegations vs. Qualcomm (2007-10-03) [ RF/Wireless ]
• Matsushita group joins green movement in China (2007-10-03) [ Process/Manufacturing ]

• CCID: Address four issues to drive mobile TV growth in China (2007-10-03) [ RF/Wireless ]
• Flextronics completes acquisition of Solectron (2007-10-03) [ Process/Manufacturing ]
• Sony to roll out OLED TV in time for Christmas (2007-10-03) [ Optical Electronics and Display ]
• Analyst: Barcelona fails to raise AMD prospects (2007-10-03) [ Control Design ]
• Carbon nanotubes find, fix aircraft wing defects (2007-10-03) [ Process/Manufacturing ]

• Sony, Qimonda form DRAM design JV (2007-10-03) [ EDA/IC Design ]
• Forum drafts next-generation Wireless USB spec (2007-10-03) [ RF/Wireless ]
• Algorithm doubles memory at minimum latency (2007-10-03) [ Buffer/Storage ]
• Acquisition equips Big Blue for design services (2007-10-03) [ EDA/IC Design ]
• Atmel transceiver kits deliver out-of-the-box experience (2007-10-03) [ RF/Wireless ]

• Low-loss material, chip combine for better cables (2007-10-03) [ Embedded Systems ]
• VIA, QSound Labs solution enhances sound in Vista PCs (2007-10-03) [ Amplifying/Conditioning/Converting ]
• Wavesat rolls WiMAX Mini-PCI for mass market CPEs (2007-10-03) [ Interface Design ]
• USB transceiver is 3x smaller than golf ball dimple (2007-10-03) [ RF/Wireless ]
• Programmable SPXOs support low voltages, high frequencies (2007-10-03) [ Interface Design ]

• Repeaters extend DVI/HDMI signal transmission (2007-10-03) [ Amplifying/Conditioning/Converting ]
• HF matrix is remotely controllable via Ethernet (2007-10-03) [ RF/Wireless ]
• DTV codec eases audio signal management (2007-10-03) [ Amplifying/Conditioning/Converting ]
• Transimpedance amps roll for next-gen SFP+ optical modules (2007-10-03) [ Optical Electronics and Display ]
• Samples of mini crystal oscillator ship in two days (2007-10-03) [ Test/Packaging ]

• Ultrasmall charge pumps target handsets (2007-10-03) [ Power Design ]
• Fire halts Li-ion battery production at Matsushita plant (2007-10-02) [ Process/Manufacturing ]
• Infineon licenses DirectFET technology from IR (2007-10-02) [ Test/Packaging ]
• Hynix, Ovonyx ink PRAM cross-licensing deal (2007-10-02) [ Buffer/Storage ]
• Motorola sells embedded computing biz to Emerson (2007-10-02) [ Embedded Systems ]

• Wipro buys Oki wireless design unit in Singapore (2007-10-02) [ EDA/IC Design ]
• ASE, NXP open assembly & test JV in China (2007-10-02) [ Test/Packaging ]
• Huawei, private equity acquire 3Com for $2.2B (2007-10-02) [ Process/Manufacturing ]
• High-tech VC fund formed for Russia, CIS (2007-10-02) [ Process/Manufacturing ]
• 120MW solar cell plant rises in Malaysia (2007-10-02) [ Process/Manufacturing ]

• SanDisk opens SiP production facility in China (2007-10-02) [ Process/Manufacturing ]
• Singapore's investment arm eyes Malaysian automation firm (2007-10-02) [ Process/Manufacturing ]
• SMIC-Saifun flash project delayed but not stalled (2007-10-02) [ Process/Manufacturing ]
• SoC drives image recognition processing in cars (2007-10-02) [ Interface Design ]
• Buck controller touts fast transient response (2007-10-02) [ Control Design ]

