• Renesas MCUs include Flash memory, CAN controller (2003-10-01) [ Controls/MCUs ]
• Samsung advances processes for 4Gb flash, 512Mb DRAM (2003-10-01) [ Memory/Storage ]
• Maxim EAM driver with integrated bias T (2003-10-01) [ Amplifiers/Converters ]
• Engineers in Taiwan seek more from work than money (2003-10-01) [ EDA/IP ]
• Mainland's stability hinges on performance of local firms (2003-10-01) [ EDA/IP ]

• Asian engineers hold on as industry recovers (2003-10-01) [ EDA/IP ]
• China hunts for competitive talent (2003-10-01) [ EDA/IP ]
• Overseas work shifts from West to East (2003-10-01) [ EDA/IP ]
• Companies keep few, but happier engineers (2003-10-01) [ EDA/IP ]
• Wages slightly rise amid economic uncertainty (2003-10-01) [ EDA/IP ]

• A rebirth of IC compilation (2003-10-01) [ Embedded ]
• Actel revamps FPGA suite, tightens link to Synplify (2003-10-01) [ Embedded ]
• EDA needs schemas for IP reuse (2003-10-01) [ EDA/IP ]
• SynApps customizes its tools for users (2003-10-01) [ Embedded ]
• Tech careers in Korea show mixed signals (2003-10-01) [ Embedded ]

• Cypress transceivers suit video transport equipment (2003-09-30) [ Amplifiers/Converters ]
• Fairchild blue LED suits keypads, push-buttons backlighting (2003-09-30) [ Amplifiers/Converters ]
• Catalyst white releases LED driver for color LCD modules (2003-09-30) [ Amplifiers/Converters ]
• SMK CRT sockets reduce TV receivers depth (2003-09-30) [ Interface ]
• Shanghai Moon wire harnesses eye consumer apps (2003-09-30) [ Interface ]

• Samlung DIN connectors with PBT body (2003-09-30) [ Interface ]
• Powercon USB connectors available in DIP, SMT types (2003-09-30) [ Interface ]
• Siliconix analog switches, multiplexers in CerDIP, LCC packages (2003-09-30) [ Amplifiers/Converters ]
• STMicro mono amplifier saves space in portable devices (2003-09-30) [ Amplifiers/Converters ]
• NTT announces breakthrough in KTN crystals (2003-09-30) [ Amplifiers/Converters ]

• Philips establishes facility for TV technology (2003-09-30) [ Optoelectronics/Displays ]
• C&D acquires Matsushita manufacturing facility, assets (2003-09-30) [ Power/Alternative Energy ]
• Electrovaya, Exide partner on Li-ion solutions (2003-09-30) [ Power/Alternative Energy ]
• Tri-Vision licenses patents to Eastech (2003-09-30) [ Amplifiers/Converters ]
• Silicon Labs to purchase MCU manufacturer (2003-09-30) [ Controls/MCUs ]

• Synopsys, Artisan ink strategic partnership (2003-09-30) [ EDA/IP ]
• Xybernaut obtains European patent (2003-09-30) [ Embedded ]
• Juniper Networks opens Indian software center (2003-09-30) [ Embedded ]
• PC's passé at Taiwan computer show (2003-09-30) [ Networks ]
• PDF Solutions acquires IDS Software Systems (2003-09-30) [ Amplifiers/Converters ]

• SMaL releases development kit for digital cameras (2003-09-30) [ Optoelectronics/Displays ]
• Motorola combines MCUs with analog ICs (2003-09-30) [ Embedded ]
• NI toolkits simplify sound apps development (2003-09-30) [ EDA/IP ]
• TI audio amplifier targets cellphones, PDAs (2003-09-30) [ RF/Microwave ]
• Linear differential receiver amp suits video apps (2003-09-30) [ Amplifiers/Converters ]

