• ADC offers 1.2GHz analog input bandwidth (2006-03-10) [ Amplifying/Conditioning/Converting ]
• Tuner leads DTV specs race (2006-03-10) [ RF/Wireless ]
• PIC MCU line offers certified full-speed USB 2.0 (2006-03-10) [ Buffer/Storage ]
• Frequency converters cure 3-phase mains imbalance (2006-03-10) [ Power Design ]
• Nucleus RTOS supports new Diamond CPU cores (2006-03-10) [ Embedded Systems ]

• Test software enhances large data-set signal acquisition/analysis (2006-03-10) [ Design Test ]
• LSI compatible with widescreen formats (2006-03-10) [ Optical Electronics and Display ]
• DSP enables robust sRIO ecosystems (2006-03-10) [ Design Test ]
• Realtek launches audio codecs (2006-03-10) [ Amplifying/Conditioning/Converting ]
• Reference design claims lower LCD TV costs (2006-03-10) [ Optical Electronics and Display ]

• Buck regulator powers GPUs in Intel Santa Rosa platforms (2006-03-10) [ Power Design ]
• ADSL chipsets deliver HD IPTV (2006-03-10) [ Networking Design ]
• GPS vendors to feature more value-added functions in products (2006-03-10) [ Networking Design ]
• Micrel discuses dual mode power management solution at IIC-China (2006-03-10) [ Power Design ]
• CE products to benefit from PCIe bus (2006-03-10) [ Interface Design ]

• TI, Philips showcase digital radio solutions at IIC-China (2006-03-10) [ RF/Wireless ]
• Univision to invest $40M in OLED line expansion (2006-03-10) [ Optical Electronics and Display ]
• Nvidia, Intel to bring 3D gaming to handheld devices (2006-03-10) [ Embedded Systems ]
• Avaya, Microsoft team up to integrate business comm solutions (2006-03-10) [ Embedded Systems ]
• UMC says sales up 20 percent through February (2006-03-10) [ Process/Manufacturing ]

• SigmaTel, Infineon team on Bluetooth PMP (2006-03-10) [ RF/Wireless ]
• Xilinx, Altera reaffirm guidance (2006-03-10) [ Programmable Logic ]
• Spansion suit seeks $100 million from Macronix (2006-03-10) [ Buffer/Storage ]
• 10GbE transceiver claims lowest power (2006-03-09) [ RF/Wireless ]
• Switches feature LED illumination (2006-03-09) [ Optical Electronics and Display ]

• RFID software gets enhancements (2006-03-09) [ EDA/IC Design ]
• Resistor ladder networks packaged in 2512 size (2006-03-09) [ Amplifying/Conditioning/Converting ]
• Mini slide switch is RoHS compliant (2006-03-09) [ Interface Design ]
• LSI developed for 40Gbps fiber-optic transmission (2006-03-09) [ Networking Design ]
• ESD protection in tiny packages for USB 2.0 (2006-03-09) [ EMI/EMC Design ]

• Solder flux designed for tin-lead, Pb-free processes (2006-03-09) [ Process/Manufacturing ]
• Interface IC supports next-gen video in cellphones (2006-03-09) [ Interface Design ]
• Sound chip plays traditional instruments (2006-03-09) [ Amplifying/Conditioning/Converting ]
• Infineon unveils new VoIP processor (2006-03-09) [ RF/Wireless ]
• LNA targets high volume, power-sensitive apps (2006-03-09) [ Amplifying/Conditioning/Converting ]

• Philips highlights Bluetooth, WLAN coexistence at IIC-China (2006-03-09) [ RF/Wireless ]
• Powerline: a new option for video transmission (2006-03-09) [ Sensor Technology ]
• Integration's single-chip solution cuts ZigBee cost (2006-03-09) [ RF/Wireless ]
• AUO begins construction of Xiamen plant (2006-03-09) [ Optical Electronics and Display ]
• Eazix participates in CeBIT (2006-03-09) [ Process/Manufacturing ]

