• Denali storage interface IP bypasses the SoC bus (2005-07-01) [ Memory/Storage ]
• VMs tighten up PC security (2005-07-01) [ Sensors/MEMS ]
• Analog EDA firm tackles PLL noise (2005-07-01) [ EDA/IP ]
• Cores ace networking benchmarks (2005-07-01) [ EDA/IP ]
• Industry sees promising market for sRIO (2005-07-01) [ Interface ]

• Survey says: Software sells the processor (2005-07-01) [ Embedded ]
• Software unsnarls embedded connections (2005-07-01) [ Embedded ]
• OS helps developers get to market on time (2005-07-01) [ EDA/IP ]
• The need to design for uncertainty (2005-07-01) [ EDA/IP ]
• Altera chief focuses on innovation (2005-07-01) [ EDA/IP ]

• DFM litho tool aims for two worlds (2005-07-01) [ EDA/IP ]
• Stirring Intel through wireless territory (2005-07-01) [ RF/Microwave ]
• Whine the days away or jump ship (2005-07-01) [ EDA/IP ]
• Truth in advertising (2005-07-01) [ FPGAs/PLDs ]
• Future Waves DAB device leverages Toumaz's silicon platform (2005-07-01) [ RF/Microwave ]

• First CMOS single-chip RF transceiver for UMTS applications? (2005-07-01) [ RF/Microwave ]
• TI offers new jitter cleaner with 'lowest phase in class noise' (2005-07-01) [ FPGAs/PLDs ]
• Spectrum Control adds more value to EMI filter plate line (2005-07-01) [ Amplifiers/Converters ]
• Synplicity software optimized for Fujitsu's AccelArray ASIC devices (2005-07-01) [ EDA/IP ]
• New version of Intel compilers accelerates threaded apps dev't (2005-07-01) [ EDA/IP ]

• DSP kit leverages Stratix II FPGA (2005-07-01) [ EDA/IP ]
• ST chip with all core circuitry requirements of electricity meters (2005-07-01) [ EDA/IP ]
• ADC with 250Msps sample rate (2005-07-01) [ Processors/DSPs ]
• Electronic Concepts' AC film capacitors suit inverter outputs (2005-07-01) [ Amplifiers/Converters ]
• Toshiba, Sun deliver Java tech handset for 3G services (2005-07-01) [ RF/Microwave ]

• Motorola to acquire Sendo R&D team and IP portfolio (2005-07-01) [ RF/Microwave ]
• Cypress WirelessUSB allows mouse-like cursor in MG1101 (2005-07-01) [ RF/Microwave ]
• Z-Com opts for TI voice solutions (2005-07-01) [ RF/Microwave ]
• NEC Electronics touts open platform for software deployment, reuse (2005-07-01) [ RF/Microwave ]
• RFMD ships CDMA PA modules to Samsung (2005-07-01) [ Power/Alternative Energy ]

• Philips demonstrates imaging based on magnetic traces (2005-07-01) [ Optoelectronics/Displays ]
• Apologetic Owens warns of more Nortel cost cuts (2005-07-01) [ Networks ]
• Altera, InterNiche, MorethanIP announce networking reference design (2005-07-01) [ Embedded ]
• CMD concluded sale of Tempe facility (2005-07-01) [ Manufacturing/Packaging ]
• Freescale re-commits itself to embedded systems market (2005-07-01) [ Embedded ]

• Iwedia tests Asian waters (2005-07-01) [ EDA/IP ]
• Genesis Microchip, Meridian Audio ally on video processors (2005-07-01) [ Controls/MCUs ]
• DVB-T/USB chip drives digital TV reception for PCs (2005-07-01) [ Processors/DSPs ]
• Design becoming bigger differentiator in IC industry, analyst says (2005-06-30) [ Manufacturing/Packaging ]
• India's electronics industry will grow faster than China's (2005-06-30) [ Embedded ]

