• Techwell video decoder integrates audio ADCs (2006-03-31) [ Amplifying/Conditioning/Converting ]
• Virtex-4 FPGAs turn into traffic managers for triple-play apps (2006-03-31) [ Programmable Logic ]
• Aldec offers 90-day free access to Riviera Verilog simulator (2006-03-31) [ EDA/IC Design ]
• Windows software endows Tektronix spectrum analyzers with offline analysis (2006-03-31) [ Design Test ]
• Low ESR capacitor targets processors (2006-03-31) [ Power Design ]

• White LED drivers feature dual-gain architecture (2006-03-31) [ Optical Electronics and Display ]
• Tyco DC/DC converters suit IBA apps (2006-03-31) [ Power Design ]
• RF detector eliminates external components (2006-03-31) [ RF/Wireless ]
• Processor supports all TV audio broadcast standards (2006-03-31) [ Digital Signal Processing ]
• Dev kit validates transceiver signal integrity (2006-03-31) [ Programmable Logic ]

• ARM-based MCU costs $1 (2006-03-31) [ Control Design ]
• Varitronix to enter OLED market (2006-03-31) [ Optical Electronics and Display ]
• AUO, Sharp expand TFT LCD licensing agreement (2006-03-31) [ Optical Electronics and Display ]
• Taiwan's Chung Hua University upgrades research capabilities (2006-03-31) [ Test/Packaging ]
• Chipworks posts results of Samsung CIS module analysis (2006-03-31) [ EDA/IC Design ]

• SigmaTel updates guidance for Q1 2006 (2006-03-31) [ RF/Wireless ]
• Synopsys' DFT MAX reduces test costs on Nvidia GPUs (2006-03-31) [ EDA/IC Design ]
• New bidding war brewing at Lexar? (2006-03-31) [ Buffer/Storage ]
• Taiwan plans extra scrutiny on China investments (2006-03-31) [ Process/Manufacturing ]
• Japan reloads chip R&D effort (2006-03-31) [ Process/Manufacturing ]

• Europe, U.S. losing manufacturing edge, says Eurocom Worldwide (2006-03-31) [ Process/Manufacturing ]
• ST aims to be top semi supplier to China (2006-03-31) [ Process/Manufacturing ]
• Intel launches Indian 'community PC' design (2006-03-31) [ Embedded Systems ]
• DDR2 price up keeps teetering, says DRAMeXchange (2006-03-30) [ Buffer/Storage ]
• MP MAN switches to SigmaTel (2006-03-30) [ Amplifying/Conditioning/Converting ]

• Sequans used Synopsys' tools in WiMAX/WiBro chip development (2006-03-30) [ EDA/IC Design ]
• NEC to unload Internet unit (2006-03-30) [ Process/Manufacturing ]
• Pantech ships GSM handsets to Vietnam (2006-03-30) [ RF/Wireless ]
• NAND, NOR flash headed in opposite directions (2006-03-30) [ Buffer/Storage ]
• Firm cuts NAND forecast, ups DRAM outlook (2006-03-30) [ Buffer/Storage ]

• India develops as hotbed for semiconductors (2006-03-30) [ Process/Manufacturing ]
• 12-inch wafers to drive IC growth, says Lam Research (2006-03-30) [ Process/Manufacturing ]
• Syntax-Brillian, LG.Philips ink supply agreement (2006-03-30) [ Optical Electronics and Display ]
• Taiwan DRAM maker places follow-on orders for Mattson's strip system (2006-03-30) [ Process/Manufacturing ]
• Siemens now a ZigBee "promoter" (2006-03-30) [ RF/Wireless ]

• New line of ZenTime products addresses specific cell design issues (2006-03-30) [ EDA/IC Design ]
• Precision resistor rated up to 20kV (2006-03-30) [ Power Design ]
• Optical sensor operates up to 12 inches (2006-03-30) [ Sensor Technology ]
• LNA claims industry first for GPS (2006-03-30) [ RF/Wireless ]
• Design, simulation tool expands its MOSFET library (2006-03-30) [ EDA/IC Design ]