• Huawei NiMH batteries have 9Ah nominal capacity (2003-09-29) [ Power/Alternative Energy ]
• Sharp, SEL merge audio circuitry into LCD panel design (2003-09-29) [ Amplifiers/Converters ]
• Joint Tech power connectors rated at 5A (2003-09-29) [ Interface ]
• Murata PTC thermistor has multilayered structure (2003-09-29) [ Amplifiers/Converters ]
• Suprl driver IC suits LCD monitors, TV receivers (2003-09-29) [ Optoelectronics/Displays ]

• CML Micro IC has on-chip signaling facilities (2003-09-29) [ Amplifiers/Converters ]
• Renesas liquid crystal panel driver suits cellphones (2003-09-29) [ Optoelectronics/Displays ]
• Intersil device offers regulation for AMD processors (2003-09-29) [ Power/Alternative Energy ]
• TAEC expands FCRAM II family (2003-09-29) [ Memory/Storage ]
• Setram to acquire Agilent test, measurement products (2003-09-29) [ T&M ]

• Skyworks GSM solution to be used on Vitelcom handsets (2003-09-29) [ RF/Microwave ]
• Acquisition to enable Bookham entry into datacom market (2003-09-29) [ RF/Microwave ]
• Lithium Tech obtains order from battery consortium (2003-09-29) [ Power/Alternative Energy ]
• Itochu, Ener1 to jointly establish company in Japan (2003-09-29) [ Power/Alternative Energy ]
• China's Panyu Cable signs pact with Salira (2003-09-29) [ Networks ]

• TELI, Coreco ink supply, joint development pact (2003-09-29) [ Sensors/MEMS ]
• ASAT relocates U.S. headquarters (2003-09-29) [ T&M ]
• Cadence, dSPACE partner on automotive design flow (2003-09-29) [ EDA/IP ]
• EDA revenue growth returns, says EDAC (2003-09-29) [ EDA/IP ]
• BodyMedia granted patent for biomedical heat sensor (2003-09-29) [ Sensors/MEMS ]

• Shengye caps withstand high current, high voltage (2003-09-26) [ Amplifiers/Converters ]
• austriamicrosystems ships enhanced mobile music chip (2003-09-26) [ Amplifiers/Converters ]
• Ritar batteries use silica gel (2003-09-26) [ Power/Alternative Energy ]
• Pulse power transformers have over 500 configurations (2003-09-26) [ Power/Alternative Energy ]
• Morning Star rolls out telephone socket plates (2003-09-26) [ Interface ]

• Legerity rolls out voice telephony line card solution (2003-09-26) [ Amplifiers/Converters ]
• Hybrid processor runs by-wire autos' commands (2003-09-26) [ Processors/DSPs ]
• Microwave Photonics antenna system suits Wi-Fi apps (2003-09-26) [ RF/Microwave ]
• Infineon demonstrates fiber-optic solutions (2003-09-26) [ Interface ]
• Exar LIU reduces overall design complexity (2003-09-26) [ Networks ]

• Philips MCUs offered in 8-, 14-pin packages (2003-09-26) [ Controls/MCUs ]
• FSI launches technology for front-end processing (2003-09-26) [ Manufacturing/Packaging ]
• Wi-Fi increases notebook TCO: Gartner (2003-09-26) [ RF/Microwave ]
• Nokia to strengthen China Unicom GSM reach (2003-09-26) [ Networks ]
• Sanyo expands coverage of Tessera license pact (2003-09-26) [ Amplifiers/Converters ]

• Intel makes investment in Micron Technology (2003-09-26) [ Memory/Storage ]
• Micron shows DDR400 platform at Via forum (2003-09-26) [ Memory/Storage ]
• EGLS announces new automatic probing technology (2003-09-26) [ Manufacturing/Packaging ]
• Design outsourcing appears inevitable, EEs told (2003-09-26) [ EDA/IP ]
• ROHM to acquire LSI Logic facility in Japan (2003-09-26) [ EDA/IP ]