• TI, Ember partner on lowest power consuming ZigBee solution (2005-06-30) [ Processors/DSPs ]
• ADI's network processors tailored for SME gateway market (2005-06-30) [ Processors/DSPs ]
• Mentor Graphics scan test tool in TSMC's Reference Flow 6.0 (2005-06-30) [ T&M ]
• Samsung unveils 'fastest 2Gbps 90nm 512Mb GDDR3 DRAM' (2005-06-30) [ Memory/Storage ]
• New power modules from Tyco provide 300A output at 1,200V (2005-06-30) [ Power/Alternative Energy ]

• Resistors with <0.1µH inductance (2005-06-30) [ Power/Alternative Energy ]
• PWM controller eyes power supplies with minimal external parts (2005-06-30) [ Processors/DSPs ]
• Auto processor platform geared to burn development rubber (2005-06-30) [ Processors/DSPs ]
• Micrel offers 'cut and paste' RF solution (2005-06-30) [ RF/Microwave ]
• New chipset from IR maximizes DC bus converter efficiency (2005-06-30) [ Power/Alternative Energy ]

• White-LED driver touts innovative brightness control (2005-06-30) [ Optoelectronics/Displays ]
• Chipscale terminators improve signal integrity in high-speed circuits (2005-06-30) [ T&M ]
• Tact switches tout long life (2005-06-30) [ Embedded ]
• Japan could impose tariffs on Hynix, says report (2005-06-30) [ Memory/Storage ]
• Datang selects Comsys' GSM/GPRS for cellular baseband line (2005-06-30) [ RF/Microwave ]

• Diversinet in OEM deal with VeriSign (2005-06-30) [ RF/Microwave ]
• Altera continues market share position in Japan (2005-06-30) [ FPGAs/PLDs ]
• LSI pushes RapidChip ASICs to 90nm (2005-06-30) [ FPGAs/PLDs ]
• Magma, SMIC forge design service partnership (2005-06-30) [ FPGAs/PLDs ]
• BT opts for Microsoft's IPTV platform (2005-06-30) [ Networks ]

• ON Semi to move site 2 wafer fab at Malaysia (2005-06-30) [ Manufacturing/Packaging ]
• VC-seeking Adiabatic Logic joins ARM community (2005-06-30) [ EDA/IP ]
• Renesas expands utilization of Blast Create, Blast Fusion IC (2005-06-30) [ EDA/IP ]
• IBM cell processor to prop up Mercury's computer systems (2005-06-30) [ Controls/MCUs ]
• ST, McubeWorks pave fast path to advance video features (2005-06-30) [ Controls/MCUs ]

• Rudolph to acquire August for $193 million (2005-06-29) [ T&M ]
• Hitachi, Tegal win fab-tool satisfaction rankings (2005-06-29) [ Manufacturing/Packaging ]
• Innovation, cooperation key to overcoming DFM issues, says Synopsys exec (2005-06-29) [ EDA/IP ]
• New capacitive touch sensor interface (2005-06-29) [ Sensors/MEMS ]
• Maxim, Philips partner on RF chip (2005-06-29) [ RF/Microwave ]

• Enhance your phones' performance (2005-06-29) [ RF/Microwave ]
• Renesas rolls out large-capacity FIFO memory modules (2005-06-29) [ RF/Microwave ]
• IR's new building block solution operates at 1MHz (2005-06-29) [ Power/Alternative Energy ]
• ADI electronics ICs target higher resolution digital displays (2005-06-29) [ Optoelectronics/Displays ]
• TI rolls LDOs in chip scale package (2005-06-29) [ Processors/DSPs ]

• Stereo amplifier's low standby current reduces battery drain (2005-06-29) [ RF/Microwave ]
• Feedback amplifier combines high performance, low power (2005-06-29) [ Amplifiers/Converters ]
• Highly-integrated 3D-Boomer audio amps tout amazing-sound (2005-06-29) [ Amplifiers/Converters ]
• ADC mixes excellent AC performance, extremely low power (2005-06-29) [ Amplifiers/Converters ]
• ARM says technology reduces Java memory footprint by up to 3X (2005-06-29) [ Memory/Storage ]