• EMI filters offer surge suppression (2006-03-30) [ EMI/EMC Design ]
• Op amp reduces power consumption by 30% (2006-03-30) [ Amplifying/Conditioning/Converting ]
• Platform integrates optical, VoIP tech (2006-03-30) [ Embedded Systems ]
• LDOs withstand up to 80V input (2006-03-30) [ Power Design ]
• OLED driver IC extends display lifetime, battery life (2006-03-30) [ Optical Electronics and Display ]

• Synopsys announces platform support for Sun processor (2006-03-30) [ EDA/IC Design ]
• Nvidia's new GPUs target mainstream market (2006-03-30) [ Control Design ]
• COTS X-band multi-function MMIC with X-band radar functions (2006-03-30) [ RF/Wireless ]
• Shipments of handset-use TFT LCD to hit 780M (2006-03-29) [ Optical Electronics and Display ]
• CMO to initiate setting up of 8G plant (2006-03-29) [ Optical Electronics and Display ]

• Omron antenna technology improves RFID tag reading performance (2006-03-29) [ RF/Wireless ]
• Kyocera selects Nvidia GPU for latest 3G mobile phone (2006-03-29) [ Optical Electronics and Display ]
• TDK, Densei-Lambda to launch unified product brand (2006-03-29) [ Power Design ]
• Spansion licenses ARM processor to expand logic-on-flash solutions (2006-03-29) [ RF/Wireless ]
• STARC adopts Synopsys' IC compiler to boost efficiency (2006-03-29) [ EDA/IC Design ]

• Cellon expands operations in Asia (2006-03-29) [ EDA/IC Design ]
• Spansion partners with Qualcomm, ARM to expand handset presence (2006-03-29) [ RF/Wireless ]
• Intel backs wireless sensor networking startup (2006-03-29) [ RF/Wireless ]
• Microsemi, Monolithic Power settle patent suit (2006-03-29) [ Optical Electronics and Display ]
• Ericsson execs reportedly on tax evasion trial (2006-03-29) [ RF/Wireless ]

• Light guides lower part count, cost (2006-03-29) [ Optical Electronics and Display ]
• Device software tools shorten development cycles (2006-03-29) [ EDA/IC Design ]
• ADCs handle 250MSps for cable and wireless (2006-03-29) [ Amplifying/Conditioning/Converting ]
• RF connector kit features 3.5mm adapters (2006-03-29) [ RF/Wireless ]
• Lead screw assemblies offer advanced coatings (2006-03-29) [ Process/Manufacturing ]

• STB decoder intended for high-volume markets (2006-03-29) [ RF/Wireless ]
• MCUs target cellphone smart cards (2006-03-29) [ Control Design ]
• Charge-pump converters suit battery-powered CE devices (2006-03-29) [ Power Design ]
• Video phone solution is built on DaVinci (2006-03-29) [ Embedded Systems ]
• HDMI switches tackle high-bandwidth video apps (2006-03-29) [ Interface Design ]

• Phototriacs isolate logic from power mains (2006-03-29) [ Power Design ]
• Power conversion IC integrates peak power capability (2006-03-29) [ Power Design ]
• LG.Philips to build a 5.5G TFT LCD plant (2006-03-28) [ Optical Electronics and Display ]
• Israeli consortium targets China's DTV market (2006-03-28) [ Optical Electronics and Display ]
• Wind River forms multicore processing initiative (2006-03-28) [ EDA/IC Design ]

• US-based HDTV maker forms alliance with Asian-based companies (2006-03-28) [ Optical Electronics and Display ]
• Flash memory-based DV camcorders to become mainstream (2006-03-28) [ Optical Electronics and Display ]
• Microsoft appeals Korea Fair Trade Commission decision (2006-03-28) [ Embedded Systems ]
• Qualcomm, IAC sign 3G license agreement (2006-03-28) [ RF/Wireless ]
• China's IC demand outpaces production (2006-03-28) [ Process/Manufacturing ]

• Sony, Nvidia expand chip alliance (2006-03-28) [ Process/Manufacturing ]
• Toshiba wins NAND suit versus Hynix, says report (2006-03-28) [ Buffer/Storage ]
• SMIC tops Chartered in '05 foundry rankings (2006-03-28) [ Process/Manufacturing ]
• Siemens sells remaining 18% stake in Infineon (2006-03-28) [ Process/Manufacturing ]
• White LED touts high brightness, small size (2006-03-28) [ Optical Electronics and Display ]