• Low-power DAB transmitter is compact (2007-10-02) [ RF/Wireless ]
• Comsys fields cellular/WiMAX reference designs (2007-10-02) [ RF/Wireless ]
• Epson unveils high-speed, high-precision SCARA robots (2007-10-02) [ Process/Manufacturing ]
• Jitter measurement device covers full 80MHz spectrum (2007-10-02) [ Design Test ]
• USB DAQ devices offer 80 I/O channels (2007-10-02) [ Interface Design ]

• Embedded processor delivers 1GHz clock speed (2007-10-02) [ Embedded Systems ]
• Vishay SOIC-8 optocouplers now offer 4,000V isolation (2007-10-02) [ Optical Electronics and Display ]
• Ethernet/IP gateways connect up to 255 extension modules (2007-10-02) [ Networking Design ]
• Sealed linear array lights suit harsh washdown environments (2007-10-02) [ Optical Electronics and Display ]
• Dual micropower comparator targets battery-run apps (2007-10-02) [ Amplifying/Conditioning/Converting ]

• Demystifying multithreading, multicore (2007-10-02) [ Digital Signal Processing ]
• Wavesat, IBM develop 4G Mobile WiMAX chipsets (2007-10-01) [ RF/Wireless ]
• Analog switches offer 10Ω on-resistance (2007-10-01) [ Power Design ]
• WiMAX transceiver first to roll with internal calibration (2007-10-01) [ RF/Wireless ]
• Sharp in-vehicle LCD touts 2,500:1 contrast ratio (2007-10-01) [ Optical Electronics and Display ]

• Integrated LED driver features dimming control (2007-10-01) [ Optical Electronics and Display ]
• Trailblazing dual differential ADC drivers debut (2007-10-01) [ Amplifying/Conditioning/Converting ]
• Controller sprinkles peripheral designs with wireless USB (2007-10-01) [ RF/Wireless ]
• TI secures e-passport market with FRAM-based chips (2007-10-01) [ Security Design ]
• Interface tester embraces Mobile WiMAX, LTE specs (2007-10-01) [ Test/Packaging ]

• Calibration application rolls for TD-SCDMA phones (2007-10-01) [ Test/Packaging ]
• USB 2.0 connectors suit automotive applications (2007-10-01) [ Networking Design ]
• Motorola unveils 802.16e-compliant handset chipset modem (2007-10-01) [ RF/Wireless ]
• Displays get the magic touch (2007-10-01) [ Process/Manufacturing ]
• Ericsson goes beyond wireless (2007-10-01) [ Networking Design ]

• Overcome obstacles in QA-process (2007-10-01) [ Design Test ]
• MOSFETs boast advanced thermal performance (2007-10-01) [ Power Design ]
• Manufacturers tip hot chips, interconnects (2007-10-01) [ Control Design ]
• Virtual video, multitouch define future (2007-10-01) [ Interface Design ]
• Optical transport system fits enterprise nets (2007-10-01) [ Optical Electronics and Display ]

• Debug evolution transforms tools (2007-10-01) [ Embedded Systems ]
• Trade-off issues chase short-range devices (2007-10-01) [ RF/Wireless ]
• Hail the CD before it is too late (2007-10-01) [ Buffer/Storage ]
• High-end memory interface needs FPGAs (2007-10-01) [ Buffer/Storage ]
• For non-SI specialists, use jitter eliminators (2007-10-01) [ EDA/IC Design ]

• Good strategies for a low-power resistive touchscreen (2007-10-01) [ Sensor Technology ]
• Handset interface taps capacitive sensors (2007-10-01) [ Sensor Technology ]
• U.S., U.K. partner up on patents (2007-10-01) [ EDA/IC Design ]
• NI cooks up ideas for next LabView (2007-10-01) [ Design Test ]
• Researchers switch magnetic domains from hard to soft (2007-10-01) [ Buffer/Storage ]

• Sensor nets monitor safety-critical structures 24/7 (2007-10-01) [ Sensor Technology ]
• Flash makers position for NAND surge (2007-10-01) [ Process/Manufacturing ]
• Chipmakers are eyeing 700MHz prize (2007-10-01) [ RF/Wireless ]