• EmTech sees growth patterns of MEMS industry changing (2005-06-29) [ Sensors/MEMS ]
• Samsung sampling 5Mpixel CMOS image sensors (2005-06-29) [ Sensors/MEMS ]
• Kyocera Wireless, Cypress develop CTM 132 data modem (2005-06-29) [ RF/Microwave ]
• National Semi completes cordless business sale (2005-06-29) [ RF/Microwave ]
• Ericsson to reportedly lay off 130, move jobs to China (2005-06-29) [ RF/Microwave ]

• Agilent color management built-in Coretronic flat-panel TVs (2005-06-29) [ Optoelectronics/Displays ]
• Toppan to expand semiconductor plant in Ichon (2005-06-29) [ Manufacturing/Packaging ]
• Freescale joins Europe's 45nm gate stack project (2005-06-29) [ Manufacturing/Packaging ]
• SOI embedded DRAM company raises $16 million (2005-06-29) [ Memory/Storage ]
• Microsoft, Toshiba join forces on next-gen DVDs (2005-06-29) [ Embedded ]

• Renesas tapes out 90nm production using Synopsys Galaxy (2005-06-29) [ EDA/IP ]
• Work begins on Hyderabad fab, doubt cast on IBM role (2005-06-28) [ RF/Microwave ]
• House-price bubble set to hit semis, warns analyst (2005-06-28) [ Manufacturing/Packaging ]
• Cypress appoints vp sales as exec leaves to lead chip company (2005-06-28) [ Manufacturing/Packaging ]
• Winbond buys out NexFlash for code-flash play (2005-06-28) [ Memory/Storage ]

• Microsoft aims to lead smartphone market within three years (2005-06-28) [ RF/Microwave ]
• Asahi Glass enters glass substrates production for HDDs (2005-06-28) [ Optoelectronics/Displays ]
• NEC outlines C3 EXPO 2005 (2005-06-28) [ Optoelectronics/Displays ]
• Quanta begins test production of LCD panels at 6G plant (2005-06-28) [ Optoelectronics/Displays ]
• PVI targets 25 percent boost in panel shipment (2005-06-28) [ Optoelectronics/Displays ]

• PMC-Sierra cuts 63 more jobs despite meeting guidance (2005-06-28) [ Networks ]
• Motorola automotive electronics facility begins production in TEDA (2005-06-28) [ Manufacturing/Packaging ]
• IBM to reportedly hire 14,000 in India (2005-06-28) [ Manufacturing/Packaging ]
• Fujitsu proposes 3-petaflops supercomputer (2005-06-28) [ Embedded ]
• Denali, TaraCom offer SATA IP solutions (2005-06-28) [ T&M ]

• AWG serves microwave design (2005-06-28) [ T&M ]
• Infineon DDR3 device processes data at 1,067Mbps transfer rate (2005-06-28) [ Memory/Storage ]
• Murata's SAW filter claims industry's smallest size for cellphones (2005-06-28) [ RF/Microwave ]
• Fairchild power modules target low-power appliance motor drives (2005-06-28) [ Power/Alternative Energy ]
• Video-over-IP streamer cuts cables with Power-over-Ethernet (2005-06-28) [ Networks ]

• Terminal block from Tyco provides two-pole power connections (2005-06-28) [ Interface ]
• Twelve new products from NI (2005-06-28) [ Embedded ]
• LDO regulator with voltage detector (2005-06-28) [ Processors/DSPs ]
• New dc-dc controller eliminates gate charging, switching losses (2005-06-28) [ Processors/DSPs ]
• TI, Altera, Mango DSP team up to address DSP market needs (2005-06-28) [ Processors/DSPs ]

• ST rolls out new motor drivers (2005-06-28) [ Controls/MCUs ]
• PolyIC unveils 13MHz rectifier (2005-06-28) [ Amplifiers/Converters ]
• China set to delay issue of 3G licenses, says report (2005-06-27) [ RF/Microwave ]
• Sony's new CEO plans to rejuvenate company (2005-06-27) [ Manufacturing/Packaging ]
• Philips Semiconductors CEO sets out platform for the future (2005-06-27) [ Manufacturing/Packaging ]

