2016 is a sequel to the M&A mania of 2015, ringing $55.3 billion in M&A agreement value in 3 quarters.
The MEMS & Sensors Industry Group's "strategic association partnership" with SEMI, helps the latter diversify its interests.
Data throughput of the 8k and 16k models is beyond 3GB/s on a single CX4 cable to aid inspection reliability.
The ring focuses the plasma directly over the wafer to speed up the etching process and provide uniform plasma coverage.
2016 is a turning point for the fan-out market since Apple and TSMC changed the game, possibly creating a trend of acceptance of fan-out pac...
The technology reduces the volume of internal GPU memory used by over 40%.
Shipments of basic wearable devices, such as wristbands, children’s watches and smart running shoes, grew by 92.1%.
The Singapore centre conducts multi-disciplinary research to develop new innovations for fan-out wafer-level packaging.
The LTC3871 provides bidirectional DC/DC control and battery charging between the 12V and 48V boardnets.
NEC Philippines kicked off its 20th anniversary last Wednesday (July 20) in an event themed "NECHPH@20: Providing Breakthrough Technologies ...