• Schurter filtered DC power entry module meets tough demands for EMC (2006-03-28) [ Networking Design ]
• Electrolytic caps are RoHS compliant (2006-03-28) [ Power Design ]
• Position sensors simplify set-up for automation apps (2006-03-28) [ Sensor Technology ]
• Stratix FPGAs qualified for military sector (2006-03-28) [ EDA/IC Design ]
• Transmitter, T&M solutions focus on mobile TV standards (2006-03-28) [ Design Test ]

• Power supply solution delivers less than 1W standby power (2006-03-28) [ Optical Electronics and Display ]
• AMIC unveils GPS receiver (2006-03-28) [ RF/Wireless ]
• Encoder IC integrates Hall elements, DSP (2006-03-28) [ Sensor Technology ]
• Broadcom claims first stackable 10GbE switches (2006-03-28) [ Networking Design ]
• Chip improves energy efficiency in CE, AC adapters (2006-03-28) [ Power Design ]

• Audio processor lengthens cellphone battery life (2006-03-28) [ Digital Signal Processing ]
• Axcelis inaugurates Beijing Technology Center (2006-03-27) [ Process/Manufacturing ]
• Model 2100 TFOS receives orders from multiple Japan, U.S.-based customers (2006-03-27) [ Test/Packaging ]
• Fujitsu Siemens notebook features ATI's graphics solution (2006-03-27) [ Embedded Systems ]
• Agere approved vendor for Nvidia Ethernet PHY chip (2006-03-27) [ Embedded Systems ]

• Report: Flex display market to grow 83.5% a year (2006-03-27) [ Optical Electronics and Display ]
• Seagate ramps Singapore investment (2006-03-27) [ Process/Manufacturing ]
• Samsung targets AM OLEDs at mobile TV phones (2006-03-27) [ Optical Electronics and Display ]
• Samsung gears up for big foundry thrust (2006-03-27) [ Process/Manufacturing ]
• NEC worker reportedly faked purchases, inflated sales (2006-03-27) [ Process/Manufacturing ]

• Ultrawide-input quarter-bricks cut the need to inventory (2006-03-27) [ Power Design ]
• Capacitors deliver low ESR for high-current apps (2006-03-27) [ Power Design ]
• 5.7-inch VGA display makes it easy to upgrade (2006-03-27) [ Optical Electronics and Display ]
• RF power detector handles WiFi, WiMAX apps (2006-03-27) [ RF/Wireless ]
• I/O module is designed for CompactPCI, PXI platform (2006-03-27) [ Interface Design ]

• Tool suite to support eclipse 3.1 platform (2006-03-27) [ EDA/IC Design ]
• Elpida's 512Mbit XDR DRAM devices operate at 4GHz data rate (2006-03-27) [ Buffer/Storage ]
• NI extends offering for industrial apps (2006-03-27) [ EDA/IC Design ]
• Samsung releases 32GB NAND flash-SSD for mobile PCs (2006-03-27) [ Buffer/Storage ]
• Philips unveils 'energy-efficient ICs' for PCs, notebooks (2006-03-27) [ Embedded Systems ]

• picoPower tech cuts "power-save" power consumption to 650nA (2006-03-27) [ Control Design ]
• Cypress streamlines on Synopsys' Galaxy Design Platform (2006-03-24) [ EDA/IC Design ]
• Avocent acquires assets of Agilent' remote IT management product line (2006-03-24) [ Process/Manufacturing ]
• Renesas adopts ARM ESL design tools (2006-03-24) [ EDA/IC Design ]
• Nvidia to acquire 3D graphics company (2006-03-24) [ Optical Electronics and Display ]

• Market rebound helps wafer maker cut losses (2006-03-24) [ Process/Manufacturing ]
• Maxwell to supply ultracap material to YEC (2006-03-24) [ Power Design ]
• Samsung execs face jail in connection with DRAM probe (2006-03-24) [ Buffer/Storage ]
• Dell acquisition start of AMD relationship, says analyst (2006-03-24) [ Amplifying/Conditioning/Converting ]
• XP Power opens Shanghai office (2006-03-24) [ Power Design ]