• Kyocera selects InnoPath Firmware Manger for mobile handsets (2006-03-09) [ RF/Wireless ]
• Dell, EMC, Intel, LSI team to drive external storage standardization (2006-03-09) [ Buffer/Storage ]
• Trident video processor powers Toshiba's digital CRT TVs (2006-03-09) [ Optical Electronics and Display ]
• Sony Electronics names Stan Glasglow president (2006-03-09) [ Optical Electronics and Display ]
• LSI scraps ASIC line, plans to sell DSP unit (2006-03-09) [ Buffer/Storage ]

• ATI buys Shanghai-based board supplier (2006-03-09) [ Embedded Systems ]
• NEC, Samsung join PISMO Advisory Council (2006-03-09) [ Buffer/Storage ]
• Electronics community welcomes inaugural issue of <I>ED-China</I> (2006-03-08) [ EDA/IC Design ]
• Number of local IC design houses in IIC-China doubles (2006-03-08) [ Networking Design ]
• CEVA claims one out of four cellphone makers uses its DSP core (2006-03-08) [ Digital Signal Processing ]

• TI highlights DaVinci-based designs at IIC-China (2006-03-08) [ Digital Signal Processing ]
• TI updates Q1 outlook (2006-03-08) [ Embedded Systems ]
• IDT, KTI ink AMD collaboration (2006-03-08) [ Test/Packaging ]
• Sharp solution powers MonRoi portable chess manager (2006-03-08) [ Control Design ]
• AMD supports fair competition in Chinese government IT procurement (2006-03-08) [ Process/Manufacturing ]

• Vodafone confirms talks on sale of Japanese unit (2006-03-08) [ RF/Wireless ]
• SMIC could post profit by Q3 (2006-03-08) [ Process/Manufacturing ]
• Micron ready to evaluate Infineon purchase (2006-03-08) [ Buffer/Storage ]
• Intel expects to miss guidance (2006-03-08) [ Embedded Systems ]
• CIPSA to build PCBs in India (2006-03-08) [ Embedded Systems ]

• RF choke features smaller size (2006-03-08) [ Amplifying/Conditioning/Converting ]
• DC/DCs meet low-power industrial applications (2006-03-08) [ Power Design ]
• Filter connector withstands thermal shock, vibration (2006-03-08) [ Networking Design ]
• Protection device tailored for DSL equipment (2006-03-08) [ EMI/EMC Design ]
• Philips implements SoC in 65nm CMOS (2006-03-08) [ EDA/IC Design ]

• Dev kit used for ARM7-enabled FPGAs (2006-03-08) [ EDA/IC Design ]
• White LED driver integrates Schottky diode (2006-03-08) [ Optical Electronics and Display ]
• Translators target cellphone memory cards (2006-03-08) [ EMI/EMC Design ]
• Control IC increases multiphase converter efficiency (2006-03-08) [ Power Design ]
• Serial RapidIO switch has multicast capability (2006-03-08) [ Networking Design ]

• Crosspoint switch claims highest level of integration (2006-03-08) [ Networking Design ]
• Digicam processor integrates image stabilization, blur reduction (2006-03-08) [ Sensor Technology ]
• CSIP, Tensilica set up IP core lab in Beijing (2006-03-07) [ EDA/IC Design ]
• Samsung India aims 200% growth in monitor sales (2006-03-07) [ Optical Electronics and Display ]
• Panel prices to drop by 20 percent this year, says Optimax (2006-03-07) [ Optical Electronics and Display ]

• Synopsys to highlight mobile storage IP solutions at IDF (2006-03-07) [ EDA/IC Design ]
• Silicon Motion flash disk controllers to power new UFD products (2006-03-07) [ Buffer/Storage ]
• Intersil showcases latest analog tech development at IIC-China (2006-03-07) [ Amplifying/Conditioning/Converting ]
• LeCroy to deploy Harvey's shipping system in Malaysian facility (2006-03-07) [ Design Test ]
• Broadcom completes Sandburst acquisition (2006-03-07) [ RF/Wireless ]