• New conference addresses system-level design (2003-09-26) [ Embedded ]
• STMicro announces advancement in light-emitting silicon (2003-09-26) [ Amplifiers/Converters ]
• Wu Zhou Circuit PCB offers up to 3mm thickness (2003-09-25) [ EDA/IP ]
• Cypress clock generators reduce EMI (2003-09-25) [ Embedded ]
• Connectors available in FC, SC, ST versions (2003-09-25) [ Interface ]

• SMK FPC connector has 0.85mm profile (2003-09-25) [ Interface ]
• Kinsun sub-connectors have male, female types (2003-09-25) [ Interface ]
• SiGe Semiconductor power amp cuts space (2003-09-25) [ RF/Microwave ]
• Wolfson software driver supports audio codec devices (2003-09-25) [ Embedded ]
• VoIP chip targets home gateways (2003-09-25) [ Processors/DSPs ]

• NJR voltage regulator features on, off control (2003-09-25) [ Amplifiers/Converters ]
• Xicor AFEs eye flat-panel monitors, projectors (2003-09-25) [ Amplifiers/Converters ]
• Triniti becomes FSA member (2003-09-25) [ Manufacturing/Packaging ]
• Giga Solution services adopted by GCT (2003-09-25) [ RF/Microwave ]
• CSR Bluetooth to support Symbian OS (2003-09-25) [ RF/Microwave ]

• FCC permit enables Ambient to speed field trials (2003-09-25) [ Networks ]
• Ericsson to service telecom operator in Ukraine (2003-09-25) [ Networks ]
• Matsushita expands production reach at Singapore plant (2003-09-25) [ Sensors/MEMS ]
• AMD licenses DivXNetworks encoding application (2003-09-25) [ Amplifiers/Converters ]
• Transmeta, Phoenix enter strategic collaboration (2003-09-25) [ Embedded ]

• STMicro sees own China fab within three years (2003-09-25) [ Memory/Storage ]
• Capital spending forecast for 2003 revised upward (2003-09-25) [ EDA/IP ]
• OSI purchases Schwartz Electro-Optics unit (2003-09-25) [ Amplifiers/Converters ]
• TI controller powers BEI sensor technology (2003-09-25) [ Sensors/MEMS ]
• NSC GbE solution comes with GigPHYTER V device (2003-09-24) [ Networks ]

• Super Display tuner module consumes 500mA (2003-09-24) [ Amplifiers/Converters ]
• Lingyun electronic tuners feature >30dB power gain (2003-09-24) [ Power/Alternative Energy ]
• Honda Tsushin connectors designed for network apps (2003-09-24) [ Interface ]
• Wu Zhou single-sided PCB with carbon keypad (2003-09-24) [ EDA/IP ]
• SoC backbone blends bursts, streams (2003-09-24) [ EDA/IP ]

• SigmaTel audio decoders offer hi-speed USB (2003-09-24) [ Amplifiers/Converters ]
• Fuel cells power up for notebooks (2003-09-24) [ Power/Alternative Energy ]
• Broadcom rolls out GbE switches for SMB (2003-09-24) [ Amplifiers/Converters ]
• SEI starts volume shipment of optical transceivers (2003-09-24) [ Networks ]
• Philips display module switches between NTSC, PAL (2003-09-24) [ Amplifiers/Converters ]

• Atmel releases Linux port for ARM9 MCU (2003-09-24) [ Controls/MCUs ]
• Icos to acquire Jointech Precision (2003-09-24) [ Manufacturing/Packaging ]
• TI to establish wireless apps center in Taiwan (2003-09-24) [ RF/Microwave ]
• KDDI extends roaming service to Taiwan (2003-09-24) [ RF/Microwave ]
• Anadigics opens second center in Taiwan (2003-09-24) [ RF/Microwave ]

• Broadcom, iCable enable residential VoIP in Asia (2003-09-24) [ Amplifiers/Converters ]
• Samsung, Toshiba to merge optical disk device lines (2003-09-24) [ Controls/MCUs ]
• Zoran licenses additional MIPS cores (2003-09-24) [ Controls/MCUs ]
• Teseda takes part of LVReady program (2003-09-24) [ T&M ]
• Cadence, Chartered partner on 90nm design solutions (2003-09-24) [ EDA/IP ]