• AST, Macro Sensors appoints OptoCom Equiptech as distributor (2006-03-24) [ Sensor Technology ]
• CSR's BlueCore3-Multimedia tech powers GG Telecom headset (2006-03-24) [ RF/Wireless ]
• RIA terminal blocks self-adjust for different wire gauges (2006-03-24) [ Interface Design ]
• Fast FPGA-based modules prototype logic on your PC (2006-03-24) [ Programmable Logic ]
• Headers designed for multi-lane SATA/SAS cables (2006-03-24) [ Buffer/Storage ]

• Schottky diodes double surge-current capability (2006-03-24) [ Power Design ]
• Rectifiers save board space in SOD-123F package (2006-03-24) [ Power Design ]
• @Lab's optoelectronic mouse SoC sensor features MCU module (2006-03-24) [ Optical Electronics and Display ]
• Design platform enables 95% efficiency in air conditioning apps (2006-03-24) [ Embedded Systems ]
• Radio communication tester has HSDPA monitoring function (2006-03-24) [ Design Test ]

• Bondply targets multilayer PCBs (2006-03-24) [ Process/Manufacturing ]
• TI, Altera introduce PCIe solution (2006-03-24) [ Interface Design ]
• Controller provides digital monitoring for PCIe, CompactPCI (2006-03-24) [ Control Design ]
• ADC delivers low noise (2006-03-24) [ Amplifying/Conditioning/Converting ]
• Tactile switches housed in small package (2006-03-23) [ Interface Design ]

• Single-board computer runs AMD Geode processor (2006-03-23) [ Embedded Systems ]
• Transceiver targets power line communications (2006-03-23) [ RF/Wireless ]
• Board first to feature VIA C7 processor (2006-03-23) [ Embedded Systems ]
• GPS module streamlines portable designs (2006-03-23) [ Embedded Systems ]
• I/Q modulation generator provides 300MHz memory clock (2006-03-23) [ Amplifying/Conditioning/Converting ]

• New software calculates heat sink performance (2006-03-23) [ Design Test ]
• IP core enables single-chip, closed-loop control systems (2006-03-23) [ EDA/IC Design ]
• National rolls out new PMU, DC/DC converter (2006-03-23) [ Power Design ]
• Express Logic unveils new RTOS for MIPS' processor core family (2006-03-23) [ EDA/IC Design ]
• GbE switch/router tailored for space-constrained apps (2006-03-23) [ Amplifying/Conditioning/Converting ]

• 100V MOSFET reduces part count in SMPSs by 30% (2006-03-23) [ Power Design ]
• Altium announces half-year report (2006-03-23) [ EDA/IC Design ]
• Court dismisses all claims against Qualcomm by Whale Telecom (2006-03-23) [ RF/Wireless ]
• HKSTP selects 93000 platform for IC dev't support center (2006-03-23) [ Design Test ]
• LG.Philips LCD lowers Q1 guidance (2006-03-23) [ Optical Electronics and Display ]

• ITC judge upholds SigmaTel's MP3 chip patents (2006-03-23) [ Embedded Systems ]
• Samsung bullish on NAND market growth (2006-03-23) [ Buffer/Storage ]
• Another firm opposes Micron-Lexar deal (2006-03-23) [ Buffer/Storage ]
• Transmeta discloses work for Microsoft, Sony (2006-03-23) [ Embedded Systems ]
• NTS, SIINT announce electron, ion-beam system alliance (2006-03-23) [ Process/Manufacturing ]

• Digi-Key to sell Helicomm's ZigBee products (2006-03-23) [ RF/Wireless ]
• Nanoelectronics roadmap aims to speed commercialization (2006-03-23) [ Process/Manufacturing ]
• BT selects Tektronix for next-gen network (2006-03-23) [ RF/Wireless ]
• PoE controller integrates power interface port (2006-03-22) [ Power Design ]
• New material eases thermal management (2006-03-22) [ Process/Manufacturing ]

• Analog signal processor doubles performance, uses less power (2006-03-22) [ Amplifying/Conditioning/Converting ]
• Amp spans 0.25GHz to 3GHz (2006-03-22) [ Amplifying/Conditioning/Converting ]
• Programmable bridge controller fuels Intel's push into embedded applications (2006-03-22) [ Interface Design ]
• Power modules beef up current capacity (2006-03-22) [ Interface Design ]
• Freescale unveils latest 8bit MCU core (2006-03-22) [ Control Design ]