• Tektronix acquires test software supplier (2005-06-27) [ T&M ]
• Infineon CEO reportedly says no plans to break up company (2005-06-27) [ Memory/Storage ]
• Elpida makes a 2Gb DRAM on 80nm process (2005-06-27) [ Memory/Storage ]
• Micron reports 3Q loss in the face of growth (2005-06-27) [ Sensors/MEMS ]
• Fuel cell guidelines support mobile PCs development (2005-06-27) [ Power/Alternative Energy ]

• Freescale, Icron eliminate USB 2.0 wires with UWB (2005-06-27) [ Networks ]
• Apple commands one third of portable digital audio, says In-Stat (2005-06-27) [ Processors/DSPs ]
• IBM, HP dominate world's fastest supercomputers (2005-06-27) [ Embedded ]
• China's analog market races ahead (2005-06-27) [ EDA/IP ]
• Acacia Tech licenses simulation tools to National Instruments (2005-06-27) [ T&M ]

• Semiconductor technologies for power management (Part 3) (2005-06-27) [ Power/Alternative Energy ]
• New technology doubles storage capacity in NOR flash devices (2005-06-27) [ Memory/Storage ]
• 2.5-inch hard disk drive with perpendicular recording technology (2005-06-27) [ Memory/Storage ]
• Micron rolls 1.7µm pixel sensor (2005-06-27) [ Sensors/MEMS ]
• Phihong 500W switching supply is hotplug n+1 configurable (2005-06-27) [ Power/Alternative Energy ]

• Chipset maximizes bus converter (2005-06-27) [ EDA/IP ]
• New scalable DP tech delivers an order of magnitude speedup (2005-06-27) [ EDA/IP ]
• NI offers engineers fast prototyping of distributed motion app (2005-06-27) [ EDA/IP ]
• Simulator leaps to 64 bits (2005-06-27) [ EDA/IP ]
• Accelerated Technology burnishes Nucleus development suite (2005-06-27) [ EDA/IP ]

• New system LED drivers tailored for compact LCDs in mobile apps (2005-06-27) [ Optoelectronics/Displays ]
• New limiting post amplifier from Micrel w/ TTL signal detect (2005-06-27) [ Amplifiers/Converters ]
• AVX medium power film capacitors suit military, industrial apps (2005-06-27) [ Amplifiers/Converters ]
• Samsung commences 90nm 1Gb DRAM production (2005-06-24) [ Memory/Storage ]
• Renesas, Hitachi improve AG-AND flash programming (2005-06-24) [ Memory/Storage ]

• Intel joins picoChip's $20.5 million funding round (2005-06-24) [ RF/Microwave ]
• Inductorless solutions on the rise (2005-06-24) [ Power/Alternative Energy ]
• Altera's Cyclone, Nios II power 32bit display system (2005-06-24) [ FPGAs/PLDs ]
• Hitachi moves to exploit its plasma display IP (2005-06-24) [ Optoelectronics/Displays ]
• CEA developing spec for automotive networks (2005-06-24) [ Networks ]

• System Integrators gain access to serial attached SCSI (2005-06-24) [ Interface ]
• HP goes mobile with AMD's Turion 64 (2005-06-24) [ Embedded ]
• ST cuts verification time with Synopsys VCS RTL solution (2005-06-24) [ T&M ]
• Toshiba MIPS-based microprocessor supports Cannon (2005-06-24) [ Controls/MCUs ]
• Wind River supporting Freescale's latest processor architectures (2005-06-24) [ Controls/MCUs ]

• Fluke's new two-in-one test tool (2005-06-24) [ T&M ]
• RF Mixer serves apps up to 3GHz (2005-06-24) [ RF/Microwave ]
• Lambda AC/DC power supply meets both medical, emission specs (2005-06-24) [ Power/Alternative Energy ]
• Cree LED chips mix high brightness, low power consumption (2005-06-24) [ Optoelectronics/Displays ]
• Foundry rolls layer 2/3 switches (2005-06-24) [ Networks ]