• February venture investment at two-year high (2006-03-07) [ Process/Manufacturing ]
• U.S., India seek closer military, technology ties (2006-03-07) [ Process/Manufacturing ]
• Chip sales off to promising start in '06, says SIA (2006-03-07) [ Process/Manufacturing ]
• Google switches from Intel to AMD (2006-03-07) [ Embedded Systems ]
• Current amplifier enhances NI DMM, DAQ module performance (2006-03-07) [ Amplifying/Conditioning/Converting ]

• White LED driver delivers 120mA output current (2006-03-07) [ Optical Electronics and Display ]
• RF MESFET bias controllers with 'unmatched level of integration' (2006-03-07) [ Control Design ]
• Sequence addresses needs of SoC designs below 90nm (2006-03-07) [ EDA/IC Design ]
• Digital potentiometers consume 0.3&#956;A (2006-03-07) [ Amplifying/Conditioning/Converting ]
• Slim connector provides dual capability (2006-03-07) [ Networking Design ]

• Toggles designed for logic-level switching (2006-03-07) [ Interface Design ]
• RF design toolkit expands model selection (2006-03-07) [ EDA/IC Design ]
• High-capacitance passives shrink for portable devices (2006-03-07) [ Power Design ]
• Lamp driver offers higher brightness, lower noise (2006-03-07) [ Optical Electronics and Display ]
• ST claims first 128Mbit serial flash device (2006-03-07) [ Buffer/Storage ]

• Dual, quad op amps in DFN packages (2006-03-07) [ Amplifying/Conditioning/Converting ]
• Largest system design event opens in Shanghai today (2006-03-06) [ EDA/IC Design ]
• Gigabit Ethernet PHY breaks the logjam (2006-03-06) [ Networking Design ]
• First color sensor to support two-wire serial interface (2006-03-06) [ Sensor Technology ]
• EMI filter targets wireless handsets (2006-03-06) [ EMI/EMC Design ]

• ESD protection comes in a tiny package for USB 2.0 (2006-03-06) [ EMI/EMC Design ]
• Converter ICs provide 85% efficiency at 500mA (2006-03-06) [ Power Design ]
• PHY/Serdes device with EDC capability (2006-03-06) [ Networking Design ]
• WiMAX PA delivers high throughput (2006-03-06) [ RF/Wireless ]
• Seica flying probe system eases PCB test programming (2006-03-06) [ Test/Packaging ]

• Flyback controller can rapidly charge large capacitors to 1,000V (2006-03-06) [ Power Design ]
• Crystal unit features low CI value (2006-03-06) [ RF/Wireless ]
• AC/DC switcher delivers any required voltage (2006-03-06) [ Power Design ]
• Design kits accelerate evaluation of ADCs (2006-03-06) [ Design Test ]
• Experts push Korea makers towards cellphone TFT LCDs (2006-03-06) [ Optical Electronics and Display ]

• Arrow, QP Semiconductor ink supply assurance agreement (2006-03-06) [ Programmable Logic ]
• IR to discuss power management breakthroughs at IIC-China (2006-03-06) [ Power Design ]
• Seiko Epson to transfer optical device business to Epson Toyocom (2006-03-06) [ Optical Electronics and Display ]
• Cadence, CEVA collaborate to deliver verification process automation (2006-03-06) [ EDA/IC Design ]
• Compal selects Freescale's platform for ZigBee module (2006-03-06) [ RF/Wireless ]

• Avaya, Samsung to jointly deliver enterprise IP telephony solutions (2006-03-06) [ RF/Wireless ]
• Philips, T3G, Samsung team on 3G phone for China (2006-03-06) [ RF/Wireless ]
• Fujitsu licenses Moore Processor Patent portfolio (2006-03-06) [ EDA/IC Design ]
• Fujitsu, Yokogawa ally on next-gen optical network (2006-03-06) [ Networking Design ]
• TVs, notebooks drive Q4 LCD sales up 69% (2006-03-06) [ Optical Electronics and Display ]