• Dual-channel isolators provide data, power isolation in single package (2006-03-22) [ Power Design ]
• Fiber-optic connectors deliver quick terminations (2006-03-22) [ Networking Design ]
• Catalyst updates Openmake development tool (2006-03-22) [ EDA/IC Design ]
• IDT, RadiSys team up to address ATCA market (2006-03-22) [ Embedded Systems ]
• POL converters offer 'dramatic' board savings (2006-03-22) [ Power Design ]

• Pentax adopts Cypress' PSoC in new digicam (2006-03-22) [ Amplifying/Conditioning/Converting ]
• Lattice agrees to settle class action litigation (2006-03-22) [ Programmable Logic ]
• Tektronix reports Q3 net sales for fiscal 2006 (2006-03-22) [ Test/Packaging ]
• Semiconductors aid Chinese focus on IP issues (2006-03-22) [ EDA/IC Design ]
• Analog vs. digital power management at IIC-China (2006-03-22) [ Power Design ]

• Zoran DTV processor powers Humax JC-5000 (2006-03-22) [ Optical Electronics and Display ]
• SMIC to employ UltraFLEX system for high volume wafer testing (2006-03-22) [ Test/Packaging ]
• Semi equipment sales down in 2005, says SEMI (2006-03-22) [ Process/Manufacturing ]
• IM Flash is looking for fab site, says report (2006-03-22) [ Process/Manufacturing ]
• Synopsys claims first complete SystemVerilog flow (2006-03-22) [ EDA/IC Design ]

• Wind River acquires middleware provider (2006-03-22) [ RF/Wireless ]
• WAPI battle exposes technology rifts with China (2006-03-22) [ RF/Wireless ]
• Gartner: IT outsourcing still focused on cost (2006-03-21) [ Process/Manufacturing ]
• NEC to establish new company in India (2006-03-21) [ Networking Design ]
• Oki claims first 160Gbps data transmission trial over 635km (2006-03-21) [ Test/Packaging ]

• Sanyo Epson seals agreement to use BOE HYDIS technology (2006-03-21) [ Optical Electronics and Display ]
• Sold out TSMC is offloading work, say reports (2006-03-21) [ RF/Wireless ]
• UTAC, SMIC launch Chengdu joint venture (2006-03-21) [ Process/Manufacturing ]
• Analyst warns LCD forecasts may fall short (2006-03-21) [ Optical Electronics and Display ]
• Seiko Instruments expands R&D in Singapore (2006-03-21) [ Buffer/Storage ]

• Court halts Japanese suit against Patriot, TPL (2006-03-21) [ Embedded Systems ]
• PMP needs to merge with cellphone, says Smartwork exec (2006-03-21) [ Embedded Systems ]
• Philips, Samsung showcase mobile TV solutions at IIC-China (2006-03-21) [ Optical Electronics and Display ]
• Local analog IC vendor targets overseas market (2006-03-21) [ Power Design ]
• Intel CPU processor powers IEI's PICMG 1.3 SBC (2006-03-21) [ Embedded Systems ]

• 40mm fan delivers 22.3cfm airflow (2006-03-21) [ Embedded Systems ]
• Conduction-cooled cPCI boards to combine Altera FPGAs with DSPs (2006-03-21) [ Digital Signal Processing ]
• Coplanar interconnect targets ATCA Zone 3 (2006-03-21) [ Networking Design ]
• Surge arrester saves space in power cabinets (2006-03-21) [ Power Design ]
• Converter eliminates motion blur, judder (2006-03-21) [ Amplifying/Conditioning/Converting ]

• Power supply comes in 1U enclosure (2006-03-21) [ Power Design ]
• Connectors allow quick mating, unmating (2006-03-21) [ Networking Design ]
• FCI offers card edge connectors for thicker PCI Express boards (2006-03-21) [ Networking Design ]
• MCU integrates USB 2.0, Ethernet MAC (2006-03-21) [ Control Design ]
• PWM controller IC reduces solution footprint by 45% (2006-03-21) [ Control Design ]

• SDK designed for portable media SoC (2006-03-21) [ EDA/IC Design ]