• Fast USB module from ACCES I/O packs 32 digital I/O lines (2005-06-24) [ Embedded ]
• IBM debuts ASICs at 65nm (2005-06-24) [ EDA/IP ]
• Agilent re-introduces UWB tool (2005-06-24) [ T&M ]
• Freescale MCU targets CE apps (2005-06-24) [ Processors/DSPs ]
• Inductors offer up to 1µH inductance (2005-06-24) [ Amplifiers/Converters ]

• Linear Tech ADCs provide zero average differential input current (2005-06-24) [ Amplifiers/Converters ]
• CompactPCI-based PXI module conveys 64 DAC channels (2005-06-24) [ Embedded ]
• Freescale unveils PPC for gaming, home entertainment, networking (2005-06-23) [ Networks ]
• Stacked package from Sharp allows 0.5-mm grid (2005-06-23) [ T&M ]
• Samsung increases speed of graphics DRAM (2005-06-23) [ Memory/Storage ]

• India's Quasar to launch GSM handset (2005-06-23) [ RF/Microwave ]
• Sasken joines Symbian development program (2005-06-23) [ RF/Microwave ]
• One more patent for power supplier O2Micro (2005-06-23) [ Power/Alternative Energy ]
• TI, Ember team up in lowest power Zigbee chipset solution (2005-06-23) [ Networks ]
• Winbond 300mm production adopts VIISta implanters (2005-06-23) [ Manufacturing/Packaging ]

• E2open buys GetSilicon to serve IC manufacturing arena (2005-06-23) [ Manufacturing/Packaging ]
• Jack Kilby, co-inventor of the IC, dies at 81 (2005-06-23) [ EDA/IP ]
• Annual ARS focuses on impact of semiconductor worldwide (2005-06-23) [ EDA/IP ]
• LTX partakes in Taiwan's evolution to chip design (2005-06-23) [ EDA/IP ]
• Nvidia spreads out in Asia with new office in Beijing (2005-06-23) [ Processors/DSPs ]

• Handheld spectrum analyzer gets cdma2000 1xEV-DO options (2005-06-23) [ T&M ]
• Intersil's seven new data transceivers comply to RS-485, RS-422 (2005-06-23) [ RF/Microwave ]
• Voltage converters rated at 1W (2005-06-23) [ Power/Alternative Energy ]
• Dc-dc converter provides high efficiency boost capability (2005-06-23) [ Power/Alternative Energy ]
• Harting offers M12 connectors in panel feed-through configuration (2005-06-23) [ Interface ]

• APEM switch sealing boots have soft feel for easy gripping (2005-06-23) [ Interface ]
• SPDT shrinks to 1mm² (2005-06-23) [ Interface ]
• Switches carry low-RDS spec at 1.5V (2005-06-23) [ Interface ]
• Goal 'goes green' with 8-bit MCUs (2005-06-23) [ Processors/DSPs ]
• Maxim temperature controllers report values in digital form (2005-06-23) [ Controls/MCUs ]

• Motor drivers from ST eliminate need for over-specification (2005-06-23) [ Controls/MCUs ]
• Freescale unveils HFET GPAs (2005-06-23) [ Amplifiers/Converters ]
• Global LCD desktop monitors up 7% Q/Q (2005-06-22) [ Optoelectronics/Displays ]
• IBM to take $150 million stake in India fab, says report (2005-06-22) [ Manufacturing/Packaging ]
• Semico sees chip market fall until Q4, raises annual forecast (2005-06-22) [ Manufacturing/Packaging ]

• Semtech to acquire Xemics for $43 million (2005-06-22) [ RF/Microwave ]
• Samsung SGH-E720 handset adopts CSR BlueCore silicon (2005-06-22) [ RF/Microwave ]
• WiMAX trials slated for Georgia, South Korea (2005-06-22) [ RF/Microwave ]
• O2Micro receives selector circuit patent for power management (2005-06-22) [ Power/Alternative Energy ]
• Xilinx expands partnership pact with Nu Horizons (2005-06-22) [ FPGAs/PLDs ]