• RapidIO association hails group's interoperability testing (2006-03-03) [ Test/Packaging ]
• Cirrus Logic, Digi-Key ink global distribution agreement (2006-03-03) [ Amplifying/Conditioning/Converting ]
• ON Semi JV among China's top 10 semicon assembly companies (2006-03-03) [ Test/Packaging ]
• Tensions high in China, Taiwan (2006-03-03) [ Process/Manufacturing ]
• Synopsys, IBM, Chartered, ARM collaborate on 90nm process (2006-03-03) [ EDA/IC Design ]

• G&D licenses Java Card OS to Renesas (2006-03-03) [ Security Design ]
• Oki middleware enables instant face recognition in camera phones (2006-03-03) [ RF/Wireless ]
• Samsung, Siltronic to form wafer venture (2006-03-03) [ Process/Manufacturing ]
• Firms partner on PCIe verification (2006-03-03) [ EDA/IC Design ]
• Wi-Fi chipset market to grow more (2006-03-03) [ RF/Wireless ]

• Symbol, Terabeam settle patent suit (2006-03-03) [ RF/Wireless ]
• Intel confirms Vietnam plant investment, expands Israeli R&D (2006-03-03) [ Process/Manufacturing ]
• TI extends SMBus multiplexer/switch offering (2006-03-03) [ Interface Design ]
• XPhase control ICs achieve 3% higher efficiency (2006-03-03) [ Power Design ]
• Aeroflex adds handset trace capability to laboratory test system (2006-03-03) [ Design Test ]

• Lower system costs with tiny DAC (2006-03-03) [ Amplifying/Conditioning/Converting ]
• Push-pull connectors enable quick mating (2006-03-03) [ Networking Design ]
• PCIe connectors target server apps (2006-03-03) [ Interface Design ]
• EMI filters integrate ESD protection (2006-03-03) [ EMI/EMC Design ]
• Macraigor unveils new USB 2.0 JTAG interface devices (2006-03-03) [ Design Test ]

• Evaluation kit designed for auto image sensor technology (2006-03-03) [ Design Test ]
• PA module tailored for WCDMA devices (2006-03-03) [ Amplifying/Conditioning/Converting ]
• Polymer cap claims benchmark for low ESR (2006-03-03) [ Amplifying/Conditioning/Converting ]
• Buck regulator delivers up to 7A (2006-03-03) [ Power Design ]
• Impinj, UMC partner in embedded NVM cores (2006-03-02) [ EDA/IC Design ]

• IBM, Novell, Parity contribute to open source initiative (2006-03-02) [ Embedded Systems ]
• Arraycomm, TI collaborate on smart antenna tech (2006-03-02) [ RF/Wireless ]
• Sony, NEC to establish joint venture company (2006-03-02) [ Optical Electronics and Display ]
• Amkor to commence wafer bumping in Singapore (2006-03-02) [ Process/Manufacturing ]
• China's Ministry of Finance appropriates $4.7 million to NANTE (2006-03-02) [ Buffer/Storage ]

• Intel to invest $300M in Vietnam to build semiconductor assembly, test facility (2006-03-02) [ Process/Manufacturing ]
• Ericsson to invest $100M in India (2006-03-02) [ RF/Wireless ]
• Memory Bulletin: NAND prices dive (2006-03-02) [ Buffer/Storage ]
• NetLogic, Broadcom team on packet processing (2006-03-02) [ Networking Design ]
• Microsoft confirms new handheld device concept (2006-03-02) [ Embedded Systems ]

• Sharp accelerates LCD fab expansion (2006-03-02) [ Optical Electronics and Display ]
• Pentium-M chassis to underscore software productivity (2006-03-02) [ Embedded Systems ]
• PCI-X board runs parallel TI DSPs (2006-03-02) [ Digital Signal Processing ]
• 16bit MCU boasts 1.8mW/MIPS power consumption (2006-03-02) [ Control Design ]
• Op amps draw 13&#956;A per amp (2006-03-02) [ Amplifying/Conditioning/Converting ]

• Optical sensor lasts 12 months with two alkaline AA cells (2006-03-02) [ Sensor Technology ]
• DC/DC converter suits wireless networks, telecom apps (2006-03-02) [ Power Design ]
• Graphics controller tailored for automotive display apps (2006-03-02) [ Control Design ]
• MOSFET driver offers 'highest' open-circuit voltage (2006-03-02) [ Power Design ]
• ADC rejects noise in 50 or 60Hz line frequencies (2006-03-02) [ Amplifying/Conditioning/Converting ]