• EDA getting serious about analog, mixed-signal (2003-09-24) [ EDA/IP ]
• Verification, test providers form outsourcing body (2003-09-24) [ EDA/IP ]
• Big investments burnish India's hardware design image (2003-09-24) [ Memory/Storage ]
• TI audio power amp has dc volume control (2003-09-23) [ RF/Microwave ]
• Fiber-optic connectors operate at 13.2Mbps (2003-09-23) [ Interface ]

• Crystek timing control line supports TI device (2003-09-23) [ Amplifiers/Converters ]
• CheerSun connectors have 20 contacts (2003-09-23) [ Interface ]
• Shunde Shunhua heatsinks target CPUs (2003-09-23) [ Embedded ]
• Single oven OCXO suits synchronization systems (2003-09-23) [ Amplifiers/Converters ]
• Top-Up pots available in low-profile slide types (2003-09-23) [ Amplifiers/Converters ]

• ADI LDD features dual loop control (2003-09-23) [ Embedded ]
• Earphone, microphone unit has square-type connector (2003-09-23) [ Amplifiers/Converters ]
• Coble modular plugs have round cable entry (2003-09-23) [ Interface ]
• Sipex LDOs offer low output noise (2003-09-23) [ Amplifiers/Converters ]
• NSC baseboard controllers suit medium-, high-end servers (2003-09-23) [ Memory/Storage ]

• Engineer creates HDL generation language (2003-09-23) [ EDA/IP ]
• Chartered establishes NanoAccess Alliance (2003-09-23) [ Manufacturing/Packaging ]
• InHand receives R&D contract from U.S. Navy (2003-09-23) [ Sensors/MEMS ]
• Juniper backs expansion of Korean service provider (2003-09-23) [ Networks ]
• Harris encryption modules adopted by Mykotronx (2003-09-23) [ Amplifiers/Converters ]

• Renesas, Nazomi in mobile phone chip pact (2003-09-23) [ Amplifiers/Converters ]
• JEITA reports rise in Japan consumer electronics sales (2003-09-23) [ Amplifiers/Converters ]
• SpatiaLight obtains volume order from China manufacturer (2003-09-23) [ Optoelectronics/Displays ]
• SuperH joins IBM IP collaboration program (2003-09-23) [ Networks ]
• Kingston expands manufacturing capacity in China (2003-09-23) [ Memory/Storage ]

• Mentor, SLE form strategic alliance (2003-09-23) [ EDA/IP ]
• Virtual Component Exchange becomes private company (2003-09-23) [ Embedded ]
• SEMI posts 0.91 book-to-bill ratio for August '03 (2003-09-22) [ Manufacturing/Packaging ]
• UMCJ expands manufacturing reach in Singapore plant (2003-09-22) [ Manufacturing/Packaging ]
• Metron purchases TEL's Eclipse PVD line (2003-09-22) [ Manufacturing/Packaging ]

• Wafer bumping technology qualified at Chartered (2003-09-22) [ Manufacturing/Packaging ]
• K&S opens first manufacturing facility in China (2003-09-22) [ Manufacturing/Packaging ]
• Nam Tai starts construction of new Shenzhen plant (2003-09-22) [ Sensors/MEMS ]
• LVL7 to deliver DSL access following Infineon deal (2003-09-22) [ RF/Microwave ]
• Cypress backs Intel network processors (2003-09-22) [ Networks ]

• ALD technology to drive Taiwan foundries next year (2003-09-22) [ EDA/IP ]
• Toshiba licenses Barcelona analog synthesis solutions (2003-09-22) [ Embedded ]
• Microsoft, ARM team with eight more silicon vendors (2003-09-22) [ Embedded ]
• Atmel MCUs offer on-chip debug capability (2003-09-22) [ Power/Alternative Energy ]
• Maxim RF ICs provide AM-PM distortion correction (2003-09-22) [ RF/Microwave ]