• Trident DPTV SVP powers Philips digital CRT TVs (2005-06-22) [ Optoelectronics/Displays ]
• UMC fabricates record-setting VCO using CMOS tech (2005-06-22) [ Manufacturing/Packaging ]
• Japanese researchers craft novel diamond semiconductor (2005-06-22) [ Manufacturing/Packaging ]
• China gets its head into gear (2005-06-22) [ Manufacturing/Packaging ]
• China devising 300mm silicon wafers (2005-06-22) [ Manufacturing/Packaging ]

• LSI Logic MegaRAID SATA supports ASUSTeK motherboards (2005-06-22) [ Embedded ]
• Celoxica, SGI step up high-performance computing apps (2005-06-22) [ EDA/IP ]
• ST simplifies energy metering apps with smart power tech (2005-06-22) [ Controls/MCUs ]
• Speed sensor eliminates external switching capacitor (2005-06-22) [ Sensors/MEMS ]
• Chipset offers user-selectable parameters for RFID tag readers (2005-06-22) [ RF/Microwave ]

• C&D's new transformers measure and monitor AC currents (2005-06-22) [ Power/Alternative Energy ]
• Molex kit offers quick and easy terminations for optical LANs (2005-06-22) [ Networks ]
• ST unveils new ADSL chipset (2005-06-22) [ Networks ]
• FCI interconnects designed for removable ExpressCard modules (2005-06-22) [ Networks ]
• Synopsys, IBM collaborate on PowerPC processor models (2005-06-22) [ Processors/DSPs ]

• Intersil PWM synchronous buck controller cuts component count (2005-06-22) [ Controls/MCUs ]
• 12-bit ADC consumes less power (2005-06-22) [ Amplifiers/Converters ]
• MPEG decoder addresses piracy (2005-06-22) [ Amplifiers/Converters ]
• A high voltage version of TI's THS3001 amplifier now available (2005-06-22) [ Amplifiers/Converters ]
• WTO tells Europe to correct Hynix chip tariffs (2005-06-21) [ Memory/Storage ]

• MII announces image sensor license deal with ORNL (2005-06-21) [ Sensors/MEMS ]
• Chipcon, Figure 8 present ZigBee in Z-Gate reference design (2005-06-21) [ RF/Microwave ]
• Intel unveils all-CMOS WLAN transceiver (2005-06-21) [ RF/Microwave ]
• LED chip makers forecast growth sales in high-luminance LEDs (2005-06-21) [ Optoelectronics/Displays ]
• OLED material suppliers ramp up capacity (2005-06-21) [ Optoelectronics/Displays ]

• TEL led display equipment rankings in '04 (2005-06-21) [ Optoelectronics/Displays ]
• China contract maker creates network interface cards for Perfisans (2005-06-21) [ Interface ]
• Trust designs, but verify, say panelists (2005-06-21) [ EDA/IP ]
• Synopsys backs migration of analog design to OpenAccess (2005-06-21) [ EDA/IP ]
• EDA innovation costly, keynoter says (2005-06-21) [ EDA/IP ]

• Sensors tout several improvements (2005-06-21) [ Sensors/MEMS ]
• Maxim overvoltage ICs protect apps from high-voltage transients (2005-06-21) [ Power/Alternative Energy ]
• Parvus preps its new galvanically isolated dc-dc power supply (2005-06-21) [ Power/Alternative Energy ]
• Charger IC targets portable apps (2005-06-21) [ EDA/IP ]
• DMUX allows demultiplexing of Giga sampling rates into FPGAs (2005-06-21) [ Networks ]

• Pericom's new HDMI switch device provides 1.65Gbps data rate (2005-06-21) [ Networks ]
• Tyco's new PCB receptacles allow board to board connection (2005-06-21) [ Interface ]
• Composite connectors beef up mil line (2005-06-21) [ Interface ]
• SBS Technologies rolls out its first AdvancedMC chassis (2005-06-21) [ Embedded ]
• New NI LabVIEW can be used in any 32-bit embedded processor (2005-06-21) [ EDA/IP ]

• Freescale processor mixes low power, high entertainment quality (2005-06-21) [ Processors/DSPs ]
• New high-ohmic value resistor from IMS provides lower pricing (2005-06-21) [ Amplifiers/Converters ]