• NAND flash MCP designed for multimedia cellphones (2006-03-02) [ Buffer/Storage ]
• USB host has 26MHz SPI interface (2006-03-02) [ Interface Design ]
• Interface ICs suit telecom, networking apps (2006-03-02) [ Interface Design ]
• Overview: Distributed IP/Ethernet DSLAMs (2006-03-01) [ Networking Design ]
• Delicate balancing acts ensure balun performance (2006-03-01) [ Amplifying/Conditioning/Converting ]

• Ethernet's inventor sounds off (2006-03-01) [ Networking Design ]
• HSDPA boosts 3G network's capabilities (2006-03-01) [ Design Test ]
• Handsets can be faithful to hi-fi (2006-03-01) [ RF/Wireless ]
• Game theory can be used to analyze CR (2006-03-01) [ RF/Wireless ]
• Will FMC heat up or fizzle out? (2006-03-01) [ RF/Wireless ]

• Manage power in next-gen handsets (2006-03-01) [ RF/Wireless ]
• Gigabit rates represent future of wireless (2006-03-01) [ RF/Wireless ]
• Smart radios stretch spectrum (2006-03-01) [ RF/Wireless ]
• Converters heed call of 'real world' (2006-03-01) [ EDA/IC Design ]
• New tech seminars, new chances (2006-03-01) [ EDA/IC Design ]

• IIC-China features power trends (2006-03-01) [ EDA/IC Design ]
• AMD's Live aims to bring online content to the TV (2006-03-01) [ Embedded Systems ]
• Security spec readied for home networks (2006-03-01) [ Security Design ]
• Matsushita, Sharp eye new flat-panel capacity (2006-03-01) [ Optical Electronics and Display ]
• Rivals jockey for 4G LEAD (2006-03-01) [ Networking Design ]

• China question dogs Taiwan's IC industry (2006-03-01) [ Process/Manufacturing ]
• Intel reViivs its CE strategy (2006-03-01) [ Embedded Systems ]
• Wireless USB scheme attains 480Mbps (2006-03-01) [ Programmable Logic ]
• Spec covers high-speed signaling boards (2006-03-01) [ EDA/IC Design ]
• Chipsets roll early for 802.11n (2006-03-01) [ Amplifying/Conditioning/Converting ]

• Comms chip prepped for digital home apps (2006-03-01) [ Networking Design ]
• High-def STB tunes in to IPTV (2006-03-01) [ Optical Electronics and Display ]
• SoC platform aims at low-cost CE apps (2006-03-01) [ Programmable Logic ]
• Agere's GbE chip gets USB 2.0 design win (2006-03-01) [ Buffer/Storage ]
• High def heads for masses (2006-03-01) [ Optical Electronics and Display ]

• DC/DC converters offer the simplicity of a buck regulator (2006-03-01) [ Power Design ]
• C language compiler generates Java Bytecode (2006-03-01) [ Embedded Systems ]
• 'Special' lens reduces cost of LEDs (2006-03-01) [ Optical Electronics and Display ]
• Biometric sensor delivers greater recognition accuracy (2006-03-01) [ Sensor Technology ]
• GPIB interface controller conforms to MD1 form factor (2006-03-01) [ Control Design ]

• FMA unveils new GDC for automotive apps (2006-03-01) [ Control Design ]
• Reference platform puts GPS in mobile devices (2006-03-01) [ RF/Wireless ]
• Epoxy resin compound adheres to plastics and metals (2006-03-01) [ Process/Manufacturing ]
• Serdes packaged in 5-by-5mm QFN (2006-03-01) [ Amplifying/Conditioning/Converting ]
• IC multi-supply powers TV/monitor's LCD panels (2006-03-01) [ Power Design ]

• Cable plug simplifies hot swapping (2006-03-01) [ Interface Design ]
• Receiver targets HD DTV signals (2006-03-01) [ Interface Design ]